CN219831774U - Radiator for computer CPU chip - Google Patents
Radiator for computer CPU chip Download PDFInfo
- Publication number
- CN219831774U CN219831774U CN202320512229.8U CN202320512229U CN219831774U CN 219831774 U CN219831774 U CN 219831774U CN 202320512229 U CN202320512229 U CN 202320512229U CN 219831774 U CN219831774 U CN 219831774U
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- CN
- China
- Prior art keywords
- fixedly connected
- water
- radiator
- heat
- bevel gear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 77
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 238000005057 refrigeration Methods 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 5
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer CPU chip radiator, which comprises a heat conducting plate, wherein the top of the heat conducting plate is fixedly connected with a water-cooling heat absorbing head, the edge of the top of the heat conducting plate is fixedly connected with a plurality of radiating fins, the water outlet of the water-cooling heat absorbing head is fixedly connected with a first hose, the tail end of the first hose is fixedly connected with an outer frame, the inner top of the outer frame is fixedly connected with a finned tube radiator, and the first hose is fixedly communicated with the water inlet of an adjacent finned tube radiator. According to the utility model, the heat dissipation mode can be changed according to actual use conditions, heat dissipation is carried out through the heat dissipation fins at the initial stage of starting the CPU, the energy consumption is reduced, the temperature of the CPU rises in the use process, the heat dissipation can be carried out through water cooling, the CPU can be cooled, when the heat dissipation effect is poor due to the higher external environment temperature, the refrigeration heat dissipation can be selected, and the heat dissipation effect is ensured, so that the use performance of the CPU is ensured.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a radiator for a computer CPU chip.
Background
The heat radiator of the computer CPU chip is the hardware for reducing the temperature of the CPU, and good heat radiation can ensure the performance of the CPU and prevent the CPU from reducing the frequency due to high temperature. CPU radiators can be divided into a plurality of types according to the heat dissipation form, and most common are air-cooled radiators and water-cooled radiators;
the existing air-cooled radiator and water-cooled radiator have certain defects in the use process, both of the air-cooled radiator and the water-cooled radiator are started along with the starting of a computer, so that unnecessary energy consumption is caused, meanwhile, under a hotter environment (such as the environment temperature is generally about 40 ℃ in summer), the heat dissipation requirements of a CPU (central processing unit) are difficult to meet through air cooling and water cooling, the principle of the air-cooled radiator is that air circulation is quickened in the heat dissipation, the heat dissipation effect is reduced under the condition that the temperature in the air is higher, the water cooling is to conduct heat dissipation through a water cooling block, the water flows through a metal block with a water channel inside after heat exchange, then exchanges heat with external air through the metal block, and the heat dissipation effect is general when the external temperature is too high.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a radiator for a computer CPU chip.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a computer CPU chip radiator, includes the heat-conducting plate, the top fixedly connected with water-cooling heat absorption head of heat-conducting plate, the top edge fixedly connected with of heat-conducting plate has a plurality of radiating fins, the delivery port fixedly connected with first hose of water-cooling heat absorption head, the terminal fixedly connected with frame of first hose, the interior top fixedly connected with finned tube radiator of frame, and the fixed link up of first hose and adjacent finned tube radiator's water inlet, the play water end of finned tube radiator is fixed to be link up there is refrigeration subassembly, the common fixedly connected with fixed pipe between the play water end of refrigeration subassembly and the frame, the fixed water pump that link up in top of fixed pipe, the common fixedly connected with second hose between play water end of water pump and the water-cooling heat absorption head, the fixed cover of surface of water pump is equipped with the casing, install the heat dissipation fan jointly between casing and the frame, install power component jointly between heat dissipation fan and the water pump.
Further, the refrigeration subassembly includes the water tray, and fixed connection and be linked together with fixed tube and finned tube radiator between water tray and the frame, the internal surface of water tray is fixed to be inlayed and is had first inserted sheet radiator, the installation end fixed mounting of first inserted sheet radiator has the semiconductor refrigeration piece, the heating end fixed mounting of semiconductor refrigeration piece has the second inserted sheet radiator, and fixed connection between second inserted sheet radiator and the water tray, the water in the water tray of being convenient for refrigerates.
Furthermore, the refrigeration end and the heating end of the semiconductor refrigeration piece are both coated with heat-conducting silica gel, the heat-conducting silica gel is bonded with the adjacent first inserting piece radiator and the second inserting piece radiator, and the contact thermal resistance generated between the surface of the semiconductor refrigeration piece and the contact surface of the radiator is reduced.
Further, the heat dissipation fan includes the installing frame, and fixed connection between installing frame and casing and the frame, the inside fixedly connected with mounting bracket of installing frame, the center department rotation of mounting bracket is connected with the fan, the first bevel gear of one end fixed connection of fan installation axle can accelerate the air circulation speed, provides the radiating effect.
Further, the power component comprises a motor, the motor is fixedly arranged in the shell, the driving end of the motor is fixedly connected with a rotating shaft, the rotating shaft vertically penetrates through the shell, extends to the outer surface and is rotationally connected with the outer surface, and the tail end of the rotating shaft is fixedly connected with a second bevel gear which is meshed with the first bevel gear, so that the fan can be conveniently driven to run.
Further, the outer surface of the rotating shaft is fixedly sleeved with a third bevel gear, the outer surface of the third bevel gear is connected with a fourth bevel gear in a meshed mode, and the fourth bevel gear is fixedly connected with an input shaft of the water pump, so that the water pump can be driven to operate conveniently.
Furthermore, a waterproof temperature sensor is arranged at the water outlet end of the water-cooling heat absorption head, the model of the waterproof temperature sensor is WZPT-291, and the waterproof temperature sensor is a thermal resistance type temperature sensor and is favorable for detecting the water temperature of the water-cooling heat absorption head when water is discharged.
The utility model has the beneficial effects that:
when the computer CPU chip radiator is used, the radiating mode can be changed according to actual use conditions, the radiating fins are used for radiating at the initial stage of starting the CPU, the energy consumption is reduced, the temperature of the CPU rises in the using process, the water cooling can be used for radiating, the CPU can be cooled, when the radiating effect is poor due to the high temperature of the external environment, the refrigeration and the radiating can be selected, and the radiating effect is ensured, so that the using performance of the CPU is ensured.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the connection of the power assembly to the water pump and the heat dissipating fan of the present utility model;
fig. 3 is a cross-sectional view of the housing of the present utility model.
Legend description:
1. a heat conductive plate; 2. a heat radiation fin; 3. a water-cooling heat absorbing head; 4. a housing; 5. a first hose; 6. an outer frame; 7. a finned tube radiator; 8. a second tab heat sink; 9. a fan; 10. a mounting frame; 11. a fixed tube; 12. a motor; 13. a rotating shaft; 14. a first bevel gear; 15. a mounting frame; 16. a water pump; 17. a semiconductor refrigeration sheet; 18. a second bevel gear; 19. a first tab heat sink; 20. a water tray; 21. a third bevel gear; 22. and a fourth bevel gear.
Detailed Description
Fig. 1 to 3 show, relate to a computer CPU chip radiator, including heat-conducting plate 1, the top fixedly connected with water-cooling heat absorption head 3 of heat-conducting plate 1, the top edge fixedly connected with a plurality of radiating fins 2 of heat-conducting plate 1, the delivery port fixedly connected with first hose 5 of water-cooling heat absorption head 3, the terminal fixedly connected with frame 6 of first hose 5, the interior top fixedly connected with finned tube radiator 7 of frame 6, and first hose 5 and the water inlet of adjacent finned tube radiator 7 are fixed link up, the water outlet end of finned tube radiator 7 is fixed link up and is had refrigeration module, be connected with fixed pipe 11 jointly between refrigeration module's the water outlet end and the frame 6 fixedly, the top fixedly link up of fixed pipe 11 has water pump 16, be connected with the second hose jointly between water outlet end and the water-cooling heat absorption head 3 of water pump 16, the fixed cover of surface of water pump 16 is equipped with casing 4, install the radiator fan jointly between casing 4 and the frame 6, install power pack jointly between radiator fan and the water pump 16.
As shown in fig. 1, a water-proof temperature sensor is mounted at the water outlet end of the water-cooling heat absorbing head 3.
The water temperature at the water outlet end of the water-cooling heat absorbing head 3 can be detected, meanwhile, the waterproof temperature sensor is connected with the computer controller, and when the computer controller receives the signal of the waterproof temperature sensor, the heat dissipation mode is convenient to select, so that the heat dissipation effect is guaranteed.
As shown in fig. 1 and 2, the refrigeration assembly comprises a water tray 20, the water tray 20 is fixedly connected with the outer frame 6 and is communicated with the fixing tube 11 and the finned tube radiator 7, a first insert radiator 19 is fixedly inlaid on the inner surface of the water tray 20, a semiconductor refrigeration piece 17 is fixedly arranged at the mounting end of the first insert radiator 19, a second insert radiator 8 is fixedly arranged at the heating end of the semiconductor refrigeration piece 17, and the second insert radiator 8 is fixedly connected with the water tray 20.
The refrigerating end and the heating end of the semiconductor refrigerating sheet 17 are coated with heat-conducting silica gel, and the heat-conducting silica gel is bonded with the adjacent first insert radiator 19 and the second insert radiator 8.
In the use process of the semiconductor refrigerating sheet 17, a heat source can be generated on one side, a cold source can be generated on the other side, the cold source is conducted to the first inserting sheet radiator 19 through heat conduction silica gel, then water in the water tray 20 is refrigerated through the first inserting sheet radiator 19, the heat source is conducted to the second inserting sheet radiator 8 through the heat conduction silica gel, and then the heat source is emitted into the air.
The heat dissipation fan comprises a mounting frame 10, the mounting frame 10 is fixedly connected with the shell 4 and the outer frame 6, a mounting frame 15 is fixedly connected to the inside of the mounting frame 10, a fan 9 is rotatably connected to the center of the mounting frame 15, and one end of a mounting shaft of the fan 9 is fixedly connected with a first bevel gear 14.
The bearing is installed jointly between the installation shaft of the fan 9 and the installation frame 15 in the rotation position, the bearing inner ring is fixedly connected with the installation shaft, and the bearing outer ring is fixedly connected with the installation frame 15, so that the installation of the fan 9 is facilitated.
As shown in fig. 2 and 3, the power assembly includes a motor 12, the motor 12 is fixedly installed in the housing 4, a driving end of the motor 12 is fixedly connected with a rotating shaft 13, the rotating shaft 13 vertically penetrates through the housing 4, extends to the outer surface and is rotatably connected with the outer surface, and a second bevel gear 18 meshed with the first bevel gear 14 is fixedly connected with the tail end of the rotating shaft 13.
The outer surface of the rotating shaft 13 is fixedly sleeved with a third bevel gear 21, the outer surface of the third bevel gear 21 is connected with a fourth bevel gear 22 in a meshed manner, and the fourth bevel gear 22 is fixedly connected with the input shaft of the water pump 16.
The motor 12 is started to drive the rotating shaft 13 to rotate, the rotating shaft 13 simultaneously drives the second bevel gear 18 and the third bevel gear 21 to rotate, the second bevel gear 18 drives the fan 9 to operate through the first bevel gear 14, the third bevel gear 21 drives the water pump 16 to operate through the fourth bevel gear 22, and the motor 12 is adopted to synchronously drive the water pump 16 and the heat dissipation fan to operate, so that the energy consumption can be reduced.
When the computer CPU chip radiator is used, heat is radiated through the heat conducting plate 1 and the radiating fins 2 at the initial stage of starting the CPU; after the water-proof temperature sensor detects that the temperature of the water outlet end of the water-cooling heat absorbing head 3 reaches a set value after a period of use, the motor 12 is started, the motor 12 drives the rotating shaft 13 to rotate, the rotating shaft 13 simultaneously drives the second bevel gear 18 and the third bevel gear 21 to rotate, the second bevel gear 18 drives the fan 9 to operate through the first bevel gear 14, the third bevel gear 21 drives the water pump 16 to operate through the fourth bevel gear 22, the water pump 16 enables water to start circulating, so that the water in the water tray 20 is conveyed into the second hose through the fixed pipe 11, then enters the water-cooling heat absorbing head 3 to exchange heat, then is conveyed into the finned tube radiator 7 through the first hose 5, the finned tube radiator 7 is matched with the fan 9 to cool the heat exchanged water, and finally, the water is conveyed into the water-collecting tray 20; when the waterproof temperature sensor detects that the temperature of the water outlet end of the water-cooling heat absorption head 3 reaches a higher set value, the semiconductor refrigerating sheet 17 is started, the semiconductor refrigerating sheet 17 generates a heat source and a cold source in the use process, the cold source is conducted to the first insert radiator 19 through the heat conduction silica gel, then the water in the water tray 20 is refrigerated through the first insert radiator 19, the heat source is conducted to the second insert radiator 8 through the heat conduction silica gel, and then the heat source is rapidly emitted to the air through the fan 9.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (7)
1. The utility model provides a computer CPU chip radiator, includes heat-conducting plate (1), its characterized in that: the top of the heat conducting plate (1) is fixedly connected with a water-cooling heat absorbing head (3), the edge of the top of the heat conducting plate (1) is fixedly connected with a plurality of radiating fins (2), the water outlet of the water-cooling heat absorbing head (3) is fixedly connected with a first hose (5), the tail end of the first hose (5) is fixedly connected with an outer frame (6), the inner top of the outer frame (6) is fixedly connected with a finned tube radiator (7), the first hose (5) is fixedly communicated with the water inlet of the adjacent finned tube radiator (7), the water outlet end of the finned tube radiator (7) is fixedly communicated with a refrigerating component, the water outlet end of the refrigeration assembly is fixedly connected with a fixing pipe (11) together with the outer frame (6), a water pump (16) is fixedly communicated with the top of the fixing pipe (11), a second hose is fixedly connected between the water outlet end of the water pump (16) and the water cooling heat absorbing head (3), a shell (4) is sleeved on the outer surface of the water pump (16), a heat dissipation fan is mounted between the shell (4) and the outer frame (6), and a power assembly is mounted between the heat dissipation fan and the water pump (16).
2. The computer CPU chip heat sink of claim 1 wherein: the refrigeration assembly comprises a water tray (20), the water tray (20) is fixedly connected with the outer frame (6) and is communicated with the fixed pipe (11) and the finned tube radiator (7), a first inserting sheet radiator (19) is fixedly inlaid on the inner surface of the water tray (20), a semiconductor refrigeration sheet (17) is fixedly arranged at the mounting end of the first inserting sheet radiator (19), a second inserting sheet radiator (8) is fixedly arranged at the heating end of the semiconductor refrigeration sheet (17), and the second inserting sheet radiator (8) is fixedly connected with the water tray (20).
3. A computer CPU chip heat sink as claimed in claim 2, wherein: the refrigerating end and the heating end of the semiconductor refrigerating sheet (17) are coated with heat-conducting silica gel, and the heat-conducting silica gel is bonded between the adjacent first inserting sheet radiator (19) and the second inserting sheet radiator (8).
4. The computer CPU chip heat sink of claim 1 wherein: the heat dissipation fan comprises a mounting frame (10), the mounting frame (10) is fixedly connected with a shell (4) and an outer frame (6), a mounting frame (15) is fixedly connected to the inside of the mounting frame (10), a fan (9) is rotationally connected to the center of the mounting frame (15), and one end of a fan (9) mounting shaft is fixedly connected with a first bevel gear (14).
5. The computer CPU chip heat sink of claim 1 wherein: the power assembly comprises a motor (12), the motor (12) is fixedly arranged in the shell (4), a rotating shaft (13) is fixedly connected with the driving end of the motor (12), the rotating shaft (13) vertically penetrates through the shell (4) and extends to the outer surface and is rotationally connected with the outer surface, and a second bevel gear (18) meshed and connected with the first bevel gear (14) is fixedly connected with the tail end of the rotating shaft (13).
6. The computer CPU chip heat sink of claim 5 wherein: the outer surface of the rotating shaft (13) is fixedly sleeved with a third bevel gear (21), the outer surface of the third bevel gear (21) is connected with a fourth bevel gear (22) in a meshed mode, and the fourth bevel gear (22) is fixedly connected with an input shaft of the water pump (16).
7. The computer CPU chip heat sink of claim 1 wherein: the water outlet end of the water-cooling heat absorbing head (3) is provided with a waterproof temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320512229.8U CN219831774U (en) | 2023-03-16 | 2023-03-16 | Radiator for computer CPU chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320512229.8U CN219831774U (en) | 2023-03-16 | 2023-03-16 | Radiator for computer CPU chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219831774U true CN219831774U (en) | 2023-10-13 |
Family
ID=88246107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320512229.8U Active CN219831774U (en) | 2023-03-16 | 2023-03-16 | Radiator for computer CPU chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219831774U (en) |
-
2023
- 2023-03-16 CN CN202320512229.8U patent/CN219831774U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |