CN219855379U - General semiconductor processing equipment - Google Patents

Abstract

The utility model relates to the technical field of semiconductor processing equipment, in particular to semiconductor processing equipment. The general semiconductor processing equipment comprises a machine table, a processing carrier, a loading and unloading device and a cutting device, wherein the processing carrier is movably arranged on the machine table and is suitable for moving along a first direction and a third direction, and the processing carrier is also suitable for rotating around a second direction; the feeding and discharging device is arranged on the machine table and is suitable for placing products on the processing carrier table, and the feeding and discharging device is also suitable for taking away the products on the processing carrier table; the cutting device is arranged on the machine table; the cutting device is used for cutting the product. According to the utility model, the product is placed at the feeding and discharging device, the feeding and discharging device can move the product to the processing carrier, the processing carrier can move the product to the designated position, the cutting device cuts and processes different positions of the product to be processed, and after the processing is finished, the feeding and discharging device can move the product away from the processing carrier, so that the full-automatic processing of the product is realized.

Description

General semiconductor processing equipment

Technical Field

The utility model relates to the technical field of semiconductor processing equipment, in particular to semiconductor processing equipment.

Background

The semiconductor comprises an integrated circuit, a flat panel display, an LED, a solar battery, a discrete device, a semiconductor equipment material and the like, and in the production and processing process of the semiconductor, cutting processing is required, the processing efficiency of the conventional equipment is low, the degree of automation is low, and a large amount of manpower is often involved.

Disclosure of Invention

The utility model solves the problem that the processing efficiency of the conventional general semiconductor processing equipment is too low.

In order to solve the problems, the utility model provides a general semiconductor processing device, which comprises a machine table, a processing carrier, a loading and unloading device and a cutting device, wherein the processing carrier is movably arranged on the machine table and is suitable for moving along a first direction and a third direction, and the processing carrier is also suitable for rotating around a second direction; the loading and unloading device is arranged on the machine table and is suitable for placing products on the processing carrier table, and the loading and unloading device is also suitable for taking away the products on the processing carrier table; the cutting device is arranged on the machine table; the cutting device is used for cutting the product.

Optionally, the universal semiconductor processing apparatus further comprises a first driving assembly, wherein the first driving assembly is in driving connection with the processing stage, and the first driving assembly is suitable for driving the processing stage to move along the first direction and the third direction.

Optionally, the first driving assembly includes a first driving mechanism and a second driving mechanism, the first driving mechanism is installed on the machine table, the second driving mechanism is installed on a driving end of the first driving mechanism, the second driving mechanism is in driving connection with the processing carrier, the first driving mechanism is suitable for driving the second driving mechanism and the processing carrier to move along the first direction, and the second driving mechanism is suitable for driving the processing carrier to move along the second direction.

Optionally, the first driving assembly further includes a third driving mechanism, the second driving mechanism is in driving connection with the third driving mechanism, the second driving mechanism is suitable for driving the third driving mechanism to move along the second direction, the processing carrier is installed on a driving end of the third driving mechanism, and the third driving mechanism is suitable for driving the processing carrier to rotate around the second direction.

Optionally, the cutting device comprises a fourth driving mechanism and a cutting head, the fourth driving mechanism is installed on the machine table, the fourth driving mechanism is in driving connection with the cutting head, and the fourth driving mechanism is suitable for driving the cutting head to move along the second direction.

Optionally, the universal semiconductor processing device further comprises a vision component, wherein the vision component is installed on the machine table and is used for detecting the position of the product.

Optionally, the loading and unloading device comprises a supporting structure, a transfer platform, a material box, a gripper mechanism and a transfer mechanism, wherein the transfer platform is installed on the supporting structure; the material box is arranged on the supporting structure and is used for storing products; the gripper mechanism is arranged on the supporting structure and is used for placing the products in the material box on the transfer platform, and the gripper mechanism is also used for placing the products on the transfer platform back into the material box; the transfer platform is located between the material box and the transfer mechanism, the transfer mechanism is used for moving the product from the transfer platform to the processing device, and the transfer mechanism is also used for transferring the processed product from the processing device back to the transfer platform.

Optionally, the transfer platform includes first clamping part and second clamping part, first clamping part with second clamping part movable mounting respectively in on the bearing structure, first clamping part with second clamping part is suitable for along the third direction removal, first clamping part with the interval between the second clamping part can be adjusted.

Optionally, the transfer mechanism includes a first connector, a first gripper assembly, and a second gripper assembly, the first connector adapted to rotate about a second direction; the first gripper assembly is mounted on the first connecting piece; the second gripper assembly is installed on the first connecting piece, the first gripper assembly and the second gripper assembly are used for grabbing products, the rotation center of the first connecting piece is located between the first gripper assembly and the second gripper assembly, and the first gripper assembly and the second gripper assembly are arranged in a central symmetry mode.

Optionally, the hand grasping mechanism includes a mounting base, a first clamping plate, a second clamping plate, an eighth driving mechanism and an induction device, wherein the first clamping plate can be movably arranged on the mounting base along a first direction; the second clamping plate can be movably arranged on the first clamping plate along a second direction, and the first direction and the second direction are arranged at 90 degrees; the eighth driving mechanism is in transmission connection with the second clamping plate and is used for driving the second clamping plate to move along the second direction so as to be close to or far away from the first clamping plate; the induction device comprises an inductor and an induction piece, wherein the induction piece can trigger the inductor to generate an induction signal when being positioned at a preset position of the inductor, the inductor is installed on the installation seat, the induction piece is installed on the first clamping plate or the inductor is installed on the first clamping plate, and the induction piece is installed on the installation seat.

Compared with the prior art, the general semiconductor processing equipment provided by the embodiment of the utility model has the beneficial effects that:

through placing the product that waits to process in last unloader department, go up unloader and can be automatic with the product that waits to process that is located on it on the processing carrier, the processing carrier can remove the product that waits to process to the assigned position to through along first direction and third direction, and rotate along the second direction, thereby can cut the processing by cutting device to wait to process the different positions of product, after the product processing is accomplished, go up unloader and can remove the product of processing completion by the processing carrier, thereby realize the full-automatic processing of product.

Drawings

FIG. 1 is a schematic view showing the structure of an embodiment of a general semiconductor processing apparatus according to the present utility model;

FIG. 2 is a schematic structural diagram of an embodiment of a loading and unloading device according to the present utility model;

FIG. 3 is a schematic structural diagram of another embodiment of the loading and unloading device of the present utility model;

FIG. 4 is a schematic structural diagram of a transfer platform according to an embodiment of the present utility model;

FIG. 5 is a schematic structural view of another embodiment of a transfer platform according to the present utility model;

FIG. 6 is a schematic structural diagram of a transfer mechanism according to an embodiment of the present utility model;

FIG. 7 is a schematic view of another embodiment of a transfer mechanism according to the present utility model;

FIG. 8 is a schematic structural view of another embodiment of a transfer mechanism according to the present utility model;

FIG. 9 is an enlarged view of a portion of FIG. 10 at A;

FIG. 10 is a schematic view of a gripper mechanism according to an embodiment of the present utility model;

FIG. 11 is a schematic view of another embodiment of a hand grip mechanism of the present utility model;

FIG. 12 is a schematic view of another embodiment of a gripper mechanism of the present utility model;

FIG. 13 is an exploded view of one embodiment of a gripper mechanism of the present utility model;

FIG. 14 is a schematic view showing the structure of a first clamping plate according to an embodiment of the present utility model;

fig. 15 is a schematic structural diagram of an embodiment of a stopper according to the present utility model.

Reference numerals illustrate:

1, a machine table; 2-processing a carrying platform; 3-loading and unloading devices; 31-a support structure; 32-transferring a carrying platform; 321-a first clamping portion; 322-a second clamping portion; 33-a magazine; 331-a vertical plate; 34-a second drive assembly; 341-a ninth drive mechanism; 342-a first pulley; 343-a second pulley; 344-a belt; 35-tenth driving mechanism; 4-a cutting device; 41-a fourth drive mechanism; 42-cutting head; 5-a transfer mechanism; 51-first connection; 511-opening holes; 52-a first gripper assembly; 521-a fifth drive mechanism; 522-a first adsorbent member; 5221-second connector; 5222-suction nozzle configuration; 5223-reinforcing bars; 523-a second adsorbent member; 53-a second grip assembly; 531-sixth drive mechanism; 532-a third adsorbent member; 533-fourth adsorbing member; 54-a third connector; 55-seventh drive mechanism; 56-a rotation mechanism; 6-a gripper mechanism; 61-mounting seats; 611-a guide hole; 62-a first splint; 621-limiting pieces; 622-baffle; 623-a stopper; 6231-cushion pad; 624-a cleat body; 6241-a through hole; 625-a first side plate; 626-a second side panel; 627-third side panels; 628-grooves; 629-connecting holes; 63-a second splint; 64-eighth drive mechanism; 65-sensing means; 651-sensor; 652-sensing element; 6521-regulating groove; 66-a guide assembly; 661-a guide rail; 662-sliders; 67-elastic member; 68-a supporting seat; 7-a first drive assembly; 71-a first drive mechanism; 72-a second drive mechanism; 73-a third drive mechanism; 8-visual component.

Detailed Description

The terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly coupled, detachably coupled, or rotatably coupled; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

The coordinate system XYZ is provided in the drawings of the embodiments of the present utility model, in which the forward direction of the X axis represents the right direction, the reverse direction of the X axis represents the left direction, the forward direction of the Z axis represents the upper direction, the reverse direction of the Z axis represents the lower direction, the forward direction of the Y axis represents the front direction, and the reverse direction of the Y axis represents the rear direction, and the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", and "right", etc. are based on the directions or positional relationships shown in the drawings, only for convenience of description and simplification of description, but do not indicate or imply that the device referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present utility model.

The terms "first," "second," and "third," etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature.

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.

As shown in fig. 1, an embodiment of the present utility model provides a general semiconductor processing apparatus. The general semiconductor processing equipment comprises a machine table 1, a processing carrier 2, a loading and unloading device 3 and a cutting device 4, wherein the processing carrier 2 is movably arranged on the machine table 1, the processing carrier 2 is suitable for moving along a first direction and a third direction, and the processing carrier 2 is also suitable for rotating around a second direction; the feeding and discharging device 3 is arranged on the machine table 1, the feeding and discharging device 3 is suitable for placing products on the processing carrier table 2, and the feeding and discharging device 3 is also suitable for taking away the products on the processing carrier table 2; the cutting device 4 is arranged on the machine table 1; the cutting device 4 is used for cutting the product.

The first direction may be the direction of the X axis in the figure, the third direction may be the direction of the Y axis in the figure, and the second direction may be the direction of the Z axis in the figure. The products may be integrated circuits, flat panel displays, LEDs, solar cells, discrete devices, and semiconductor device materials, examples of which are wafers of semiconductor device materials. The wafer to be processed can be placed on the loading and unloading device 3 together, the loading and unloading device 3 moves the wafer to be processed to the processing carrier 2, the processing carrier 2 can move along the X-axis direction and the Y-axis direction and rotate around the Z-axis direction, and therefore the relative position between the wafer on the processing carrier 2 and the cutting device 4 can be adjusted. The dicing apparatus 4 may perform dicing processing on the wafer on the processing stage 2, and the dicing apparatus 4 may include a laser whose focal point may be located on the surface of the wafer or inside the wafer. When the focus is located in the wafer, along with the movement of the processing carrier 2, the focus of the laser can form a modified layer in the wafer so as to facilitate the subsequent splitting operation of the wafer; similarly, the wafer can be cut directly by increasing the cutting time of the laser to the wafer. After the wafer processing is completed, the loading and unloading device 3 can take the processed wafer off the processing carrier 2, so that full-automatic processing of the wafer is realized.

Through placing the product of waiting to process in last unloader 3 department, go up unloader 3 can be automatic with the product of waiting to process that is located on it on processing carrier 2, processing carrier 2 can be with the product of waiting to process to the assigned position to through along first direction and third direction removal, and rotate along the second direction, thereby can cut the processing by cutting device 4 the different positions of waiting to process the product, after the product processing is accomplished, go up unloader 3 can be with the product of processing completion removed by processing carrier 2, thereby realize the full-automatic processing of product.

As shown in fig. 1, the general semiconductor processing apparatus further includes a first driving assembly 7, the first driving assembly 7 is in driving connection with the processing stage 2, and the first driving assembly 7 is adapted to drive the processing stage 2 to move in the first direction and the third direction.

In one embodiment of the present utility model, the first driving assembly 7 includes a first driving mechanism 71 and a second driving mechanism 72, the first driving mechanism 71 is mounted on the machine table 1, the second driving mechanism 72 is mounted on a driving end of the first driving mechanism 71, the second driving mechanism 72 is in driving connection with the processing stage 2, the first driving mechanism 71 is adapted to drive the second driving mechanism 72 and the processing stage 2 to move in a third direction, and the second driving mechanism 72 is adapted to drive the processing stage 2 to move in the first direction.

The first direction may be the direction of the X-axis in the figure, and the third direction may be the direction of the Y-axis in the figure. The first driving mechanism 71 and the second driving mechanism 72 may be a cylinder, an electric cylinder, a stepping motor, a servo motor, a linear motor, etc., and the linear motor is exemplified herein as a linear motor composed of a mover and a stator, and the mover moves relative to the stator. The stator of the first driving mechanism 71 is fixed on the machine 1, the stator of the second driving mechanism 72 can be mounted on the rotor of the first driving mechanism 71, and the movement of the second driving mechanism 72 and the processing stage 2 in the X-axis direction can be realized as the rotor of the first driving mechanism 71 moves relative to the stator of the first driving mechanism 71; the machining stage 2 may be fixed to the mover of the second driving mechanism 72, and the mover of the second driving mechanism 72 may move relative to the stator of the second driving mechanism 72, so as to drive the machining stage 2 to move in the Y-axis direction.

In another embodiment of the present utility model, rollers may be mounted at the bottom of the processing stage 2, the processing stage 2 may slide on the machine 1 by the rollers, the processing stage 2 may slide on the machine 1 by a six-axis manipulator, and the six-axis manipulator may drive the processing stage 2 to slide along the X-axis and the Y-axis directions.

As shown in fig. 1, the first driving assembly 7 further includes a third driving mechanism 73, the second driving mechanism 72 is drivingly connected to the third driving mechanism 73, the second driving mechanism 72 is adapted to drive the third driving mechanism 73 to move in the first direction, the machining carrier 2 is mounted on a driving end of the third driving mechanism 73, and the third driving mechanism 73 is adapted to drive the machining carrier 2 to rotate around the second direction.

The third driving mechanism 73 may be a DD motor, which is a special high-precision motor, and may directly drive the motion stage through the rotor without other transitional connection therebetween, and the DD motor may drive the machining stage 2 to rotate around the Z-axis direction, thereby adjusting the position of the product on the machining stage 2, and facilitating laser machining.

As shown in fig. 1, the cutting device 4 includes a fourth driving mechanism 41 and a cutting head 42, the fourth driving mechanism 41 is mounted on the machine 1, the fourth driving mechanism 41 is in driving connection with the cutting head 42, and the fourth driving mechanism 41 is adapted to drive the cutting head 42 to move along the second direction.

The second direction may be a direction of a Z axis in the drawing, the fourth driving mechanism 41 may be an air cylinder, an electric cylinder, a stepping motor, a servo motor, a linear motor, or the like, which may drive the cutting head 42 to move along the Z axis direction, so that products with different thicknesses may be cut, the cutting head 42 may be driven to move along the Z axis direction by the fourth driving mechanism 41, and the laser focus position of the cutting head 42 may be changed.

As shown in fig. 3, the general semiconductor processing apparatus further includes a vision module 8, the vision module 8 is mounted on the machine 1, and the vision module 8 is used for detecting the position of a product. The vision component 8 can comprise a camera, and the whole outline of the product can be grasped by the camera so as to realize preliminary positioning of the product, and the later cutting processing is facilitated.

As shown in fig. 2 and 3, an embodiment of the present utility model provides a loading and unloading device 3. The loading and unloading device 3 comprises a supporting structure 31, a transfer platform 32, a material box 33, a grabbing mechanism 6 and a transfer mechanism 5, wherein the transfer platform 32 is arranged on the supporting structure 31; a magazine 33 is mounted on the support structure 31, the magazine 33 being for storing products; the gripper mechanism 6 is mounted on the supporting structure 31, the gripper mechanism 6 is used for placing the products in the material box 33 on the transfer platform 32, and the gripper mechanism 6 is also used for placing the products on the transfer platform 32 back into the material box 33; the transfer table 32 is located between the magazine 33 and the transfer mechanism 5, the transfer mechanism 5 is used for moving the product from the transfer table 32 to the processing device, and the transfer mechanism 5 is also used for transferring the processed product from the processing device back to the transfer table 32.

The product can be the tablet, and the tablet comprises bearing iron ring and wafer, and the magazine 33 can include two risers 331, has seted up a plurality of recesses on two risers 331 correspondingly, and the tablet is located between two risers 331, and the recess of riser 331 can be blocked into at the opposite both ends of tablet. The tablet is placed in the magazine 33 along the Z-axis direction, when the feeding is required, the whole magazine 33 can move along the Z-axis direction, so that the uppermost tablet in the magazine 33 moves to a position flush with the gripper mechanism 6, at this time, the gripper mechanism 6 can grasp the tablet and place the tablet on the intermediate transfer table 32, and the tablet located at the uppermost of the magazine 33 can be the first tablet.

At this time, the gripper mechanism 6 may move to the magazine 33, take the first sheet in the magazine 33, transfer the first sheet onto the transfer table 32, and perform preliminary positioning on the position of the first sheet by the transfer table 32. After positioning is completed, the transfer mechanism 5 may move the first web on the transfer table 32 to a subsequent processing station. When the next sheet needs to be processed, the whole magazine 33 moves along the positive direction of the Z axis, so that the second sheet moves to a position flush with the gripper mechanism 6, at this time, the gripper mechanism 6 clamps the second sheet again, and the clamped sheet is placed on the transfer table 32.

After the first sheet is processed, the transfer mechanism 5 may move the second sheet to a subsequent processing station, and the transfer mechanism 5 may simultaneously move the first sheet back to the transfer table 32, and the processed first sheet on the transfer table 32 may be placed back into the magazine 33 by the gripper mechanism 6. And the processed web may be stacked in the magazine 33 in order from top to bottom. Similarly, the whole magazine 33 may be moved in the Z-axis direction so that the third sheet is moved to a position flush with the gripper mechanism 6, and at this time the gripper mechanism 6 again performs gripping of the third sheet and places the gripped sheet on the intermediate transfer table 32. After the second sheet is processed, the transferring mechanism 5 may move the third sheet to a subsequent processing station, and the transferring mechanism 5 may simultaneously move the second sheet back to the transferring stage 32, and the processed second sheet on the transferring stage 32 is placed back into the magazine 33 by the gripper mechanism 6. Whereby the subsequent webs in the magazine 33 are fed in a similar manner as the preceding first, second and third webs.

The product in the material box 33 is taken out and placed on the transfer table 32 through the gripper mechanism 6, the product on the transfer table 32 is moved to a processing device for processing through the transfer mechanism 5, after the processing device is used for processing, the transfer mechanism 5 moves the processed product back to the transfer table 32, and the gripper mechanism 6 returns the processed product to the material box 33. And when the processing device processes the product, the new product to be processed can be synchronously moved out of the material box 33 by the gripper mechanism 6, and placed on the transfer table 32, and after the processing device processes the product, the transfer mechanism 5 can exchange positions of the processed product and the product to be processed at the same time, so that the overall processing efficiency is increased.

As shown in fig. 4 and 5, the transfer platform 32 includes a first clamping portion 321 and a second clamping portion 322, the first clamping portion 321 and the second clamping portion 322 are respectively movably mounted on the supporting structure 31, the first clamping portion 321 and the second clamping portion 322 are suitable for moving along a third direction, and a space between the first clamping portion 321 and the second clamping portion 322 can be adjusted.

The third direction may be a direction of the Y axis in the drawing, and the distance between the first clamping portion 321 and the second clamping portion 322 may be adjusted, so that the device may adapt to webs of various sizes, and according to the size of the incoming web, the device may adapt by adjusting the distance between the first clamping portion 321 and the second clamping portion 322. And the first clamping part 321 and the second clamping part 322 can also realize the function of correcting the angle of the incoming material sheet, and realize the rough adjustment of the incoming material position, so that the subsequent material sheet is finely adjusted by the processing carrier 2 of the processing device after entering the processing device. Meanwhile, since the preliminary adjustment has been performed through the intermediate transfer stage 32, the processing stage 2 can more quickly adjust the direction of the web in place.

As shown in fig. 4 and 5, the feeding and discharging device 3 further includes a second first driving component 734, the second first driving component 734 is mounted on the supporting structure 31, the second first driving component 734 is respectively in driving connection with the first clamping portion 321 and the second clamping portion 322, and the second first driving component 734 is suitable for driving the first clamping portion 321 and the second clamping portion 322 to move along opposite directions.

In one embodiment, the second first driving assembly 734 comprises a ninth driving mechanism 341, a first pulley 342, a second pulley 343 and a belt 344, the belt 344 is partially looped around the first pulley 342 and the second pulley 343, the ninth driving mechanism 341 is in driving connection with the first pulley 342, the ninth driving mechanism 341 is adapted to drive the first pulley 342 to rotate around the second direction, the second pulley 343 is adapted to be in driving connection with the first pulley 342 through the belt 344, the first clamping portion 321 and the second clamping portion 322 are mounted on the belt 344, and the first clamping portion 321 and the second clamping portion 322 are adapted to move along with the belt 344.

The driving end of the ninth driving mechanism 341 may be keyed to the first pulley 342, and as the driving end of the ninth driving mechanism 341 rotates, the belt 344 and the second pulley 343 may rotate synchronously, with two belts 344 between the first pulley 342 and the second pulley 343, and as the first pulley 342 rotates, the movement directions of the two belts 344 are opposite. The first clamping portion 321 and the second clamping portion 322 are respectively connected with one of the belts 344, so that the first clamping portion 321 and the second clamping portion 322 can be moved closer to or farther from each other as the ninth driving mechanism 341 drives the first pulley 342 to rotate forward or backward.

In another embodiment, the second first driving assembly 734 may further use a cylinder, an electric cylinder, a linear motor, a servo motor, etc., for example, the second first driving assembly 734 may use two cylinders, the first clamping portion 321 and the second clamping portion 322 are respectively connected to one of the cylinders, and the first clamping portion 321 and the second clamping portion 322 may be independently controlled to move by one cylinder.

As shown in fig. 2 and 3, the loading and unloading device 3 further includes a tenth driving mechanism 35, the tenth driving mechanism 35 is mounted on the supporting structure 31, the tenth driving mechanism 35 is in driving connection with the magazine 33, and the tenth driving mechanism 35 is adapted to drive the magazine 33 to move along the second direction.

The second direction may be a direction of a Z axis in the drawing, and the tenth driving mechanism 35 may be a cylinder, an electric cylinder, a linear motor, a servo motor, or the like, and in an embodiment of the present utility model, the tenth driving mechanism 35 is selected to be a servo motor, and the servo motor has advantages of high control precision, good operation stability, and the like. The material box 33 is driven to move along the Z-axis direction by the servo motor, so that the alignment precision between the material sheets in the material box 33 and the gripper mechanism 6 can be ensured, and the gripper mechanism 6 can grasp the material sheets conveniently.

As shown in fig. 6 and 7, an embodiment of the present utility model provides a transfer mechanism 5. The transfer mechanism 5 comprises a first link 51, a first gripper assembly 52 and a second gripper assembly 53, the first link 51 being adapted to rotate about a second direction; the first grip assembly 52 is mounted to the first link 51; the second gripper assembly 53 is mounted on the first connecting piece 51, the first gripper assembly 52 and the second gripper assembly 53 are used for grabbing products, the rotation center of the first connecting piece 51 is located between the first gripper assembly 52 and the second gripper assembly 53, and the first gripper assembly 52 and the second gripper assembly 53 are arranged in a central symmetry mode.

The product can be a wafer, in the production and processing process of the wafer, the wafer needs to be taken out from a feeding station and transferred to a processing station for processing, and the processed wafer also needs to be uniformly recovered and fed, and the second direction can be the direction of a Z axis in the figure.

For example, the wafers may be sequentially placed on a loading platform from which the material is to be taken, and the first gripper assembly 52 may first grip the first wafer. And after the first gripper assembly 52 fixes the first wafer, the first link 51 may be rotated in the Z-axis direction so that the first gripper assembly 52 moves close to the processing device. The first gripper assembly 52 may now place the wafer on the processing platform of the processing device, while the second gripper assembly 53 is now positioned close to the loading platform due to the rotation of the first connector 51, at which time the second wafer continues to be placed on the loading platform.

The second gripper assembly 53 may grasp the second wafer after the processing device processes the first wafer, and the first gripper assembly 52 may grasp the first wafer processed by the processing device when the second gripper assembly 53 grasps the second wafer. After the first connecting piece 51 rotates around the Z-axis direction, the second wafer is transferred to the processing platform by the second gripper assembly 53, and the first processed wafer may be placed back onto the loading platform by the first gripper assembly 52, and the processed first wafer is removed from the loading platform and stored uniformly. After the first wafer is removed from the loading platform, a third wafer may continue to be placed on the loading platform.

When the processing device finishes processing the second wafer, the first gripper assembly 52 can grab the third wafer, the second gripper assembly 53 can grab the processed second wafer, and after grabbing, the first connecting piece 51 rotates along the Z-axis direction, so that the third wafer is transferred to the processing platform by the first gripper assembly 52, the second processed wafer can be placed back to the feeding platform by the second gripper assembly 53, the processed second wafer is removed from the feeding platform to be uniformly stored, and seamless connection processing of the wafer can be realized by repeating the steps, so that the efficiency is effectively improved.

And under the general circumstances, loading platform and processing platform are not in on a straight line, probably have certain dislocation between the two, although processing platform can follow X axle and Y axle direction and remove, but all need to remove processing platform to the same straight line with the loading platform before processing at every turn and lead to holistic process time to increase, have influenced efficiency. Therefore, by arranging the first gripper assembly 52 and the second gripper assembly 53 in a staggered manner, after the first connecting piece 51 rotates 180 degrees, the first gripper assembly 52 or the second gripper assembly 53 can convey the wafer to the processing platform more quickly or take the wafer off from the processing platform, so that the overall production and processing efficiency is greatly improved.

Through first tongs subassembly 52 and the second tongs subassembly 53 that are the centrosymmetric setting for first tongs subassembly 52 or second tongs subassembly 53 are snatching the processing position that the product can be faster transported to processingequipment, have reduced processingequipment's processing platform and have adjusted time, secondly, rotate along the second direction through first connecting piece 51, make the position of first tongs subassembly 52 and second tongs subassembly 53 carry out the switching material loading, can reduce transfer mechanism 5's volume effectively, avoid the waste of too much material.

As shown in fig. 6 and 7, the first gripper assembly 52 includes a fifth driving mechanism 521, a first adsorbing member 522 and a second adsorbing member 523, the fifth driving mechanism 521 is mounted on the first connecting member 51, the fifth driving mechanism 521 is respectively in driving connection with the first adsorbing member 522 and the second adsorbing member 523, and the fifth driving mechanism 521 is adapted to drive the first adsorbing member 522 and the second adsorbing member 523 to approach or separate.

The fifth driving mechanism 521 may be a bidirectional cylinder, the bidirectional cylinder may be provided with two ejector rods, the first adsorption component 522 and the second adsorption component 523 are respectively installed on one of the ejector rods, and along with the air flow flowing in the cylinder body of the cylinder, the ejector rods on the cylinder can drive the first adsorption component 522 and the second adsorption component 523 to gradually approach or separate from each other, so as to realize the function of adjusting the distance, and further be compatible with wafers of different sizes.

As shown in fig. 6 and 7, the first adsorbing member 522 includes a second connecting member 5221 and a nozzle structure 5222, the fifth driving mechanism 521 is in driving connection with the second connecting member 5221, the nozzle structure 5222 is movably mounted on the second connecting member 5221, and the position of the nozzle structure 5222 relative to the second connecting member 5221 is adjustable.

The second connector 5221 may be provided with a waist-shaped hole, the suction nozzle structure 5222 may be adjusted in the waist-shaped hole, and the opening direction of the waist-shaped hole may be the moving direction of the first or second suction member 522 or 523. Since the first suction member 522 and the second suction member 523 are driven by the air cylinder, there is a certain error in accuracy, and thus fine adjustment of the position of the suction nozzle structure 5222 can be achieved by adjusting the position of the suction nozzle structure 5222 with respect to the second connector 5221.

As shown in fig. 6 and 7, the second connecting member 5221 includes a first segment and a second segment, the first segment and the second segment are disposed at an included angle, the first segment is mounted on the driving end of the fifth driving mechanism 521, the nozzle structures 5222 are respectively mounted on two opposite ends of the second segment, and the first end is located between the two nozzle structures 5222.

The included angle between the first segment and the second segment may be 90 °, and the suction nozzle structure 5222 installed at the opposite ends of the second segment may effectively increase the fixing range of the first adsorption member 522 to the wafer. The second adsorption component 523 may also include a second connector 5221 and a suction nozzle structure 5222, two suction nozzle structures 5222 may be mounted on each second connector 5221, and four suction nozzle structures 5222 are disposed on the first gripper assembly 52 or the second gripper assembly 53, and the four suction nozzle structures 5222 can adsorb the wafer at the same time, so as to ensure the stability of wafer adsorption.

As shown in fig. 8 and 9, the second connecting member 5221 is provided with a reinforcing rib 5223. The reinforcing ribs 5223 can function to increase the overall strength of the second connecting member 5221, and ensure the reliability of the second connecting member 5221 when used for a long period of time.

The transfer mechanism 5 further comprises a third connecting piece 54, the third connecting piece 54 is mounted on the first connecting piece 51, a waist-shaped hole is formed in the third connecting piece 54, and a bolt is suitable for penetrating through the waist-shaped hole and being connected with the fifth driving mechanism 521.

The third connecting member 54 may include a first bending section, a second bending section and a third bending section, where the first bending section is perpendicular to the second bending section, the second bending section is perpendicular to the third bending section, the first bending section is parallel to the third bending section, the fifth driving mechanism 521 is fixed on the first bending section, and the third bending section is mounted on the first connecting member 51. By providing the third connecting member 54, on the one hand, the length of the relay mechanism 5 in the Z-axis direction can be shortened, and excessive loss of material can be reduced. On the other hand, since the positions of the openings 511 formed in the cylinders are all set before shipment, the positions of the openings 511 of the cylinders with different sizes are different, so that the cylinders with different sizes can be compatible through the waist-shaped holes in the third connecting piece 54, and the fifth driving mechanism 521 can be conveniently fixed by using bolts.

As shown in fig. 6 and 7, the second gripper assembly 53 includes a sixth driving mechanism 531, a third absorbing member 532 and a fourth absorbing member 533, the sixth driving mechanism 531 is mounted on the first connecting member 51, the sixth driving mechanism 531 is respectively in driving connection with the third absorbing member 532 and the fourth absorbing member 533, and the sixth driving mechanism 531 is adapted to drive the third absorbing member 532 and the fourth absorbing member 533 to approach or separate.

The sixth driving mechanism 531 may be a bidirectional cylinder, the bidirectional cylinder may be provided with two ejector rods, the third adsorption component 532 and the fourth adsorption component 533 are respectively installed on one of the ejector rods, and along with the air flow flowing in the cylinder body of the cylinder, the ejector rods on the cylinder can drive the third adsorption component 532 and the fourth adsorption component 533 to gradually approach or separate from each other, so that the effect of adjusting the distance is achieved, and wafers with different sizes can be compatible.

As shown in fig. 6 and 8, the transfer mechanism 5 further comprises a rotation mechanism 56, the rotation mechanism 56 being in driving connection with the first connection member 51, the rotation mechanism 56 being adapted to drive the first connection member 51 to rotate about the second direction. The rotation mechanism 56 may be a rotation cylinder, and the second direction may be a direction of the Z axis, and the rotation of the first link 51 about the Z axis direction may be achieved by the rotation cylinder.

As shown in fig. 6 and 8, the transfer mechanism 5 further includes a seventh driving mechanism 55, the seventh driving mechanism 55 is mounted on the driving end of the rotating mechanism 56, the seventh driving mechanism 55 is in driving connection with the first connecting member 51, and the seventh driving mechanism 55 is adapted to drive the first connecting member 51 to move along the second direction.

The seventh driving mechanism 55 may be a linear motor, an electric cylinder, a cylinder, etc., and the cylinder may be a double-acting cylinder, for example, on which two air holes are provided, respectively, and in which air flows so that a piston rod may be extended or retracted from a cylinder body of the cylinder. The end of the piston rod away from the cylinder may be connected to the first link 51, and the first link 51 may be moved as the piston rod is extended or retracted, and the moving direction of the first link 51 may be the direction of the Z axis in the drawing.

The first connecting member 51 is driven to move along the Z-axis direction by the air cylinder, so that the effect of adsorbing the alignment wafer can be achieved. When the wafer needs to be grasped, the cylinder drives the first connecting piece 51 to move in a direction approaching the wafer until the surface of the wafer is contacted. The suction nozzle structure 5222 can adsorb the wafer, and the cylinder drives the first connecting piece 51 to move towards a direction away from the loading platform, so that the wafer leaves the surface of the loading platform. And the first connecting piece 51 rotates to prevent the surface of the wafer from being scratched in the rotating process, so that the wafer can be safely moved to the processing platform.

The first connecting member 51 is provided with a plurality of openings 511. The opening 511 formed in the first connecting member 51 can effectively reduce the weight of the first connecting member 51 itself, reduce the load weight of the seventh driving mechanism 55, the rotating mechanism 56 and the like, and ensure the reliability of the apparatus for long-term use.

Referring to fig. 10 and 11 together, a description will be given of the gripper mechanism 6 provided by the present application. The application provides a gripper mechanism 6, which comprises a mounting seat 61, a first clamping plate 62, a second clamping plate 63, an eighth driving mechanism 64 and an induction device 65. The first clamping plate 62 is movably disposed on the mounting seat 61 along a first direction. The second clamping plate 63 is movably disposed on the first clamping plate 62 along the second direction. Wherein the first direction and the second direction are arranged at 90 degrees. As shown in fig. 10, "first direction" refers to the X-axis direction in the drawing, and "second direction" refers to the Z-axis direction in the drawing. It is to be understood that the above definitions are merely to facilitate understanding of the relative positional relationship of the various components and are not to be construed as limiting the present application.

The eighth driving mechanism 64 is in transmission connection with the second clamping plate 63, and is used for driving the second clamping plate 63 to move along the second direction to approach or separate from the first clamping plate 62, so as to clamp or unclamp a workpiece.

Sensing device 65 includes a sensor 651 and a sensing member 652. Sensing element 652 is capable of triggering sensor 651 to generate a sensing signal when in a predetermined position of sensor 651. In one embodiment of the present application, inductor 651 may be mounted to mount 61 and inductor 652 may be mounted to first clamping plate 62. When the first clamping plate 62 collides with the workpiece, the first clamping plate 62 can retract along the first direction due to the fact that the first clamping plate 62 can move along the first direction relative to the mounting seat 61, so that the first clamping plate 62 is prevented from directly colliding with the workpiece in a rigid manner; meanwhile, as the sensing piece 652 is mounted on the first clamping plate 62, the sensor 651 is mounted on the mounting seat 61, when the first clamping plate 62 is retracted along the first direction, the sensing piece 652 can retract synchronously along with the first clamping plate 62, and when the sensing piece 652 moves to a preset position of the sensor 651, the sensor 651 can be triggered to generate a sensing signal, so that the gripper mechanism 6 stops working, the workpiece is prevented from being damaged due to further movement of the gripper mechanism 6, waste of production products can be avoided, and production cost is saved.

Of course, the arrangement of the inductor 651 and the inductor 652 is not limited thereto, and for example, in another embodiment of the present application, the inductor 651 may be mounted on the first clamping plate 62, and the inductor 652 may be mounted on the mounting seat 61.

According to the gripper mechanism 6 provided by the application, the first clamping plate 62, the second clamping plate 63 and the eighth driving mechanism 64 are arranged, and the eighth driving mechanism 64 is utilized to drive the second clamping plate 63 to move along the second direction so as to be close to or far from the first clamping plate 62, so that the clamping or loosening of a workpiece is realized; the first clamping plate 62 can move along a first direction relative to the mounting seat 61, and when the first clamping plate 62 collides with a workpiece, the first clamping plate 62 can retract along the first direction, so that the first clamping plate 62 is prevented from directly and rigidly colliding with the workpiece; meanwhile, as the sensing piece 652 is mounted on the first clamping plate 62, the sensor 651 is mounted on the mounting seat 61, when the first clamping plate 62 is retracted along the first direction, the sensing piece 652 can retract synchronously along with the first clamping plate 62, and when the sensing piece 652 moves to a preset position of the sensor 651, the sensor 651 can be triggered to generate a sensing signal, so that the gripper mechanism 6 stops working, the workpiece is prevented from being damaged due to further movement of the gripper mechanism 6, waste of production products can be avoided, and production cost is saved.

Further, referring to fig. 10 and 13, as an embodiment of the gripper mechanism 6 provided by the present application, the gripper mechanism 6 may further include a guide assembly 66, where the guide assembly 66 includes a guide rail 661 and a slider 662 slidably connected to the guide rail 661. In one embodiment of the present application, the guide rail 661 is mounted on the first clamping plate 62, the slider 662 is mounted on the mounting seat 61, the first clamping plate 62 can move along the guide rail 661 by the cooperation of the guide rail 661 and the slider 662, so that the movement accuracy can be improved, and the movement of the first clamping plate 62 can be more sensitive by mounting the guide rail 661 on the first clamping plate 62 and the slider 662 on the mounting seat 61, so that the workpiece can be effectively prevented from being damaged. Of course, the arrangement of the guide rail 661 and the slider 662 is not limited to this, and for example, in another embodiment of the present application, the guide rail 661 may be mounted on the mount 61, and the slider 662 may be mounted on the first clamp plate 62.

Further, referring to fig. 11 and 13, as a specific embodiment of the gripper mechanism 6 provided by the present application, a limiting piece 621 may be further disposed on the first clamping plate 62, where the limiting piece 621 is used to prevent the slider 662 from falling off from the guide rail 661. Specifically, the limiting member 621 is disposed on a side of the first clamping plate 62 away from the workpiece.

Further, referring to fig. 10 and 13, as a specific embodiment of the gripper mechanism 6 provided by the present application, the gripper mechanism 6 may further include an elastic member 67, where the elastic member 67 is disposed between the first clamping plate 62 and the mounting seat 61. The elastic piece 67 can provide pretightening force for the first clamping plate 62 during clamping, so that the first clamping plate 62 is stable and reliable during workpiece clamping, and the first clamping plate 62 can be reset in time after moving along the first direction during collision.

Further, referring to fig. 10, 12 and 13, as a specific embodiment of the gripper mechanism 6 provided by the present application, a baffle 622 may be disposed on the first clamping plate 62, one end of the elastic member 67 abuts against the baffle 622, and the other end of the elastic member 67 abuts against the mounting seat 61. By providing the blocking plate 622 on the first clamping plate 62, the installation of the elastic member 67 can be facilitated. Specifically, in one embodiment of the present application, the elastic member 67 may be a compression spring, and in other embodiments of the present application, the elastic member 67 may be an extension spring, a spring plate, or the like.

Specifically, as shown in fig. 13, the baffle 622 and the mounting seat 61 may be provided with guide holes 611, and two ends of the elastic member 67 are respectively mounted in the guide holes 611. By the arrangement of the guide holes 611, a guiding function can be performed.

Further, referring to fig. 12, as a specific embodiment of the gripper mechanism 6 provided by the present application, a limiting block 623 may be disposed on the first clamping plate 62, where the limiting block 623 is used to limit the maximum travel of the second clamping plate 63 moving along the second direction and away from the first clamping plate 62. When the gripper mechanism 6 needs to be opened, the eighth drive mechanism 64 drives the second clamping plate 63 in the second direction and away from the first clamping plate 62, thereby achieving the opening. By the setting of the stopper 623, the opening range of the gripper mechanism 6 can be limited.

Further, referring to fig. 10, as a specific embodiment of the gripper mechanism 6 provided by the present application, the number of the limiting blocks 623 may include a plurality of limiting blocks 623, and the plurality of limiting blocks 623 are disposed on the first clamping plate 62 at intervals, so as to limit the peripheral side of the second clamping plate 63, and have good stability.

Further, referring to fig. 12 and 15, as a specific embodiment of the gripper mechanism 6 provided by the present application, a buffer pad 6231 is disposed on a surface of the stopper 623 contacting the first clamping plate 62. By the provision of the cushion 6231, damage to the second clamp plate 63 can be avoided. Specifically, the cushion 6231 may be plastic or silica gel.

Further, referring to fig. 10 and 14, as an embodiment of the gripper mechanism 6 provided by the present application, the first gripper 62 includes a gripper body 624, a first side plate 625, a second side plate 626, and a third side plate 627. The clamping plate main body 624, the first side plate 625, the second side plate 626 and the third side plate 627 are enclosed to form a groove 628, and the second clamping plate 63 is accommodated in the groove 628. By accommodating the second clamping plate 63 in the groove 628, the structure is compact, which is beneficial to reducing the volume.

Specifically, the first side plate 625, the second side plate 626, and the third side plate 627 may be integrally formed with the clamp plate main body 624, and the processing technology is simple, and of course, the first side plate 625, the second side plate 626, and the third side plate 627 may also be detachably connected with the clamp plate main body 624.

Further, referring to fig. 10 and 14, as a specific embodiment of the gripper mechanism 6 provided by the present application, a through hole 6241 may be formed in the clamping plate main body 624, the eighth driving mechanism 64 is disposed on a side of the clamping plate main body 624 facing away from the recess 628, and one end of the eighth driving mechanism 64 passes through the through hole 6241 and is connected and fixed with the second clamping plate 63. The structure is simple and compact, and the volume can be effectively reduced. The eighth driving mechanism 64 passes through the through hole 6241 and is fixedly connected with the second clamping plate 63, so that the second clamping plate 63 can be driven to move along the second direction.

Specifically, the eighth driving mechanism 64 may be an air cylinder, and of course, the eighth driving mechanism 64 may be a linear motor, or may be a rotary motor and convert the rotational driving force of the rotary motor into linear motion of the second clamping plate 63 through a transmission mechanism, such as a rack-and-pinion or a screw-nut transmission mechanism.

Further, referring to fig. 12 to 13, as an embodiment of the gripper mechanism 6 provided in the present application, the sensing member 652 is detachably mounted on the first clamping plate 62. Specifically, the first clamping plate 62 is provided with a connecting hole 629, the sensing element 652 is provided with an adjusting groove 6521 extending along the first direction, and a fixing element (not shown) passes through any position of the adjusting groove 6521 and is connected and fixed with the connecting hole 629. Trimming of sensing element 652 in a first direction may be accomplished. When the position of the sensing piece 652 needs to be adjusted, the connecting piece and the connecting hole 629 are only required to be loosened, the sensing piece 652 is moved, and when the sensing piece 652 moves to a designated position, the connecting piece and the connecting hole 629 are connected and fixed, so that the adjustment is very simple and convenient. Specifically, the connecting member may be a screw, and the connecting hole 629 may be a threaded hole.

Further, referring to fig. 10 to 11, as a specific embodiment of the gripper mechanism 6 provided by the present application, the gripper mechanism 6 further includes a support base 68, the mounting base 61 is fixed on the support base 68, and the gripper mechanism 6 is mounted on a feeding device or a discharging device through the support base 68, so as to realize feeding or discharging of a workpiece.

Although the utility model is disclosed above, the scope of the utility model is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the utility model, and these changes and modifications will fall within the scope of the utility model.

Claims (10)

1. A general semiconductor processing apparatus, comprising:

a machine table;

the processing carrier is movably mounted on the machine table, is suitable for moving along a first direction and a third direction, and is also suitable for rotating around a second direction;

the feeding and discharging device is arranged on the machine table and is suitable for placing products on the processing carrier table, and the feeding and discharging device is also suitable for taking away the products on the processing carrier table;

the cutting device is arranged on the machine table; the cutting device is used for cutting the product.

2. The semiconductor processing apparatus of claim 1, further comprising a first drive assembly drivingly coupled to the processing stage, the first drive assembly adapted to drive the processing stage in the first direction and the third direction.

3. The semiconductor processing apparatus according to claim 2, wherein the first driving assembly comprises a first driving mechanism and a second driving mechanism, the first driving mechanism is mounted on the machine table, the second driving mechanism is mounted on a driving end of the first driving mechanism, the second driving mechanism is in driving connection with the processing stage, the first driving mechanism is adapted to drive the second driving mechanism and the processing stage to move in the third direction, and the second driving mechanism is adapted to drive the processing stage to move in the first direction.

4. A semiconductor processing apparatus according to claim 3, wherein the first drive assembly further comprises a third drive mechanism, the second drive mechanism being drivingly connected to the third drive mechanism, the second drive mechanism being adapted to drive the third drive mechanism to move in the first direction, the processing stage being mounted on a drive end of the third drive mechanism, the third drive mechanism being adapted to drive the processing stage to rotate about the second direction.

5. The semiconductor processing apparatus according to claim 2, wherein the cutting device comprises a fourth driving mechanism and a cutting head, the fourth driving mechanism being mounted on the machine table, the fourth driving mechanism being in driving connection with the cutting head, the fourth driving mechanism being adapted to drive the cutting head to move in the second direction.

6. The general semiconductor processing apparatus of claim 1, further comprising a vision assembly mounted on the machine, the vision assembly for detecting a position of the product.

7. The general semiconductor processing apparatus according to claim 1, wherein the loading and unloading device comprises:

a support structure;

a transfer station mounted on the support structure;

the material box is arranged on the supporting structure and is used for storing products;

the gripper mechanism is arranged on the supporting structure and is used for placing the products in the material box on the transfer platform and also used for placing the products on the transfer platform back into the material box;

the transfer mechanism is positioned between the material box and the transfer mechanism, and is used for moving the product from the transfer platform to the processing device and transferring the processed product from the processing device back to the transfer platform.

8. The semiconductor processing apparatus of claim 7, wherein the transfer table comprises a first clamping portion and a second clamping portion, the first clamping portion and the second clamping portion being movably mounted on the support structure, respectively, the first clamping portion and the second clamping portion being adapted to move in a third direction, and a spacing between the first clamping portion and the second clamping portion being adjustable.

9. The general semiconductor processing apparatus according to claim 7, wherein the relay mechanism comprises:

a first link adapted to rotate about a second direction;

a first gripper assembly mounted on the first connector;

the second tongs subassembly, the second tongs subassembly install in on the first connecting piece, first tongs subassembly with the second tongs subassembly is used for snatching the product, the rotation center of first connecting piece is located first tongs subassembly with between the second tongs subassembly, first tongs subassembly with second tongs subassembly central symmetry sets up.

10. The general semiconductor processing apparatus of claim 7, wherein the gripper mechanism comprises:

a mounting base;

the first clamping plate can be movably arranged on the mounting seat along a first direction;

the second clamping plate can be movably arranged on the first clamping plate along a second direction, and the first direction and the second direction are arranged at 90 degrees;

the eighth driving mechanism is in transmission connection with the second clamping plate and is used for driving the second clamping plate to move along the second direction so as to be close to or far away from the first clamping plate;

The induction device comprises an inductor and an induction piece, wherein the induction piece can trigger the inductor to generate induction signals when being positioned at a preset position of the inductor, the inductor is installed on the installation seat, the induction piece is installed on the first clamping plate or the inductor is installed on the first clamping plate, and the induction piece is installed on the installation seat.