CN219811466U - Gas flow field device for cleaning wafer - Google Patents
Gas flow field device for cleaning wafer Download PDFInfo
- Publication number
- CN219811466U CN219811466U CN202320769997.1U CN202320769997U CN219811466U CN 219811466 U CN219811466 U CN 219811466U CN 202320769997 U CN202320769997 U CN 202320769997U CN 219811466 U CN219811466 U CN 219811466U
- Authority
- CN
- China
- Prior art keywords
- flow field
- gas flow
- component
- wafer cleaning
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 154
- 230000000903 blocking effect Effects 0.000 claims abstract description 32
- 238000005253 cladding Methods 0.000 claims description 19
- 230000000694 effects Effects 0.000 abstract description 11
- 238000005265 energy consumption Methods 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000005192 partition Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a gas flow field device for cleaning a wafer, which is applied to the field of semiconductor preparation and comprises the following components: a wafer cleaning air supply part and a gas flow field part forming a gas channel; an air outlet is formed in the gas flow field component, and a notch is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component; a baffle wall is additionally arranged on one side of the gap, which is close to the wafer cleaning air supply component, to prevent the air in the air channel from flowing out of the gap. According to the utility model, the baffle wall is additionally arranged on one side of the notch, which is close to the wafer cleaning air supply component, in the gas flow field component, so that the cross-sectional area of the notch is reduced, the effect of blocking the gas in the gas channel from flowing out of the notch is achieved, a large amount of gas in the gas flow field component is effectively prevented from being scattered, the energy consumption of the air supply component is reduced, and the wafer cleaning efficiency is further improved.
Description
Technical Field
The utility model relates to the field of semiconductor preparation, in particular to a gas flow field device for cleaning a wafer.
Background
In the existing process of cleaning a wafer by using a gas flow field, a stable gas flow field is required to be formed, so that pollution particles and particles possibly causing wafer pollution are separated from the wafer along with the trend of the air flow to a guide exhaust system, and a high-purity cleaning effect is achieved. However, in the existing device, a gap which is far larger than the size required by the ingress and egress and movement of the manipulator is formed at the ingress and egress position of the manipulator for operating the wafer, so that a large amount of gas in the formed gas flow field is dissipated, and the cleaning efficiency of the wafer is reduced.
Disclosure of Invention
Accordingly, the present utility model is directed to a gas flow field device for cleaning a wafer, which solves the problems of the prior art that a lot of gas in the gas flow field component is lost and the cleaning efficiency of the wafer is reduced.
In order to solve the above technical problems, the present utility model provides a wafer cleaning gas flow field device, including:
a wafer cleaning air supply part and a gas flow field part forming a gas channel;
an air outlet is formed in the gas flow field component, and a notch is formed in the gas flow field component for the wafer bearing component to move and enter and exit;
and a baffle wall is additionally arranged on one side of the gap, which is close to the wafer cleaning air supply component, so that the gas in the gas channel is prevented from flowing out of the gap.
Optionally, the compartment member of the gas flow field member is disposed opposite the wafer cleaning air supply member.
Optionally, a seal is provided between one end of the first barrier wall and the compartment component;
one end of the additional retaining wall and the other end of the first retaining wall form the gap;
and the other end of the additionally arranged baffle wall is sealed with the wafer cleaning air supply component.
Optionally, the air outlet is formed between one end of the second blocking wall in the gas flow field component and the partition component;
and the other end of the second blocking wall is sealed with the wafer cleaning air supply component.
Optionally, the notch is formed by the other end of the additional blocking wall and one end of the first blocking wall, including:
the additional baffle wall is arranged on one side, pointing to the gas channel, of the first baffle wall in a staggered manner with the first baffle wall to form the notch.
Optionally, the additional blocking wall is connected with a cladding housing carrying the additional blocking wall.
Optionally, the additional baffle wall is connected with the cladding shell through bolts.
Optionally, the additional baffle wall is movably connected with the cladding shell.
Optionally, the additional baffle wall is movably connected with the cladding shell through a sliding rail component.
Optionally, the additional baffle wall is hinged with the cladding shell.
The wafer cleaning gas flow field device provided by the utility model comprises a wafer cleaning air supply component and a gas flow field component forming a gas channel; an air outlet is formed in the gas flow field component, and a notch is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component; a baffle wall is additionally arranged on one side of the gap, which is close to the wafer cleaning air supply component, to prevent the air in the air channel from flowing out of the gap. According to the utility model, the baffle wall is additionally arranged on one side of the notch, which is close to the wafer cleaning air supply component, in the gas flow field component, so that the cross-sectional area of the notch is reduced, the effect of blocking the gas in the gas channel from flowing out of the notch is achieved, a large amount of gas in the gas flow field component is effectively prevented from being scattered, the energy consumption of the air supply component is reduced, and the wafer cleaning efficiency is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional view of a conventional wafer cleaning gas flow field device according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a gas flow field device for wafer cleaning according to an embodiment of the present utility model;
FIG. 3 is a schematic cross-sectional view of a gas flow field device for wafer cleaning according to an embodiment of the present utility model;
FIG. 4 is a schematic cross-sectional view of another embodiment of a gas flow field apparatus for wafer cleaning;
in fig. 1-4, the reference numerals are as follows:
10-cleaning a wafer air supply component;
21-a first baffle wall, 22-an additional baffle wall, 23-a partition component, 24-a second baffle wall;
31-air outlet and 32-notch.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the semiconductor process, the process of cleaning the etched wafer affects the quality of the final product of the wafer, and the process of cleaning the etched wafer generally adopts to place the wafer in a gas flow field for cleaning, and guide the polluted particles on the wafer or particles possibly causing wafer pollution to an exhaust system. Therefore, the stability of the gas flow field directly affects the yield of the wafer.
In the existing gas flow field for cleaning the wafer, only a large gap is reserved at the position of the gas flow field for the manipulator carrying the wafer to enter and exit, so that a large amount of cleaning gas in the gas flow field leaks out, and the efficiency of the formed gas flow field for cleaning the wafer is reduced. Referring to fig. 1 in detail, fig. 1 is a schematic cross-sectional structure of a conventional wafer cleaning gas flow field device according to an embodiment of the present utility model. The opposite side of the air outlet is provided with only one baffle, and a gap with larger gap is formed at the upper side of the position of the manipulator for entering and exiting the gas flow field, so that clean gas in the gas flow field leaks out, and the power of a wafer cleaning air supply component is required to be continuously increased to achieve the effect of cleaning the wafer, so that the cleaning efficiency of the wafer is greatly reduced.
In order to solve the problem, the utility model provides a gas flow field device for cleaning a wafer, wherein a baffle wall is additionally arranged on one side of a gap, which is close to a wafer cleaning air supply part, in the gas flow field part, so that the cross-sectional area of the gap is reduced, the effect of blocking the air in a gas channel from flowing out of the gap is achieved, a great deal of gas in the gas flow field part is effectively prevented from being lost, the energy consumption of the air supply part is reduced, and the cleaning efficiency of the wafer is further improved.
Example 1:
referring to fig. 2, fig. 2 is a schematic structural diagram of a wafer cleaning gas flow field device according to an embodiment of the utility model. The apparatus may include:
wafer cleaning air supply part 10 and gas flow field part forming gas channel;
an air outlet is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer carrying component to move and enter and exit the gas flow field component;
the notch 32 is provided with an additional baffle wall 22 on a side of the wafer cleaning air supply member 10, which blocks the gas in the gas passage from flowing out of the notch 32.
It should be noted that, in this embodiment, the notch 32 is ensured to enable the wafer carrying member to enter and exit the gas flow field member, and meanwhile, a baffle wall is additionally provided on one side of the notch 32 close to the wafer cleaning air supply member 10, so that the cleaning air input into the gas flow field member by the wafer cleaning air supply member 10 can be guided, the air in the air channel can be blocked from flowing out from the notch 32, and a large amount of cleaning air in the gas flow field member can be effectively avoided. In this embodiment, the wafer cleaning air supply component is used for inputting a cleaning gas into the gas flow field component, and is used for cleaning a wafer in the gas flow field, where the cleaning gas may be an acid gas. The cleaning gas circulates along the structure inside the gas flow field component, flows out from the air outlet, and the wafer bearing component bearing the wafer enters the inside of the gas flow field component from the notch 32 and is cleaned by the circulating cleaning gas. The wafer bearing component moves after entering the gas flow field component so as to ensure that the wafer is cleaned fully. In order to facilitate understanding of the wafer cleaning gas flow field device provided in this embodiment, reference may be made to fig. 3, and fig. 3 is a schematic cross-sectional structure of a wafer cleaning gas flow field device provided in an embodiment of the present utility model.
The present embodiment is not limited to the structure in which the baffle wall 22 is added, and may have an effect of blocking the gas in the gas passage from flowing out of the notch 32. For example, the structure of the additional baffle wall 22 may be an integral additional baffle wall 22 disposed on the side of the notch 32 close to the wafer cleaning and air supplying member 10, or the structure of the additional baffle wall 22 may be an additional baffle wall 22 formed by a plurality of sub baffle walls disposed on the side of the notch 32 close to the wafer cleaning and air supplying member 10, for example, the sizes of the sub baffle walls at different positions may be different, the sizes of the sub baffle walls at different positions may be set according to the situation that the wafer carrying member moves in the gas flow field member, and the size of the sub baffle wall may be larger than the size of the sub baffle wall with a large movement range. The present embodiment is not limited to the specific shape of the additional baffle wall 22, as long as it can block the gas in the gas passage from flowing out of the notch 32. For example, the shape of the additional blocking wall 22 may be a plate shape, or the shape of the additional blocking wall 22 may be other shapes satisfying the condition. The specific material of the baffle wall 22 is not limited to this embodiment. For example, the additional baffle wall 22 may be made of metal; alternatively, the baffle wall 22 may be made of plastic, such as polypropylene.
Further, the present embodiment is not limited to the specific structure of the gas channels formed in the gas flow field member, as long as the wafer can be cleaned and circulated efficiently. The wafer cleaning air supply part 10 in this embodiment may be an FFU (purge fan), or may be another part capable of outputting cleaning air. The position of the air outlet 31 in the gas flow field member is not limited in this embodiment, as long as the cleaning gas in the gas flow field member can be flowed out of the gas flow field member after cleaning the wafer. The present embodiment does not limit the number of notches 32. For example, the number of notches 32 may be 1, or the number of notches 32 may be 2, or the number of notches 32 may be 3. To be noted, in this embodiment, each notch 32 is provided with an additional baffle wall 22 at a side close to the wafer cleaning air supply member 10.
Further, in order to make the gas flow field device for cleaning a wafer provided by the embodiment of the present utility model, a baffle wall 22 may be additionally provided on the basis of the existing gas flow field device for cleaning a conventional wafer, so as to reduce the endless waste of resources, and the partition member 23 in the gas flow field member may be disposed on the opposite side of the wafer cleaning air supply member 10.
It should be noted that, in this embodiment, the wafer cleaning air supply component 10 and the partition component 23 in the gas flow field component are arranged along alignment, so that the baffle wall 22 can be directly arranged in the conventional wafer cleaning gas flow field device, and the cost of device upgrading is reduced.
Further, in order to further reduce the cost of upgrading the device and simplify the structure of the device, the space between one end of the first blocking wall 21 and the partition member 23 may be sealed;
one end of the additional retaining wall 22 and the other end of the first retaining wall 21 form a notch 32;
the other end of the additional baffle wall 22 is sealed with the wafer cleaning air supply assembly 10.
In this embodiment, the first blocking wall 21 and the partition member 23 are sealed, and the gap 23 is formed between the partition member 23 and the side surface of the wafer cleaning air supply member 10, so that the wafer carrying member can carry the wafer into the gas flow field member for cleaning, and meanwhile, the gap 23 is arranged on the side surface of the partition member 23 and the wafer cleaning air supply member 10, so that the structure of the device can be simplified, and the cleaning efficiency of the wafer cleaning gas flow field device on the wafer can be improved. The present embodiment does not limit the specific shape of the first barrier 21. For example, the first baffle 21 may be a gable as shown in fig. 2; or the first shutter 21 may be a shutter of another shape.
Further, in order to ensure that the cleaning gas in the gas flow field component can sufficiently clean the wafer, an air outlet 31 may be formed between one end of the second blocking wall 24 in the gas flow field component and the partition component 23;
the other end of the second barrier wall 24 is sealed with the wafer cleaning air supply member 10.
In this embodiment, the air outlet 31 is disposed at a side close to the partition member 23, so that the cleaning gas after cleaning the wafer can be more conveniently discharged from the gas flow field member through the air outlet 31, and the cleaning efficiency of the wafer can be further improved.
Further, in order to improve the efficiency of the exhaust gas flow field component for cleaning the wafer, the above-mentioned wafer cleaning gas flow field device may be further provided with a wind box component for generating negative pressure and an adjusting component for adjusting the negative pressure and the airflow direction, and may be further provided with an air extraction component for generating negative pressure.
The gas flow field device applied to the wafer cleaning provided by the utility model comprises a wafer cleaning air supply component 10 and a gas flow field component forming a gas channel; an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component; the notch 32 is provided with an additional baffle wall 22 on a side of the wafer cleaning air supply member 10, which blocks the gas in the gas passage from flowing out of the notch 32. According to the utility model, the baffle wall 22 is additionally arranged on one side of the notch 32, which is close to the wafer cleaning air supply component 10, in the gas flow field component, so that the cross-sectional area of the notch 32 is reduced, the effect of blocking the gas in the gas channel from flowing out of the notch 32 is achieved, a great deal of gas in the gas flow field component is effectively prevented from being scattered, the energy consumption of the air supply component is reduced, and the wafer cleaning efficiency is further improved. In addition, the partition part 23 in the gas flow field part is arranged at the opposite side of the wafer cleaning air supply part 10, so that the wafer cleaning gas flow field device provided by the embodiment of the utility model can be obtained by additionally arranging the baffle wall 22 on the basis of the conventional wafer cleaning gas flow field device, and the endless waste of resources is reduced; by arranging the notch 23 on the side surfaces of the partition member 23 and the wafer cleaning air supply member 10, the structure of the device can be simplified, and the wafer cleaning efficiency of the wafer cleaning gas flow field device can be improved; by arranging the air outlet 31 on the side close to the partition member 23, the cleaning gas after cleaning the wafer can be more conveniently discharged out of the gas flow field member through the air outlet 31, and the cleaning efficiency of the wafer can be further improved.
Example 2:
referring to fig. 4, fig. 4 is a schematic cross-sectional view of another wafer cleaning gas flow field device according to an embodiment of the present utility model. The apparatus may include:
wafer cleaning air supply part 10 and gas flow field part forming gas channel;
an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component;
the notch 32 is provided with an additional baffle wall 22 at one side close to the wafer cleaning air supply part 10 to prevent the air in the air channel from flowing out of the notch 32;
the compartment member 23 of the gas flow field member is disposed on the opposite side of the wafer cleaning air supply member 10;
one end of the first blocking wall 21 is sealed with the compartment member 23; the additional baffle wall 22 is arranged on one side of the first baffle wall 21 pointing to the gas channel and is staggered with the first baffle wall 21 to form a notch 32; the other end of the additional baffle wall 22 is sealed with the wafer cleaning air supply assembly 10.
In this embodiment, the additional baffle wall 22 is arranged on the side of the first baffle wall 21 pointing to the gas channel and is offset from the first baffle wall 21, so that the gas flow inputted into the gas flow field component by the wafer cleaning air supply component 10 flows along the gas channel of the air outlet 31, and at this time, the cleaning gas in the gas flow field component is not easy to flow out from the notch 32, and the cleaning gas in the gas flow field component can be further prevented from leaking.
The gas flow field device applied to the wafer cleaning provided by the utility model comprises a wafer cleaning air supply component 10 and a gas flow field component forming a gas channel; an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component; the notch 32 is provided with an additional baffle wall 22 on a side of the wafer cleaning air supply member 10, which blocks the gas in the gas passage from flowing out of the notch 32. According to the utility model, the notch 32 is arranged on one side of the gas flow field component, which is close to the wafer cleaning air supply component 10, and the baffle wall 22 is additionally arranged, so that the cross-sectional area of the notch 32 is reduced, the effect of blocking the air in the air channel from flowing out of the notch 32 is achieved, a great amount of air in the gas flow field component is effectively prevented from being scattered, the energy consumption of the air supply component is reduced, the cleaning efficiency of the wafer is further improved, and the baffle wall 22 is additionally arranged on one side of the first baffle wall 21, which is directed to the air channel, and is staggered with the first baffle wall 21, so that the cleaning air in the gas flow field component can be further prevented from being leaked out.
Example 3:
referring to fig. 3, fig. 3 is a schematic cross-sectional structure of a wafer cleaning gas flow field device according to an embodiment of the utility model. The apparatus may include:
wafer cleaning air supply part 10 and gas flow field part forming gas channel;
an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component;
the notch 32 is provided with an additional baffle wall 22 at one side close to the wafer cleaning air supply part 10 to prevent the air in the air channel from flowing out of the notch 32;
the additional baffle wall 22 is connected to a cladding enclosure carrying the additional baffle wall 22.
It should be noted that, in this embodiment, the additional baffle wall 22 is connected to the cladding case, so that the additional baffle wall 22 can be more conveniently set.
Further, in order to facilitate the disassembly between the additional blocking wall 22 and the cladding case, the additional blocking wall 22 may be bolted to the cladding case.
In this embodiment, the additional retaining wall 22 may be attached to the cladding enclosure by a plurality of bolts.
The gas flow field device applied to the wafer cleaning provided by the utility model comprises a wafer cleaning air supply component 10 and a gas flow field component forming a gas channel; an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component; the notch 32 is provided with an additional baffle wall 22 on a side of the wafer cleaning air supply member 10, which blocks the gas in the gas passage from flowing out of the notch 32. According to the utility model, the notch 32 is arranged on one side, close to the wafer cleaning air supply component 10, of the gas flow field component, and the additional baffle wall 22 is arranged, so that the cross-sectional area of the notch 32 is reduced, the effect of blocking the gas in the gas channel from flowing out of the notch 32 is achieved, a great amount of gas in the gas flow field component is effectively prevented from being scattered, the energy consumption of the air supply component is reduced, the wafer cleaning efficiency is further improved, and the additional baffle wall 22 can be more conveniently arranged by connecting the additional baffle wall 22 with the coating shell. In addition, through the bolt connection of the additional retaining wall 22 and the cladding shell, the additional retaining wall 22 and the cladding shell can be detached more conveniently.
Example 4:
referring to fig. 3, fig. 3 is a schematic cross-sectional structure of a wafer cleaning gas flow field device according to an embodiment of the utility model. The apparatus may include:
wafer cleaning air supply part 10 and gas flow field part forming gas channel;
an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component;
the notch 32 is provided with an additional baffle wall 22 at one side close to the wafer cleaning air supply part 10 to prevent the air in the air channel from flowing out of the notch 32;
the additional retaining wall 22 is movably connected with the cladding shell.
It should be noted that, in this embodiment, the additional baffle wall 22 is movably connected with the covering shell, so that when the wafer carrying member enters and exits the gas flow field member and when the wafer carrying member moves in the gas flow field member, the additional baffle wall 22 moves, and at this time, the shielding area of the additional baffle wall 22 to the notch 32 can be further increased. The embodiment is not limited to a specific manner in which the baffle wall 22 is movably connected to the covering housing, as long as the baffle wall 22 can be additionally moved to move the wafer carrier in the gap 32 or to move the wafer carrier in and out of the gas flow field part when the wafer carrier moves in and out of the gas flow field part. For example, the baffle wall 22 and the cladding shell can be movably connected through a sliding rail component, or the baffle wall 22 and the cladding shell can be movably connected in other manners.
Further, in order to increase the movement range of the additional blocking wall 22, the additional blocking wall 22 may be movably connected to the covering housing through a sliding rail member.
The present embodiment is not limited to the direction in which the slide rail members are provided. For example, the rail member may be disposed in a direction along which the cleaning gas flows in the gas passage, or may be disposed in other directions.
The gas flow field device applied to the wafer cleaning provided by the utility model comprises a wafer cleaning air supply component 10 and a gas flow field component forming a gas channel; an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component; the notch 32 is provided with an additional baffle wall 22 on a side of the wafer cleaning air supply member 10, which blocks the gas in the gas passage from flowing out of the notch 32. According to the utility model, the notch 32 is arranged on one side, close to the wafer cleaning air supply component 10, of the gas flow field component, the baffle wall 22 is additionally arranged, so that the cross-sectional area of the notch 32 is reduced, the effect of blocking the gas in the gas channel from flowing out of the notch 32 is achieved, a great amount of gas in the gas flow field component is effectively prevented from being scattered, the energy consumption of the air supply component is reduced, the wafer cleaning efficiency is further improved, and the additional baffle wall 22 is movably connected with the coating shell, so that the gas in the gas flow field component can be further prevented from being leaked. In addition, the additional baffle wall 22 is movably connected with the cladding shell through the sliding rail component, so that the movement range of the additional baffle wall 22 can be improved.
Example 5:
referring to fig. 3, fig. 3 is a schematic cross-sectional structure of a wafer cleaning gas flow field device according to an embodiment of the utility model. The apparatus may include:
wafer cleaning air supply part 10 and gas flow field part forming gas channel;
an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component;
the notch 32 is provided with an additional baffle wall 22 at one side close to the wafer cleaning air supply part 10 to prevent the air in the air channel from flowing out of the notch 32;
a retaining wall 22 is added to hinge the cladding enclosure.
In this embodiment, the additional blocking wall 22 is hinged to the covering housing, so that the convenience in moving the additional blocking wall 22 can be further improved. In this embodiment, in order to improve the automation degree of the device, a sensing device and a component for controlling the movement of the additional baffle wall 22 may be disposed at the notch, so that the additional baffle wall 22 may be automatically controlled to move when the sensor detects that the wafer carrying component enters and exits the gas flow field component.
The gas flow field device applied to the wafer cleaning provided by the utility model comprises a wafer cleaning air supply component 10 and a gas flow field component forming a gas channel; an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component; the notch 32 is provided with an additional baffle wall 22 on a side of the wafer cleaning air supply member 10, which blocks the gas in the gas passage from flowing out of the notch 32. According to the utility model, the notch 32 is arranged on one side, close to the wafer cleaning air supply component 10, of the gas flow field component, and the additional baffle wall 22 is arranged, so that the cross-sectional area of the notch 32 is reduced, the effect of blocking the gas in the gas channel from flowing out of the notch 32 is achieved, a great amount of gas in the gas flow field component is effectively prevented from being scattered, the energy consumption of the air supply component is reduced, the wafer cleaning efficiency is further improved, and the convenience in moving the additional baffle wall 22 can be further improved by connecting the additional baffle wall 22 with the cladding shell through the hinge.
In order to facilitate understanding of the present utility model, the gas flow field device for cleaning a wafer provided by the present utility model may specifically include:
wafer cleaning air supply part 10 and gas flow field part forming gas channel;
an air outlet 31 is formed in the gas flow field component, and a notch 32 is formed in the gas flow field component for the wafer bearing component to move and enter and exit the gas flow field component;
the notch 32 is provided with an additional baffle wall 22 at one side close to the wafer cleaning air supply part 10 to prevent the air in the air channel from flowing out of the notch 32;
the additional baffle wall 22 is arranged on one side of the first baffle wall 21 pointing to the gas channel and is staggered with the first baffle wall 21 to form a notch 32.
In the present embodiment, the first blocking wall 21 is provided on the same side as the additional blocking wall 22, and a gap 32 is formed between the first blocking wall and the additional blocking wall 22.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other.
Finally, it is further noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprise," "include," or any other variation thereof, are intended to cover a non-exclusive inclusion.
The above description of a wafer cleaning gas flow field device provided by the present utility model has been presented in detail, and a number of specific examples have been applied to illustrate the present utility model, the above description of the embodiments is only for aiding in understanding the method of the present utility model and its core ideas; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present utility model, the present description should not be construed as limiting the present utility model in view of the above.
Claims (10)
1. A wafer cleaning gas flow field apparatus, comprising:
a wafer cleaning air supply part and a gas flow field part forming a gas channel;
an air outlet is formed in the gas flow field component, and a notch is formed in the gas flow field component for the wafer bearing component to move and enter and exit;
and a baffle wall is additionally arranged on one side of the gap, which is close to the wafer cleaning air supply component, so that the gas in the gas channel is prevented from flowing out of the gap.
2. The wafer cleaning gas flow field device of claim 1, wherein a compartment member of the gas flow field member is disposed opposite the wafer cleaning air supply member.
3. The wafer cleaning gas flow field device of claim 2, wherein a seal is provided between an end of the first baffle wall and the compartment component;
one end of the additional retaining wall and the other end of the first retaining wall form the gap;
and the other end of the additionally arranged baffle wall is sealed with the wafer cleaning air supply component.
4. A wafer cleaning gas flow field device according to claim 3, wherein the air outlet is formed between one end of a second baffle wall in the gas flow field component and the compartment component;
and the other end of the second blocking wall is sealed with the wafer cleaning air supply component.
5. A wafer cleaning gas flow field device according to claim 3, wherein the other end of the additional baffle wall and one end of the first baffle wall form the gap, comprising:
the additional baffle wall is arranged on one side, pointing to the gas channel, of the first baffle wall in a staggered manner with the first baffle wall to form the notch.
6. The wafer cleaning gas flow field device of claim 1, wherein the additional baffle wall is coupled to a cladding enclosure carrying the additional baffle wall.
7. The wafer cleaning gas flow field device of claim 6, wherein the additional baffle wall is bolted to the containment shell.
8. The wafer cleaning gas flow field device of claim 6, wherein the additional baffle wall is movably coupled to the containment housing.
9. The wafer cleaning gas flow field device of claim 8, wherein the additional baffle wall is movably coupled to the containment housing by a slide rail member.
10. The wafer cleaning gas flow field device of claim 8, wherein the additional baffle wall is hinged to the containment housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320769997.1U CN219811466U (en) | 2023-04-07 | 2023-04-07 | Gas flow field device for cleaning wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320769997.1U CN219811466U (en) | 2023-04-07 | 2023-04-07 | Gas flow field device for cleaning wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219811466U true CN219811466U (en) | 2023-10-10 |
Family
ID=88215512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320769997.1U Active CN219811466U (en) | 2023-04-07 | 2023-04-07 | Gas flow field device for cleaning wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219811466U (en) |
-
2023
- 2023-04-07 CN CN202320769997.1U patent/CN219811466U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105169863B (en) | Integrated treating apparatus and treating process for exhaust gas of setting machine used in dyeing and finishing industry | |
| CN219811466U (en) | Gas flow field device for cleaning wafer | |
| CN108339695A (en) | A kind of frame paint line of novel energy-saving environment-friendly | |
| CN116899397A (en) | Oxidation tuber pipe structure for wet flue gas desulfurization | |
| CN217656288U (en) | Heat dissipation box and distribution equipment thereof | |
| CN105964518A (en) | Continuous automatic drying solidification device | |
| CN211721510U (en) | Incubator, incubator set and hatching room with reasonable air circulation | |
| CN112023530B (en) | Secondary zinc oxide settling chamber with high settling efficiency | |
| CN212058380U (en) | Water circulation device for plastic pipeline production workshop | |
| CN214830751U (en) | Electrolytic cell | |
| CN213253583U (en) | Wet dust collector with noise reduction function | |
| CN206199843U (en) | A kind of controllable flat board cleaning machine water tank of water | |
| CN219543719U (en) | Cooling equipment for rubber compound production | |
| CN220895627U (en) | Thermal management device and electric engineering vehicle | |
| CN220049364U (en) | Flow guide assembly and exhaust cabinet | |
| CN219972124U (en) | Environment-friendly water treatment organic sludge treatment device | |
| CN209985885U (en) | Gas-liquid two-phase hybrid photovoltaic panel cleaning device | |
| CN220900790U (en) | Novel energy-saving environment-friendly spray booth | |
| CN220049365U (en) | External air supplementing box and exhaust cabinet | |
| CN221057507U (en) | Liquid cooling modularization energy storage cabin | |
| CN219729418U (en) | Integrated gas collecting hood for sensible heat recovery and dust control of solid materials | |
| CN211858260U (en) | Air-cooled cooling device in production of ceramic high-temperature-resistant fireproof cable for fire fighting access | |
| CN220304067U (en) | Panel drying equipment | |
| CN115889384B (en) | Fume hood, ventilation method and computer readable storage medium | |
| CN217069957U (en) | Three-door delivery window |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |