CN219805963U

CN219805963U - Semiconductor wafer detection device

Info

Publication number: CN219805963U
Application number: CN202320702219.0U
Authority: CN
Inventors: 梁珀
Original assignee: Chengdu Weihan Electric Co ltd
Current assignee: Chengdu Weihan Electric Co ltd
Priority date: 2023-04-03
Filing date: 2023-04-03
Publication date: 2023-10-10
Anticipated expiration: 2033-04-03

Abstract

The utility model discloses a semiconductor wafer detection device which comprises a detector, wherein the detector consists of a base, a placing table and a detection assembly, the top of the base is fixedly connected with the bottom of the placing table, and the detection assembly is positioned at the top of the placing table and is in sliding connection with the base. According to the semiconductor wafer detection device, through the arrangement of the structural components such as the detector, the base, the placement table, the detection assembly, the fixed blocks and the like, the movable assembly is used in the fixed blocks, the clamping assembly can be used in cooperation with the movable blocks to fix the wafer and separate the wafer from the wafer, the replaced clamping assembly is fixed with the two movable blocks, the wafer can be clamped and fixed, and shaking is avoided.

Description

Semiconductor wafer detection device

Technical Field

The utility model belongs to the technical field of wafer detection, and particularly relates to a semiconductor wafer detection device.

Background

The utility model provides a semiconductor wafer is the used silicon wafer of preparation silicon semiconductor circuit, the semiconductor wafer needs to use detecting instrument to detect the wafer after producing, the automatic film thickness tester of wafer is one of them, the automatic film thickness tester of wafer is the instrument of a detection wafer film thickness, the automatic film thickness tester of current wafer does not have the subassembly that carries out the centre gripping fixed to the wafer in the in-process of using, thereby make the automatic film thickness tester of wafer when receiving the collision, can make the wafer rock, lead to can influence the detection effect to the wafer, inconvenient use, the problem that prior art exists is: the automatic film thickness tester of the wafer does not have a component for clamping and fixing the wafer, and the wafer can shake due to collision of the automatic film thickness tester of the wafer, so that the detection effect is affected, and therefore, the semiconductor wafer detection device is provided for solving the problems.

Disclosure of Invention

Aiming at the problems in the prior art, the utility model provides a semiconductor wafer detection device which has the advantages of clamping and fixing a wafer and avoiding shaking, and solves the problem that the existing automatic wafer film thickness tester does not have a component for clamping and fixing the wafer, and the wafer can shake due to collision of the automatic wafer film thickness tester, so that the detection effect is affected.

The utility model discloses a semiconductor wafer detection device, which comprises a detector, wherein the detector consists of a base, a placing table and a detection assembly, the top of the base is fixedly connected with the bottom of the placing table, the detection assembly is positioned at the top of the placing table and is in sliding connection with the base, the left side and the right side of the top of the base are fixedly connected with fixed blocks, the left side of the fixed blocks is internally provided with a cavity, the inside of the cavity is provided with a movable assembly, the right side of the movable assembly is matched with two plug blocks, the opposite ends of the two plug blocks are fixedly connected with clamping blocks for fixing wafers, and the tops of the two plug blocks are respectively provided with a clamping assembly.

As the preferable mode of the utility model, the movable assembly comprises two movable blocks, the surfaces of the two movable blocks are movably connected with the inside of the cavity, the left sides of the two movable blocks are fixedly connected with pull blocks, the left sides of the pull blocks are fixedly connected with reset springs, the left sides of the reset springs are fixedly connected with the left sides of the inner walls of the cavity, the right sides of the two movable blocks are connected with the inside of the two plug-in blocks in a plug-in manner, and the two movable blocks and the pull blocks can move leftwards or rightwards in the inside of the cavity through the movable assembly, and the reset springs can squeeze the two movable blocks and the pull blocks to play a role in fixing.

As the preferred mode of the utility model, the clamping assembly at the front side comprises a protruding block, the top of the plugging block at the front side is fixedly connected with the bottom of the protruding block, a movable groove is formed in the protruding block, the clamping block is movably connected in the movable groove and matched with the movable block for use, the top of the clamping block is fixedly connected with a handle, and the clamping block can move into the movable block through the movable groove by arranging the clamping assembly and is used for enabling the plugging block to drive the clamping block and the movable block.

As the preferable one of the utility model, the inside of the clamping block is connected with the limiting plate in a sliding way, the left side and the right side of the limiting plate are respectively and fixedly connected with the left side and the right side of the inner wall of the movable groove, the bottom of the limiting plate is fixedly connected with the elastic spring, one side of the elastic spring, which is close to the clamping block, is fixedly connected with the clamping block, and the clamping block drives the handle to automatically rebound to the original position after moving by arranging the limiting plate and the elastic spring which are matched.

As the preferable mode of the utility model, the bottom of the clamping block sequentially penetrates through the protruding block, the plug-in block and the movable block through the movable groove and extends to the inside of the movable block, and the clamping block is moved to the inside of the movable block through the clamping block, so that the clamping block after replacement is fixed.

As the preferred mode of the utility model, the bottom of the clamping block is tightly contacted with the inside of the movable block, and after the clamping block is in plug-in connection with the movable block, the two plug-in blocks drive the clamping block to be more firmly fixed with the two movable blocks, and the bottom of the clamping block is tightly contacted with the inside of the movable block by arranging the clamping block, so that the clamping block can be prevented from shaking when fixing the wafer.

Preferably, the clamping blocks are replaceable, and the matched clamping blocks are replaced according to wafers with different sizes, so that a user can replace the clamping blocks with the matched sizes according to the detected wafer sizes, and the detection is facilitated.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, by arranging the structural components such as the detector, the base, the placing table, the detection assembly, the fixed block and the like, the movable assembly is used in the fixed block, so that the clamping block is fixed with the wafer and is separated from the wafer, and the clamping assembly is matched with the movable block for use, so that the clamping block is fixed with the two movable blocks after replacement, and the wafer clamping device has the advantages of being capable of clamping and fixing the wafer and avoiding shaking.

2. According to the utility model, by arranging structural components such as the detector, the base, the placement table, the detection assembly, the fixed block and the like, when the clamping blocks are required to be separated from contact with a wafer, the pulling blocks are pulled to move leftwards by manpower and drive the two movable blocks to move leftwards, the two movable blocks can enable the two inserting blocks to move leftwards and enable the clamping blocks to move leftwards, so that the clamping blocks are separated from contact with the wafer, a deformation force is generated by the reset spring in the leftwards moving process of the pulling blocks, the same force is generated by the reset spring after the pulling blocks are released, the pulling blocks drive the two movable blocks and the two inserting blocks and enable the clamping blocks to rebound to the original position, the wafer is fixed, the clamping blocks are driven to move upwards and move out of the movable blocks by pulling handles, the clamping blocks are driven to move rightwards and separate from the two movable blocks, the matched clamping blocks are replaced, the elastic spring can generate a deformation force in the moving process of the clamping blocks, and the elastic spring can give the same force to the clamping blocks after the clamping blocks are released, the clamping blocks are enabled to rebound to the inside the movable blocks and rebound to the original position after the clamping blocks are replaced, and the clamping blocks are fixed in place.

Drawings

FIG. 1 is a schematic diagram of a structure provided by an embodiment of the present utility model;

FIG. 2 is a top cross-sectional view of a securing block provided by an embodiment of the present utility model;

FIG. 3 is a detailed perspective view of a partial structure provided by an embodiment of the present utility model;

fig. 4 is a perspective view of a clamping assembly according to an embodiment of the present utility model.

In the figure: 1. a detector; 101. a base; 102. a placement table; 103. a detection assembly; 2. a fixed block; 3. a cavity; 4. a movable assembly; 401. a movable block; 402. pulling blocks; 403. a return spring; 5. a plug block; 6. a clamping block; 7. a clamping assembly; 701. a bump; 702. a movable groove; 703. a clamping block; 704. a handle; 8. a limiting plate; 9. and an elastic spring.

Detailed Description

For a further understanding of the utility model, its features and advantages, reference is now made to the following examples, which are illustrated in the accompanying drawings.

The structure of the present utility model will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 4, the semiconductor wafer inspection device provided by the embodiment of the utility model comprises an inspection apparatus 1, a base 101, a placement table 102, an inspection assembly 103, a fixed block 2, a cavity 3, a movable assembly 4, a movable block 401, a pull block 402, a return spring 403, an inserting block 5, a clamping block 6, a clamping assembly 7, a limiting plate 8, a bump 701, a movable groove 702, a clamping block 703, a handle 704, a limiting plate 8 and an elastic spring 9, wherein the inspection apparatus 1 is composed of the base 101, the placement table 102 and the inspection assembly 103, the top of the base 101 is fixedly connected with the bottom of the placement table 102, the inspection assembly 103 is located at the top of the placement table 102 and is in sliding connection with the base 101, the left side and the right side of the top of the base 101 are fixedly connected with the fixed block 2, the cavity 3 is formed in the left side of the fixed block 2, the movable assembly 4 is arranged in the cavity 3, two inserting blocks 5 are matched with the right side of the movable assembly 4, the opposite ends of the two inserting blocks 5 are fixedly connected with the clamping blocks 6 for fixing wafers, and the clamping assemblies 7 are arranged at the tops of the two blocks 5.

Referring to fig. 2, the movable assembly 4 includes two movable blocks 401, the surfaces of the two movable blocks 401 are movably connected with the inside of the cavity 3, the left sides of the two movable blocks 401 are fixedly connected with a pull block 402, the left sides of the pull blocks 402 are fixedly connected with a reset spring 403, the left sides of the reset spring 403 are fixedly connected with the left sides of the inner walls of the cavity 3, and the right sides of the two movable blocks 401 are connected with the inside of the two plug blocks 5 in a plug manner.

The scheme is adopted: by arranging the movable assembly 4, the two movable blocks 401 and the pull block 402 can move leftwards or rightwards in the cavity 3, and the two movable blocks 401 and the pull block 402 can be extruded by using the reset spring 403, so that a fixing effect is realized.

Referring to fig. 4, the front clamping assembly 7 includes a bump 701, the top of the front plug block 5 is fixedly connected with the bottom of the bump 701, a movable groove 702 is formed in the bump 701, a clamping block 703 is movably connected in the movable groove 702 and is matched with the movable block 401, and a handle 704 is fixedly connected to the top of the clamping block 703.

The scheme is adopted: through setting up chucking subassembly 7, chucking piece 703 can be through the inside of movable groove 702 removal to movable block 401 for make plug-in block 5 drive grip block 6 and movable block 401.

Referring to fig. 4, a limiting plate 8 is slidably connected to the inside of the clamping block 703, the left side and the right side of the limiting plate 8 are fixedly connected to the left side and the right side of the inner wall of the movable groove 702 respectively, an elastic spring 9 is fixedly connected to the bottom of the limiting plate 8, and one side of the elastic spring 9, which is close to the clamping block 703, is fixedly connected to the clamping block 703.

The scheme is adopted: through setting up limiting plate 8 and elasticity spring 9, the cooperation of limiting plate 8 and elasticity spring 9 is used, makes chucking piece 703 drive handle 704 and rebound to the normal position after removing automatically.

Referring to fig. 2, the bottom of the clamping block 703 sequentially penetrates the protruding block 701, the inserting block 5 and the movable block 401 through the movable groove 702 and extends to the inside of the movable block 401.

The scheme is adopted: through setting up chucking piece 703, chucking piece 703 is fixed through moving to the inside of movable block 401, realizes the grip block 6 after the change.

Referring to fig. 2, the bottom of the clamping block 703 is in close contact with the inside of the movable block 401, so that after the clamping block 703 is in plug connection with the movable block 401, the two plug blocks 5 drive the clamping blocks 6 to be more firmly fixed with the two movable blocks 401.

The scheme is adopted: through setting up chucking piece 703, the bottom of chucking piece 703 and the inside in close contact of movable block 401 can avoid grip block 6 to appear rocking when fixed to the wafer.

Referring to fig. 1, the clamping blocks 6 are replaceable, and the matched clamping blocks 6 are replaced according to wafers of different sizes.

The scheme is adopted: through setting up grip block 6, the wafer size that the user can change the detection changes grip block 6 of assorted size to be convenient for detect.

The working principle of the utility model is as follows:

when the clamping block 6 is required to be separated from contact with a wafer, the pulling block 402 is pulled by manpower to move leftwards and drive the two movable blocks 401 to move leftwards, the two movable blocks 401 can enable the two plug blocks 5 to move leftwards and enable the clamping block 6 to move leftwards, so that the clamping block 6 is separated from contact with the wafer, the reset spring 403 can generate deformation force in the process of moving leftwards, after the pulling block 402 is loosened, the reset spring 403 can give the pulling block 402 the same force, the pulling block 402 drives the two movable blocks 401 and the two plug blocks 5 and enables the clamping block 6 to rebound to the original position, the wafer is fixed, the clamping block 703 is moved upwards and is moved out of the movable block 401 by pulling the handle 704, the two plug blocks 5 drive the clamping block 6 to move rightwards and separate from contact with the two movable blocks 401, the matched clamping block 6 is replaced, after the handle 704 is loosened, the elastic spring 9 can give the clamping block 703 the same force, and the clamping block 703 is enabled to rebound to the original position after the handle 704 is loosened, and the clamping block 703 is rebound to the inside of the movable block 401 is replaced, and the clamping block 703 is fixed to the original position.

To sum up: this semiconductor wafer detection device, through setting up detector 1, base 101, place the platform 102, detect subassembly 103, fixed block 2, cavity 3, movable subassembly 4, movable block 401, pull piece 402, reset spring 403, plug-in piece 5, grip block 6, chucking subassembly 7, limiting plate 8, lug 701, movable groove 702, chucking piece 703, handle 704, limiting plate 8 and elastic spring 9's cooperation is used, the problem that current automatic film thickness tester of wafer does not have to carry out the fixed subassembly of centre gripping to the wafer, the automatic film thickness tester of wafer receives the collision and can make the wafer rock, thereby influence the detection effect is solved.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor wafer detection device, includes detector (1), detector (1) comprises base (101), place platform (102) and detection component (103), the top of base (101) with place the bottom fixed connection of platform (102), detection component (103) are located the top of placing platform (102) and with base (101) sliding connection, its characterized in that: the wafer clamping device is characterized in that a fixing block (2) is fixedly connected to the left side and the right side of the top of the base (101), a cavity (3) is formed in the fixing block (2), a movable assembly (4) is arranged in the cavity (3), two plug blocks (5) are matched with the right side of the movable assembly (4), clamping blocks (6) are fixedly connected to the opposite ends of the two plug blocks (5) and used for fixing a wafer, and clamping assemblies (7) are arranged at the tops of the two plug blocks (5).

2. A semiconductor wafer inspection apparatus as claimed in claim 1, wherein: the movable assembly (4) comprises two movable blocks (401), the surfaces of the two movable blocks (401) are movably connected with the inside of the cavity (3), the left sides of the two movable blocks (401) are fixedly connected with pull blocks (402), the left sides of the pull blocks (402) are fixedly connected with reset springs (403), the left sides of the reset springs (403) are fixedly connected with the left sides of the inner walls of the cavity (3), and the right sides of the two movable blocks (401) are connected with the inside of the two plug blocks (5) in a plug-in mode.

3. A semiconductor wafer inspection apparatus as claimed in claim 2, wherein: the front side chucking subassembly (7) include lug (701), the front side the top of grafting piece (5) and the bottom fixed connection of lug (701), movable groove (702) have been seted up to the inside of lug (701), the inside swing joint in movable groove (702) has chucking piece (703) and uses with movable piece (401) cooperation, the top fixedly connected with handle (704) of chucking piece (703).

4. A semiconductor wafer inspection apparatus as claimed in claim 3, wherein: the inside sliding connection of chucking piece (703) has limiting plate (8), the left side and the right side of limiting plate (8) respectively with movable groove (702) inner wall left side and right side fixed connection, the bottom fixedly connected with elasticity spring (9) of limiting plate (8), one side that elasticity spring (9) is close to chucking piece (703) and chucking piece (703) fixed connection.

5. A semiconductor wafer inspection apparatus as claimed in claim 3, wherein: the bottom of the clamping block (703) sequentially penetrates through the protruding block (701), the inserting block (5) and the movable block (401) through the movable groove (702) and extends to the inside of the movable block (401).

6. A semiconductor wafer inspection apparatus as claimed in claim 3, wherein: the bottom of chucking piece (703) and the inside in close contact of movable block (401) for chucking piece (703) are pegged graft and are connected back with movable block (401), and two grafting pieces (5) drive grip block (6) and the fixed effect of two movable blocks (401) are more firm.

7. A semiconductor wafer inspection apparatus as claimed in claim 1, wherein: the clamping blocks (6) are replaceable, and the matched clamping blocks (6) are replaced according to wafers with different sizes.