CN219851706U - Stamping die side pin buffer assembly - Google Patents
Stamping die side pin buffer assembly Download PDFInfo
- Publication number
- CN219851706U CN219851706U CN202321262747.5U CN202321262747U CN219851706U CN 219851706 U CN219851706 U CN 219851706U CN 202321262747 U CN202321262747 U CN 202321262747U CN 219851706 U CN219851706 U CN 219851706U
- Authority
- CN
- China
- Prior art keywords
- accommodating groove
- side pin
- buffer block
- pin rod
- aluminum alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 25
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 22
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 229910000737 Duralumin Inorganic materials 0.000 description 17
- 229910045601 alloy Inorganic materials 0.000 description 17
- 239000000956 alloy Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
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- Presses And Accessory Devices Thereof (AREA)
Abstract
The utility model relates to the technical field of stamping dies and discloses a side pin buffer assembly of a stamping die, which comprises a material pressing device and an upper die body, wherein a horizontal side pin rod penetrates through the upper die body, a first accommodating groove is formed in one side, facing the upper die body, of the material pressing device, the end part of the side pin rod extends into the first accommodating groove, the height of the first accommodating groove is larger than the outer diameter of the side pin rod, a second accommodating groove is further formed in the material pressing device and is communicated with the first accommodating groove, the depth of the second accommodating groove is larger than that of the first accommodating groove, and a hard aluminum alloy buffer block is arranged in the second accommodating groove. The side pin buffer assembly of the stamping die avoids direct contact of rigid parts, prolongs the service life of the die and saves cost.
Description
Technical Field
The utility model relates to the technical field of stamping dies, in particular to a side pin buffer assembly of a stamping die.
Background
At present, a material pressing device structure is widely used in an automobile panel stamping die, the pressure required by different products is different, the larger the spring pressure is, the larger the reaction force is, the reaction force acts on the material pressing device, after stamping is completed, a lateral pin rod and the material pressing device collide instantaneously when the punching machine is on the upper side, the lateral pin rod and the material pressing device can fail when the designed use frequency of the lateral pin rod and the material pressing device is far less, the service life of the die is influenced, and therefore, frequent replacement is required, the production efficiency is seriously influenced, and the cost is increased.
Disclosure of Invention
The utility model aims at overcoming the defects of the technology, and provides the side pin buffer assembly of the stamping die, so that the direct contact of rigid parts is avoided, the service life of the die is prolonged, and the cost is saved.
In order to achieve the above purpose, the stamping die side pin buffer assembly comprises a material pressing device and an upper die body, wherein a horizontal side pin rod penetrates through the upper die body, a first accommodating groove is formed in one side, facing the upper die body, of the material pressing device, the end portion of the side pin rod extends into the first accommodating groove, the height of the first accommodating groove is larger than the outer diameter of the side pin rod, a second accommodating groove is further formed in the material pressing device, the second accommodating groove is communicated with the first accommodating groove, the depth of the second accommodating groove is larger than that of the first accommodating groove, and a hard aluminum alloy buffer block is arranged in the second accommodating groove.
Preferably, the top of the material pressing device is provided with a vertical screw mounting hole, a screw mounting groove is formed in the position, corresponding to the screw mounting hole, of the hard aluminum alloy buffer block, and the material pressing device and the hard aluminum alloy buffer block are fixedly connected through screws penetrating through the screw mounting hole and the screw mounting groove, so that the hard aluminum alloy buffer block is prevented from falling off and rotating when impacted by the side pin rod.
Preferably, the side pin rod is a cylinder, the side surface, close to the side pin rod, of the duralumin alloy buffer block is an arc surface matched with the side pin rod, so that the contact area of the duralumin alloy buffer block and the side pin rod during collision can be increased, and the too concentrated stress is avoided.
Preferably, the duralumin alloy buffer block is a cylinder, and the inner wall of the second accommodating groove is an arc surface matched with the duralumin alloy buffer block, so that the duralumin alloy buffer block is better contacted with the material pressing device.
Preferably, the bottom surface of the second accommodating groove is in contact with the bottom surface of the duralumin alloy buffer block.
Compared with the prior art, the utility model has the following advantages:
1. when the side pin rod and the hard aluminum alloy buffer block are in contact collision, the hard aluminum alloy buffer block absorbs a large amount of impact kinetic energy of the side pin rod, so that noise generated by rigid collision is reduced;
2. the direct contact of rigid components is avoided in the whole process, the service life of the die is prolonged, and the cost is saved;
3. the structure is simple, and the production and the use are convenient;
4. the hard aluminum alloy buffer block is easy to replace.
Drawings
Fig. 1 is a schematic structural view of a side pin buffer assembly of a press die according to the present utility model.
The reference numerals of the components in the drawings are as follows:
the die comprises a material pressing device 1, an upper die body 2, a side pin rod 3, a first accommodating groove 4, a second accommodating groove 5, a hard aluminum alloy buffer block 6, screw mounting holes 7, screw mounting grooves 8, screws 9, side surfaces 10 and an inner wall 11.
Detailed Description
The utility model will now be described in further detail with reference to the drawings and to specific examples.
As shown in fig. 1, a stamping die side pin buffer assembly comprises a material pressing device 1 and an upper die body 2, wherein a horizontal side pin rod 3 penetrates through the upper die body 2, a first accommodating groove 4 is formed in one side, facing the upper die body 2, of the material pressing device 1, the end portion of the side pin rod 3 stretches into the first accommodating groove 4, the height of the first accommodating groove 4 is larger than the outer diameter of the side pin rod 3, a second accommodating groove 5 is further formed in the material pressing device 1, the second accommodating groove 5 is communicated with the first accommodating groove 4, the depth of the second accommodating groove 5 is larger than that of the first accommodating groove 4, and a hard aluminum alloy buffer block 6 is arranged in the second accommodating groove 5.
Wherein, the glassware 1 top is equipped with vertical screw mounting hole 7, and the position that duralumin alloy buffer block 6 corresponds with screw mounting hole 7 is equipped with screw mounting groove 8, and glassware 1, duralumin alloy buffer block 6 drop, rotate when preventing that duralumin alloy buffer block 6 receives side pin 3 striking through passing screw 9 fixed connection of screw mounting hole 7 and screw mounting groove 8.
In addition, in the embodiment, the side pin rod 3 is a cylinder, and the side surface 10 of the duralumin alloy buffer block 6 close to the side pin rod 3 is an arc surface matched with the side pin rod 3, so that the contact area of the duralumin alloy buffer block 6 and the side pin rod 3 during collision can be increased, and the too concentrated stress is avoided; the duralumin alloy buffer block 6 is a cylinder, and the inner wall 11 of the second accommodating groove 5 is an arc surface matched with the duralumin alloy buffer block 6, so that the duralumin alloy buffer block 6 is better contacted with the material pressing device 1.
Finally, the bottom surface of the second accommodating groove 5 is contacted with the bottom surface of the hard aluminum alloy buffer block 6, so that the hard aluminum alloy buffer block 6 is better contacted with the material pressing device 1.
When the embodiment is used, after stamping is completed, the upper die body 2 moves upwards along with the punch sliding block, at the moment, the side pin rod 3 and the duralumin alloy buffer block 6 start to collide and contact, the material pressing device 1 and the duralumin alloy buffer block 6 move upwards along with the side pin rod 3, the density of the duralumin alloy buffer block 6 is relatively low, the performance of absorbing impact force is good, the strength is high, a large amount of impact kinetic energy can be absorbed after the impact, and meanwhile noise generated by the collision is reduced.
According to the side pin buffer assembly of the stamping die, when the side pin rods 3 and the hard aluminum alloy buffer block 6 are in contact collision, the hard aluminum alloy buffer block 6 absorbs a large amount of collision kinetic energy of the side pin rods 3, so that noise generated by rigid collision is reduced; the direct contact of rigid components is avoided in the whole process, the service life of the die is prolonged, and the cost is saved; the structure is simple, and the production and the use are convenient; and the hard aluminum alloy buffer block 6 is easy to replace.
Claims (5)
1. The utility model provides a stamping die side round pin buffer unit, includes glassware (1) and last die body (2), its characterized in that: the die comprises an upper die body (2), wherein a horizontal side pin rod (3) penetrates through the upper die body (2), a first accommodating groove (4) is formed in one side of the upper die body (2) towards the material pressing device (1), the end portion of the side pin rod (3) stretches into the first accommodating groove (4), the height of the first accommodating groove (4) is larger than the outer diameter of the side pin rod (3), a second accommodating groove (5) is further formed in the material pressing device (1), the second accommodating groove (5) is communicated with the first accommodating groove (4), and the depth of the second accommodating groove (5) is larger than that of the first accommodating groove (4), and a hard aluminum alloy buffer block (6) is arranged in the second accommodating groove (5).
2. The stamping die side pin cushioning assembly of claim 1, wherein: the screw mounting device is characterized in that a vertical screw mounting hole (7) is formed in the top of the material pressing device (1), a screw mounting groove (8) is formed in the position, corresponding to the screw mounting hole (7), of the hard aluminum alloy buffer block (6), and the material pressing device (1) and the hard aluminum alloy buffer block (6) are fixedly connected through screws (9) penetrating through the screw mounting hole (7) and the screw mounting groove (8).
3. The stamping die side pin cushioning assembly of claim 1, wherein: the side pin rod (3) is a cylinder, and the side surface (10) of the hard aluminum alloy buffer block (6) close to the side pin rod (3) is an arc surface matched with the side pin rod (3).
4. The stamping die side pin cushioning assembly of claim 1, wherein: the hard aluminum alloy buffer block (6) is a cylinder, and the inner wall (11) of the second accommodating groove (5) is an arc surface matched with the hard aluminum alloy buffer block (6).
5. The stamping die side pin cushioning assembly of claim 1, wherein: the bottom surface of the second accommodating groove (5) is contacted with the bottom surface of the hard aluminum alloy buffer block (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321262747.5U CN219851706U (en) | 2023-05-23 | 2023-05-23 | Stamping die side pin buffer assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321262747.5U CN219851706U (en) | 2023-05-23 | 2023-05-23 | Stamping die side pin buffer assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219851706U true CN219851706U (en) | 2023-10-20 |
Family
ID=88318464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321262747.5U Active CN219851706U (en) | 2023-05-23 | 2023-05-23 | Stamping die side pin buffer assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219851706U (en) |
-
2023
- 2023-05-23 CN CN202321262747.5U patent/CN219851706U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |