CN219831734U - Core board with heat abstractor - Google Patents
Core board with heat abstractor Download PDFInfo
- Publication number
- CN219831734U CN219831734U CN202320953494.XU CN202320953494U CN219831734U CN 219831734 U CN219831734 U CN 219831734U CN 202320953494 U CN202320953494 U CN 202320953494U CN 219831734 U CN219831734 U CN 219831734U
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- China
- Prior art keywords
- core
- core board
- power supply
- heat
- upper ends
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 230000005855 radiation Effects 0.000 claims description 10
- 230000003139 buffering effect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 3
- 239000000523 sample Substances 0.000 claims description 3
- 230000002457 bidirectional effect Effects 0.000 claims description 2
- 238000013016 damping Methods 0.000 abstract description 8
- 230000035939 shock Effects 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 210000001503 joint Anatomy 0.000 description 4
- 230000033228 biological regulation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000006260 foam Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001821 foam rubber Polymers 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000008571 general function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a core board with a heat dissipating device, which comprises a fixing box and a buffer mechanism; fixing box: the four corners of the bottom wall of the core plate are respectively provided with a sliding column, the upper ends of the sliding columns are respectively provided with a baffle, the sliding columns are respectively and correspondingly connected with sliding ports arranged at the lower ends of the core plates in a sliding manner, the upper ends of the core plates are provided with power management chips, and the middle parts of the upper ends of the core plates are provided with a CPU; buffer gear: the buffer mechanism is arranged in the fixed box, and the upper ends of the buffer mechanisms are fixedly connected with the lower ends of the core plates; wherein: still include power source, power source sets up in the front side of core board upper end, this core board with heat abstractor, can turn into the vertical effort and carry out damping shock attenuation protection for fore-and-aft effort with vertical effort after the core board receives the influence of vibrations, simple structure has effectively reduced the space that elasticity buffer assembly occupy, avoids leading to the core board to produce the trouble because of the vibrations that cooling fan produced.
Description
Technical Field
The utility model relates to the technical field of electronic equipment, in particular to a core board with a heat dissipation device.
Background
The core board is an electronic main board for packaging and encapsulating the core functions of the MINI PC. Most of core boards integrate a CPU, a storage device and pins, and are connected with a matched bottom board through the pins so as to realize a system chip in a certain field, and people often refer to the system as an embedded development platform, and because the core boards integrate the general functions of cores, the embedded development platform has the universality that one core board can customize various bottom boards, so that the development efficiency of a singlechip is greatly improved;
after the core board runs for a long time, a great amount of heat can be generated by equipment such as a CPU (central processing unit) and the like in the core board, so that the normal running of the equipment is influenced, and at the moment, the core board is usually subjected to blowing and heat dissipation through a heat dissipation fan or the heat of the core board is taken away through a water cooling radiator, so that the normal running of the equipment in the core board is ensured;
the existing core board with the heat abstractor can vibrate when the heat abstractor blows and dissipates heat, and the core board can be caused to fail over time, so that the vibration force applied to the core board is damped and slowed down through a spring or a buffer component, all directions of damping and shock absorption protection can not be well realized through force steering, and even a complex buffer mechanism is added for better buffer protection, so that the normal operation of the core board is influenced, and therefore, the core board with the heat abstractor is provided.
Disclosure of Invention
The utility model aims to overcome the existing defects, and provides the core plate with the heat dissipating device, which can convert the vertical acting force into the longitudinal acting force to carry out damping and shock absorption protection after the core plate is affected by vibration through the matching arrangement of the connecting rod and the sliding block, has a simple structure, effectively reduces the space occupied by the elastic buffer assembly, reduces the impact force born by the core plate, avoids the core plate from generating faults due to the vibration generated by the heat dissipating fan, and can effectively solve the problems in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a core board with a heat dissipating device comprises a fixing box and a buffer mechanism;
fixing box: the four corners of the bottom wall of the core plate are respectively provided with a sliding column, the upper ends of the sliding columns are respectively provided with a baffle, the sliding columns are respectively and correspondingly connected with sliding ports arranged at the lower ends of the core plates in a sliding manner, the upper ends of the core plates are provided with power management chips, and the middle parts of the upper ends of the core plates are provided with a CPU;
buffer gear: the buffer mechanism is arranged in the fixed box, and the upper ends of the buffer mechanisms are fixedly connected with the lower ends of the core plates;
wherein: still include power source, power source sets up in the front side of core board upper end, power source's input is connected with external power source electricity, power management chip's input is connected with power source's output electricity, CPU's input is connected with power management chip's output electricity, cooperation through connecting rod and slider sets up, can turn into vertical effort and carry out damping shock attenuation protection for fore-and-aft effort after the core board receives the influence of vibrations, and is simple in structure, effectively reduced the space that elastic buffer assembly occupy, reduced the impact force that the core board received, avoid leading to the core board to produce the trouble because of the vibrations that radiator fan produced.
Further, the portable electronic device further comprises a single chip microcomputer, wherein the single chip microcomputer is located on the front side of the fixed box, the input end of the single chip microcomputer is electrically connected with an external power supply, and electric elements inside the device can be regulated and controlled.
Further, buffer gear includes direction traveller, slider, connecting seat, connecting rod and spring, the direction traveller all sets up in the spout that fixed box diapire set up, both sides respectively sliding connection have the slider around the direction traveller, the slider all with spout sliding connection, the upper end of connecting seat all with the lower extreme fixed connection of core board, be connected with the connecting rod through the round pin axle rotation in the mounting groove that the connecting seat lower extreme set up respectively, the lower extreme of connecting rod is connected with the upper end rotation of vertical adjacent slider respectively, the spring sets up in the inner wall of spout and the one end that the slider kept away from fixed box inside center respectively, the outside of both sides around the direction traveller is located to the spring cover respectively, can be with vertical effort steering to the fore-and-aft effort and carry out damping protection after the influence of vibrations at the core board.
Further, the buffer mechanism further comprises buffer sponge pads which are respectively arranged on the front side and the rear side of the bottom wall of the fixed box, so that the core plate is prevented from being damaged due to collision between the core plate and the bottom wall of the fixed box.
Further, still include installing frame, heat conduction copper post and heat dissipation copper pipe, the installing frame sets up in the middle part of core board upper surface, and the heat conduction copper post sets up in the middle part of installing frame roof, and the lower extreme of heat conduction copper post passes the lower surface of installing frame and contacts with CPU's upper end, and heat dissipation copper pipe sets up in the middle part of heat conduction copper post extrados, has improved the radiating effect.
Further, the multifunctional fan comprises a heat radiation fan, wherein the heat radiation fan is respectively arranged at the front side and the rear side of the upper end of the core plate and the right end of the mounting frame, the input end of the heat radiation fan is electrically connected with the output end of the singlechip, and the heat radiation fan can blow and radiate the core plate and internal equipment.
Further, still include the temperature detector, the temperature detector sets up in the right side of nuclear core plate upper end, and the detection probe of temperature detector contacts with core plate and CPU respectively, and the temperature detector is connected with the singlechip is two-way electricity, temperature detector real-time supervision CPU and the temperature of nuclear core plate.
Compared with the prior art, the utility model has the beneficial effects that: the core board with the heat dissipation device has the following advantages:
when the core board receives the influence of radiator fan vibrations to deflect downwards, the spring shrink, the slider is along the vertical slip of direction traveller, under the effect of connecting rod, can vertical effort turn to for fore-and-aft effort, simultaneously slider and traveller's sliding friction damping, under the elastic action of spring, shock attenuation buffering, the existence of buffering foam-rubber cushion can prevent that the core board from bumping with the diapire of fixed box and leading to the damage of core board, cooperation setting through connecting rod and slider, can turn to the effort of fore-and-aft effort and carry out damping shock attenuation protection after the core board receives the influence of vibrations, and is simple in structure, effectively reduced the space that elasticity buffer assembly occupy, the impact force that the core board received has been reduced, avoid leading to the core board to producing the trouble because of the vibrations that radiator fan produced.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is a schematic structural view of a buffering mechanism of the present utility model.
In the figure: the device comprises a fixed box 1, a singlechip 2, a sliding column 3, a baffle 4, a core plate 5, a power interface 6, a buffer mechanism 7, a guide sliding column 71, a sliding block 72, a connecting seat 73, a connecting rod 74, a spring 75, a buffer foam cushion 76, a power management chip 8, a temperature detector 9, a mounting frame 10, a heat conduction copper column 11, a heat dissipation copper pipe 12, a heat dissipation fan 13 and a CPU 14.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, the present embodiment provides a technical solution: a core board with a heat dissipating device, which comprises a fixed box 1 and a buffer mechanism 7;
fixed box 1: the four corners of the bottom wall of the device are respectively provided with a slide column 3, the upper ends of the slide columns 3 are respectively provided with a baffle 4, the slide columns 3 are respectively and correspondingly provided with slide openings at the lower ends of the core plates 5 in a sliding manner, the upper ends of the core plates 5 are provided with power management chips 8, the middle parts of the upper ends of the core plates 5 are provided with CPUs 14, and the core plates with heat dissipation devices are moved to a designated working place before working, so that the fixed box 1 is in butt joint with the corresponding station installation, and the fixed box 1 and internal equipment are installed and fixed;
buffer mechanism 7: the buffer mechanism 7 comprises a guide slide column 71, a slide block 72, a connecting seat 73, a connecting rod 74 and a spring 75, wherein the guide slide column 71 is arranged in a chute arranged on the bottom wall of the fixed box 1, the front side and the rear side of the guide slide column 71 are respectively and slidably connected with the slide block 72, the slide block 72 is respectively and slidably connected with the chute, the upper end of the connecting seat 73 is fixedly connected with the lower end of the core plate 5, the connecting rod 74 is respectively and rotatably connected with the upper end of the vertically adjacent slide block 72 through a pin roll in a mounting groove arranged at the lower end of the connecting seat 73, the spring 75 is respectively arranged at one end of the inner wall of the chute and the end of the slide block 72 far away from the inner center of the fixed box 1, the spring 75 is respectively sleeved outside the front side and the rear side of the guide slide column 71, the buffer mechanism 7 further comprises a buffer sponge cushion 76, the buffer foam pads 76 are respectively arranged at the front side and the rear side of the bottom wall of the fixed box 1, when the core plate 5 is influenced by the vibration of the heat radiation fan 13 to deflect downwards, the springs 75 are contracted, the sliding blocks 72 longitudinally slide along the guide sliding columns 71, under the action of the connecting rods 74, the vertical acting force can be turned into longitudinal acting force, meanwhile, the sliding friction damping of the sliding blocks 72 and the sliding columns 71 is realized, under the elastic action of the springs 75, the buffer foam pads 76 can prevent the core plate 5 from being damaged due to the collision between the core plate 5 and the bottom wall of the fixed box 1, the vertical acting force can be turned into longitudinal acting force to damp and protect after the core plate 5 is influenced by the vibration through the cooperation of the connecting rods 74 and the sliding blocks 72, the structure is simple, the space occupied by the elastic buffer component is effectively reduced, and the impact force of the core plate 5 is reduced, the core board is prevented from being broken down due to vibration generated by the heat radiation fan 13;
wherein: the power supply device further comprises a power supply interface 6, the power supply interface 6 is arranged on the front side of the upper end of the core plate 5, the input end of the power supply interface 6 is electrically connected with an external power supply, the input end of the power supply management chip 8 is electrically connected with the output end of the power supply interface 6, the input end of the CPU14 is electrically connected with the output end of the power supply management chip 8, and when the power supply device works, an external power supply plug is in butt joint with the power supply interface 6, and the power supply management chip 8 converts current into power which can be used by the load of the CPU 14.
Wherein: still include singlechip 2, singlechip 2 are located the front side of fixed box 1, and the input and the external power supply electricity of singlechip 2 are connected, can regulate and control the inside electrical components of equipment, have improved work efficiency.
Wherein: still include installing frame 10, heat conduction copper post 11 and heat dissipation copper pipe 12, installing frame 10 sets up in the middle part of core board 5 upper surface, heat conduction copper post 11 sets up in the middle part of installing frame 10 roof, the lower extreme of heat conduction copper post 11 passes the lower surface of installing frame 10 and the upper end contact of CPU14, heat dissipation copper pipe 12 sets up in the middle part of heat conduction copper post 11 extrados, when the temperature of CPU14 and core board 5 is too high, through the regulation and control of singlechip 2, the cooling equipment drives the wind and blows to heat dissipation copper pipe 12 and dispel the heat, the radiating effect has been improved.
Wherein: still include radiator fan 13, radiator fan 13 set up respectively in the front and back both sides of core board 5 upper end and the right-hand member of installing frame 10, and radiator fan 13's input all is connected with the output electricity of singlechip 2, and when CPU14 and core board 5's temperature was too high, through the regulation and control of singlechip 2, radiator fan 13 began to operate, radiator fan 13 drove the wind and blows to radiating copper pipe 12 and core board 5 and dispel the heat, reduces CPU14 and core board 5's temperature.
Wherein: the temperature detector 9 is arranged on the right side of the upper end of the core plate 5, a detection probe of the temperature detector 9 is respectively in contact with the core plate 5 and the CPU14, the temperature detector 9 is in bidirectional electric connection with the single chip microcomputer 2, and the temperature detector 8 monitors the temperatures of the CPU14 and the core plate 5 in real time.
The working principle of the core plate with the heat dissipation device provided by the utility model is as follows: before working, the core plate with the heat dissipation device is moved to a designated working place, the fixing box 1 is in butt joint with the corresponding station, the fixing box 1 and the internal equipment are installed and fixed, during working, an external power plug is in butt joint with the power interface 6, the power management chip 8 converts current into power which can be used by the load of the CPU14, the temperature detector 8 monitors the temperature of the CPU14 and the core plate 5 in real time, the temperature detector 8 transmits monitored data to the singlechip 2, when the temperature of the CPU14 and the core plate 5 is too high, the heat dissipation fan 13 starts to operate through the regulation and control of the singlechip 2, the heat dissipation fan 13 drives wind to blow to the heat dissipation copper pipe 12 and the core plate 5 to dissipate heat, the temperature of the CPU14 and the core plate 5 is reduced, vibration is generated during working of the heat dissipation fan 13, when the core plate 5 is subjected to downward deflection due to the influence of the vibration of the heat dissipation fan 13, the spring 75 is contracted, the slider 72 slides longitudinally along the guide slide post 71, under the action of the connecting rod 74, the vertical acting force is turned into longitudinal acting force, meanwhile the slider 72 rubs with the slide post 71, under the action of the spring 75, the elastic cushion pad 76 and the core plate 5 can be prevented from being damaged due to the fact that the core plate is in the impact of the cushion pad 1.
It should be noted that, in the above embodiment, the single chip microcomputer 2 may be selected from STM8S207S8T6C, the power management chip 8 may be selected from ACT8846PM, the temperature detector 9 may be selected from OHR-E700, the heat dissipation fan 13 may be selected from ME92252V1-000C-a99, the CPU14 may be selected from i9 12900KF, and the single chip microcomputer 2 controls the operation of the temperature detector 9 and the heat dissipation fan 13 by the methods commonly used in the prior art.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (7)
1. A core board with a heat dissipating device, characterized in that: comprises a fixed box (1) and a buffer mechanism (7);
fixed box (1): the four corners of the bottom wall of the sliding column are respectively provided with a sliding column (3), the upper ends of the sliding columns (3) are respectively provided with a baffle plate (4), the sliding columns (3) are respectively and correspondingly connected with sliding ports arranged at the lower ends of the core plates (5), the upper ends of the core plates (5) are provided with power management chips (8), and the middle parts of the upper ends of the core plates (5) are provided with CPUs (14);
buffer gear (7): the buffer mechanism is arranged in the fixed box (1), and the upper ends of the buffer mechanisms (7) are fixedly connected with the lower ends of the core plates (5);
wherein: the power supply device is characterized by further comprising a power supply interface (6), wherein the power supply interface (6) is arranged on the front side of the upper end of the core plate (5), the input end of the power supply interface (6) is electrically connected with an external power supply, the input end of the power supply management chip (8) is electrically connected with the output end of the power supply interface (6), and the input end of the CPU (14) is electrically connected with the output end of the power supply management chip (8).
2. A core board with a heat dissipating device according to claim 1, wherein: the portable electronic device further comprises a singlechip (2), wherein the singlechip (2) is positioned at the front side of the fixed box (1), and the input end of the singlechip (2) is electrically connected with an external power supply.
3. A core board with a heat dissipating device according to claim 1, wherein: the buffer mechanism (7) comprises a guide slide column (71), a slide block (72), a connecting seat (73), a connecting rod (74) and a spring (75), wherein the guide slide column (71) is arranged in a chute formed in the bottom wall of the fixed box (1), the slide blocks (72) are respectively and slidably connected to the front side and the rear side of the guide slide column (71), the slide blocks (72) are respectively and slidably connected with the chute, the upper ends of the connecting seat (73) are fixedly connected with the lower end of the core plate (5), the connecting rod (74) is respectively and rotatably connected to the mounting groove formed in the lower end of the connecting seat (73) through a pin shaft, the lower ends of the connecting rod (74) are respectively and rotatably connected with the upper ends of vertically adjacent slide blocks (72), the spring (75) is respectively arranged at one ends, far away from the inner centers of the fixed box (1), of the inner walls of the chute and the slide blocks (72), and the springs (75) are respectively sleeved outside the front side and the rear side of the guide slide column (71).
4. A core board with a heat dissipating device according to claim 1, wherein: the buffering mechanism (7) further comprises buffering sponge cushions (76), and the buffering sponge cushions (76) are respectively arranged on the front side and the rear side of the bottom wall of the fixed box (1).
5. A core board with a heat dissipating device according to claim 2, wherein: still include installing frame (10), heat conduction copper post (11) and heat dissipation copper pipe (12), installing frame (10) set up in the middle part of core board (5) upper surface, and heat conduction copper post (11) set up in the middle part of installing frame (10) roof, and the lower extreme of heat conduction copper post (11) passes the lower surface of installing frame (10) and the upper end contact of CPU (14), and heat dissipation copper pipe (12) set up in the middle part of heat conduction copper post (11) extrados.
6. A core board with heat dissipating apparatus as set forth in claim 5, wherein: the multifunctional heat radiation device comprises a core plate (5) and is characterized by further comprising a heat radiation fan (13), wherein the heat radiation fan (13) is respectively arranged on the front side and the rear side of the upper end of the core plate (5) and the right end of the mounting frame (10), and the input end of the heat radiation fan (13) is electrically connected with the output end of the single chip microcomputer (2).
7. A core board with a heat dissipating device according to claim 2, wherein: the temperature detector (9) is arranged on the right side of the upper end of the core plate (5), a detection probe of the temperature detector (9) is respectively contacted with the core plate (5) and the CPU (14), and the temperature detector (9) is electrically connected with the singlechip (2) in a bidirectional mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320953494.XU CN219831734U (en) | 2023-04-25 | 2023-04-25 | Core board with heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320953494.XU CN219831734U (en) | 2023-04-25 | 2023-04-25 | Core board with heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219831734U true CN219831734U (en) | 2023-10-13 |
Family
ID=88251161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320953494.XU Active CN219831734U (en) | 2023-04-25 | 2023-04-25 | Core board with heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219831734U (en) |
-
2023
- 2023-04-25 CN CN202320953494.XU patent/CN219831734U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Room 601-3, No. 7 Caibin Road, Science City, Huangpu District, Guangzhou City, Guangdong Province, 510000 (for office use only) Patentee after: Guangzhou Shengchuangda Technology Co.,Ltd. Country or region after: China Address before: Room 413, 4th Floor, No. 2817, Kaikai Avenue, Science City, Huangpu District, Guangzhou City, Guangdong Province, 510000 (office only) Patentee before: Guangzhou Shengchuangda Technology Co.,Ltd. Country or region before: China |
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| CP03 | Change of name, title or address |