CN219800917U - Film substrate with conductive function, conductive polymer film and battery - Google Patents
Film substrate with conductive function, conductive polymer film and battery Download PDFInfo
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- CN219800917U CN219800917U CN202223336717.2U CN202223336717U CN219800917U CN 219800917 U CN219800917 U CN 219800917U CN 202223336717 U CN202223336717 U CN 202223336717U CN 219800917 U CN219800917 U CN 219800917U
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- conductive
- film
- film substrate
- insulating layer
- base material
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- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 229920001940 conductive polymer Polymers 0.000 title claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims abstract description 9
- 239000010408 film Substances 0.000 claims description 125
- 239000010410 layer Substances 0.000 claims description 66
- 239000002923 metal particle Substances 0.000 claims description 36
- 239000004020 conductor Substances 0.000 claims description 11
- 239000010409 thin film Substances 0.000 claims description 9
- 239000002344 surface layer Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims description 5
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229920002799 BoPET Polymers 0.000 claims description 4
- 238000001755 magnetron sputter deposition Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract description 5
- 229920000642 polymer Polymers 0.000 abstract description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000007738 vacuum evaporation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 239000004800 polyvinyl chloride Substances 0.000 description 4
- 229920000915 polyvinyl chloride Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000012994 photoredox catalyst Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model provides a film base material with a conductive function, a conductive polymer film and a battery, wherein the film base material comprises the following components: an insulating layer, and conductive layers disposed on both surfaces of the insulating layer. The conductive polymer film comprises a film substrate and metal layers arranged on two sides of the film substrate. In the embodiment of the utility model, the film substrate has a conductive function, so that the metal layers can be directly arranged on the two sides of the film substrate in a hydropower plating mode when the polymer conductive film is produced, magnetron sputtering coating is not needed, the film substrate is prevented from being burned at high temperature, and the production quality of products is improved.
Description
Technical Field
The utility model relates to the technical field of batteries, in particular to a film base material with a conductive function, a conductive polymer film and a battery.
Background
The conductive polymer film is a film with certain conductive performance, and the film has certain characteristics and is greatly applied to batteries. But currently such membranes are costly.
The current conductive polymer film is produced by adopting magnetron sputtering or vacuum evaporation, wherein the purpose of the magnetron sputtering is to attach a conductive layer on the surface of a film substrate, and the conductive layer is tightly combined with the film substrate and is in an inlaid state with a film base layer. Although magnetron sputtering can effectively combine the conductive material with the film substrate, the vacuum evaporation or magnetron sputtering coating can easily cause the technical problem of film substrate hole burning, resulting in reduced production quality of the product.
Disclosure of Invention
Accordingly, an object of the embodiments of the present utility model is to provide a thin film substrate, a conductive polymer film and a battery with a conductive function, so as to solve the technical problem in the prior art that the thin film substrate is easy to burn during the vacuum evaporation or magnetron sputtering coating process.
To achieve the above object, in a first aspect, an embodiment of the present utility model provides a film substrate having a conductive function, the film substrate including: an insulating layer, and conductive layers disposed on upper and lower surfaces of the insulating layer.
In some possible embodiments, the conductive material is conductive metal particles and the conductive layer is a metal particle layer.
In some possible embodiments, the conductive metal particles are pressed into the upper and lower surfaces of the insulating layer in the height direction.
In some possible embodiments, the conductive metal particles have a diameter of 20nm to 1000nm.
In some possible embodiments, the conductive metal particles are embedded on the upper and lower surfaces of the insulating layer along the height direction; the embedding means that a part of the conductive metal particles are arranged inside the surface layer of the insulating layer, and another part of the conductive metal particles are arranged outside the surface layer of the insulating layer.
In some possible embodiments, the conductive metal particles have a diameter of 200nm to 1000nm.
In some possible embodiments, the material of the film substrate is PP film, PE film, PC film, PET film, PI film, PVC film or BOPP film.
In a second aspect, an embodiment of the present utility model provides a conductive polymer film, including: the thin film substrate with the conductive function and the metal layers arranged on two sides of the thin film substrate.
In some possible embodiments, the metal layer is disposed on both surfaces of the conductive film by means of water plating.
In a third aspect, an embodiment of the present utility model provides a battery, where a current collector used in the battery is a conductive polymer film as described above.
The beneficial technical effects of the technical scheme are as follows:
the embodiment of the utility model provides a film substrate with a conductive function and a conductive polymer film, wherein the film substrate comprises: an insulating layer, and conductive layers disposed on both surfaces of the insulating layer. The conductive polymer film comprises a film substrate and metal layers arranged on two sides of the film substrate. In the embodiment of the utility model, the film substrate has a conductive function, so that the metal layers can be directly arranged on the two sides of the film substrate in a hydropower plating mode when the polymer conductive film is produced, magnetron sputtering coating is not needed, the film substrate is prevented from being burned at high temperature, and the production quality of products is improved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural diagram of a first conductive thin film substrate according to an embodiment of the present utility model;
FIG. 2 is a schematic structural diagram of a second conductive thin film substrate according to an embodiment of the present utility model;
FIG. 3 is a schematic structural diagram of a third conductive thin film substrate according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a conductive polymer film according to an embodiment of the present utility model.
Reference numerals illustrate:
1. a film substrate; 11. an insulating layer; 12. a conductive layer;
2. a conductive polymer film; 21. a metal layer.
Detailed Description
Features and exemplary embodiments of various aspects of the utility model are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the utility model. It will be apparent, however, to one skilled in the art that the present utility model may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the utility model by showing examples of the utility model. In the drawings and the following description, at least some well-known structures and techniques have not been shown in detail in order not to unnecessarily obscure the present utility model; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Fig. 1 is a schematic structural diagram of a first film substrate with conductive function according to an embodiment of the present utility model, and as shown in fig. 1, the film substrate 1 includes: an insulating layer 11, and conductive layers 12 provided on both upper and lower surfaces of the insulating layer 11.
In the embodiment of the utility model, the insulating layer 11 is arranged in the middle of the film substrate 1, the upper surface and the lower surface are the conductive layers 12, the middle insulating layer 11 can enable the film substrate 1 to have certain tensile strength, the conductive layers 12 on the upper surface and the lower surface enable the film substrate 1 to have a conductive function, and when the conductive polymer film is subsequently produced, water electroplating can be directly carried out without a vacuum coating process, so that film substrate hole burning caused by high temperature can be avoided, and the production quality of products is improved.
In addition, the magnetron sputtering coating adopted in the prior art is expensive due to the fact that one magnetron equipment is millions low, tens of millions high in cost, and key parts are imported, so that maintenance cost is high, the magnetron sputtering coating or vacuum evaporation is required to run in a vacuum environment, power consumption is high, production cost of products is directly improved, accordingly, the existing conductive polymer film is high in production cost and high in price, and the film substrate with the conductive function provided by the embodiment can greatly save production cost of subsequently producing the conductive polymer film.
In some embodiments, the conductive material is coated on the upper and lower surfaces of the film substrate 1, and the conductive material is pressed into the film substrate 1 by a rolling mechanism, so that the conductive layers 12 are formed on the upper and lower surfaces of the film substrate 1.
Specifically, the ultra-fine conductive material is uniformly coated on both surfaces of the film substrate 1, and is rolled by a rolling mechanism, which may be a set of high-precision press rollers, to press the ultra-fine conductive material into both surfaces of the film substrate to form the conductive layers 12. The film substrate 1 with the conductive function prepared by the method has stronger conductive capability on the surface and lower manufacturing cost.
In some embodiments, the conductive material is a conductive metal particle and the conductive layer 12 is a metal particle layer. Specifically, in order to make the conductive layers 12 on both sides of the film substrate 1 more compact, the conductive material used in the present embodiment is metal particles; in addition, the conductive material is used as conductive metal particles, and the conductive material can be easily pressed into both sides of the film base material 1.
Fig. 2 is a schematic structural diagram of a second film substrate with conductive function according to an embodiment of the present utility model, as shown in fig. 2, in some embodiments, conductive metal particles are pressed into the upper and lower surfaces of the insulating layer 11 along the height direction. Alternatively, the conductive metal particles have a diameter of 20nm to 1000nm. Specifically, in order to make the middle of the film base material 1 have an insulating layer of a certain thickness, the diameter of the metal particles pressed into both sides of the film base material 1 in the present embodiment cannot be too large, generally between 20nm and 1000nm, and of course, the larger the diameter of the metal particles, the stronger the conductivity. In addition, since the insulating layer 11 is still present in the middle of the film base material 1, the original strength thereof is shown to be little affected.
Fig. 3 is a schematic structural view of a third film substrate with conductive function according to an embodiment of the present utility model, as shown in fig. 3, in some embodiments, conductive metal particles are inlaid on upper and lower surfaces of the insulating layer 11 along a height direction, wherein the inlaid refers to that a part of the conductive metal particles are disposed inside a surface layer of the insulating layer 11, and another part of the conductive metal particles are disposed outside the surface layer of the insulating layer 11, that is, the conductive metal particles are not completely pressed into the inside of the insulating layer 11, and a part is exposed outside the insulating layer 11. Since the conductive metal particles in this embodiment are embedded on the upper and lower surfaces of the insulating layer 11 along the height direction, the thickness of the insulating layer 11 may be slightly thinner, and the diameter of the conductive metal particles may be slightly larger, so that the tensile strength of the insulating layer 11 may be ensured, and the conductivity of the conductive layer 12 may be improved, and optionally, the diameter of the conductive metal particles may be 200nm to 1000nm.
Specifically, the method for inlaying may be: the film base material 1 is placed in a vacuum chamber, and conductive metal particles are sprayed by a high-pressure spraying mechanism to be inlaid on the two surfaces of the film base material 1 to form conductive layers 12.
Specifically, the film substrate 1 is placed in a closed space, then the space is vacuumized to remove oxygen in the closed space, inert gases such as argon are injected into the space, meanwhile, an air pump is arranged in the closed space, the air pump is injected into a sealed tank filled with conductive particles with the argon, copper powder is arranged in the sealed tank, a spray gun mechanism is arranged outside the sealed tank, the argon is released at a gun nozzle after entering a spray gun with the copper powder, the outer side of the nozzle is opposite to two surfaces of the film substrate 1, and the argon and copper powder particles released at the gun nozzle bombard the surfaces of the film substrate 1 at high speed and are inlaid into the two surfaces of the film substrate 1 to form the conductive layer 12.
In some embodiments, both surfaces of the metal particle embedded film substrate 1 are rolled by a rolling mechanism. According to the embodiment of the utility model, the conductive layers 12 on the two surfaces of the film substrate 1 are rolled, so that the conductive layers 12 are flatter.
In some embodiments, the conductive metal particles have a diameter of 200nm to 1000nm. Since the conductive metal particles in the present embodiment are embedded on both surfaces of the film base material 1, the diameter of the conductive metal particles in the present embodiment may be slightly larger, for example, the diameter of the conductive metal particles is 200nm to 1000nm.
In some embodiments, the material of the film substrate 1 is any one of PP film (polypropylene film), PE film (polyethylene film), PC film (polycarbonate film), PET film (polyester substrate film), PI film (polyimide film), PVC film (polyvinyl chloride film) or BOPP film (biaxially oriented polypropylene film).
In this embodiment, the film substrate 1 is made of a non-conductive material, such as PP film, PE film, PC film, PET film, PI film, PVC film, BOPP film, etc., and the film substrate 1 in this embodiment has no requirement, and mainly plays an insulating role.
Fig. 4 is a schematic structural diagram of a conductive polymer film according to an embodiment of the present utility model, and as shown in fig. 4, the embodiment of the present utility model further provides a conductive polymer film 2, where the conductive polymer film 2 includes: a film base material 1 having any one of the above-mentioned conductive functions, and metal layers 21 provided on both sides of the film base material 1. In this embodiment, the metal layers 21 are provided on both surfaces of the conductive film by means of water plating.
Because the vacuum evaporation plating mode or the magnetron sputtering plating mode in the prior art has higher cost and lower product yield, for example, in the vacuum evaporation plating process, hole burning is easy to occur due to higher temperature, the magnetron process control difficulty of the magnetron sputtering plating is high, and the like.
The conductive layers 12 are arranged on the two sides of the film substrate 1, so that the film substrate 1 has a conductive function, and therefore, when the conductive polymer film 2 is produced, the film substrate 1 can be directly subjected to water electroplating, and the metal layers 21 are plated on the two sides of the conductive layers 12 of the film substrate 1, so that the production quality of the conductive polymer film 2 can be improved, and the production cost can be greatly saved.
In addition, the embodiment of the utility model also provides a battery, and the current collector adopted by the battery is the conductive polymer film 2, and the conductive polymer film 2 has a relatively thin thickness, a relatively light weight and no hole burning, so that the energy density is relatively high, and the conductive performance of the battery can be improved. The battery may be a lithium battery.
In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by "upper, lower, inner and outer", etc. in terms are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, rather than indicating or suggesting that the device or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first, second, or third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The terms "mounted, connected, and coupled" in embodiments of the utility model are to be construed broadly, unless otherwise specifically indicated and defined, for example: can be fixed connection, detachable connection or integral connection; it may also be a mechanical connection, an electrical connection, or a direct connection, or may be indirectly connected through an intermediate medium, or may be a communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
While the utility model has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present utility model is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (10)
1. A film base material (1) having a conductive function, characterized in that the film base material (1) comprises: an insulating layer (11), and conductive layers (12) provided on the upper and lower surfaces of the insulating layer (11).
2. A film substrate (1) with conductive function according to claim 1, characterized in that the conductive layer (12) comprises a conductive material, which is a conductive metal particle.
3. A film base material (1) with a conductive function according to claim 2, wherein the conductive metal particles are pressed into the inside of the upper and lower surfaces of the insulating layer (11) in the height direction.
4. A thin film substrate (1) with a conductive function according to claim 3, characterized in that the diameter of the conductive metal particles is 20nm to 1000nm.
5. A film base material (1) with a conductive function according to claim 2, characterized in that the conductive metal particles are inlaid on both upper and lower surfaces of the insulating layer (11) in the height direction, the inlaid meaning that a part of the conductive metal particles is disposed inside the surface layer of the insulating layer (11) and another part of the conductive metal particles is disposed outside the surface layer of the insulating layer (11).
6. A thin film substrate (1) with conductive function according to claim 5, characterized in that the diameter of the conductive metal particles is 200nm to 1000nm.
7. The film base material (1) with the conductive function according to claim 1, wherein the material of the film base material (1) is a PP film, a PE film, a PC film, a PET film, a PI film, a PVC film or a BOPP film.
8. A conductive polymer film (2), characterized in that the conductive polymer film (2) comprises: the film base material (1) having a conductive function as claimed in any one of claims 1 to 7, and metal layers (21) provided on both sides of the film base material (1).
9. The conductive polymer film (2) according to claim 8, wherein the metal layer (21) is provided on the surface of the conductive layer (12) on both sides of the film base material (1) by means of water plating.
10. A battery, characterized in that a current collector used in the battery is a conductive polymer film (2) according to claim 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223336717.2U CN219800917U (en) | 2022-12-08 | 2022-12-08 | Film substrate with conductive function, conductive polymer film and battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223336717.2U CN219800917U (en) | 2022-12-08 | 2022-12-08 | Film substrate with conductive function, conductive polymer film and battery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219800917U true CN219800917U (en) | 2023-10-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223336717.2U Active CN219800917U (en) | 2022-12-08 | 2022-12-08 | Film substrate with conductive function, conductive polymer film and battery |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219800917U (en) |
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2022
- 2022-12-08 CN CN202223336717.2U patent/CN219800917U/en active Active
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