CN219873508U

CN219873508U - Transistor heat abstractor

Info

Publication number: CN219873508U
Application number: CN202321323405.XU
Authority: CN
Inventors: 严泉林; 朱一鸣
Original assignee: Guangzhou Sino Microelectronics Co ltd
Current assignee: Guangzhou Sino Microelectronics Co ltd
Priority date: 2023-05-29
Filing date: 2023-05-29
Publication date: 2023-10-20
Anticipated expiration: 2033-05-29

Abstract

The utility model discloses a transistor heat dissipation device, which comprises a clamping assembly, wherein the inside of the clamping assembly is provided with a heat dissipation assembly in a sliding manner, the heat dissipation assembly comprises a moving mechanism and a heat dissipation mechanism, the heat dissipation mechanism comprises a plurality of heat dissipation fins which are arranged in a staggered manner, the moving mechanism comprises a plurality of heat dissipation check blocks which are arranged in the clamping assembly in a sliding manner, each heat dissipation fin and each heat dissipation check block are arranged in a crossed manner, a hollow groove is formed in each heat dissipation fin, and the heat dissipation mechanism is driven to be extruded so as to drive the heat dissipation fins to protrude out of the clamping assembly. According to the transistor heat dissipation device, the transistor is clamped inside the heat dissipation assembly by pressing the transistor towards the heat dissipation seat, the heat dissipation fins protrude out to dissipate heat, and the transistor is pushed out only by pressing the heat dissipation fins when the transistor is required to be taken out; the movable frame can be made to slide laterally by the slider and the first runner, thereby changing the pitch between the connected individual internal transistors.

Description

Transistor heat abstractor

Technical Field

The utility model relates to the technical field of transistor heat dissipation, in particular to a transistor heat dissipation device.

Background

Transistors are generally referred to as single elements based on semiconductor materials, and have a variety of functions such as detection, rectification, amplification, switching, voltage regulation, signal modulation, etc., and are used for a wide variety of digital and analog functions.

As in patent CN205911298U, a heat dissipation device for a transistor is disclosed, comprising a heat sink and heat transfer members disposed on both sides of the heat sink; the heat transfer elements on two sides are respectively provided with a plurality of first installation positions and a plurality of second installation positions for installing the transistors, the distance between the first installation positions and the second installation positions is sequentially increased from the wind head end to the wind tail end of the radiating fin, the distance from the first installation position and the first second installation position of the wind head end to the wind head end is 10mm, the distance from the second first installation position to the first installation position of the wind head end is 14mm, and the distance from the second installation position to the first second installation position is 14mm. According to the crystal heat dissipation device, the first installation positions and the second installation positions which are not equidistantly arranged are adopted, so that the transistors have equal heat dissipation opportunities in the air path, the temperature difference of the heat dissipation fins is reduced, the working temperature difference of the crystals is reduced, and the damage of the crystals is prevented.

In the actual operation process, most transistor heat dissipation devices cannot be used for carrying out clamping heat dissipation on one transistor independently, the size of the transistor heat dissipation devices is large, and the transistor heat dissipation devices are small, so that the transistor heat dissipation devices are inconvenient to screw down, fix and take out.

It can be seen that the above problems exist in the prior art, and improvements are needed.

Disclosure of Invention

In view of the above problems in the prior art, an aspect of the present utility model is to provide a transistor heat dissipation device, which solves the problems that the transistor heat dissipation device is large, cannot be clamped with only one transistor, covers a layout space, has a small transistor size, and is inconvenient to be fastened and taken out by a screw.

In order to achieve the above object, the present utility model provides a transistor heat dissipating device, which comprises a clamping assembly, wherein a heat dissipating assembly is slidably disposed inside the clamping assembly, the heat dissipating assembly comprises a moving mechanism and a heat dissipating mechanism, the heat dissipating mechanism specifically comprises a plurality of heat dissipating fins which are staggered, the moving mechanism specifically comprises a plurality of heat dissipating stoppers which are slidably disposed inside the clamping assembly, each heat dissipating fin and each heat dissipating stopper are kept to be crossed, a hollow groove is formed inside the heat dissipating mechanism, and the heat dissipating mechanism is driven to be kept extruded so as to drive the heat dissipating fins to protrude outside the clamping assembly.

Through the cross arrangement of the radiating fins and the radiating stop blocks, the transistor can be pressed towards the radiating seat, the transistor can be clamped inside the radiating assembly, the radiating fins protrude out of the radiating assembly to radiate heat, and the transistor can be pushed out only by pressing the radiating fins when the transistor needs to be taken out.

Preferably, the clamping assembly comprises a clamping frame, a through groove is formed in the clamping frame, a first sliding groove is symmetrically formed in the outer wall of one side of the clamping frame with respect to the through groove, and the heat dissipation assembly is in sliding clamping connection with the inner portion of the first sliding groove.

Preferably, the moving mechanism specifically comprises a moving frame, the outer wall of one side of the moving frame, which is close to the clamping frame, is provided with a sliding block clamped in the first sliding groove, elastic propping blocks are elastically arranged on the outer walls of two opposite sides of the sliding block, the first sliding groove is in a side convex shape, and the sliding block is driven to keep pressing so as to drive the elastic propping blocks to be clamped in the first sliding groove to drive the heat dissipation assembly to be fixed in the clamping assembly.

Through the joint in the inside slider of first spout, can make the movable frame transversely slide in the joint frame, and can connect a plurality of heat abstractor through outside draw-in groove and fixture block to order about the interval between each inside transistor, and the elasticity through the slider outer wall supports the piece and to the butt of first spout, makes it to be pressed the back order about the radiator unit and keep fixed.

Preferably, the inner walls of two opposite sides of the through groove in the vertical direction are symmetrically provided with second sliding grooves, the inside of the movable frame is provided with a plurality of heat dissipation check blocks which are linearly distributed, and each heat dissipation check block is slidably clamped in the second sliding groove and is kept in contact with the second sliding groove so as to drive each heat dissipation check block to keep synchronous movement.

Preferably, a heat dissipation seat is slidably arranged in the movable frame, a plurality of heat dissipation fins are arranged on the heat dissipation seat close to the outer wall of the clamping assembly, and the heat dissipation seat is driven to keep pressing so as to drive the heat dissipation fins to protrude out of the outer wall of the clamping assembly.

Preferably, a fixed block is arranged at the bottom of the heat dissipation seat, and a plurality of pin grooves are formed in the fixed block.

Preferably, the outer walls of the two opposite sides of the clamping frame are symmetrically provided with clamping grooves and clamping blocks respectively.

The beneficial effects are that:

compared with the prior art, the transistor heat dissipation device provided by the utility model has the following beneficial effects:

1. through the cross arrangement of the radiating fins and the radiating stop blocks, the transistor can be pressed towards the radiating seat, the transistor can be clamped inside the radiating assembly, the radiating fins protrude out of the radiating assembly to radiate heat, and the transistor can be pushed out only by pressing the radiating fins when the transistor needs to be taken out.

2. Through the joint in the inside slider of first spout, can make the movable frame transversely slide in the joint frame, and can connect a plurality of heat abstractor through outside draw-in groove and fixture block to change the interval between each inside transistor, and through the elasticity butt piece of slider outer wall to the butt of first spout, make it by pressing the back order about the radiator unit keep fixed.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.

Fig. 1 is a schematic structural diagram of a transistor heat dissipation device according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of a side section of a transistor heat dissipation device according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a cross section of a heat dissipation device for a transistor according to an embodiment of the present utility model.

The main reference numerals:

1. a clamping assembly; 2. a heat dissipation assembly; 101. clamping the frame; 102. a first chute; 103. a through groove; 104. a clamping groove; 105. a clamping block; 106. a second chute; 201. a moving frame; 202. a slide block; 203. an elastic abutting block; 204. a heat dissipation stop block; 205. a heat dissipation seat; 206. a fixed block; 207. stitch grooves; 208. and a heat radiating fin.

Detailed Description

In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.

As shown in fig. 1-3, a transistor heat dissipation device comprises a clamping assembly 1, wherein a heat dissipation assembly 2 is slidably arranged in the clamping assembly 1, the heat dissipation assembly 2 comprises a moving mechanism and a heat dissipation mechanism, the heat dissipation mechanism specifically comprises a plurality of heat dissipation fins 208 which are arranged in a staggered manner, the moving mechanism specifically comprises a plurality of heat dissipation check blocks 204 which are slidably arranged in the clamping assembly 1, each heat dissipation fin 208 is arranged in a crossed manner with the heat dissipation check block 204, a hollow groove is formed in the heat dissipation mechanism, and the heat dissipation mechanism is driven to be extruded so as to drive the heat dissipation fins 208 to protrude out of the clamping assembly 1.

The main purpose of the transistor heat dissipation device is to press the transistor to the heat dissipation seat 205 through the crossing arrangement of the heat dissipation fins 208 and the heat dissipation stop blocks 204, so that the transistor is clamped inside the heat dissipation component 2, the heat dissipation fins 208 protrude outside to perform heat dissipation work, and the transistor can be pushed out only by pressing the heat dissipation fins 208 when the transistor needs to be taken out; the movable frame 201 can slide transversely in the clamping frame 101 through the sliding block 202 clamped in the first sliding groove 102, and the plurality of heat dissipation devices can be connected through the external clamping groove 104 and the clamping block 105, so that the interval between the internal transistors is changed, and the elastic abutting block 203 on the outer wall of the sliding block 202 abuts against the first sliding groove 102, so that the heat dissipation assembly 2 is driven to be kept fixed after being pressed.

In the technical scheme provided by the utility model, from fig. 1, fig. 2 and fig. 3, the joint subassembly 1 includes joint frame 101, and the inside of joint frame 101 has been seted up logical groove 103 and is used for joint radiator unit 2, and the outer wall of joint frame 101 one side still has been seted up first spout 102 about logical groove 103 symmetry, and can make radiator unit 2 joint and can slide through first spout 102.

Furthermore, the moving mechanism specifically includes a moving frame 201, and the outer wall of the moving frame 201 near one side of the clamping frame 101 is further provided with a sliding block 202 that is clamped inside the first sliding groove 102, and the outer walls of two opposite sides of the sliding block 202 are elastically provided with elastic supporting blocks 203, under the movable state, the elastic supporting blocks 203 are completely unfolded and clamped in the notch of the first sliding groove 102 near the outer wall, under the fixed state, the sliding block 202 is pressed into the notch of the first sliding groove 102 far away from the outer wall, the elastic supporting blocks 203 are extruded and contracted, and are abutted against the inner wall of the first sliding groove 102, so as to drive the clamping frame 101 to keep fixed.

Moreover, the upper and lower inner walls inside the through groove 103 are symmetrically provided with the second sliding groove 106, the inside of the moving frame 201 is further provided with a plurality of heat dissipation check blocks 204 which are linearly distributed, each heat dissipation check block 204 is slidably clamped inside the second sliding groove 106 and is kept in contact, and when the moving frame 201 moves transversely, each heat dissipation check block 204 inside can be kept to move synchronously.

Furthermore, the heat dissipation seat 205 is slidably disposed in the moving frame 201, and the heat dissipation seat 205 is further disposed near the outer wall of the clamping assembly 1, and each heat dissipation fin 208 is also linearly distributed in a row and is clamped with the heat dissipation stop block 204 in a cross manner, and a hollow groove is formed, and in an unpressed state, the heat dissipation fin 208 is flush with the outer wall of the heat dissipation stop block 204, and after being pressed, the heat dissipation fin 208 protrudes out of the outer wall of the clamping assembly 1 to perform protruding heat dissipation.

Furthermore, a fixing block 206 is further disposed at the bottom of the heat dissipation base 205, and a plurality of pin slots 207 are further disposed inside the fixing block 206, so as to fix and clamp each pin at the bottom of the protection transistor.

Furthermore, the clamping grooves 104 and the clamping blocks 105 are symmetrically arranged on the outer walls of the two opposite sides of the clamping frame 101 respectively, so that each clamping assembly 1 can be driven to transversely clamp and extend.

Working principle: when a single transistor needs to be subjected to heat dissipation, the sliding block 202 and the first sliding groove 102 drive the moving frame 201 to move to a proper position, and then the sliding block 202 is pressed into a notch of the first sliding groove 102 far away from the outer wall, and the elastic abutting block 203 is extruded and contracted to abut against the inner wall of the first sliding groove 102;

then, the transistor is attached to the heat dissipation seat 205, pins at the bottom are aligned to the pin grooves 207, the transistor is pressed inwards, the heat dissipation fins 208 distributed in a crossed manner move towards the heat dissipation stop block 204, and the heat dissipation fins 208 protrude out of the outer wall of the clamping assembly 1 to perform protruding heat dissipation;

when not in use, the transistor can be pushed out and taken away by only pressing the radiating fins 208;

when a plurality of transistors need to dissipate heat at the same time, only a single heat dissipating device is needed to be clamped and connected through the clamping groove 104 and the clamping block 105, and the distance between each transistor is adjustable through the sliding block 202 and the first sliding groove 102.

While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.

Claims

1. The utility model provides a transistor heat abstractor, its characterized in that, includes joint subassembly (1), the inside slip of joint subassembly (1) is provided with radiator unit (2), radiator unit (2) are including moving mechanism and cooling mechanism, cooling mechanism specifically includes heat dissipation fin (208) that a plurality of quantity set up alternately, moving mechanism specifically including a plurality of quantity slide set up in inside heat dissipation dog (204) of joint subassembly (1), each heat dissipation fin (208) with heat dissipation dog (204) keep alternately setting, and inside formation empty slot, cooling mechanism is driven keeps the extrusion in order to drive heat dissipation fin (208) outstanding in the outside of joint subassembly (1).

2. The transistor heat dissipation device according to claim 1, wherein the clamping assembly (1) comprises a clamping frame (101), a through groove (103) is formed in the clamping frame (101), a first sliding groove (102) is symmetrically formed on one side outer wall of the clamping frame (101) with respect to the through groove (103), and the heat dissipation assembly (2) is slidably clamped in the first sliding groove (102).

3. The transistor heat dissipation device according to claim 2, wherein the moving mechanism specifically comprises a moving frame (201), a sliding block (202) clamped inside the first sliding groove (102) is arranged on an outer wall of one side of the moving frame (201) close to the clamping frame (101), elastic supporting blocks (203) are elastically arranged on outer walls of two opposite sides of the sliding block (202), the first sliding groove (102) is in a side-convex shape, and the sliding block (202) is driven to keep pressing so as to drive the elastic supporting blocks (203) to be clamped inside the first sliding groove (102) so as to drive the heat dissipation component (2) to be fixed inside the clamping component (1).

4. A transistor heat dissipation device according to claim 3, wherein the inner walls of two opposite sides of the through groove (103) in the vertical direction are symmetrically provided with second sliding grooves (106), a plurality of heat dissipation blocks (204) linearly distributed are arranged in the moving frame (201), each heat dissipation block (204) is slidably clamped in the second sliding groove (106), and the heat dissipation blocks (204) are kept connected to drive each heat dissipation block (204) to move synchronously.

5. A transistor heat sink according to claim 3, wherein a heat sink (205) is slidably disposed in the movable frame (201), and a plurality of heat dissipation fins (208) are disposed on the heat sink (205) near the outer wall of the clamping assembly (1), and the heat sink (205) is driven to keep pressing to drive the heat dissipation fins (208) to protrude from the outer wall of the clamping assembly (1).

6. The transistor heat sink according to claim 5, wherein a fixed block (206) is provided at the bottom of the heat sink (205), and a plurality of pin slots (207) are provided in the fixed block (206).

7. The heat dissipating device for transistors according to claim 2, wherein the clamping frame (101) is symmetrically provided with a clamping groove (104) and a clamping block (105) on the outer walls of the opposite sides respectively.