CN215560780U - Electroplating heat exchange device for copper foil production - Google Patents
Electroplating heat exchange device for copper foil production Download PDFInfo
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- CN215560780U CN215560780U CN202121519482.3U CN202121519482U CN215560780U CN 215560780 U CN215560780 U CN 215560780U CN 202121519482 U CN202121519482 U CN 202121519482U CN 215560780 U CN215560780 U CN 215560780U
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Abstract
The utility model belongs to the technical field of copper foil production equipment, and discloses an electroplating heat exchange device for copper foil production, which comprises an electroplating bath, an electrolyte preparation tank and a heat exchanger, wherein the electrolyte preparation tank and the heat exchanger are arranged below the electroplating bath, a first temperature detector is arranged in the electroplating bath, a second temperature detector is arranged in the electrolyte preparation tank, a liquid output pipe is arranged at the bottom side of the electroplating bath, the tail end of the liquid output pipe is connected with a three-way pipe, one end of the three-way pipe is connected with a heat exchange pipeline passing through the heat exchanger, the other end of the three-way pipe is connected with an electrolyte return pipe leading to the top side of the electrolyte preparation tank, and a control unit for controlling the flow proportion of electrolyte leading to the heat exchange pipeline and the electrolyte return pipe is arranged in the three-way pipe. According to the utility model, through the feedback of the first detector and the second detector, the control unit controls the flow of the liquid to the heat exchange pipeline, so that the liquid flowing back to the electrolyte preparation tank is maintained within a certain temperature range, the energy is saved, the consumption is reduced, and the best electroplating effect is ensured.
Description
Technical Field
The utility model belongs to the technical field of copper foil production equipment, and particularly relates to an electroplating heat exchange device for copper foil production.
Background
The production of the electrolytic copper foil is divided into four procedures of copper dissolution, raw foil manufacturing, surface treatment and slitting, wherein the copper dissolution procedure and the surface treatment process both need a large number of heat exchange systems, a copper layer needs to be electroplated on an electroplating bath in the surface treatment process, each heat exchange system is provided with a heat exchanger and a liquid raising pump in the process, the power of the pump is 5-100 kw, the energy consumption caused by the heat exchange system is quite large every day, but the requirements of energy conservation, consumption reduction and carbon emission reduction are higher and higher along with the national requirements, and the high-power-consumption equipment can be used less and used as little as possible.
In addition, in the process, the temperature of the electrolyte of the electroplating bath needs to be controlled within a certain range to achieve the best effect, the electrolyte output by the electroplating bath flows back to the electrolyte preparation tank after being subjected to heat exchange through the heat exchange system by the conventional heat exchange device, so that the electroplating effect of the electroplating bath is influenced due to the over-low temperature of the electrolyte, and the heating device of the electroplating bath needs to be started to heat the electrolyte, thereby wasting energy consumption.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an electroplating heat exchange device for copper foil production, which aims to solve the problems that the existing electroplating heat exchange device cannot adjust the flow of heat exchange liquid according to the temperature of liquid in an electrolytic bath, the electroplating effect is not optimal easily, and energy consumption is wasted.
In order to achieve the purpose, the utility model provides the following technical scheme:
an electroplating heat exchange device for copper foil production comprises an electroplating bath, an electrolyte preparation tank and a heat exchanger, wherein the electrolyte preparation tank and the heat exchanger are arranged below the electroplating bath, a first temperature detector is arranged in the electroplating bath, a second temperature detector is arranged in the electrolyte preparation tank, a liquid output pipe is arranged on the bottom side of the electroplating bath, the tail end of the liquid output pipe is connected with a three-way pipe, one end of the three-way pipe is connected with a heat exchange pipeline passing through the heat exchanger, the other end of the three-way pipe is connected with an electrolyte return pipe leading to the top side of the electrolyte preparation tank, and a control unit used for controlling the electrolyte flow proportion leading to the heat exchange pipeline and the electrolyte return pipe is arranged in the three-way pipe.
In the electroplating heat exchange device for copper foil production, the control unit is an electric butterfly valve arranged on a branch port in the tee pipe.
In the electroplating heat exchange device for copper foil production, the control unit comprises a first electric proportional valve arranged at one end of the three-way pipe connected with the heat exchange pipeline and a second electric proportional valve arranged at one end of the three-way pipe connected with the electrolysis return pipe.
In the electroplating heat exchange device for copper foil production, one end of the heat exchange pipeline is connected with the three-way pipe, and the other end of the heat exchange pipeline is connected with the electrolyte preparation tank.
In the electroplating heat exchange device for copper foil production, an electrolyte output pipe is arranged at the bottom side of the electrolyte preparation tank, the electrolyte output pipe is connected with a liquid pumping pump, and a liquid output end of the liquid pumping pump is connected with a liquid input pipe leading to the top side of an electroplating tank.
In the electroplating heat exchange device for copper foil production, a third electric proportional valve for controlling the flow of the electrolyte output by the electroplating bath is arranged in the liquid output pipe.
In the electroplating heat exchange device for copper foil production, the heat exchange pipeline comprises a heat exchange section passing through the heat exchanger and a backflow section flowing back to the electrolyte preparation tank after heat exchange, and a fourth electric proportional valve is arranged between the heat exchange section and the backflow section.
In the electroplating heat exchange device for copper foil production, the lowest part of the electroplating bath is 2-5m higher than the highest part of the electrolytic preparation bath, and the lowest part of the electroplating bath is 1-4m higher than the highest part of the heat exchanger.
Compared with the prior art, the utility model has the beneficial effects that: through the feedback of the first detector and the second detector, the control unit controls the flow of the liquid to the heat exchange pipeline, so that the liquid flowing back to the electrolyte preparation tank is maintained within a certain temperature range, energy is saved, consumption is reduced, and the best electroplating effect can be ensured.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
FIG. 2 is an enlarged view of part A of example 1 of the present invention;
fig. 3 is a schematic structural diagram of embodiment 2 of the present invention.
In the figure: 1. the device comprises an electroplating bath, 2, an electrolyte preparation tank, 3, a heat exchanger, 4, a liquid output pipe, 5, a three-way pipe, 6, a heat exchange pipeline, 7, an electrolyte return pipe, 8, an electrolyte output pipe, 9, a liquid raising pump, 10, a liquid input pipe, 401, a third electric proportional valve, 501, an electric butterfly valve, 502, a first electric proportional valve, 503, a second electric proportional valve, 601, a heat exchange section, 602, a return section, 603 and a fourth electric proportional valve.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
Referring to fig. 1-2, the present invention provides a technical solution: an electroplating heat exchange device for copper foil production comprises an electroplating bath 1, an electrolyte preparation tank 2 and a heat exchanger 3, wherein a first temperature detector (not shown in the figure) is arranged in the electroplating bath 1, a second temperature detector (not shown in the figure) is arranged in the electrolyte preparation tank 2, a liquid output pipe 4 is arranged at the bottom side of the electroplating bath 1, the tail end of the liquid output pipe 4 is connected with a three-way pipe 5, one end of the three-way pipe 5 is connected with a heat exchange pipeline 6 passing through the heat exchanger 3, the other end of the three-way pipe is connected with an electrolyte return pipe 7 leading to the top side of the electrolyte preparation tank 2, and a control unit used for controlling the electrolyte flow proportion of the heat exchange pipeline 6 and the electrolyte return pipe 7 is arranged in the three-way pipe 5.
Furthermore, one end of the heat exchange pipeline 6 is connected with the three-way pipe 5, and the other end is connected with the electrolyte preparation tank 2.
In practical application, after electroplating in the electroplating bath 1, the electrolyte flows out from the liquid output pipe 4, passes through the three-way pipe 5, the control unit of the three-way pipe 5 is started, the electrolyte flow rates to the heat exchange pipeline 6 and the electrolyte return pipe 7 are distributed according to the temperature conditions of the electrolyte in the electroplating bath 1 and the electrolyte preparation tank 2 fed back by the first temperature detector and the second temperature detector, the electrolyte in the heat exchange pipeline 6 exchanges heat through the heat exchanger 3 and then returns to the electrolyte preparation tank 2, and the electrolyte in the electrolyte return pipe 7 directly returns to the electrolyte preparation tank 2.
In this embodiment, the control unit is an electric butterfly valve 501 provided at a branch point in the tee pipe 5.
In practical application, according to the temperature condition of the electrolyte in the electroplating bath 1 and the electrolyte preparation tank 2 fed back by the first temperature detector and the second temperature detector, the electric butterfly valve 501 rotates by a certain angle, so that one part of the electrolyte falling from the liquid output pipe 4 directly falls to the electrolyte return pipe 7 from the opening on the left side of the electric butterfly valve 501, and the other part falls to the heat exchange pipeline 6 from the right side of the electric butterfly valve 501 according to the inclination angle of the electric butterfly valve 501.
In the present embodiment, an electrolyte outlet pipe 8 is disposed at the bottom side of the electrolyte preparation tank 2, the electrolyte outlet pipe 8 is connected with a pumping pump 9, and a liquid outlet end of the pumping pump 9 is connected with a liquid inlet pipe 10 leading to the top side of the electroplating tank 2.
Preferably, the lowest part of the plating bath 1 is 2 to 5m higher than the highest part of the electrolytic preparation tank 2, and the lowest part of the plating bath 1 is 1 to 4m higher than the highest part of the heat exchanger 3, and the function of the plating bath is that the electrolyte in the plating bath 1 can naturally fall to the pipe heat pipe 6 and the electrolyte return pipe 7 through gravity.
In practical applications, the pumping pump 9 pumps the electrolyte in the electrolyte preparation tank 2 to the plating tank 1 for use, and after use, the electrolyte in the plating tank 1 falls down from the liquid inlet pipe 4 by gravity.
In this embodiment, preferably, a third electric proportional valve 401 for controlling the flow rate of the electrolyte output by the electroplating tank 1 is disposed in the liquid output pipe 4, and is used for controlling the flow rate of the electrolyte output by the liquid output pipe 4, so as to prevent the heat exchange efficiency of the heat exchanger 3 from being low due to too fast liquid flow.
More preferably, the heat exchange pipeline 6 includes a heat exchange section 601 passing through the heat exchanger 3 and a return section 602 flowing back to the electrolyte preparation tank 2 after heat exchange, and a fourth electric proportional valve 603 is disposed between the heat exchange section 601 and the return section 602, and is used for enabling the electrolyte to have sufficient retention time in the heat exchange section 601, improving heat exchange efficiency, and enabling the electrolyte to slowly flow in the heat exchange section 601 by matching with the third electric proportional valve 401, so as to perform sufficient heat exchange.
Example 2
Referring to fig. 1 and 3, the present invention provides a technical solution: an electroplating heat exchange device for copper foil production comprises an electroplating bath 1, an electrolyte preparation tank 2 and a heat exchanger 3, wherein a first temperature detector (not shown in the figure) is arranged in the electroplating bath 1, a second temperature detector (not shown in the figure) is arranged in the electrolyte preparation tank 2, a liquid output pipe 4 is arranged at the bottom side of the electroplating bath 1, the tail end of the liquid output pipe 4 is connected with a three-way pipe 5, one end of the three-way pipe 5 is connected with a heat exchange pipeline 6 passing through the heat exchanger 3, the other end of the three-way pipe is connected with an electrolyte return pipe 7 leading to the top side of the electrolyte preparation tank 2, and a control unit used for controlling the electrolyte flow proportion of the heat exchange pipeline 6 and the electrolyte return pipe 7 is arranged in the three-way pipe 5.
Furthermore, one end of the heat exchange pipeline 6 is connected with the three-way pipe 5, and the other end is connected with the electrolyte preparation tank 2.
In practical application, after electroplating in the electroplating bath 1, the electrolyte flows out from the liquid output pipe 4, passes through the three-way pipe 5, the control unit of the three-way pipe 5 is started, the electrolyte flow rates to the heat exchange pipeline 6 and the electrolyte return pipe 7 are distributed according to the temperature conditions of the electrolyte in the electroplating bath 1 and the electrolyte preparation tank 2 fed back by the first temperature detector and the second temperature detector, the electrolyte in the heat exchange pipeline 6 exchanges heat through the heat exchanger 3 and then returns to the electrolyte preparation tank 2, and the electrolyte in the electrolyte return pipe 7 directly returns to the electrolyte preparation tank 2.
In this embodiment, the control unit comprises a first electric proportional valve 502 arranged at the end of the tee pipe 5 connected to the heat exchange pipe 6 and a second electric proportional valve 503 arranged at the end of the tee pipe 5 connected to the electrolysis return pipe 7.
In practical application, the on-off proportion of the first electric proportional valve 502 and the second electric proportional valve 503 is controlled according to the temperature conditions of the electrolytes in the electroplating tank 1 and the electrolyte preparation tank 2 fed back by the first temperature detector and the second temperature detector, so that the flow rate of the electrolyte flowing into the heat exchange pipeline 6 and the electrolyte return pipe 7 can be controlled.
In the present embodiment, an electrolyte outlet pipe 8 is disposed at the bottom side of the electrolyte preparation tank 2, the electrolyte outlet pipe 8 is connected with a pumping pump 9, and a liquid outlet end of the pumping pump 9 is connected with a liquid inlet pipe 10 leading to the top side of the electroplating tank 2.
Preferably, the lowest part of the plating bath 1 is 2 to 5m higher than the highest part of the electrolytic preparation tank 2, and the lowest part of the plating bath 1 is 1 to 4m higher than the highest part of the heat exchanger 3, and the function of the plating bath is that the electrolyte in the plating bath 1 can naturally fall to the pipe heat pipe 6 and the electrolyte return pipe 7 through gravity.
In practical applications, the pumping pump 9 pumps the electrolyte in the electrolyte preparation tank 2 to the plating tank 1 for use, and after use, the electrolyte in the plating tank 1 falls down from the liquid inlet pipe 4 by gravity.
In this embodiment, preferably, a third electric proportional valve 401 for controlling the flow rate of the electrolyte output by the electroplating tank 1 is disposed in the liquid output pipe 4, and is used for controlling the flow rate of the electrolyte output by the liquid output pipe 4, so as to prevent the heat exchange efficiency of the heat exchanger 3 from being low due to too fast liquid flow.
More preferably, the heat exchange pipeline 6 includes a heat exchange section 601 passing through the heat exchanger 3 and a return section 602 flowing back to the electrolyte preparation tank 2 after heat exchange, and a fourth electric proportional valve 603 is disposed between the heat exchange section 601 and the return section 602, and is used for enabling the electrolyte to have sufficient retention time in the heat exchange section 601, improving heat exchange efficiency, and enabling the electrolyte to slowly flow in the heat exchange section 601 by matching with the third electric proportional valve 401, so as to perform sufficient heat exchange.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The electroplating heat exchange device for copper foil production comprises an electroplating bath, an electrolyte preparation tank and a heat exchanger, wherein the electrolyte preparation tank is arranged below the electroplating bath, and the electroplating heat exchange device is characterized in that a first temperature detector is arranged in the electroplating bath, a second temperature detector is arranged in the electrolyte preparation tank, a liquid output pipe is arranged at the bottom side of the electroplating bath, the tail end of the liquid output pipe is connected with a three-way pipe, one end of the three-way pipe is connected with a heat exchange pipeline passing through the heat exchanger, the other end of the three-way pipe is connected with an electrolyte return pipe leading to the top side of the electrolyte preparation tank, and a control unit used for controlling the flow proportion of electrolyte leading to the heat exchange pipeline and the electrolyte return pipe is arranged in the three-way pipe.
2. The electroplating heat exchange device for copper foil production as claimed in claim 1, wherein the control unit is an electric butterfly valve arranged on a branch port in the tee pipe.
3. The electroplating heat exchange device for copper foil production as claimed in claim 1, wherein the control unit comprises a first electric proportional valve arranged at one end of the tee pipe connecting heat exchange pipeline and a second electric proportional valve arranged at one end of the tee pipe connecting electrolysis return pipe.
4. The electroplating heat exchange device for copper foil production according to any one of claims 1 to 3, wherein one end of the heat exchange pipeline is connected with a three-way pipe, and the other end of the heat exchange pipeline is connected with an electrolyte preparation tank.
5. The apparatus for exchanging heat in electroplating of copper foil production according to claim 4, wherein the electrolyte outlet pipe is disposed at the bottom side of the electrolyte preparation tank, the electrolyte outlet pipe is connected to a pumping pump, and the liquid outlet end of the pumping pump is connected to a liquid inlet pipe leading to the top side of the electroplating tank.
6. The apparatus for electrolytic plating heat exchange in copper foil production as claimed in claim 1, wherein a third electric proportional valve for controlling the flow rate of the output electrolyte of the electrolytic plating tank is provided in said liquid output pipe.
7. The electroplating heat exchange device for copper foil production as claimed in claim 4, wherein the heat exchange pipeline comprises a heat exchange section passing through the heat exchanger and a return section returning to the electrolyte preparation tank after heat exchange, and a fourth electric proportional valve is arranged between the heat exchange section and the return section.
8. The apparatus for electroplating heat exchange in copper foil production according to claim 1, wherein the lowest part of the electroplating bath is 2-5m higher than the highest part of the electrolytic preparation tank, and the lowest part of the electroplating bath is 1-4m higher than the highest part of the heat exchanger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121519482.3U CN215560780U (en) | 2021-07-05 | 2021-07-05 | Electroplating heat exchange device for copper foil production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121519482.3U CN215560780U (en) | 2021-07-05 | 2021-07-05 | Electroplating heat exchange device for copper foil production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215560780U true CN215560780U (en) | 2022-01-18 |
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ID=79823532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121519482.3U Active CN215560780U (en) | 2021-07-05 | 2021-07-05 | Electroplating heat exchange device for copper foil production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215560780U (en) |
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2021
- 2021-07-05 CN CN202121519482.3U patent/CN215560780U/en active Active
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