CN219872350U - Intelligent data analysis system storage module - Google Patents
Intelligent data analysis system storage module Download PDFInfo
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- CN219872350U CN219872350U CN202321364734.9U CN202321364734U CN219872350U CN 219872350 U CN219872350 U CN 219872350U CN 202321364734 U CN202321364734 U CN 202321364734U CN 219872350 U CN219872350 U CN 219872350U
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- 238000007405 data analysis Methods 0.000 title claims abstract description 16
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Abstract
The utility model discloses a storage module of an intelligent data analysis system, which comprises a storage medium, a RAID module and a health management unit, wherein the storage medium is respectively in information interaction with the RAID module and the health management unit, the storage medium is formed by 8 blocks of 2.5 inch SAS/SATASSD, and the RAID module leads 8 paths of SAS3.0 to P1 connectors; the health management unit selects GD32F103VET6, the utility model adopts 8 SSDs with 2.5 inches, each SSD has 2T capacity, serial ATA is a novel hard disk interface type different from parallel ATA, has stronger error correction capability, has simple structure and supports hot plug. The energy consumption of the system can be reduced, and the complexity of the system can be reduced.
Description
Technical Field
The utility model relates to the field of data analysis, in particular to a storage module of an intelligent data analysis system.
Background
In terms of signal data processing technology, FPGAs, DSPs and microprocessors can provide an effective solution. The FPGA is suitable for continuous high-speed data pipelining, while the microprocessor supports a general-purpose system of high-level language programming and double-precision floating-point operations. The traditional single-board big data storage technology mostly uses a combination of an FPGA and a microprocessor as a management processor to perform configuration management on the on-board large-capacity SSD, DDR3/4 and various interfaces, so as to process a large amount of high-speed data streams.
The OPENVPX standard is used as a new generation serial bus standard, has the advantages of high bandwidth, strong real-time performance, flexible topological structure, strong universality, strong severe environment resistance and the like, and also represents the development trend and direction of new generation comprehensive information processing equipment. The signal processing device based on the VPX standard can have powerful signal processing, data processing capabilities, and I/O and high performance network switching capabilities. The VITA46 bus standard has larger data throughput capacity and exchange capacity, and has a slot with higher power under better heat dissipation performance, thereby fully meeting the requirements of a signal processing system on bandwidth and arithmetic processing capacity. The VPX standard adopts high-speed high-density connectors, the serial number can reach 10Gbps, high-speed serial rapidIO, PCIe communication protocols and the like are supported, a switching slot is defined, and a centralized switching mode, a distributed switching mode and the like are supported.
Referring to fig. 1, a similar technical scheme is that a prior art 3u open VPXSATA protocol memory card is used for storing technical files, a two-way sataii protocol is adopted, a domestic industrial-grade solid state disk is built in, a single-way SATA sequential read-write speed is greater than 500MB/s, and a maximum total capacity of random read/write IOPS is greater than 75 and can reach 4TB, so that the memory card is suitable for industrial data storage, especially for high-impact and high-vibration application environments.
The relevant technical indexes in fig. 1 are as follows:
the domestic autonomous controllable solid state disk technology comprises the steps of supporting wear balance, bad block management, ECC error correction, power-off protection, SMART and the like
● High reliability, high transmission rate VPX host interface supporting 2 SATA (6.0 Gbps)
● Maximum capacity 4TB
● Read-write performance, single path SATA maximum sequential read-write speed 530/500MB/s
● The working temperature range is-40 ℃ to +85 ℃.
Disclosure of Invention
Aiming at the defects existing in the prior art, the utility model provides an intelligent data analysis system storage module, 8 SSDs with 2T capacity are adopted for each SSD, serial ATA is a novel hard disk interface type different from parallel ATA, has stronger error correction capability, has a simple structure, and supports hot plug. The energy consumption of the system can be reduced, and the complexity of the system can be reduced.
In order to achieve the above object, the present utility model provides the following technical solutions
The intelligent data analysis system storage module comprises a storage medium, a RAID module and a health management unit, wherein the storage medium is respectively in information interaction with the RAID module and the health management unit, the storage medium is formed by 8 blocks of 2.5 inch SAS/SATASSD, and the RAID module leads 8 paths of SAS3.0 to P1 connectors; and the health management unit selects GD32F103VET6.
As a further aspect of the utility model, the external connection interface is a VITA46 standard VPX connector and a front panel corresponding interface.
As a further aspect of the utility model, 16 LEDs are LED to the front panel, with one movable indicator light and one positioning light for each tray.
As a further aspect of the present utility model, the 8-block 2.5-inch SAS/satssd is divided into 4 groups of 2-block 2.5-inch SAS/satssd.
As a further scheme of the utility model, the front panel status lamp and the system power-on and time management are realized by OBC.
The utility model has the following beneficial effects
The intelligent data analysis system storage module provided by the utility model adopts 8 SSDs with 2.5 inches, each SSD has 2T capacity, serial ATA is a novel hard disk interface type different from parallel ATA, has stronger error correction capability, and has a simple structure and supports hot plug. The energy consumption of the system can be reduced, and the complexity of the system can be reduced.
In order to more clearly illustrate the structural features and efficacy of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings and examples.
Drawings
FIG. 1 is a general block diagram of a memory card of the prior art according to the present utility model.
FIG. 2 is a schematic block diagram of a memory module of the intelligent data analysis system of the present utility model.
Detailed Description
The utility model will be further described in the following clear and complete description with reference to the figures and the associated knowledge, it being evident that the described applications are only some, but not all embodiments of the utility model.
In fig. 1, the existing data storage technology has the defects of small storage capacity, low transmission rate, imperfect expansibility and management mechanism, weak environment adaptability and the like, and the types of the general memory boards meeting the requirements of the military industry are limited.
The intelligent data analysis system memory module provided by the utility model is designed to be a general, high-performance, high-capacity, high-speed, high-real-time and high-bandwidth military grade VITA46 standard memory board card suitable for complex environments. Is a VITA46 standard memory board card with large capacity and high expansibility in industry.
Referring to FIG. 2, the memory module is composed of 8 SATASSD stacks;
selecting GD32F103VET6 as a health management unit;
on-board 16-32 TB, the maximum recording speed of the module is 3.3GB/s;
the external connection interface is a VITA46 standard VPX connector and a front panel corresponding interface;
in the utility model, 8 blocks of 2.5-inch SAS/SATASSD are selected as storage media by the storage module;
RAID leads to 8 SAS3.0 to P1 connectors;
the module leads 16 paths of LEDs to the front panel, and each tray is provided with a movable indicator lamp and a positioning lamp;
the front panel status lamp and the system power-on and time management are realized by an OBC (GD 32F103VET 6);
providing a visual interface management tool, and performing operations such as storage medium formatting, file management and the like;
the device has over-temperature, over-voltage, under-voltage and over-current protection functions;
the card supports data playback functions.
The utility model relates to a VITA46 standard memory board card with the highest performance in the industry, and the board card function is required to be selected and divided to a certain extent by adopting an alternative scheme. In the alternative, the management chip may consider adding FPGAs and CPUs, but its programming process may be somewhat complex.
In the utility model, the on-board high-performance processor has a large capacity high-speed memory, has extremely wide application range and quality grade reaching the military standard, and specifically comprises;
the high-speed data management technology adopts 8 SSDs with 2T capacity, serial ATA is a novel hard disk interface type different from parallel ATA, has stronger error correction capability, simple structure and supports hot plug. The energy consumption of the system can be reduced, and the complexity of the system can be reduced.
The ultra-large capacity storage technology is characterized in that 8 industrial grade SSDs of 2.5 inches are integrated on board, each SSD is selected to be 2TB capacity, and the physical capacity of a single module is 16TB. The method is suitable for most reference scenes, when the SSD capacity of the subsequent single disk reaches 4TB, the SSD disk is replaced, and the whole physical capacity can reach 32TB.
Among factors affecting stability of electronic devices, the quality of devices and the robustness of programs are major factors in high-speed circuit design technology. The reasonable layout and wiring in the design process has stronger adaptability to the environment. In the utility model, more than 70% of the signals are high-speed signals, and the utility model has the characteristics of small ripple wave and quick response to power supply. In order to meet the requirements, besides high Tg and low loss materials (such as Tu 872) are used in the production and processing of the PCB, SI and PI are also used in the design to carry out design simulation analysis so as to achieve the purpose of improving the stability of equipment, and the problems of a PDN network and high-speed signals are particularly considered.
It is not difficult to find out that the power supply ripple and the transient response are a pair of twin brothers, the transient response is deteriorated when the low ripple is pursued, on the contrary, the ripple is increased, and the problem of selecting the balance point of the ripple and the transient response is involved in the design. In the utility model, for high ripple requirements, a power supply with low requirements on transient response and current (such as an analog power supply in an ASIC) is designed to adopt an LDO power supply mode, and a power supply with high transient response and large current is designed to adopt a DC-DC power supply mode, so that the ripple meets the design requirements, the ripple is processed in a mode of adding a filter capacitor, PDN network analysis is performed for balancing the ripple and the transient response by using PI simulation software in the design, the optimal filter capacitor quantity and placement position are further determined, and meanwhile, the capacitance with the same capacitance is processed in a mode of matching the capacitance with the same capacitance as much as possible during design, so that the negative influence of ESR on the PDN network is reduced as much as possible.
The definition of high-speed signals is different in different fields, but it is unquestionable that signals higher than 1Gbps are high-speed signals, and more than 70% of signals in the design exceed the range. For high-speed signals, the problems mainly exist in signal reflection caused by impedance discontinuity, signal fading caused by board loss factors and crosstalk caused by coupling of electromagnetic signals. For the problem of discontinuous impedance, the design is carried out by controlling differential impedance, meanwhile, the number of the through holes is reduced, and when the through holes are unavoidable, the backflow ground holes are added around the through holes to protect high-speed signals; for the problem of signal fading caused by plate loss factors, a plate with high Tg and low loss factors (such as TU 872) is selected for processing during PCB production; for the crosstalk problem caused by the coupling of electromagnetic signals, the coupling with other signal networks needs to be reduced during design, and parallel wires are reduced, so that the mutual distance is pulled as far as possible when the parallel wires are unavoidable. In addition, SI simulation software is comprehensively used for carrying out PCB front simulation and rear simulation, and the PCB wiring is reversely adjusted according to simulation results, so that the wiring is as reasonable as possible. For a 40G network, eye diagram simulation is carried out through an IBIS model provided by a device manufacturer, and then corresponding indexes are adjusted, so that the signal quality is improved.
The heat design technology, ideal equipment can not produce heat, but real equipment can continuously generate heat in the use, can suddenly break down when reaching a certain temperature point, and the device damage that has just appeared overheated production, in order to solve this problem, often takes away the heat through the mode of conduction in the design, makes the device work in reasonable temperature range, adopts software to carry out thermal simulation's mode to assist the design in this design, strives to accomplish rationally feasible overall arrangement, and the radiating mode easily realizes simultaneously.
(a) High temperature design
The power consumption of the module is much higher than that of a common embedded system, and how to quickly dissipate heat in a sealed chassis ensures the reliable operation of the system in various severe environments and presents challenges to thermal design. The key to solving the problem is in two aspects, namely how to transfer the power consumption on the module to the chassis sidewall heat sink as soon as possible. The module is transferred to the side wall radiator of the case, and mainly adopts a conduction mode.
(b) Cryogenic design
Because the low-temperature working temperature is-40 ℃, different processing methods are adopted aiming at different modules in order to ensure that each module can be started normally, besides selecting chips with good low-temperature performance as much as possible during circuit design, devices and modules are subjected to ageing screening, components with poor low-temperature performance are eliminated, and components with good low-temperature performance are selected. Ensure that the whole machine can work normally at the temperature of minus 40 ℃.
The utility model has the following beneficial effects: the utility model adopts 8 SSDs with 2.5 inch, each SSD has 2T capacity, and SATA is a novel hard disk interface type different from PATA, has stronger error correction capability, has simple structure and supports hot plug; the storage capacity is large, the storage space of the on-board SSD is 16 TB-32 TB, the maximum speed is 3.3GB/s, and the custom file system is supported. A large amount of data in the signal processing process can be cached, so that a plentiful storage space is provided; the transmission rate is high, the external data transmission interface can reach 10Gbps standard, the read-write maximum speed of the on-board SSD is 3.3GB/s, and the storage requirement of communication high-speed data can be met; the utility model is provided with a special BMC to provide comprehensive temperature and power protection, and provides over-temperature, over-voltage, under-voltage, over-current and other protection functions for the board card, so that the safe work of the board card is ensured, and the board card is suitable for a complex working environment; the utility model integrates a high-performance processor, a high-capacity high-speed memory and a high-bandwidth interface, is suitable for ground, carrier-based and airborne large SAR imaging, high-speed signal processing of a phased array radar system and data storage calculation during data processing, and is also suitable for real-time signal processing in the fields of sonar and software radio. The quality grade can simultaneously meet the requirements of business grade, industrial grade and military grade and meet most application requirements.
The technical principle of the present utility model has been described above in connection with specific embodiments, but is only the preferred embodiment of the present utility model. The protection scope of the present utility model is not limited to the above embodiments, and all technical solutions belonging to the concept of the present utility model belong to the protection scope of the present utility model. Other embodiments of the utility model will occur to those skilled in the art without the exercise of inventive effort and are intended to fall within the scope of the utility model.
Claims (6)
1. The intelligent data analysis system storage module is characterized by comprising a storage medium, a RAID module and a health management unit, wherein the storage medium is respectively in information interaction with the RAID module and the health management unit, the storage medium is formed by 8 blocks of 2.5 inch SAS/SATASSD, and the RAID module leads 8 paths of SAS3.0 to P1 connectors; and the health management unit selects GD32F103VET6.
2. The intelligent data analysis system storage module of claim 1, wherein the external connection interface is a VITA46 standard VPX connector.
3. The intelligent data analysis system storage module of claim 2, wherein each tray has a movable indicator light and a positioning light by directing 16 LEDs to the front panel.
4. The intelligent data analysis system storage module of claim 3, wherein the 8 blocks of 2.5 inch SAS/satasassd are divided into 4 groups of 2 blocks of 2.5 inch SAS/satasassd.
5. The intelligent data analysis system storage module of claim 4, wherein the front panel status lights, system power-on and timing management are implemented by an OBC.
6. The intelligent data analysis system storage module of claim 4, wherein each block of 2.5 inch SAS/satasassd has a capacity of 2T.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202321364734.9U CN219872350U (en) | 2023-05-31 | 2023-05-31 | Intelligent data analysis system storage module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202321364734.9U CN219872350U (en) | 2023-05-31 | 2023-05-31 | Intelligent data analysis system storage module |
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| CN202321364734.9U Active CN219872350U (en) | 2023-05-31 | 2023-05-31 | Intelligent data analysis system storage module |
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