CN219820652U - Special pressure leveling board for 3D printer - Google Patents
Special pressure leveling board for 3D printer Download PDFInfo
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- CN219820652U CN219820652U CN202320682559.1U CN202320682559U CN219820652U CN 219820652 U CN219820652 U CN 219820652U CN 202320682559 U CN202320682559 U CN 202320682559U CN 219820652 U CN219820652 U CN 219820652U
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- 238000005070 sampling Methods 0.000 claims abstract description 60
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- 239000003990 capacitor Substances 0.000 claims description 114
- 230000000087 stabilizing effect Effects 0.000 claims description 16
- 239000011324 bead Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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- Force Measurement Appropriate To Specific Purposes (AREA)
Abstract
The utility model discloses a special pressure leveling plate for a 3D printer, which comprises a power input conversion module, a processor electrically connected with the power input conversion module, a burning port electrically connected with the processor, a sampling module electrically connected with the processor, a reference source module electrically connected with the sampling module and electrically connected with the processor, and an indication module electrically connected with the processor. The sampling chip collects deformation pressure of a nozzle in a hot bed of the 3D printer to the hot bed through the pressure sensor, and a processor obtains a comparison result to process after comparison analysis through a reference source of the reference source module. The beneficial effects of the utility model are as follows: the hot bed leveling assistance for the FDM3D printer can be provided on the PCB substrate.
Description
Technical Field
The utility model relates to the technical field of FDM3D printers.
Background
The FDM3D printer conveys the filamentous consumable to a nozzle through an extruder, and the nozzle melts the filamentous 3D printing consumable and is extruded and piled on a hot bed to form a three-dimensional model. Before the 3D printing is started, leveling work is needed to be carried out on the hot bed, and if the leveling is not carried out, the problem that the first printing layer is not stuck to the hot bed can occur, so that the printing failure is caused.
The technical content of the utility model is to make a circuit design of a pressure regulating plate for auxiliary leveling.
Previously, the nozzle was moved to a position close to the hot bed, then an A4 sheet was inserted between the hot bed and the nozzle, then the friction between the nozzle and the A4 sheet was adjusted, and then the height adjustment screw below the hot bed was adjusted. Still other 3D printers are configured with auto leveling sensors.
The customer base to be served by the utility model is that the 3D printer is not provided with a leveling sensor. Because the A4 paper leveling mode is unstable, the operation is troublesome, and a beginner cannot easily understand and operate.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art and provide a special pressure leveling plate for a 3D printer, which can be used for assisting in leveling a heat bed arranged on a PCB substrate for an FDM3D printer.
The technical scheme adopted by the utility model is as follows:
the special pressure leveling plate for the 3D printer comprises a power input conversion module, a processor electrically connected with the power input conversion module, a burning port electrically connected with the processor, a sampling module electrically connected with the processor, a reference source module electrically connected with the sampling module and electrically connected with the processor, and an indication module electrically connected with the processor; the sampling module comprises a sensor interface P3, a resistor R10, a resistor R13, a capacitor C10, a capacitor C11, a capacitor C12, a capacitor C8, a resistor R9, a sampling chip U4, magnetic beads, a capacitor C7, a capacitor C9, a resistor R11, a resistor R12, a resistor R6 and a resistor R7; the processor is a SN8F5703 processor; the processor comprises 24 pins, wherein a first pin, a second pin, a third pin, a ninth pin, a tenth pin, an eleventh pin, a twelfth pin, a twenty-second pin and a twenty-fourth pin are arranged in the 24 pins; the sampling chip is provided with 8 pins, namely a pin 1, a pin 2, a pin 3, a pin 4, a pin 5, a pin 6, a pin 7 and a pin 8; the sensor interface P3 is provided with four pins, namely a 1 st pin, a 2 nd pin, a 3 rd pin and a4 th pin; the 1 st pin of the sensor interface P3 is grounded, and the 2 nd pin of the sensor interface P3 is electrically connected with the negative electrode of the capacitor C8, the positive electrode of the resistor R9 and the pin 1 of the sampling chip; the 3 rd pin of the sensor interface P3 is electrically connected to the positive electrode of the resistor R10, and the 4 th pin of the sensor interface P3 is electrically connected to the positive electrode of the resistor R13; the negative electrode of the resistor R10 is electrically connected with the negative electrode of the capacitor C10, the positive electrode of the capacitor C11 and the pin 3 of the sampling chip; the negative electrode of the resistor R13 is electrically connected with the negative electrode of the capacitor C11, the positive electrode of the capacitor C12 and the pin 4 of the sampling chip; the negative electrode of the capacitor C12 is grounded; the positive electrode of the capacitor C10 is grounded, and the positive electrode of the capacitor C10 is electrically connected with the positive electrode of the capacitor C8 and the pin 2 of the sampling chip; the negative electrode of the resistor R9 is electrically connected with the pin 8 of the sampling chip; the sampling chip is a sampling chip of CS 1237; the pin 7 of the sampling chip is electrically connected with the anode of the capacitor C9, the anode of the capacitor C7 and the anode of the magnetic bead L1; the negative electrode of the capacitor C9 is grounded; the negative electrode of the capacitor C7 is grounded; the negative electrode of the magnetic bead L1 is electrically connected with the positive electrode of the resistor R6 and the twenty-fourth pin of the positive electrode processor of the resistor R7; the pin 6 of the sampling chip is electrically connected with the positive electrode of the resistor R11; the pin 5 of the sampling chip is electrically connected with the positive electrode of the resistor R12; the negative electrode of the resistor R11 is electrically connected with the resistor R6 and the tenth pin of the processor, and the negative electrode of the resistor R12 is electrically connected with the negative electrode of the resistor R7 and the ninth pin of the processor; the sensor interface P3 is electrically connected to a pressure sensor.
The second pin of the processor is electrically connected to the negative electrode of the resistor R5, and the third pin of the processor is electrically connected to the negative electrode of the resistor R8; the first pin of the processor is grounded; the twenty-second pin of the processor is electrically connected with the 3 pin of the burning port, and the 2 pin of the burning device is grounded; the twenty-fourth pin of the processor is electrically connected with the 1 pin of the burning port.
The reference source module comprises a voltage stabilizing chip U2, a resistor R4 and a capacitor C6; the voltage stabilizing chip is an LM285 voltage stabilizing chip; the 4 pins of the voltage stabilizing chip are grounded, and the 8 pins of the voltage stabilizing chip are electrically connected with the negative electrode of the resistor R2, the positive electrode of the resistor R4 and the positive electrode of the capacitor C6; the negative electrode of the capacitor C6 is grounded; the positive electrode of the resistor R2 is electrically connected with the twenty-fourth pin of the processor, the negative electrode of the magnetic bead L1, the positive electrode of the resistor R6 and the positive electrode of the resistor R7; the negative electrode of the resistor R4 is electrically connected to the negative electrode of the capacitor C8, the positive electrode of the resistor R9 and the pin 1 of the sampling chip.
The indication module comprises a light emitting diode LR1, a light emitting diode LG1, a resistor R1 and a resistor R3; the negative electrode of the light emitting diode LR1 is electrically connected to the eleventh pin of the processor, and the negative electrode of the light emitting diode LG1 is electrically connected to the twelfth pin of the processor; the positive electrode of the light emitting diode LR1 is electrically connected to the positive electrode of the resistor R1, and the positive electrode of the light emitting diode LG1 is electrically connected to the positive electrode of the resistor R3; the negative electrode of the resistor R1 and the negative electrode of the resistor R3 are electrically connected to a twenty-fourth pin of the processor.
The power input conversion module comprises an interface P1, a capacitor C5, a diode D1, a capacitor C2, a buck chip U1, a capacitor C3, a capacitor C1 and a capacitor C4; the pin 1 of the interface P1 is electrically connected with the anode of the capacitor C5 and the anode of the diode D1; the 2 pin of the interface P1 is electrically connected with the anode of the resistor R5; the 3 pin of the interface P1 is electrically connected with the anode of the resistor R8; the pin 4 of the interface P1 is electrically connected with the negative electrode of the capacitor C5 and the negative electrode of the capacitor C2; the 4 pin of the interface P1 is grounded; the cathode of the diode D1 is electrically connected with the anode of the capacitor C2 and the pin 2 of the voltage reduction chip; the 1 pin of the buck chip is grounded; the 3 pins of the buck chip are electrically connected with the positive electrode of the capacitor C3, the positive electrode of the capacitor C1, the positive electrode of the capacitor C4 and the twenty-fourth pin of the processor; the negative electrode of the capacitor C3 is grounded, the negative electrode of the capacitor C1 is grounded, and the negative electrode of the capacitor C4 is grounded.
Diode D1 is a SOD4007 diode; the step-down chip is HT 7533-1; the light emitting diode LR1 is a red light emitting diode; the light emitting diode LG1 is a green light emitting diode; the resistance value of the resistor R1 is 2K, and the resistance value of the resistor R3 is 2K; the resistance value of the resistor R2 is 1K.
The beneficial effects of the utility model are as follows: the hot bed leveling assistance for the FDM3D printer can be provided on the PCB substrate.
Drawings
FIG. 1 is a schematic diagram of the overall principle of the present utility model;
FIG. 2 is a schematic diagram of a power input conversion module according to the present utility model;
FIG. 3 is a schematic diagram of a reference source module in accordance with the present utility model;
FIG. 4 is a schematic diagram of a processor in accordance with the present utility model;
FIG. 5 is a schematic diagram of a burning port according to the present utility model;
FIG. 6 is a schematic diagram of a pointing module in the present utility model;
fig. 7 is a schematic diagram of a sampling module according to the present utility model.
Detailed Description
As shown in fig. 1, 2, 3, 4, 5, 6 and 7, the special pressure leveling plate for a 3D printer of the present utility model includes a power input conversion module, a processor electrically connected to the power input conversion module, a burning port electrically connected to the processor, a sampling module electrically connected to the processor, a reference source module electrically connected to the sampling module and electrically connected to the processor, and an indication module electrically connected to the processor; the sampling module comprises a sensor interface P3, a resistor R10, a resistor R13, a capacitor C10, a capacitor C11, a capacitor C12, a capacitor C8, a resistor R9, a sampling chip U4, magnetic beads, a capacitor C7, a capacitor C9, a resistor R11, a resistor R12, a resistor R6 and a resistor R7; the processor is a SN8F5703 processor; the processor comprises 24 pins, wherein a first pin, a second pin, a third pin, a ninth pin, a tenth pin, an eleventh pin, a twelfth pin, a twenty-second pin and a twenty-fourth pin are arranged in the 24 pins; the sampling chip is provided with 8 pins, namely a pin 1, a pin 2, a pin 3, a pin 4, a pin 5, a pin 6, a pin 7 and a pin 8; the sensor interface P3 is provided with four pins, namely a 1 st pin, a 2 nd pin, a 3 rd pin and a4 th pin; the 1 st pin of the sensor interface P3 is grounded, and the 2 nd pin of the sensor interface P3 is electrically connected with the negative electrode of the capacitor C8, the positive electrode of the resistor R9 and the pin 1 of the sampling chip; the 3 rd pin of the sensor interface P3 is electrically connected to the positive electrode of the resistor R10, and the 4 th pin of the sensor interface P3 is electrically connected to the positive electrode of the resistor R13; the negative electrode of the resistor R10 is electrically connected with the negative electrode of the capacitor C10, the positive electrode of the capacitor C11 and the pin 3 of the sampling chip; the negative electrode of the resistor R13 is electrically connected with the negative electrode of the capacitor C11, the positive electrode of the capacitor C12 and the pin 4 of the sampling chip; the negative electrode of the capacitor C12 is grounded; the positive electrode of the capacitor C10 is grounded, and the positive electrode of the capacitor C10 is electrically connected with the positive electrode of the capacitor C8 and the pin 2 of the sampling chip; the negative electrode of the resistor R9 is electrically connected with the pin 8 of the sampling chip; the sampling chip is a sampling chip of CS 1237; the pin 7 of the sampling chip is electrically connected with the anode of the capacitor C9, the anode of the capacitor C7 and the anode of the magnetic bead L1; the negative electrode of the capacitor C9 is grounded; the negative electrode of the capacitor C7 is grounded; the negative electrode of the magnetic bead L1 is electrically connected with the positive electrode of the resistor R6 and the twenty-fourth pin of the positive electrode processor of the resistor R7; the pin 6 of the sampling chip is electrically connected with the positive electrode of the resistor R11; the pin 5 of the sampling chip is electrically connected with the positive electrode of the resistor R12; the negative electrode of the resistor R11 is electrically connected with the resistor R6 and the tenth pin of the processor, and the negative electrode of the resistor R12 is electrically connected with the negative electrode of the resistor R7 and the ninth pin of the processor; the sensor interface P3 is electrically connected to a pressure sensor.
The second pin of the processor is electrically connected to the negative electrode of the resistor R5, and the third pin of the processor is electrically connected to the negative electrode of the resistor R8; the first pin of the processor is grounded; the twenty-second pin of the processor is electrically connected with the 3 pin of the burning port, and the 2 pin of the burning device is grounded; the twenty-fourth pin of the processor is electrically connected with the 1 pin of the burning port.
The reference source module comprises a voltage stabilizing chip U2, a resistor R4 and a capacitor C6; the voltage stabilizing chip is an LM285 voltage stabilizing chip; the 4 pins of the voltage stabilizing chip are grounded, and the 8 pins of the voltage stabilizing chip are electrically connected with the negative electrode of the resistor R2, the positive electrode of the resistor R4 and the positive electrode of the capacitor C6; the negative electrode of the capacitor C6 is grounded; the positive electrode of the resistor R2 is electrically connected with the twenty-fourth pin of the processor, the negative electrode of the magnetic bead L1, the positive electrode of the resistor R6 and the positive electrode of the resistor R7; the negative electrode of the resistor R4 is electrically connected to the negative electrode of the capacitor C8, the positive electrode of the resistor R9 and the pin 1 of the sampling chip.
The indication module comprises a light emitting diode LR1, a light emitting diode LG1, a resistor R1 and a resistor R3; the negative electrode of the light emitting diode LR1 is electrically connected to the eleventh pin of the processor, and the negative electrode of the light emitting diode LG1 is electrically connected to the twelfth pin of the processor; the positive electrode of the light emitting diode LR1 is electrically connected to the positive electrode of the resistor R1, and the positive electrode of the light emitting diode LG1 is electrically connected to the positive electrode of the resistor R3; the negative electrode of the resistor R1 and the negative electrode of the resistor R3 are electrically connected to a twenty-fourth pin of the processor.
The power input conversion module comprises an interface P1, a capacitor C5, a diode D1, a capacitor C2, a buck chip U1, a capacitor C3, a capacitor C1 and a capacitor C4; the pin 1 of the interface P1 is electrically connected with the anode of the capacitor C5 and the anode of the diode D1; the 2 pin of the interface P1 is electrically connected with the anode of the resistor R5; the 3 pin of the interface P1 is electrically connected with the anode of the resistor R8; the pin 4 of the interface P1 is electrically connected with the negative electrode of the capacitor C5 and the negative electrode of the capacitor C2; the 4 pin of the interface P1 is grounded; the cathode of the diode D1 is electrically connected with the anode of the capacitor C2 and the pin 2 of the voltage reduction chip; the 1 pin of the buck chip is grounded; the 3 pins of the buck chip are electrically connected with the positive electrode of the capacitor C3, the positive electrode of the capacitor C1, the positive electrode of the capacitor C4 and the twenty-fourth pin of the processor; the negative electrode of the capacitor C3 is grounded, the negative electrode of the capacitor C1 is grounded, and the negative electrode of the capacitor C4 is grounded.
Diode D1 is a SOD4007 diode; the step-down chip is HT 7533-1; the light emitting diode LR1 is a red light emitting diode; the light emitting diode LG1 is a green light emitting diode; the resistance value of the resistor R1 is 2K, and the resistance value of the resistor R3 is 2K; the resistance value of the resistor R2 is 1K.
As shown in fig. 2, an external power supply provides a 5V power supply to the leveling board through an interface P1, a diode D1 plays a role in unidirectional protection, and after the power supply flows through the diode D1, the power supply is reduced to 3.3V through a voltage reduction chip U1 to supply power to the processor and the sampling chip.
The converted 3.3V shown in fig. 3 provides a clean and stable reference power supply for the pressure sensor and the sampling chip through the voltage stabilizing chip U2.
After the processor of fig. 4 is powered on, a command is sent through the SPI digital interface to configure parameters of the sampling chip, and the sampling chip is started, and the serial port of the processor communicates with the SOC processor through the interface P1.
As shown in fig. 5, the pressure sensor is connected to the high-precision sampling chip U4 through the sensor interface P3, and the pressure sensor is fixed on the deformable structure (hereinafter referred to as a nozzle module) through glue and a printer nozzle through screws. When the printer executes leveling action, the Z axis drives the nozzle module to move downwards, when the nozzle module is pressed to the printing platform, the deformable part of the nozzle module is caused to slightly deform, so that the change of an internal electric signal of the pressure sensor is caused, the change can not be measured by using the universal meter because the changed signal is very weak, at the moment, the weak signal is required to be amplified by the sampling chip and is processed by the sampling chip, the weak signal is finally converted into a digital signal to be sent to the processor through the SPI interface, after the processor processes the data read by the sampling chip through the algorithm, the current nozzle module is judged to be pressed to the printing platform, the current state and real-time data are returned to the SOC chip through the serial port, and after the SOC receives the data, the Z axis motor is stopped to move or the Z axis is reversely moved according to the current data, so that the leveling action is completed.
The pressure sensor is called full bridge type strain gauge.
The beneficial effects of the utility model are as follows: the hot bed leveling assistance for the FDM3D printer can be provided on the PCB substrate.
Claims (6)
- The special pressure leveling plate for the 3D printer is characterized by comprising a power input conversion module, a processor electrically connected with the power input conversion module, a burning port electrically connected with the processor, a sampling module electrically connected with the processor, a reference source module electrically connected with the sampling module and electrically connected with the processor, and an indication module electrically connected with the processor; the sampling module comprises a sensor interface P3, a resistor R10, a resistor R13, a capacitor C10, a capacitor C11, a capacitor C12, a capacitor C8, a resistor R9, a sampling chip U4, magnetic beads, a capacitor C7, a capacitor C9, a resistor R11, a resistor R12, a resistor R6 and a resistor R7; the processor is a SN8F5703 processor; the processor comprises 24 pins, wherein a first pin, a second pin, a third pin, a ninth pin, a tenth pin, an eleventh pin, a twelfth pin, a twenty-second pin and a twenty-fourth pin are arranged in the 24 pins; the sampling chip is provided with 8 pins, namely a pin 1, a pin 2, a pin 3, a pin 4, a pin 5, a pin 6, a pin 7 and a pin 8; the sensor interface P3 is provided with four pins, namely a 1 st pin, a 2 nd pin, a 3 rd pin and a4 th pin; the 1 st pin of the sensor interface P3 is grounded, and the 2 nd pin of the sensor interface P3 is electrically connected with the negative electrode of the capacitor C8, the positive electrode of the resistor R9 and the pin 1 of the sampling chip; the 3 rd pin of the sensor interface P3 is electrically connected to the positive electrode of the resistor R10, and the 4 th pin of the sensor interface P3 is electrically connected to the positive electrode of the resistor R13; the negative electrode of the resistor R10 is electrically connected with the negative electrode of the capacitor C10, the positive electrode of the capacitor C11 and the pin 3 of the sampling chip; the negative electrode of the resistor R13 is electrically connected with the negative electrode of the capacitor C11, the positive electrode of the capacitor C12 and the pin 4 of the sampling chip; the negative electrode of the capacitor C12 is grounded; the positive electrode of the capacitor C10 is grounded, and the positive electrode of the capacitor C10 is electrically connected with the positive electrode of the capacitor C8 and the pin 2 of the sampling chip; the negative electrode of the resistor R9 is electrically connected with the pin 8 of the sampling chip; the sampling chip is a sampling chip of CS 1237; the pin 7 of the sampling chip is electrically connected with the anode of the capacitor C9, the anode of the capacitor C7 and the anode of the magnetic bead L1; the negative electrode of the capacitor C9 is grounded; the negative electrode of the capacitor C7 is grounded; the negative electrode of the magnetic bead L1 is electrically connected with the positive electrode of the resistor R6 and the twenty-fourth pin of the positive electrode processor of the resistor R7; the pin 6 of the sampling chip is electrically connected with the positive electrode of the resistor R11; the pin 5 of the sampling chip is electrically connected with the positive electrode of the resistor R12; the negative electrode of the resistor R11 is electrically connected with the resistor R6 and the tenth pin of the processor, and the negative electrode of the resistor R12 is electrically connected with the negative electrode of the resistor R7 and the ninth pin of the processor; the sensor interface P3 is electrically connected to a pressure sensor.
- 2. The 3D printer specific pressure leveling plate of claim 1, wherein: the second pin of the processor is electrically connected to the negative electrode of the resistor R5, and the third pin of the processor is electrically connected to the negative electrode of the resistor R8; the first pin of the processor is grounded; the twenty-second pin of the processor is electrically connected with the 3 pin of the burning port, and the 2 pin of the burning device is grounded; the twenty-fourth pin of the processor is electrically connected with the 1 pin of the burning port.
- 3. The 3D printer dedicated pressure leveling plate according to claim 2, wherein: the reference source module comprises a voltage stabilizing chip U2, a resistor R4 and a capacitor C6; the voltage stabilizing chip is an LM285 voltage stabilizing chip; the 4 pins of the voltage stabilizing chip are grounded, and the 8 pins of the voltage stabilizing chip are electrically connected with the negative electrode of the resistor R2, the positive electrode of the resistor R4 and the positive electrode of the capacitor C6; the negative electrode of the capacitor C6 is grounded; the positive electrode of the resistor R2 is electrically connected with the twenty-fourth pin of the processor, the negative electrode of the magnetic bead L1, the positive electrode of the resistor R6 and the positive electrode of the resistor R7; the negative electrode of the resistor R4 is electrically connected to the negative electrode of the capacitor C8, the positive electrode of the resistor R9 and the pin 1 of the sampling chip.
- 4. A 3D printer dedicated pressure leveling plate according to claim 3, characterized in that: the indication module comprises a light emitting diode LR1, a light emitting diode LG1, a resistor R1 and a resistor R3; the negative electrode of the light emitting diode LR1 is electrically connected to the eleventh pin of the processor, and the negative electrode of the light emitting diode LG1 is electrically connected to the twelfth pin of the processor; the positive electrode of the light emitting diode LR1 is electrically connected to the positive electrode of the resistor R1, and the positive electrode of the light emitting diode LG1 is electrically connected to the positive electrode of the resistor R3; the negative electrode of the resistor R1 and the negative electrode of the resistor R3 are electrically connected to a twenty-fourth pin of the processor.
- 5. The 3D printer dedicated pressure leveling plate of claim 4, wherein: the power input conversion module comprises an interface P1, a capacitor C5, a diode D1, a capacitor C2, a buck chip U1, a capacitor C3, a capacitor C1 and a capacitor C4; the pin 1 of the interface P1 is electrically connected with the anode of the capacitor C5 and the anode of the diode D1; the 2 pin of the interface P1 is electrically connected with the anode of the resistor R5; the 3 pin of the interface P1 is electrically connected with the anode of the resistor R8; the pin 4 of the interface P1 is electrically connected with the negative electrode of the capacitor C5 and the negative electrode of the capacitor C2; the 4 pin of the interface P1 is grounded; the cathode of the diode D1 is electrically connected with the anode of the capacitor C2 and the pin 2 of the voltage reduction chip; the 1 pin of the buck chip is grounded; the 3 pins of the buck chip are electrically connected with the positive electrode of the capacitor C3, the positive electrode of the capacitor C1, the positive electrode of the capacitor C4 and the twenty-fourth pin of the processor; the negative electrode of the capacitor C3 is grounded, the negative electrode of the capacitor C1 is grounded, and the negative electrode of the capacitor C4 is grounded.
- 6. The 3D printer dedicated pressure leveling plate of claim 5, wherein: diode D1 is a SOD4007 diode; the step-down chip is HT 7533-1; the light emitting diode LR1 is a red light emitting diode; the light emitting diode LG1 is a green light emitting diode; the resistance value of the resistor R1 is 2K, and the resistance value of the resistor R3 is 2K; the resistance value of the resistor R2 is 1K.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320682559.1U CN219820652U (en) | 2023-03-31 | 2023-03-31 | Special pressure leveling board for 3D printer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320682559.1U CN219820652U (en) | 2023-03-31 | 2023-03-31 | Special pressure leveling board for 3D printer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219820652U true CN219820652U (en) | 2023-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320682559.1U Active CN219820652U (en) | 2023-03-31 | 2023-03-31 | Special pressure leveling board for 3D printer |
Country Status (1)
| Country | Link |
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| CN (1) | CN219820652U (en) |
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2023
- 2023-03-31 CN CN202320682559.1U patent/CN219820652U/en active Active
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