CN219861651U - Electroplating device - Google Patents

Electroplating device Download PDF

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Publication number
CN219861651U
CN219861651U CN202321283048.9U CN202321283048U CN219861651U CN 219861651 U CN219861651 U CN 219861651U CN 202321283048 U CN202321283048 U CN 202321283048U CN 219861651 U CN219861651 U CN 219861651U
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China
Prior art keywords
tank
heating
electroplating
pipeline
pipe
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CN202321283048.9U
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Chinese (zh)
Inventor
石宁
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Jiangmen Gaozhi Electronic Technology Co ltd
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Jiangmen Gaozhi Electronic Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Electroplating Methods And Accessories (AREA)

Abstract

The utility model discloses an electroplating device, comprising: plating bath; the auxiliary tank is communicated with the electroplating tank through a connecting pipe; the heating system comprises a heating tank and a heating rod, water is contained in the heating tank, the heating rod is arranged in the heating tank and located below the liquid level of the heating tank, the heating rod is connected with an external power supply through a wire, a first pipeline and a second pipeline are arranged at the top of the heating tank, the first pipeline is connected with the electroplating tank, and the second pipeline is connected with the auxiliary tank. When the electroplating device works, the heating rod is electrified and generates heat so as to heat water in the heating tank, the water is heated to become hot air, and the hot air enters the electroplating tank and the auxiliary tank through the first pipeline and the second pipeline respectively so as to heat electroplating liquid in the electroplating tank and the auxiliary tank. According to the electroplating device provided by the embodiment of the utility model, the electroplating solution in the electroplating tank and the auxiliary tank is heated through the heating system, so that the activity of the electroplating solution is increased, the electroplating effect is improved, and the product quality is improved.

Description

Electroplating device
Technical Field
The utility model relates to the technical field of electroplating, in particular to an electroplating device.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by utilizing the electrolysis principle, and is a process of adhering a metal film on the surface of the metal or other material parts by utilizing the electrolysis so as to play roles of preventing the metal from being oxidized (such as rust), improving the wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate and the like), improving the beauty and the like. Wherein, in the process of electroplating, the activity of the electroplating liquid is lower, so that the electroplating effect is poor and the product quality is affected.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides an electroplating device, wherein the electroplating solution in the electroplating tank and the auxiliary tank is heated by the heating system, so that the activity of the electroplating solution is increased, the electroplating effect is improved, and the product quality is improved.
According to an embodiment of the present utility model, an electroplating apparatus includes: plating bath; the auxiliary tank is communicated with the electroplating tank through a connecting pipe; the heating system comprises a heating tank and a heating rod, water is contained in the heating tank, the heating rod is arranged in the heating tank and located below the liquid level of the heating tank, the heating rod is connected with an external power supply through a wire, a first pipeline and a second pipeline are arranged at the top of the heating tank, the first pipeline is connected with the electroplating tank, and the second pipeline is connected with the auxiliary tank.
The electroplating device provided by the embodiment of the utility model has at least the following beneficial effects: when the electroplating device works, the heating rod is electrified and generates heat so as to heat water in the heating tank, the water is heated to become hot air, and the hot air enters the electroplating tank and the auxiliary tank through the first pipeline and the second pipeline respectively so as to heat electroplating liquid in the electroplating tank and the auxiliary tank. According to the electroplating device provided by the embodiment of the utility model, the electroplating solution in the electroplating tank and the auxiliary tank is heated through the heating system, so that the activity of the electroplating solution is increased, the electroplating effect is improved, and the product quality is improved.
According to the electroplating device provided by the embodiment of the utility model, the electroplating tank and the auxiliary tank are provided with temperature sensors, the first pipeline and the second pipeline are provided with regulating valves, and the temperature sensors are connected with the regulating valves.
According to the electroplating device provided by the embodiment of the utility model, the first pipeline and the second pipeline are provided with heat insulation layers.
According to the electroplating device disclosed by the embodiment of the utility model, the heating rod comprises the fixing part and the heating part, the fixing part is arranged at the top end of the heating part, the fixing part penetrates through the top of the heating groove, the heating part stretches into the heating groove, and the conducting wire is connected with the fixing part.
According to the electroplating device provided by the embodiment of the utility model, the heating system further comprises a hot water pipe, wherein the hot water pipe is arranged in the heating tank and is positioned below the liquid level of the heating tank, and the hot water pipe is used for circulating hot water.
According to the electroplating device provided by the embodiment of the utility model, the hot water pipe is connected with the boiler, and the boiler is arranged at one side of the heating tank.
According to the electroplating device disclosed by the embodiment of the utility model, the connecting pipe is provided with the filter pump, and the top of the filter pump is provided with the exhaust hole.
According to the electroplating device provided by the embodiment of the utility model, the exhaust hole is provided with the exhaust pipe, and the exhaust pipe is connected with the auxiliary groove.
According to the electroplating device of the embodiment of the utility model, the connecting pipe is provided with a flowmeter, and the flowmeter is positioned at the downstream of the filtering pump.
According to the electroplating device provided by the embodiment of the utility model, the electroplating tank is provided with the overflow hole, and the overflow hole is connected with the auxiliary tank through the overflow pipe.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic view of an electroplating apparatus according to some embodiments of the present utility model;
FIG. 2 is a schematic view of an electroplating apparatus according to other embodiments of the present utility model;
FIG. 3 is a schematic view showing a heating system in an electroplating apparatus according to still other embodiments of the present utility model.
Reference numerals illustrate:
plating cell 100; an overflow pipe 110; a sub-tank 200; a connection pipe 210; a filter pump 220; an exhaust pipe 230; an exhaust valve 240; a flow meter 250; a heating tank 310; a heating rod 320; a fixing portion 321; a heat generating portion 322; a first conduit 330; a second conduit 340; a water inlet pipe 350; a water inlet valve 351; a regulating valve 360; a hot water pipe 370; a water inlet end 371; a water outlet 372; a heat exchanging portion 373; a boiler 380.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Referring to fig. 1 to 3, an embodiment of the present utility model provides an electroplating apparatus including: plating cell 100; sub-tank 200 communicates with plating tank 100 via connection pipe 210; the heating system comprises a heating tank 310 and a heating rod 320, wherein water is contained in the heating tank 310, the heating rod 320 is arranged in the heating tank 310 and positioned below the liquid level of the heating tank 310, the heating rod 320 is connected with an external power supply through a wire, a first pipeline 330 and a second pipeline 340 are arranged at the top of the heating tank 310, the first pipeline 330 is connected with the electroplating tank 100, and the second pipeline 340 is connected with the auxiliary tank 200.
In operation, the heating rod 320 is energized and generates heat to heat water in the heating tank 310, the water is heated to become hot gas, and the hot gas enters the plating tank 100 and the auxiliary tank 200 through the first pipeline 330 and the second pipeline 340, respectively, to heat the plating solution in the plating tank 100 and the auxiliary tank 200. According to the electroplating device disclosed by the embodiment of the utility model, the electroplating solution in the electroplating tank 100 and the auxiliary tank 200 is heated by the heating system, so that the activity of the electroplating solution is increased, the electroplating effect is improved, and the product quality is improved.
Referring to fig. 1 to 3, the heating rod 320 includes a fixing portion 321 and a heating portion 322, the fixing portion 321 is disposed at a top end of the heating portion 322, the fixing portion 321 is disposed at a top of the heating slot 310 in a penetrating manner, the heating portion 322 extends into the heating slot 310, and the wire is connected to the fixing portion 321. By fixing the heating rod 320 at the top of the heating tank 310, the result is simple and the operation is easy. It will be appreciated that the heating tank 310 is provided with a water inlet pipe 350, the water inlet pipe 350 is provided with a water inlet valve 351, a liquid level sensor is provided in the heating tank 310, and the liquid level sensor is also connected with the water inlet valve 351. Along with the evaporation of the water in the heating tank 310, the liquid level gradually drops, when the liquid level is lower than the preset position, the liquid level sensor transmits information to the water inlet valve 351, at this time, the water inlet valve 351 is opened, and the water in the water inlet pipe 350 enters the heating tank 310, so that automatic water inlet is realized. Through the structure, automatic operation is realized, labor intensity is reduced, and working efficiency is improved.
It is easily understood that plating cell 100 and sub-cell 200 are provided with temperature sensors, and first pipe 330 and second pipe 340 are provided with a regulating valve 360, and the temperature sensors are connected to regulating valve 360. Wherein the temperature sensor is used to detect the temperature of the plating solution in the plating vessel 100 and the sub-vessel 200. According to the temperature conditions of the plating solution in the plating tank 100 and the sub-tank 200, the adjusting valve 360 is controlled, so that the flow rates of the first pipeline 330 and the second pipeline 340 are changed, the plating solution is kept at a certain temperature, the activity of the plating solution is ensured, and the plating efficiency is improved. Further, the first pipe 330 and the second pipe 340 are provided with heat insulation layers, so that heat loss of hot air in the first pipe 330 and the second pipe 340 can be avoided, and heating effect is enhanced.
Referring to fig. 1 to 2, in the present embodiment, a connection pipe 210 is provided with a filter pump 220, and the top of the filter pump 220 is provided with an exhaust hole. The plating liquid in sub-tank 200 is filtered by filter pump 220 and fed into plating tank 100 so as to improve plating quality; by providing the vent hole, the saturated gas in the plating solution is exhausted in the filter pump 220, and the exhausted gas flows out from the vent hole, thereby improving the removal effect of the saturated gas in the plating solution. Further, during the process of exhausting by using the exhaust hole, a part of the plating liquid flows out of the exhaust hole. In order to avoid waste of the plating liquid, the exhaust hole is provided with an exhaust pipe 230, and the exhaust pipe 230 is connected to the sub-tank 200 such that the plating liquid flows back into the reservoir sub-tank 200 through the exhaust pipe 230. It is easy to understand that the exhaust pipe 230 is provided with the exhaust valve 240, so that the flow of the exhaust pipe 230 can be adjusted to adapt to different use scenes, and the application range is enlarged. It is conceivable that the connection pipe 210 is provided with a flow meter 250, the flow meter 250 being located downstream of the filter pump 220. By providing the flowmeter 250, the flow rate of the connection pipe 210 can be adjusted, and the effect of removing the saturated gas in the plating liquid can be improved. Wherein, the flow rate of the flowmeter 250 is not higher than/hour, which can prevent the electroplating solution from generating new gas in the electroplating bath 100, reduce the risk of needle point plating and improve the product quality.
Referring to fig. 1 and 2, in some embodiments, plating cell 100 is provided with overflow apertures that are connected to secondary tank 200 by overflow tube 110. By providing the overflow holes, when the plating solution in the plating tank 100 reaches the overflow holes, the plating solution flows back into the sub-tank 200 from the overflow holes, thereby ensuring that the liquid level in the plating tank 100 remains unchanged and improving the product quality.
Referring to fig. 2 and 3, in some embodiments, the heating system further includes a hot water pipe 370, the hot water pipe 370 being disposed within the heating tank 310 below the liquid surface of the heating tank 310, the hot water pipe 370 being for circulation of hot water. Through being provided with hot-water line 370, when outage or heating rod 320 damage, can let in hot-water line 370 and carry out the heat transfer with the water in the heating tank 310, can be with the heating of realizing the water in the heating tank 310, guarantee the continuity of work, improve production efficiency. Wherein, the hot water pipe 370 includes a water inlet 371, a water outlet 372 and a heat exchange portion 373, the water inlet 371 and the water outlet 372 are respectively connected with two ends of the heat exchange portion 373, and the water inlet 371 and the water outlet 372 penetrate through the heating tank 310 to extend outwards, so as to realize circulation of hot water. The heat exchanging portion 373 is disposed in the heating tank 310 and below the liquid surface. The hot water enters the heat exchange part 373 through the water inlet end 371, the hot water in the heat exchange part 373 transfers heat to the water in the heating tank 310 to heat the water, and meanwhile, the water in the heating tank 310 cools the hot water to realize heat exchange; finally, the heat exchanged water flows out through the water outlet 372. The heat exchanging portion 373 has a reciprocating serpentine structure, so that the contact area can be increased, and the heat exchanging efficiency can be improved. It is conceivable that a boiler 380 is connected to the hot water pipe, and the boiler 380 is provided at one side of the heating tank 310. By heating the boiler 380, the water temperature in the boiler 380 is increased and then enters the hot water pipe 370 to heat the heating tank 310, and the heating device is simple in structure and convenient to operate.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An electroplating apparatus, comprising:
plating bath;
the auxiliary tank is communicated with the electroplating tank through a connecting pipe;
the heating system comprises a heating tank and a heating rod, water is contained in the heating tank, the heating rod is arranged in the heating tank and located below the liquid level of the heating tank, the heating rod is connected with an external power supply through a wire, a first pipeline and a second pipeline are arranged at the top of the heating tank, the first pipeline is connected with the electroplating tank, and the second pipeline is connected with the auxiliary tank.
2. Electroplating device according to claim 1, characterized in that the electroplating tank and the secondary tank are provided with temperature sensors, the first and the second pipe being provided with regulating valves, the temperature sensors being connected to the regulating valves.
3. The plating apparatus as recited in claim 2, wherein said first conduit and said second conduit are provided with a thermal insulation layer.
4. The plating apparatus as recited in claim 1, wherein said heating rod includes a fixing portion and a heat generating portion, said fixing portion is disposed at a top end of said heat generating portion, said fixing portion is disposed through a top portion of said heating tank, said heat generating portion extends into said heating tank, and said wire is connected to said fixing portion.
5. The plating apparatus as recited in claim 1, wherein said heating system further comprises a hot water pipe disposed in said heating tank below a liquid surface of said heating tank, said hot water pipe being for circulation of hot water.
6. The plating apparatus as recited in claim 5, wherein said hot water pipe is connected with a boiler, said boiler being provided at one side of said heating tank.
7. Electroplating device according to claim 1, wherein the connecting tube is provided with a filter pump, the top of which is provided with an exhaust vent.
8. The plating device as recited in claim 7, wherein said exhaust hole is provided with an exhaust pipe, said exhaust pipe being connected to said sub-tank.
9. Electroplating device according to claim 7, wherein the connecting tube is provided with a flow meter, which is located downstream of the filter pump.
10. Electroplating device according to claim 1, characterized in that the electroplating tank is provided with overflow apertures, which are connected to the secondary tank by overflow pipes.
CN202321283048.9U 2023-05-24 2023-05-24 Electroplating device Active CN219861651U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321283048.9U CN219861651U (en) 2023-05-24 2023-05-24 Electroplating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321283048.9U CN219861651U (en) 2023-05-24 2023-05-24 Electroplating device

Publications (1)

Publication Number Publication Date
CN219861651U true CN219861651U (en) 2023-10-20

Family

ID=88333062

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321283048.9U Active CN219861651U (en) 2023-05-24 2023-05-24 Electroplating device

Country Status (1)

Country Link
CN (1) CN219861651U (en)

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