CN219800795U - Device suitable for silicon-based micro-display film pasting - Google Patents
Device suitable for silicon-based micro-display film pasting Download PDFInfo
- Publication number
- CN219800795U CN219800795U CN202321222301.XU CN202321222301U CN219800795U CN 219800795 U CN219800795 U CN 219800795U CN 202321222301 U CN202321222301 U CN 202321222301U CN 219800795 U CN219800795 U CN 219800795U
- Authority
- CN
- China
- Prior art keywords
- positioning block
- silicon
- disc body
- positioning
- workbench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 18
- 239000010703 silicon Substances 0.000 title claims abstract description 18
- 235000012431 wafers Nutrition 0.000 claims description 18
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a device suitable for a silicon-based micro-display film, which comprises a workbench disc body and a positioning block which is arranged on the workbench disc body and used for positioning a wafer, wherein the positioning block is provided with various types with different thickness, the positioning block is replaceable, and the positioning block is detachably connected with the workbench disc body. The utility model is suitable for the device of the silicon-based micro-display film, the positioning block is arranged to be replaceable, each time the product is changed, only the positioning block is needed to be replaced, the whole workbench plate is not needed to be replaced, a plurality of film pasting devices are not needed to be used for corresponding to products with different thicknesses to produce, the universality is improved, the operation time between the model switching and the manpower and material resources needed by the change are effectively reduced, the input cost of the device is saved, the production efficiency is improved, and the utility model has the characteristics of simple process, obvious performance improvement and the like.
Description
Technical Field
The utility model belongs to the technical field of wafer film sticking, and particularly relates to a device suitable for silicon-based micro-display film sticking.
Background
Wafer dicing is an indispensable process in the semiconductor manufacturing process, and the wafer circuit surface, i.e., the side that performs the chip function, is generally referred to as the front side, and the other side is the back side. In the prior art of silicon-based microdisplay, a glass cover plate is generally attached to the front surface of a wafer to protect the silicon-based microdisplay device from being damaged, prevent water and oxygen from invading, and the like, and the thickness requirements of the glass cover plate are generally different from each other due to different optical display applications of end customers, and the thickness of the existing mainstream glass cover plate is generally 0.3mm, 0.5mm, 0.7mm, 1.0mm, 1.1mm, and the like.
The film pasting platforms which are required to be used for different glass cover plate thicknesses are not uniform in height, and in the prior art, when the types of different glass cover plate thicknesses are switched in the daily production process, the special film pasting platforms are required to be replaced frequently or a plurality of special film pasting machines with different glass cover plate thicknesses are used for corresponding production, so that the working time generated by the frequent replacement of the film pasting platforms by personnel is long, and the equipment cost required to be input is high.
As disclosed in patent document publication No. CN115527895a, a wafer film laminating apparatus includes: the cutting device comprises a first plate, a feeding mechanism and a cutting tool, wherein the first plate is provided with a groove, the groove is used for placing a wafer, the feeding mechanism can attach a dry film to the wafer, and the cutting tool can cut the dry film along the edge of the wafer. The wafer film laminating equipment cannot solve the technical problems.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides a device suitable for a silicon-based micro-display film, and aims to improve the universality.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the device suitable for the silicon-based micro-display film comprises a workbench disc body and a positioning block which is arranged on the workbench disc body and used for positioning a wafer, wherein the positioning block is provided with various types with different thickness, is replaceable and is detachably connected with the workbench disc body.
The positioning block is adsorbed on the workbench disc body.
The positioning block is arranged on the workbench disc body in a magnetic attraction mode.
The positioning block is arranged on the workbench disc body in a vacuum adsorption mode.
The workbench disc body is provided with a positioning groove, and the positioning block is embedded into the positioning groove.
The positioning block is of a circular ring structure.
The utility model is suitable for the device of the silicon-based micro-display film, the positioning block is arranged to be replaceable, each time the product is changed, only the positioning block is needed to be replaced, the whole workbench plate is not needed to be replaced, a plurality of film pasting devices are not needed to be used for corresponding to products with different thicknesses to produce, the universality is improved, the operation time between the model switching and the manpower and material resources needed by the change are effectively reduced, the input cost of the device is saved, the production efficiency is improved, and the utility model has the characteristics of simple process, obvious performance improvement and the like.
Drawings
The present specification includes the following drawings, the contents of which are respectively:
FIG. 1 is a schematic diagram of an apparatus for silicon-based microdisplay film attachment according to the present utility model;
marked in the figure as: 1. a positioning block; 2. a table tray body; 3. and a positioning groove.
Detailed Description
The following detailed description of the embodiments of the utility model, given by way of example only, is presented in the accompanying drawings to aid in a more complete, accurate and thorough understanding of the concepts and aspects of the utility model, and to aid in its practice, by those skilled in the art.
As shown in fig. 1, the utility model provides a device suitable for silicon-based micro-display film sticking, which comprises a workbench disc body 2 and a positioning block 1 arranged on the workbench disc body 2 and used for positioning a wafer and a glass substrate, wherein the wafer and the glass substrate are stacked in a central hole of the positioning block 1, and the thickness of the positioning block 1 is smaller than the sum of the thicknesses of the wafer and the glass substrate. The positioning block 1 is provided with various types with different thickness, the positioning block 1 is replaceable, and the positioning block 1 is detachably connected with the workbench disc body 2.
Specifically, as shown in fig. 1, the positioning block 1 is in a circular ring structure, the thickness of the positioning block 1 is the axial dimension of the positioning block 1, the positioning groove 3 is formed in the workbench disc body 2, the positioning block 1 is embedded into the positioning groove 3, and the positioning groove 3 is a circular ring groove formed in the top surface of the workbench disc body 2. When in use, the positioning block 1 with corresponding thickness is selected according to wafers (different thicknesses of the glass cover plates) with different types, and the positioning block 1 is adsorbed in the positioning groove 3 arranged at the edge of the workbench disc body 2.
Preferably, the positioning block 1 is adsorbed on the table plate body 2. The positioning block 1 can be installed on the workbench tray body 2 in a magnetic attraction mode, or can be installed on the workbench tray body 2 in a vacuum attraction mode, and the dismounting is convenient. The bottom of the positioning groove 3 is provided with a magnetic attraction function or a vacuum attraction function, so that the positioning block 1 is firmly attracted to the workbench plate to prevent the positioning block 1 from shifting and falling;
only the positioning block 1 needs to be replaced every time when the product is replaced, the whole workbench plate does not need to be replaced, and a plurality of film pasting devices do not need to be used for producing products with different thicknesses correspondingly; the thickness of the positioning block 1 can be selected according to the actual thickness of the product, for example, a glass substrate with the thickness of 0.3mm and a wafer with the thickness of 0.725mm can be selected as the positioning block 1 with the thickness of 1.0mm, and the actual height of the product is ensured to be higher than that of the edge positioning block 1; thus, the roller can effectively and smoothly press the film material onto the product, and the generation of film sticking bubbles is reduced.
Preferably, the top surface of the workbench tray body 2 is provided with a vacuum hole, the wafer is placed on the top surface of the workbench tray body 2 and is positioned above the vacuum hole, the workbench tray body 2 is connected with an external vacuum generator for generating negative pressure, negative pressure is formed in the vacuum hole, and the product to be pasted can be adsorbed to prevent deflection displacement of the product.
The utility model is described above by way of example with reference to the accompanying drawings. It will be clear that the utility model is not limited to the embodiments described above. As long as various insubstantial improvements are made using the method concepts and technical solutions of the present utility model; or the utility model is not improved, and the conception and the technical scheme are directly applied to other occasions and are all within the protection scope of the utility model.
Claims (6)
1. The device suitable for the silicon-based micro-display film is characterized in that: the wafer positioning device comprises a workbench disc body and positioning blocks which are arranged on the workbench disc body and used for positioning wafers, wherein the positioning blocks are of various types with different thickness and sizes, the positioning blocks are replaceable, and the positioning blocks are detachably connected with the workbench disc body.
2. The device for silicon-based microdisplay film according to claim 1, wherein: the positioning block is adsorbed on the workbench disc body.
3. The device for silicon-based microdisplay film according to claim 2, wherein: the positioning block is arranged on the workbench disc body in a magnetic attraction mode.
4. The device for silicon-based microdisplay film according to claim 2, wherein: the positioning block is arranged on the workbench disc body in a vacuum adsorption mode.
5. A device for a silicon-based microdisplay film according to any one of claims 1 to 3, characterized in that: the workbench disc body is provided with a positioning groove, and the positioning block is embedded into the positioning groove.
6. The device for silicon-based microdisplay film as set forth in claim 5, wherein: the positioning block is of a circular ring structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321222301.XU CN219800795U (en) | 2023-05-19 | 2023-05-19 | Device suitable for silicon-based micro-display film pasting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321222301.XU CN219800795U (en) | 2023-05-19 | 2023-05-19 | Device suitable for silicon-based micro-display film pasting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219800795U true CN219800795U (en) | 2023-10-03 |
Family
ID=88187031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321222301.XU Active CN219800795U (en) | 2023-05-19 | 2023-05-19 | Device suitable for silicon-based micro-display film pasting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219800795U (en) |
-
2023
- 2023-05-19 CN CN202321222301.XU patent/CN219800795U/en active Active
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