CN219876233U - Multilayer integrated circuit board convenient to heat dissipation - Google Patents
Multilayer integrated circuit board convenient to heat dissipation Download PDFInfo
- Publication number
- CN219876233U CN219876233U CN202320296331.9U CN202320296331U CN219876233U CN 219876233 U CN219876233 U CN 219876233U CN 202320296331 U CN202320296331 U CN 202320296331U CN 219876233 U CN219876233 U CN 219876233U
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- CN
- China
- Prior art keywords
- circuit board
- multilayer
- heat dissipation
- shell
- integrated circuit
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 16
- 230000000670 limiting effect Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a multilayer integrated circuit board convenient for heat dissipation, which comprises a shell, wherein a multilayer circuit board main body is arranged at the top of the shell through a supporting structure, U-shaped fixing clamps are arranged at two sides of the multilayer circuit board main body through fastening bolts, racks are arranged on one sides of the U-shaped fixing clamps, gears are arranged on one sides of the racks through rotating shafts, first bevel gears are further arranged on the rotating shafts, and second bevel gears are arranged at the front ends of the first bevel gears. This multilayer integrated circuit board convenient to heat dissipation is provided with first awl tooth, second awl tooth, gear and rack, when the multilayer circuit board body is played in the lifting, drives the rotation of second awl tooth through the dwang for first awl tooth is rotatory, and then drives the gear rotation, utilizes the cooperation of gear and rack, realizes the lifting of multilayer circuit board body, and the inside radiating component of convenient equipment is to multilayer circuit board body back cooling, and this structure is convenient to realize the effect of going up and down from external control.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer integrated circuit board convenient for heat dissipation.
Background
The method for manufacturing the multi-layer board generally comprises the steps of firstly making an inner layer pattern, then making a single-sided or double-sided substrate by a printing etching method, incorporating the single-sided or double-sided substrate into a designated interlayer, heating, pressurizing and bonding, and then drilling holes, which are the same as the plating through hole method of the double-sided board, but the characteristics of the multi-layer board attached to the multi-layer board are diversified along with the more mature materials and processing technologies (such as pressing bonding technology, improving glue residues and films generated during the drilling holes).
When the existing multilayer circuit board is used, the existing multilayer circuit board is installed in the shell, heat at the back of the existing multilayer circuit board is difficult to dissipate due to the fact that the back of the existing multilayer circuit board is attached to the shell, and the height of the existing multilayer circuit board in the shell cannot be adjusted from the outside, so that heat dissipation becomes a problem that the existing multilayer circuit board is difficult to solve.
Disclosure of Invention
The utility model aims to provide a multilayer integrated circuit board convenient for heat dissipation, which solves the problems that the prior multilayer circuit board proposed in the background art is installed in a shell when in use, the heat at the back of the multilayer circuit board is difficult to dissipate because the back of the multilayer circuit board is attached to the shell, and the height of the multilayer circuit board in the shell cannot be adjusted from the outside.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a multilayer integrated circuit board facilitating heat dissipation, comprising:
the casing, the multilayer circuit board main part is installed through bearing structure at the top of casing, U-shaped fixation clamp is installed through the binding bolt to the both sides of multilayer circuit board main part, and one side of U-shaped fixation clamp is equipped with the rack, the gear is installed through the pivot to one side of rack, still install first awl tooth in the pivot, the front end of first awl tooth is equipped with the second awl tooth, the dwang is installed to the bottom of second awl tooth.
As a further scheme of the utility model: the supporting structure comprises a supporting cylinder, a screw and a clamping block, wherein the supporting cylinder is arranged between the shell and the multilayer circuit board main body, the screw penetrates through the shell, the multilayer circuit board main body and the supporting cylinder, the clamping block is arranged at the top of the screw, and the part of the screw, which is positioned at the bottom of the shell, is provided with a limiting ring.
Through adopting above-mentioned technical scheme, conveniently support and fixed effect to multilayer circuit board main part through bearing structure.
As a further scheme of the utility model: the gear is meshed with the rack, and the first bevel gear is meshed with the second bevel gear.
By adopting the technical scheme, the transmission of kinetic energy is conveniently realized through mutual engagement.
As a further scheme of the utility model: an extension groove is formed in the top of the shell, and the bottom of the rack stretches into the extension groove.
By adopting the technical scheme, the lifting stroke of the multilayer circuit board is convenient to improve.
As a further scheme of the utility model: the rotating rod penetrates through the shell, and bearings are arranged on the rotating rod and located on two sides of the shell.
Through adopting above-mentioned technical scheme, conveniently realize the location of dwang.
Compared with the prior art, the utility model has the beneficial effects that: the multi-layer integrated circuit board convenient for heat dissipation,
the multi-layer circuit board comprises a multi-layer circuit board body, a rotating rod, a first bevel gear, a second bevel gear, a gear and a rack, wherein the first bevel gear, the second bevel gear, the gear and the rack are arranged;
be provided with support drum, screw rod and fixture block, utilize before the lift multilayer circuit board main part, need remove the fixed of multilayer circuit board main part, just at this moment the spacing ring on the accessible with the screw rod rotates downwards for can move about between fixture block and the multilayer circuit board main part, the process of conveniently going up and down.
Drawings
FIG. 1 is a schematic cross-sectional view of the present utility model;
FIG. 2 is a schematic view of the structure of the support cylinder, screw, clamping block and limiting ring of the present utility model;
FIG. 3 is a schematic side view of the gear, first bevel gear, second bevel gear, rotating rod and rotating shaft of the present utility model.
In the figure: 1. a housing; 2. a multilayer wiring board main body; 3. a support cylinder; 4. a screw; 5. a clamping block; 6. a limiting ring; 7. a U-shaped fixing clip; 8. a rack; 9. a gear; 10. a first bevel gear; 11. a second bevel gear; 12. a rotating lever; 13. a bearing; 14. an extension groove; 15. a rotating shaft.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present utility model provides a technical solution: a multilayer integrated circuit board facilitating heat dissipation, comprising:
the multi-layer circuit board comprises a shell 1, wherein a multi-layer circuit board main body 2 is arranged at the top of the shell 1 through a supporting structure, U-shaped fixing clamps 7 are arranged at two sides of the multi-layer circuit board main body 2 through fastening bolts, racks 8 are arranged on one sides of the U-shaped fixing clamps 7, gears 9 are arranged on one sides of the racks 8 through rotating shafts 15, first conical teeth 10 are further arranged on the rotating shafts 15, second conical teeth 11 are arranged at the front ends of the first conical teeth 10, and rotating rods 12 are arranged at the bottoms of the second conical teeth 11;
when using, when using longer time to need dispel the heat to the back of multilayer circuit board main part 2, through loosening bearing structure for multilayer circuit board main part 2 is not being fixed, then rotates dwang 12, make second awl tooth 11 drive first awl tooth 10 rotatory, and then drive gear 9 rotatory through pivot 15, make rack 8 drive U-shaped fixation clamp 7 and the whole lift of multilayer circuit board main part 2, realize the promotion of distance between multilayer circuit board main part 2 and the casing 1, make things convenient for the air current to pass through between multilayer circuit board main part 2 and the casing 1, realize the effect of cooling.
Referring to the figure, further, the supporting structure comprises a supporting cylinder 3, a screw 4 and a clamping block 5, wherein the supporting cylinder 3 is arranged between the shell 1 and the multi-layer circuit board main body 2, the screw 4 penetrates through the shell 1, the multi-layer circuit board main body 2 and the supporting cylinder 3, the clamping block 5 is arranged at the top of the screw 4, and a limiting ring 6 is arranged at the part of the screw 4, which is positioned at the bottom of the shell 1;
when loosening bearing structure, lift stop collar 6 off for fixture block 5 no longer presses down multilayer circuit board main part 2, and then is not restricted when making things convenient for multilayer circuit board main part 2 to go up and down, and such structure has fine fixed effect when fixed, is convenient for again to untie from casing 1 outside simultaneously and fix.
Referring to the figure, further, the gear 9 is meshed with the rack 8, and the first conical teeth 10 are meshed with the second conical teeth 11;
by utilizing the first conical teeth 10 and the second conical teeth 11, the longitudinal kinetic energy is converted into transverse kinetic energy, and then the rack 8 is driven by the gear 9 to realize lifting effect.
Referring to the figure, further, an extension groove 14 is formed at the top of the housing 1, and the bottom of the rack 8 extends into the extension groove 14;
when the rack 8 is positioned at the lowest position, the rack 8 is inserted into the extension groove 14, so that the rack 8 is convenient to store, and meanwhile, the lifting stroke of the multilayer circuit board main body 2 is determined by the length of the rack 8.
Referring to the figure, further, the rotating rod 12 penetrates through the housing 1, and bearings 13 are disposed on the rotating rod 12 and located on two sides of the housing 1;
when the rotating rod 12 is installed, the bearing 13 not only has a limiting effect, but also can avoid influencing the rotation of the rotating rod 12.
The terms "center," "longitudinal," "transverse," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used for descriptive simplicity and convenience only and not as an indication or implying that the apparatus or element being referred to must have a particular orientation, be constructed and operated for a particular orientation, based on the orientation or positional relationship illustrated in the drawings, and thus should not be construed as limiting the scope of the present utility model.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (5)
1. The utility model provides a multilayer integrated circuit board convenient to heat dissipation, its characterized in that, the multilayer integrated circuit board convenient to heat dissipation includes:
the casing (1), multilayer circuit board main part (2) are installed through bearing structure at the top of casing (1), U-shaped fixation clamp (7) are installed through the binding bolt in the both sides of multilayer circuit board main part (2), and one side of U-shaped fixation clamp (7) is equipped with rack (8), gear (9) are installed through pivot (15) in one side of rack (8), still install first awl tooth (10) in pivot (15), the front end of first awl tooth (10) is equipped with second awl tooth (11), dwang (12) are installed to the bottom of second awl tooth (11).
2. The multilayer integrated circuit board for facilitating heat dissipation of claim 1, wherein: the supporting structure comprises a supporting cylinder (3), a screw rod (4) and a clamping block (5), wherein the supporting cylinder (3) is arranged between the shell (1) and the multilayer circuit board main body (2), the screw rod (4) penetrates through the shell (1), the multilayer circuit board main body (2) and the supporting cylinder (3), the clamping block (5) is arranged at the top of the screw rod (4), and the limiting ring (6) is arranged at the part, located at the bottom of the shell (1), of the screw rod (4).
3. The multilayer integrated circuit board for facilitating heat dissipation of claim 1, wherein: the gear (9) is meshed with the rack (8), and the first conical teeth (10) are meshed with the second conical teeth (11).
4. The multilayer integrated circuit board for facilitating heat dissipation of claim 1, wherein: an extension groove (14) is formed in the top of the shell (1), and the bottom of the rack (8) stretches into the extension groove (14).
5. The multilayer integrated circuit board for facilitating heat dissipation of claim 1, wherein: the rotating rod (12) penetrates through the shell (1), and bearings (13) are arranged on the rotating rod (12) and located on two sides of the shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320296331.9U CN219876233U (en) | 2023-02-23 | 2023-02-23 | Multilayer integrated circuit board convenient to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320296331.9U CN219876233U (en) | 2023-02-23 | 2023-02-23 | Multilayer integrated circuit board convenient to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876233U true CN219876233U (en) | 2023-10-20 |
Family
ID=88339420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320296331.9U Active CN219876233U (en) | 2023-02-23 | 2023-02-23 | Multilayer integrated circuit board convenient to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876233U (en) |
-
2023
- 2023-02-23 CN CN202320296331.9U patent/CN219876233U/en active Active
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| GR01 | Patent grant |