CN219778880U - Chip heat dissipation mechanism - Google Patents
Chip heat dissipation mechanism Download PDFInfo
- Publication number
- CN219778880U CN219778880U CN202320592593.XU CN202320592593U CN219778880U CN 219778880 U CN219778880 U CN 219778880U CN 202320592593 U CN202320592593 U CN 202320592593U CN 219778880 U CN219778880 U CN 219778880U
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- Prior art keywords
- chip
- heat dissipation
- air
- cooling
- pipe
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 56
- 239000007788 liquid Substances 0.000 claims abstract description 40
- 239000011093 chipboard Substances 0.000 claims abstract description 30
- 230000001681 protective effect Effects 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 abstract description 16
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 description 4
- 239000000110 cooling liquid Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a chip heat dissipation mechanism, which belongs to the technical field of semiconductor heat dissipation and comprises a chip board, wherein the side surface of the chip board is provided with a contact point, an active heat dissipation component is arranged on the chip board, the side surface of the active heat dissipation component is provided with a passive heat dissipation component, the passive heat dissipation component is arranged under the chip board, and the side surface of the passive heat dissipation component is provided with a liquid storage tank. This chip cooling mechanism, through setting up vent and cooling tube, the fan is with the air in the protection casing to be inhaled away, when the air was inhaled away in the protection casing, inside air reduces and forms the negative pressure, outside air passes through filter plate and air intake entering air-supply line, and through cooling tube lowering temperature, take away the temperature of chip board lower part and get into the protection casing through the vent when cold air passes through the ventilation pipe, again by the fan exhaust, realized simultaneously to chip upper portion and lower part heat dissipation cooling simultaneously, the radiating efficiency of chip has been improved, security and the stability when the chip operation are protected.
Description
Technical Field
The utility model belongs to the technical field of semiconductor heat dissipation, and particularly relates to a chip heat dissipation mechanism.
Background
The chip is also called an integrated circuit, the chip is generally classified into a digital chip, an analog chip and a digital-analog hybrid chip, the chip is wider according to the classification of the application, all high-tech electronic devices are not separated from the chip, the modern life is not separated from the chip, the chip is used for completing operation and processing tasks, if a Central Processing Unit (CPU) is liked to be the heart of the whole computer system, a chipset on a main board is the trunk of the whole body, the chipset almost determines the function of the main board for the main board, the performance of the whole computer system is affected, the chipset is the soul of the main board, the chip generates heat when the chip works, the operation of the chip is affected by the excessively high heat, the chip is seriously burnt, most of the existing chip is packaged and fan through the self-cooling mode, the heat at the upper part of the chip is only dissipated, the heat at the lower part of the chip can only be dissipated by the self-cooling efficiency, and the heat dissipation mechanism on the chip is lower, and the heat dissipation mechanism on the chip is needed to normally run.
Disclosure of Invention
In order to overcome the defects, the utility model provides a chip heat dissipation mechanism, which solves the problem that the traditional chip heat dissipation device can only dissipate heat of one side of a chip.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a chip cooling mechanism, includes the chip board, the side of chip board is equipped with the contact point, be equipped with initiative radiator unit on the chip board, initiative radiator unit's side is equipped with passive radiator unit, passive radiator unit establishes under the chip board, passive radiator unit's side is equipped with the liquid reserve tank, be equipped with the cooling chamber in the liquid reserve tank, the side of liquid reserve tank is equipped with the support frame, be equipped with the notes liquid mouth on the liquid reserve tank, the notes liquid mouth runs through the liquid reserve tank and is connected with the cooling chamber, the side of liquid reserve tank is equipped with the leakage fluid dram, the leakage fluid dram runs through the side of liquid reserve tank and is connected with the cooling chamber.
As a further aspect of the utility model: the active heat dissipation assembly comprises a protective cover, the protective cover is arranged on the chip board, a connecting groove is formed in the side face of the protective cover, and an air exhaust plate is arranged on the protective cover.
As a further aspect of the utility model: the side of the air exhaust plate is provided with a connecting plate, the side of the connecting plate is provided with a connecting ring, and the connecting ring is provided with a connecting frame.
As a further aspect of the utility model: the motor is arranged below the connecting frame, a fan is arranged at the output end of the motor, and the fan is arranged in the protective cover.
As a further aspect of the utility model: the passive heat dissipation assembly comprises a vent, the vent is arranged on the side face of the connecting groove, the vent is arranged on the side face of the vent pipe, the vent pipe is arranged under the chip board, and a shunt pipe is arranged at the other end of the vent pipe.
As a further aspect of the utility model: the other end of shunt tubes is equipped with the connecting pipe, run through the liquid reserve tank on the connecting pipe and be equipped with the cooling tube, the cooling tube is established in the cooling chamber, the cooling tube is spiral design.
As a further aspect of the utility model: the other end of the cooling pipe is provided with an air inlet pipe, one end of the air inlet pipe penetrates through the liquid storage tank and is provided with an air inlet, and the side face of the air inlet is provided with a filter plate.
Compared with the prior art, the utility model has the beneficial effects that:
1. this chip cooling mechanism, through setting up vent and cooling tube, when the motor drives the fan and rotates, the fan is with the temperature of in the protection casing to in discharging the heat of chip board to the air through the aviation baffle, when the air was taken away in the protection casing, inside air reduces and forms the negative pressure, the vent is with in the air suction protection casing, outside air gets into the air-supply line through filter plate and air intake, and through cooling tube lowering temperature, then in getting into the ventilation pipe by connecting pipe and shunt tubes, the temperature of chip board lower part is taken away and gets into the protection casing through the vent when cold air passes through the ventilation pipe, again by the fan discharge, realized simultaneously to chip upper portion and lower part heat dissipation cooling simultaneously, the radiating efficiency of chip has been improved, security and stability when the chip operation are protected.
2. This chip cooling mechanism through setting up cooling tube and cooling chamber, can store the coolant liquid in the cooling chamber, with through cooling tube and air current heat transfer, reduces air current temperature, and the cooling tube has increased the area of contact of air current in the cooling chamber, has increased heat exchange efficiency for the radiating efficiency of chip is higher, guarantees chip steady operation.
3. This chip cooling mechanism through setting up air intake and filter plate, and the filter plate will get into the air filtration in the air intake, prevents debris entering air-supply line in, influences the efficiency of air inlet, and the air intake has increased the area of air inlet for in the air-supply line of entering that external air can be more smooth and easy, improved the efficiency of air inlet.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of a liquid storage tank according to the present utility model;
FIG. 3 is a schematic cross-sectional view of an active heat dissipating device according to the present utility model;
FIG. 4 is a schematic diagram of a passive heat dissipating assembly according to the present utility model;
in the figure: 1 chip board, 2 contact points, 3 active heat dissipation components, 301 protective cover, 302 air exhaust plate, 303 connecting plate, 304 connecting ring, 305 motor, 306 connecting frame, 307 connecting groove, 308 fan, 4 liquid injection port, 5 liquid storage tank, 6 liquid discharge port, 7 support frame, 8 passive heat dissipation components, 801 ventilation port, 802 ventilation pipe, 803 filter plate, 804 air inlet, 805 shunt pipe, 806 connecting pipe, 807 cooling pipe, 808 air inlet pipe, 9 cooling cavity.
Detailed Description
The technical scheme of the patent is further described in detail below with reference to the specific embodiments.
As shown in fig. 1-4, the present utility model provides a technical solution: the chip heat dissipation mechanism comprises a chip board 1, wherein a contact point 2 is arranged on the side surface of the chip board 1, an active heat dissipation component 3 is arranged on the chip board 1, the active heat dissipation component 3 comprises a protective cover 301, the protective cover 301 is arranged on the chip board 1, a connecting groove 307 is formed in the side surface of the protective cover 301, an air exhaust plate 302 is arranged on the protective cover 301, through the arrangement of the air exhaust plate 302, air flow can pass through and be exhausted by the air exhaust plate 302, meanwhile, a fan 308 is separated from the outside, and sundries are prevented from entering the fan 308 when the air exhaust is ensured;
the side of the air exhaust plate 302 is provided with a connecting plate 303, the side of the connecting plate 303 is provided with a connecting ring 304, the connecting ring 304 is provided with a connecting frame 306, a motor 305 is arranged under the connecting frame 306, a fan 308 is arranged at the output end of the motor 305, the fan 308 is arranged in the protective cover 301, and the connecting frame 306 plays a role in supporting and limiting the motor 305 through the arrangement of the connecting frame 306, so that the motor 305 can be stably fixed at the center of the connecting ring 304, the motor 305 can not move at will when rotating at a high speed, and the stability of the motor 305 when running is improved;
the side of the active heat radiation component 3 is provided with a passive heat radiation component 8, the passive heat radiation component 8 comprises a ventilation opening 801, the ventilation opening 801 is arranged on the side of the connecting groove 307, the ventilation opening 801 is arranged on the side of the ventilation pipe 802, the ventilation pipe 802 is arranged below the chip board 1, the other end of the ventilation pipe 802 is provided with a shunt pipe 805, the other end of the shunt pipe 805 is provided with a connecting pipe 806, the connecting pipe 806 penetrates through the liquid storage tank 5 and is provided with a cooling pipe 807, the cooling pipe 807 is arranged in the cooling cavity 9, and the cooling pipe 807 is in a spiral design, so that the residence time of air flow in the cooling cavity 9 is prolonged, the contact area of the air flow and cooling liquid is enlarged, the air flow can be rapidly cooled when passing through the cooling pipe 807, and the heat radiation efficiency is improved;
an air inlet pipe 808 is arranged at the other end of the cooling pipe 807, an air inlet 804 is arranged at one end of the air inlet pipe 808 penetrating through the liquid storage tank 5, a filter plate 803 is arranged on the side surface of the air inlet 804, the filter plate 803 filters air, clean air enters the air inlet 804 through the filter plate 803, dust and impurities are blocked, and the dust and the impurities are prevented from entering the air inlet pipe 808, so that the air inlet efficiency is prevented from being influenced by blockage;
the passive cooling assembly 8 is arranged below the chip board 1, the liquid storage tank 5 is arranged on the side face of the passive cooling assembly 8, the cooling cavity 9 is arranged in the liquid storage tank 5, the support frame 7 is arranged on the side face of the liquid storage tank 5, the liquid injection port 4 penetrates through the liquid storage tank 5 to be connected with the cooling cavity 9, the liquid discharge port 6 is arranged on the side face of the liquid storage tank 5, the liquid discharge port 6 penetrates through the side face of the liquid storage tank 5 to be connected with the cooling cavity 9, cooling liquid can be stored in the cooling cavity 9 through the cooling cavity 9, the temperature of air can be reduced when passing through the cooling cavity 9, and the heat dissipation efficiency is improved.
The working principle of the utility model is as follows:
the motor 305 is started to drive the fan 308 to rotate so as to discharge air in the protective cover 301 through the air discharge plate 302, the air brings away the temperature of the upper part of the chip board 1, the upper part of the chip board 1 is subjected to heat dissipation, negative pressure is formed after the air in the protective cover 301 is discharged, the negative pressure sucks air in the ventilation opening 801, the ventilation opening 801 sucks the air through the air inlet 804, the air enters the air inlet 804 through the filter plate 803, and then the air enters the cooling pipe 807 through the air inlet pipe 808;
the air exchanges heat with the cooling liquid in the cooling cavity 9 when passing through the cooling pipe 807, so that the temperature of the air is reduced, the low-temperature air enters the ventilation pipe 802 through the connecting pipe 806 and the shunt pipe 805, the air exchanges heat with the lower part of the chip board 1 when the ventilation pipe 802, the lower part of the chip board 1 completes heat dissipation, and the air after heat exchange enters the protective cover 301 through the ventilation opening 801 and is discharged by the fan 308.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.
While the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes may be made without departing from the spirit of the present patent within the knowledge of one of ordinary skill in the art.
Claims (7)
1. The utility model provides a chip cooling mechanism, includes chip board (1), its characterized in that: the side of chip board (1) is equipped with contact point (2), be equipped with initiative radiator unit (3) on chip board (1), the side of initiative radiator unit (3) is equipped with passive radiator unit (8), passive radiator unit (8) are established under chip board (1), the side of passive radiator unit (8) is equipped with liquid reserve tank (5), be equipped with cooling chamber (9) in liquid reserve tank (5), the side of liquid reserve tank (5) is equipped with support frame (7), be equipped with annotate liquid mouth (4) on liquid reserve tank (5), annotate liquid mouth (4) and run through liquid reserve tank (5) and be connected with cooling chamber (9), the side of liquid reserve tank (5) is equipped with leakage fluid dram (6), the side that liquid reserve dram (6) run through liquid reserve tank (5) is connected with cooling chamber (9).
2. A chip heat dissipation mechanism as defined in claim 1, wherein: the active heat dissipation assembly (3) comprises a protective cover (301), the protective cover (301) is arranged on the chip board (1), a connecting groove (307) is formed in the side face of the protective cover (301), and an air exhaust plate (302) is arranged on the protective cover (301).
3. A chip heat dissipation mechanism as defined in claim 2, wherein: the side of exhaust plate (302) is equipped with connecting plate (303), the side of connecting plate (303) is equipped with go-between (304), be equipped with link (306) on go-between (304).
4. A chip heat dissipation mechanism according to claim 3, wherein: the motor (305) is arranged under the connecting frame (306), a fan (308) is arranged at the output end of the motor (305), and the fan (308) is arranged in the protective cover (301).
5. The die attach mechanism of claim 4, wherein: the passive heat dissipation assembly (8) comprises a vent (801), the vent (801) is arranged on the side face of the connecting groove (307), the vent (801) is arranged on the side face of the vent pipe (802), the vent pipe (802) is arranged under the chip board (1), and a shunt pipe (805) is arranged at the other end of the vent pipe (802).
6. The die attach mechanism of claim 5, wherein: the other end of shunt tubes (805) is equipped with connecting pipe (806), run through liquid reserve tank (5) on connecting pipe (806) and be equipped with cooling tube (807), cooling tube (807) are established in cooling chamber (9), cooling tube (807) are spiral design.
7. The die attach mechanism of claim 6, wherein: the other end of the cooling pipe (807) is provided with an air inlet pipe (808), one end of the air inlet pipe (808) penetrates through the liquid storage tank (5) and is provided with an air inlet (804), and the side surface of the air inlet (804) is provided with a filter plate (803).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320592593.XU CN219778880U (en) | 2023-03-23 | 2023-03-23 | Chip heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320592593.XU CN219778880U (en) | 2023-03-23 | 2023-03-23 | Chip heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219778880U true CN219778880U (en) | 2023-09-29 |
Family
ID=88130638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320592593.XU Active CN219778880U (en) | 2023-03-23 | 2023-03-23 | Chip heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219778880U (en) |
-
2023
- 2023-03-23 CN CN202320592593.XU patent/CN219778880U/en active Active
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