CN211120803U

CN211120803U - Heat exchange device

Info

Publication number: CN211120803U
Application number: CN201921879515.8U
Authority: CN
Inventors: 巫晓彬; 张贵贤
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-11-01
Filing date: 2019-11-01
Publication date: 2020-07-28
Anticipated expiration: 2029-11-01

Abstract

The utility model belongs to the technical field of PCB board processing equipment, especially, relate to a heat exchange device, be connected with the microetching main tank on the heat exchange device, the heat exchange device is provided with first input port, circulation mouth and delivery outlet, the heat exchange device includes cooling bucket, first pumpback, second pumpback and circulating pump surge, the inside low temperature groove and the high temperature groove of being equipped with respectively of cooling bucket, be provided with the third input port on the low temperature groove, be provided with the second input port on the high temperature groove; the delivery outlet is connected with a second pipeline, the second pipeline is connected with an anti-blocking spraying system, the second pumping pump surge is arranged on the second pipeline, the circulating pump surge is arranged on the circulating pipeline, and a backflow pipeline is arranged on the second pipeline. Through the arrangement, the heating operation required by the temperature rise of the solution in the temperature rise and reduction treatment process and the ice water required to be added for the temperature reduction are reduced, so that a more energy-saving effect is achieved.

Description

Heat exchange device

Technical Field

The utility model belongs to the technical field of PCB board processing equipment, especially, relate to a heat exchange device.

Background

In the treatment process of copper sulfate solution generated in the micro-etching process of an electronic circuit board (PCB), the copper sulfate solution is generally kept in a low-temperature environment through controlling the temperature, so that crystals are separated out, and then the whole treatment process is completed through extracting and filtering the crystals. In the traditional process, the copper sulfate solution is directly extracted and cooled by ice water, so that the crystallization effect of the copper sulfate solution is achieved, the stability of the temperature of the copper sulfate solution in the treatment process cannot be maintained by the copper sulfate solution generated by micro-etching in the treatment process by adopting the traditional process method, and meanwhile, the extracted low-temperature copper sulfate solution returns to a customer micro-etching main tank to cause large temperature fluctuation, and higher energy needs to be consumed again for heating.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat exchange device aims at solving the great technical problem of heat exchange device regulation solution temperature demand energy among the prior art.

For realizing the above-mentioned purpose, the embodiment of the utility model provides a pair of heat exchange device, be connected with the etching owner groove a little on the heat exchange device, heat exchange device is provided with first input port, circulation mouth and delivery outlet, heat exchange device includes that cooling bucket, first pumpback, second pumpback gush and the circulating pump gushes, cooling bucket is inside to be equipped with respectively to be located cooling bucket central point puts the low temperature groove and centers on the high temperature groove that low temperature groove set up, first input port with the delivery outlet sets up on the low temperature groove, still be provided with the third input port on the low temperature groove, circulation mouth sets up on the high temperature groove, still be provided with the second input port on the high temperature groove.

Further, the microetching main tank is connected with the second input port through a first pipeline, the first pumpback is arranged on the first pipeline, the output port is connected with the second pipeline, the second pipeline is connected with the anti-blocking spraying system, the second pumpback is arranged on the second pipeline, the second pipeline is connected with the third input port through a circulating pipeline, the circulating pump is arranged on the circulating pipeline, a backflow pipeline is arranged on the second pipeline, and the backflow pipeline is connected with the microetching main tank.

Optionally, the circulation port is located below a sidewall of the high temperature tank, and the output port is located below a sidewall of the low temperature tank.

Optionally, the first inlet is connected to an overflow inlet pipe, which is connected to a filtration system.

Optionally, a third pipeline is connected to the circulation port, and the third pipeline is connected to the crystallization barrel.

Optionally, a third pumping surge is arranged on the third pipeline between the crystallization barrel and the circulation port.

Optionally, the circulation conduit is located on the second conduit between the outlet port and the second pumpback.

Optionally, the return line is disposed between the second pumpback and the anti-clog spray system.

Optionally, the cooling barrel and the low-temperature groove are both cylindrical, and the radius of the low-temperature groove is smaller than that of the cooling barrel.

Optionally, the joint of the first pipe and the main micro-etching groove is located below the main micro-etching groove.

Optionally, the connection of the return pipe and the main micro-etching groove is located above the main micro-etching groove.

The embodiment of the utility model provides an among the heat exchange device above-mentioned one or more technical scheme have one of following technological effect at least: the heat exchange device of the utility model realizes the connection with other devices through a first input port, a circulation port and an output port which are arranged on the heat exchange device, a cooling barrel for cooling solution is arranged in the heat exchange device, the cooling barrel is internally divided into a low temperature groove and a high temperature groove, the solution is cooled in the high temperature groove, the temperature is raised in the low temperature groove, the first input port and the output port are arranged on the low temperature groove, the low temperature groove can ensure the direct heating treatment of the solution and the direct output of the heated solution, a micro-etching main groove is connected with a second input port through a first pipeline, the solution in the micro-etching main groove can enter the high temperature groove, the solution flows out of the circulation port after being cooled and enters a crystallization barrel, a part of the solution flowing out of the cooling barrel enters a second pipeline under the action of a second pumpback pump, and a part of the solution enters the circulation pipeline under the action of the circulation pump pumpback, the solution entering the circulating pipeline returns to the low-temperature tank through the third input port and is heated again, part of the solution entering the second pipeline enters the micro-etching main tank from the return pipeline after flowing through the second pumpback pump, and the other part of the solution enters the anti-blocking spraying system.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a heat exchange device according to an embodiment of the present invention.

Fig. 2 is a top view of a cooling barrel of the heat exchange device provided by the embodiment of the present invention.

Fig. 3 is an inside plan view of the cooling barrel of the heat exchange device provided by the embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

10-cooling barrel 11-high temperature groove 12-low temperature groove

13-first inlet 14-second inlet 15-third inlet

16-circulation port 17-output port 20-micro etching main tank

131-overflow water inlet pipe 141-first pumping surge 142-first pipeline

151-circulating pipe 152-circulating pump surge 161-third pumping surge

162-third conduit 171-second conduit 172-second pumpback

173-return line.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in fig. 1-3, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below by referring to the drawings are exemplary and intended to explain the embodiments of the present invention and are not to be construed as limiting the present invention.

In the description of the embodiments of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which is only for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element so indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.

In an embodiment of the present invention, as shown in fig. 1 to 3, a heat exchange device is provided, which can be used for heating and cooling the solution after treatment. Specifically, the heat exchange device is connected with a main micro-etching tank, the main micro-etching tank is a user solution storage tank, and is connected with the main micro-etching tank through the heat exchange device, so that the heat exchange device can process the solution in the main micro-etching tank, and the processed solution returns to the main micro-etching tank for continuous use. The heat exchange device is provided with a first input port 13, a circulation port 16 and an output port 17, the first input port 13 is an inlet of a solution in a filtering system entering the heat exchange device, the heat exchange device comprises a cooling barrel 10, a micro-etching main tank 20, a first back pumping surge 141, a second back pumping surge 172 and a circulation pump surge 152, the cooling barrel 10 is used for cooling a customer solution, a low-temperature tank 12 located at the center of the cooling barrel 10 and a high-temperature tank 11 arranged around the low-temperature tank 12 are respectively arranged in the cooling barrel 10, the low-temperature tank 12 is a heating area of the solution, the high-temperature tank 11 is a cooling area of the solution, the first input port 13 and the output port 17 are arranged on the low-temperature tank 12, the solution can directly enter the low-temperature tank 12 for heating treatment, the solution after heating treatment can be directly output through the output port 17, the low-temperature tank 12 is also provided with a third input port 15, the third input port 15 is an input port of, the circulating port 16 is arranged on the high-temperature tank 11, so that the solution subjected to the temperature reduction treatment in the high-temperature tank 11 flows out of the circulating port 16, the high-temperature tank 11 is also provided with a second input port 14, and the second input port 14 provides an inlet for inputting the solution in the high-temperature tank 11.

Furthermore, the main micro-etching tank 20 is connected with the second input port 14 through the first pipe 142, the solution in the main micro-etching tank 20 is conveyed into the high temperature tank 11 from the second input port 14 through the first pipe 142, the first suck-back pump surge 141 is arranged on the first pipe 142, the first suck-back pump surge 141 is arranged to provide power for the outflow of the solution in the main micro-etching tank 20, the output port 17 is connected with the second pipe 171, the solution cooled by the low temperature tank 12 enters the second pipe 171 from the output port 17, the second pipe 171 is connected with the anti-clogging spray system, the solution heated by the low temperature tank 12 can enter the anti-clogging spray system through the first pipe 142, the second suck-back pump surge 172 is arranged on the second pipe 171, the second suck-back pump surge 172 provides power for the outflow of the solution in the low temperature tank 12, the second pipe 171 is connected with the third input port 15 through the circulation pipe 151, so that part of the solution in the second pipeline 171 flows back to the low-temperature tank 12 from the third input port 15 through the circulating pipeline 151, the temperature of the solution with lower temperature in the low-temperature tank 12 is further raised, the heating efficiency of the low-temperature tank 12 is improved, the circulating pump 152 is arranged on the circulating pipeline 151, the circulating pump 152 provides power for the flow of the solution in the circulating pipeline 151, the second pipeline 171 is provided with a return pipeline 173, the return pipeline 173 is connected with the main micro-etching tank 20, and part of the solution subjected to the heating treatment in the low-temperature tank 12 is guided into the main micro-etching tank 20 through the return pipeline 173, so that the high-temperature tank 11 cools the solution and guides the cooled solution back to the crystallization barrel, thereby achieving more efficient utilization of the filtered solution.

The heat exchange device of the utility model realizes the connection with other devices through a first input port, a circulation port and an output port which are arranged on the heat exchange device, a cooling barrel for cooling solution is arranged in the heat exchange device, the cooling barrel is internally divided into a low temperature groove and a high temperature groove, the solution is cooled in the high temperature groove, the temperature is raised in the low temperature groove, the first input port and the output port are arranged on the low temperature groove, the low temperature groove can ensure the direct heating treatment of the solution and the direct output of the heated solution, a micro-etching main groove is connected with a second input port through a first pipeline, the solution in the micro-etching main groove can enter the high temperature groove, the solution flows out of the circulation port after being cooled and enters a crystallization barrel, a part of the solution flowing out of the cooling barrel enters a second pipeline under the action of a second pumpback pump, and a part of the solution enters the circulation pipeline under the action of the circulation pump pumpback, the solution entering the circulating pipeline returns to the low-temperature tank through the third input port and is heated again, part of the solution entering the second pipeline enters the micro-etching main tank from the return pipeline after flowing through the second back-pumping pump, and the other part of the solution enters the anti-blocking spraying system, due to the design of the cooling barrel, the circulating pipeline and the micro-etching main tank, the solution coming out of the micro-etching main tank and the solution coming out of the crystallization barrel and passing through the filtering system are subjected to simple heat exchange, so that the temperature rise and fall treatment is realized through the solution, if the solution subjected to once temperature rise and fall treatment is treated again to reach an ideal temperature interval, less cooling ice water needs to be added, the ideal temperature can be reached through simple heating only in the heating treatment, and meanwhile, the crystallization effect in the crystallization barrel cannot be reduced due to large temperature difference by simple heat exchange between the solutions, and the solution entering the main micro-etching tank does not have large temperature fluctuation, so that the stable micro-etching amount is more facilitated.

The utility model discloses a further embodiment, as shown in fig. 1, circulation mouth 16 is located the lateral wall below of high temperature groove 11, and with circulation mouth 16 setting can follow the solution that is favorable to in the high temperature groove 11 and flow from circulation mouth 16 in the lateral wall below of high temperature groove 11, delivery outlet 17 is located the lateral wall below of low temperature groove 12, sets up delivery outlet 17 and can follow the solution that is favorable to in the low temperature groove 12 and flow from delivery outlet 17 in the lateral wall below of low temperature groove 12.

In another embodiment of the present invention, as shown in fig. 1, the first input port 13 is connected to the overflow inlet pipe 131, the overflow inlet pipe 131 is connected to the filtering system, and the solution filtered by the filtering system can be introduced into the low temperature tank 12 through the overflow inlet pipe 131 for temperature rise treatment.

In another embodiment of the present invention, as shown in fig. 1, the circulation opening 16 is connected with a third pipeline 162, the third pipeline 162 is connected with the crystallization barrel, and the solution in the high temperature tank 11 is guided out from the circulation opening 16 and guided into the crystallization barrel by the action of the third pipeline 162.

In another embodiment of the present invention, as shown in fig. 1, a third pumping surge 161 is disposed on the third pipeline 162 between the crystallization barrel and the circulation port 16, and the third pumping surge 161 is set to provide power for the solution in the high temperature tank 11 to flow from the high temperature tank 11 to the crystallization barrel.

In another embodiment of the present invention, as shown in fig. 1, the circulation pipeline 151 is located between the output port 17 and the second pumping surge 23 on the second pipeline 22, and the solution coming out from the low temperature tank 12 can be diverted at the first time by setting the circulation pipeline 151 between the output port 17 and the second pumping surge 23.

In another embodiment of the present invention, as shown in fig. 1, the backflow pipeline 173 is disposed between the second pumping pump surge 23 and the anti-blocking spraying system, and the backflow pipeline 173 is disposed between the second pumping pump surge 23 and the anti-blocking spraying system, so that the solution heated by the low temperature tank 12 can partially flow into the backflow pipeline 173 before entering the anti-blocking spraying system.

In another embodiment of the present invention, as shown in fig. 1, the cooling barrel 10 and the low temperature tank 12 are both cylindrical, the cylindrical arrangement can reduce the local resistance when the solution in the tank flows, the radius of the low temperature tank 12 is smaller than the radius of the cooling barrel 10, the empty part between the outer wall of the low temperature tank 12 and the inner wall of the cooling barrel 10 is set as the high temperature tank 11, so that the solution in the high temperature tank 11 can also reduce the local resistance when flowing.

In another embodiment of the present invention, as shown in fig. 1, the joint of the first pipe 142 and the main micro-etching groove 20 is located below the main micro-etching groove 20, and the joint of the first pipe 142 and the main micro-etching groove 20 is located below the main micro-etching groove 20, which is more favorable for the outflow of the solution in the main micro-etching groove 20, and the solution that cannot flow out is not left in the main micro-etching groove 20.

In another embodiment of the present invention, as shown in fig. 1, the connection point of the backflow pipe 173 and the main micro-etching groove 20 is located above the main micro-etching groove 20, and the connection point of the backflow pipe 173 and the main micro-etching groove 20 is disposed above the main micro-etching groove 20, so that the main micro-etching groove 20 can be filled with more solution.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A heat exchange device characterized by: the heat exchange device is connected with a micro-etching main tank, and is provided with a first input port, a circulation port and an output port, the heat exchange device comprises a cooling barrel, a first pumpback, a second pumpback and a circulating pump surge, a low-temperature tank positioned in the center of the cooling barrel and a high-temperature tank arranged around the low-temperature tank are respectively arranged in the cooling barrel, the first input port and the output port are arranged on the low-temperature tank, a third input port is also arranged on the low-temperature tank, the circulation port is arranged on the high-temperature tank, and a second input port is also arranged on the high-temperature tank;

the microetching main tank is connected with the second input port through a first pipeline, the first pumpback is arranged on the first pipeline, the output port is connected with the second pipeline, the second pipeline is connected with the anti-blocking spraying system, the second pumpback is arranged on the second pipeline, the second pipeline is connected with the third input port through a circulating pipeline, the circulating pump is arranged on the circulating pipeline in a mode of being provided with a backflow pipeline, and the backflow pipeline is connected with the microetching main tank.

2. The heat exchange device of claim 1, wherein: the circulation port is located below the side wall of the high-temperature tank, and the output port is located below the side wall of the low-temperature tank.

3. The heat exchange device of claim 1, wherein: the first input port is connected with an overflow water inlet pipe, and the overflow water inlet pipe is connected with a filtering system.

4. The heat exchange device of claim 1, wherein: and the circulating port is connected with a third pipeline, and the third pipeline is connected with the crystallization barrel.

5. The heat exchange device of claim 4, wherein: and a third pumping pump surge is arranged between the crystallization barrel and the circulating port on the third pipeline.

6. The heat exchange device of claim 1, wherein: the circulating pipeline is located between the output port on the second pipeline and the second pumpback.

7. The heat exchange device of claim 1, wherein: the backflow pipeline is arranged between the second pumping-back pump surge and the anti-blocking spraying system.

8. The heat exchange device according to any one of claims 1 to 7, wherein: the cooling barrel and the low-temperature groove are both cylindrical, and the radius of the low-temperature groove is smaller than that of the cooling barrel.

9. The heat exchange device according to any one of claims 1 to 7, wherein: the joint of the first pipeline and the micro-etching main groove is positioned below the micro-etching main groove.

10. The heat exchange device according to any one of claims 1 to 7, wherein: the joint of the return pipe and the main micro-etching groove is positioned above the main micro-etching groove.