CN219759608U

CN219759608U - Packaging structure

Info

Publication number: CN219759608U
Application number: CN202320851279.9U
Authority: CN
Inventors: 蔡杰廷; 郑伟德; 邱国铭
Original assignee: Lite On Technology Corp
Current assignee: Lite On Technology Corp
Priority date: 2022-04-18
Filing date: 2023-04-17
Publication date: 2023-09-26
Anticipated expiration: 2033-04-17
Also published as: CN116598403A; CN219735040U

Abstract

The utility model discloses a packaging structure which comprises a carrier, a photoelectric module, a first packaging colloid and a second packaging colloid. The photoelectric module is arranged on the carrier. The first encapsulant is disposed on the carrier and surrounds the optoelectronic module. The top surface of the first encapsulation colloid is provided with a first preset height which is smaller than or equal to the height of the photoelectric module. The second encapsulant is disposed on the first encapsulant and covers at least a portion of a surface of the optoelectronic module. Therefore, the packaging structure can achieve the effect of improving the light source conversion efficiency.

Description

Packaging structure

The present utility model claims priority from U.S. provisional patent application Ser. No. 63/331,907, having application day 2022, month 04, 18.

Technical Field

The present utility model relates to a package structure, and more particularly, to a package structure capable of improving light source conversion efficiency.

Background

In the prior art, a High power light emitting diode (High power LED) package structure is generally stacked on a Light Emitting Diode (LED) chip by using a phosphor sheet in the configuration of an internal structure, and a reflective material is filled around the LED chip. For example, blue light emitted from the LED chip passes through the phosphor sheet to excite the phosphor to generate light of other colors (e.g., green light, red light, etc.).

However, the existing high-power LED package structure has a problem of insufficient brightness, and further, the existing high-power LED package structure has a problem of insufficient light source conversion efficiency due to a defect in the internal structure configuration, so that blue light emitted by the LED chip is easily exposed, that is, not all blue light can be smoothly converted into required color light.

Therefore, how to improve the light source conversion efficiency of the LED package structure by improving the structural design to overcome the above-mentioned drawbacks has become one of the important issues to be solved in the field.

Disclosure of Invention

The utility model aims to solve the technical problem of providing a packaging structure aiming at the defects of the prior art so as to solve the problem that the existing high-power LED packaging structure has insufficient light source conversion efficiency.

In order to solve the above technical problems, one of the technical solutions adopted in the present utility model is to provide a packaging structure, which includes a carrier, a photovoltaic module, a first encapsulant and a second encapsulant. The photoelectric module is arranged on the carrier. The first encapsulant is disposed on the carrier and surrounds the optoelectronic module. The top surface of the first encapsulation colloid is provided with a first preset height which is smaller than or equal to the height of the photoelectric module. The second encapsulant is disposed on the first encapsulant and covers at least a portion of a surface of the optoelectronic module.

Preferably, the optoelectronic module includes an optoelectronic component and an optical component, and the optical component is disposed on the optoelectronic component.

Preferably, the optoelectronic component comprises a light emitting part or a receiving part and a wire bonding part, the optical component is attached to a light emitting surface or a receiving surface of the light emitting part, and a height difference is formed between the light emitting surface or the receiving surface and the surface of the wire bonding part.

Preferably, the projected area of the optical component projected on the carrier surface is greater than or equal to the projected area of the emission surface on the carrier surface.

Preferably, the package structure further comprises at least one metal wire, the carrier comprises a first metal pad and a second metal pad, the photoelectric component is arranged on the first metal pad, one end of the at least one metal wire is connected to the wire bonding part, the other end of the at least one metal wire is connected to the second metal pad, and the highest point of the at least one metal wire is lower than the bottom of the optical component.

Preferably, the first encapsulant partially covers the side surface of the optical component.

Preferably, the optoelectronic component comprises a light emitting part or a receiving part, the light emitting part is provided with a light emitting surface, the receiving part is provided with a receiving surface, a second preset height is arranged between the light emitting surface or the receiving surface and the surface of the carrier, the first preset height is larger than or equal to the second preset height, and the first preset height is smaller than or equal to the sum of 1/2 of the height of the optical component plus the second preset height.

Preferably, the second encapsulant partially or completely covers the side surface of the optical component, and the top surface of the optical component is exposed to the second encapsulant.

Preferably, the second encapsulant partially or completely covers the side surface of the optical component and completely covers the top surface of the optical component.

Preferably, the first encapsulant completely covers the side surface of the optical component, and the second encapsulant completely covers the top surface of the optical component.

Preferably, the package structure emits a total light output in a wavelength range of visible light, and the ratio of the light output emitted by the package structure in the wavelength range of 425nm to 465nm to the total light output is equal to or less than 7%; wherein the ratio of the output quantity of light emitted by the packaging structure in the wavelength range of 500nm to 600nm to the output quantity of light emitted by the packaging structure in the wavelength range of 425nm to 465nm is equal to or more than 20.

Preferably, the optical component is a radiation conversion component or a radiation filtering component.

Preferably, the radiation conversion element is a fluorescent glass plate or a fluorescent ceramic plate, and the radiation filtering element is a dye or an optical coating.

Preferably, the radiation conversion package has a thickness of between 100 μm and 300 μm.

Preferably, the first encapsulant is a reflective material or a light absorbing material.

Preferably, the packaging structure further comprises a wall body, the wall body is arranged on the carrier, the wall body surrounds the photoelectric module, the first packaging colloid and the second packaging colloid, and the distance between the top surface of the second packaging colloid and the carrier is equal to or lower than the height of the wall body.

The packaging structure provided by the utility model has the beneficial effects that the light source conversion efficiency can be improved by the technical scheme that the first preset height is arranged between the top of the first packaging colloid and the surface of the carrier, and the first preset height is smaller than or equal to the height of the photoelectric module, and the second packaging colloid is arranged on the first packaging colloid and covers at least part of the surface of the photoelectric module, so that the brightness is improved.

For a further understanding of the nature and the technical aspects of the present utility model, reference should be made to the following detailed description of the utility model and the accompanying drawings, which are provided for purposes of reference only and are not intended to limit the utility model.

Drawings

Fig. 1 is a schematic cross-sectional view of a first embodiment of a package structure according to a first embodiment of the present utility model.

Fig. 2 is a schematic top view of an optoelectronic module with a package structure according to the present utility model.

Fig. 3 is a schematic cross-sectional view of a second embodiment of a package structure according to a first embodiment of the present utility model.

Fig. 4 is a schematic cross-sectional view of a package structure according to a second embodiment of the present utility model.

Fig. 5 is a schematic cross-sectional view of a package structure according to a third embodiment of the present utility model.

Fig. 6 is a schematic cross-sectional view of a package structure according to a fourth embodiment of the present utility model.

Fig. 7 is a schematic view of the luminous intensity of the package structure of the present utility model.

Detailed Description

The following specific examples are given to illustrate the embodiments of the present utility model disclosed herein with respect to "package structure", and those skilled in the art will be able to understand the advantages and effects of the present utility model from the disclosure herein. The utility model is capable of other and different embodiments and its several details are capable of modifications and various other uses and applications, all of which are obvious from the description, without departing from the spirit of the utility model. The drawings of the present utility model are merely schematic illustrations, and are not intended to be drawn to actual dimensions. The following embodiments will further illustrate the related art content of the present utility model in detail, but the disclosure is not intended to limit the scope of the present utility model.

It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used primarily to distinguish one element from another element. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.

First embodiment

Referring to fig. 1, fig. 1 is a schematic cross-sectional view of a first embodiment of a package structure according to a first embodiment of the present utility model. The first embodiment of the present utility model provides a package structure M1, which includes a carrier 1, a photovoltaic module, a first encapsulant 4 and a second encapsulant 5. The carrier 1 may be, for example, but not limited to, a ceramic substrate. The carrier 1 comprises a first metal pad 11 and a second metal pad 12, the first metal pad 11 and the second metal pad 12 having different polarities. The optoelectronic module is disposed on the carrier 1, and the optoelectronic module includes an optoelectronic component 2 (a component in a dashed line frame as shown in fig. 1) and an optical component 3, where the optical component 3 is disposed on the optoelectronic component 2, and the optoelectronic component 2 is fixed on the first metal pad 11 of the carrier 1 through the die bond adhesive 8. The optoelectronic component 2 may be a light emitting element or a light receiving element, which is not limited to the present utility model. When the photoelectric component 2 is a light emitting part, the photoelectric component 2 is provided with a light emitting part, and the light emitting part is provided with an emitting surface; when the optoelectronic component 2 is a light receiving element, the optoelectronic component 2 has a receiving portion, and the receiving portion has a receiving surface. In addition, the package structure M1 further includes at least one metal wire 6 connected between the optoelectronic device 2 and the second metal pad 12. For example, the Light emitting device may be a Light Emitting Diode (LED), which emits Light to an external object; the light receiving element may be a Photo Transistor (PTR), a Photo Diode (Photo Diode), or a Photo IC (Photo IC), which may be used to receive light. In the present utility model, the optoelectronic device 2 will be described by taking a light emitting element emitting blue light as an example.

For example, in the present utility model, the optoelectronic device 2 may be a vertical LED chip, that is, two electrodes with different polarities of the optoelectronic device 2 are respectively located on the upper and lower sides. The electrode at the lower side of the photoelectric component 2 is electrically connected with the first metal pad 11 through the die bond glue 8. The electrode on the upper side of the optoelectronic component 2 is electrically connected to the second metal pad 12 through at least one metal wire 6. However, the above examples are only one possible embodiment and are not intended to limit the present utility model.

Referring to fig. 1 and fig. 2, fig. 2 is a schematic top view of an optoelectronic module with a package structure according to the present utility model. The optoelectronic component 2 includes a light emitting portion 21 and a wire bonding portion 22, the light emitting portion 21 and the wire bonding portion 22 are located on an upper surface of the optoelectronic component 2, the wire bonding portion 22 is disposed on one side of the upper surface, and further the optoelectronic component 2 is a P Pad up structure. The light emitting portion 21 includes an Epitaxial layer (epi-layer) and has an emission surface 211. One end of at least one metal wire 6 is connected to the wire bonding portion 22, and the other end of at least one metal wire 6 is connected to the second metal pad 12. In addition, the first encapsulant 4 completely encapsulates the at least one metal wire 6 to protect the at least one metal wire 6 from being broken by external force.

Further, as shown in fig. 2, the light emitting portion 21 of the optoelectronic device 2 has a plurality of conductive vias V to form a mesa (junction) and the wire bonding portion 22 of the optoelectronic device 2 is disposed on a single side of the optoelectronic device 2 to form P pad bar. Therefore, the photoelectric component 2 not only can provide the large-area wire bonding part 22 capable of being provided with a plurality of metal wires 6, but also can provide the complete emitting surface 211, so that the packaging structure of the utility model can effectively improve the light output through the design of the photoelectric component 2 in a P Pad bar structure. In addition, in the present utility model, the metal wire 6 connects the optoelectronic device 2 and the second metal pad 12 by reverse bonding, so that the highest point of the metal wire 6 is lower than the bottom of the optical device 3, and interference of the optical device 3 during bonding is avoided. However, the above examples are only one possible embodiment and are not intended to limit the present utility model.

The optical component 3 is a radiation conversion component or a radiation filtering component. For example, the radiation conversion element is a fluorescent glass sheet (Phosphor in glass) or a fluorescent ceramic sheet (Phosphor in ceramic), which may include, but is not limited to, yttrium Aluminum Garnet (YAG) or lutetium aluminum garnet (LuAG), among other constituent materials. The thickness of the radiation conversion element is 100 μm to 300 μm, but the utility model is not limited thereto. In addition, the constituent materials of the radiation filtering component may include organic materials and inorganic materials, for example. The organic material may be, for example, organic dye (dye). The inorganic material may be, for example, mgF2, ta2O5 or Al2O3, and is capable of forming an optical plating film. Thus, when the optoelectronic element 2 emits light (e.g. blue light), the light passes through the optical element 3 to excite the phosphor therein to generate light of other colors (e.g. green light, red light, etc.).

The first encapsulant 4 is preferably made of an opaque material, such as a reflective material or a light absorbing material, but the present utility model is not limited thereto. The first encapsulant 4 is disposed on the carrier 1 and surrounds the photovoltaic module. As shown in fig. 1, the first encapsulant 4 partially covers the side surface 31 of the optical component 3. The top surface 41 of the first encapsulant 4 and the surface of the carrier 1 have a first predetermined height H1 therebetween, and the first predetermined height H1 is smaller than the height H of the optoelectronic module (the optoelectronic component 2 and the optical component 3). More precisely, the first preset height H1 refers to the distance between the highest point of the top surface 41 of the first encapsulant 4 and the surface of the carrier 1. The emitting surface 211 and the surface of the carrier 1 have a second preset height H2 therebetween, the first preset height H1 is greater than or equal to the second preset height H2, and the first preset height H1 is less than or equal to the sum of 1/2 of the height T of the optical component 3 plus the second preset height H2. In general, the first preset height H1, the second preset height H2 and the height T of the optical assembly 3 satisfy the following relation:

H2≤H1≤H2+(T)/2。

the second encapsulant 5 is disposed on the first encapsulant 4 and covers at least a portion of the surface of the optoelectronic module. Further, the top surface profile of the second encapsulant 5 is a high-low surface with a concave-convex shape. The top surface of the second encapsulant 5 corresponds to the high surface of the top surface profile of the photovoltaic module, while the other parts of the top surface of the second encapsulant 5 are low surfaces. Furthermore, the projection area of the high surface 51 of the top surface profile of the second encapsulant 5 projected onto the carrier 1 overlaps the projection area of the photovoltaic module projected onto the carrier 1, and the projection area of the low surface 52 of the top surface profile of the second encapsulant 5 projected onto the carrier 1 does not overlap the projection area of the photovoltaic module projected onto the carrier 1. The second encapsulant 5 is preferably a light-transmitting material, such as silica gel, epoxy, fluorine polymer, etc., which is not limited to the present utility model. In this embodiment, the first encapsulant 4 completely covers the optoelectronic device 2, so that blue light exposure can be avoided. The second encapsulant 5 partially covers the optical assembly 3, and in more detail, the second encapsulant 5 completely covers the top surface 32 of the optical assembly 3 and partially covers the side surfaces 31. In detail, one part of the side surface 31 of the optical component 3 is covered by the second encapsulant 5, and the other part of the side surface 31 of the optical component 3 is covered by the first encapsulant 4. Therefore, the package structure M1 can improve the light extraction efficiency, i.e. has the effect of high extraction, through the design of the second encapsulant 5.

It should be noted that the package structure M1 further includes an adhesive disposed between the optoelectronic device 2 and the optical device 3, and the thickness of the adhesive is negligible compared to the thickness of the optoelectronic device 2 and the optical device 3, so that the adhesive is not shown in fig. 1 (this is the same in the embodiment described below, and is not repeated). Further, the material of the adhesive may include silica gel, polydimethylsiloxane (polydimethyl siloxane), fluorine compound, and the like. In addition, the material of the adhesive may further include silica. By adding silica to the adhesive, the heat dissipation efficiency of the photovoltaic module can be improved (silica has a higher thermal conductivity).

In addition, in the package structure M1 of the present utility model, the refractive indexes of the optical component 3, the second encapsulant 5, and the adhesive (not shown) disposed between the optoelectronic component 2 and the optical component 3 are all different. Therefore, the utility model can lead the light to generate multiple refraction when passing through the components through the gradual change of the refractive index of the materials, thereby improving the light-emitting efficiency.

As shown in fig. 1 and 2, the projected area of the optical component 3 projected on the surface of the carrier 1 is greater than or equal to the projected area of the emission surface 211 projected on the surface of the carrier 1. Further, in the present embodiment, the projected area of the optical component 3 projected on the surface of the carrier 1 is larger than the projected area of the emission surface 211 projected on the surface of the carrier 1. That is, the receiving surface area of the optical component 3 is larger than the area of the emitting surface 211. The utility model increases the light quantity received by the optical component 3 by increasing the receiving surface area of the optical component 3 so that the light emitted by the light emitting part 21 can be emitted into the optical component 3 as much as possible, thereby improving the light source conversion efficiency.

However, due to the large size of the optical component 3, when the optical component 3 is attached to the emitting surface 211 of the light emitting portion 21, the edge of the optical component 3 protrudes from the optoelectronic component 2, and the metal wire 6 may be interfered by the edge of the optical component 3 when the optoelectronic component 2 is wire-bonded. Therefore, a height difference HD is designed between the emitting surface 211 and the surface of the wire bonding portion 22. By the design of the height difference HD, the metal wire 6 is not interfered by the optical component 3 when being connected to the second metal pad 12.

The encapsulation structure M1 further comprises a wall 7, the wall 7 is disposed on the carrier 1, and the wall 7 surrounds the photovoltaic module, the first encapsulation colloid 4 and the second encapsulation colloid 5. In other words, a space S is formed between the wall 7 and the carrier 1, and the optoelectronic module, the first encapsulant 4 and the second encapsulant 5 are located in the space S. However, the utility model is not limited thereto. Further, the distance from the top surface of the second encapsulant 5 to the carrier 1 is equal to or lower than the height of the wall 7. As shown in fig. 1, the high surface 51 in the top surface profile of the second encapsulant 5 will be level with the top of the wall 7, while the low surface 52 in the top surface profile of the second encapsulant 5 will be lower than the top of the wall 7. In addition, referring to fig. 3, fig. 3 is a schematic cross-sectional view of a second embodiment of a package structure according to the first embodiment of the utility model. In the embodiment of fig. 3, the package structure M1 may not be provided with the wall 7.

Second embodiment

Referring to fig. 4, fig. 4 is a schematic cross-sectional view of a package structure according to a second embodiment of the utility model. The second embodiment of the present utility model provides a package structure M2, which includes a carrier 1, a photovoltaic module, a first encapsulant 4, a second encapsulant 5, metal wires 6 and a wall 7, wherein the photovoltaic module includes a photovoltaic module 2 (such as the module in the dashed frame shown in fig. 3) and an optical module 3.

As can be seen from comparing fig. 4 and fig. 1, the package structure M2 of the second embodiment and the package structure M1 of the first embodiment have similar structures, and their description is omitted. In the package structure M2 of fig. 4, the second encapsulant 5 completely covers the side surface 31 and the top surface 32 of the optical component 3, as compared to fig. 1. In detail, the top surface 41 of the first encapsulant 4 is cut Ji Guangxue to the bottom surface of the component 3 (or, the top surface 41 of the first encapsulant 4 is cut to the top surface of the optoelectronic component 2, i.e., the emitting surface 211). That is, the first encapsulant 4 only covers the optoelectronic device 2, and the side surface 31 and the top surface 32 of the optical device 3 are completely covered by the second encapsulant 5.

Third embodiment

Referring to fig. 5, fig. 5 is a schematic cross-sectional view of a package structure according to a third embodiment of the utility model. The third embodiment of the present utility model provides a package structure M3, which includes a carrier 1, a photovoltaic module, a first encapsulant 4, a second encapsulant 5, metal wires 6 and a wall 7, wherein the photovoltaic module includes a photovoltaic module 2 (such as the module in the dashed frame shown in fig. 5) and an optical module 3.

As can be seen from comparing fig. 5 and fig. 1, the package structure M3 of the third embodiment has a similar structure to the package structure M1 of the first embodiment, and the description thereof is omitted. In comparison with fig. 1, in the package structure M3 of fig. 5, the first preset height H1 is equal to the height H of the optoelectronic module (the optoelectronic component 2 and the optical component 3), and in general, the first preset height H1 is equal to the sum of the height T of the optical component 3 plus the second preset height H2, in detail, the top surface 41 of the first encapsulant 4 cuts the top surface 32 of the Ji Guangxue component 3. The top surface of the second encapsulant 5 is cut out of the top of Ji Qiangti. That is, the first encapsulant 4 surrounds the optoelectronic device 2 and the optical device 3 and completely covers the side surface 31 of the optical device 3, and the top surface 32 of the optical device 3 is completely covered by the second encapsulant 5.

Fourth embodiment

Referring to fig. 6, fig. 6 is a schematic cross-sectional view of a package structure according to a fourth embodiment of the utility model. The fourth embodiment of the present utility model provides a package structure M4, which includes a carrier 1, a photovoltaic module, a first encapsulant 4, a second encapsulant 5, metal wires 6 and a wall 7, wherein the photovoltaic module includes a photovoltaic module 2 (such as the module in the dashed frame shown in fig. 6) and an optical module 3.

As can be seen from comparing fig. 6 and fig. 1, the package structure M4 of the fourth embodiment and the package structure M1 of the first embodiment have similar structures, and their description is omitted. In the encapsulation structure M4 of fig. 6, compared to fig. 1, the high surface 51 in the top surface profile of the second encapsulant 5 is level with the top of the wall 7 and the top surface 32 of the optical component 3. The second encapsulant 5 partially covers the side surface 31 of the optical component 3, and the top surface 32 of the optical component 3 is exposed to the second encapsulant 5. Carefully, the first encapsulant 4 completely covers the optoelectronic component 2, so that the blue light exposure phenomenon can be avoided. The second encapsulant 5 covers a portion of the side surface 31 around the optical assembly 3, while the first encapsulant 4 covers another portion of the side surface 31. Further, the top surface 32 of the optical component 3 is not covered by the second encapsulant 5 and is exposed, so that the optical component 3 has a better heat dissipation effect.

Referring to fig. 7, fig. 7 is a schematic diagram of a light emitting spectrum (spectral radiant power) of the package structure of the present utility model. The first curve represents the package structure M2 (see fig. 4), and the optical component 3 is completely exposed from the first encapsulant; the second curve represents the package structure M1 (see fig. 1) in which the side portion of the optical component 3 is covered by the first encapsulant; the third generation of the curve table package M3 (see fig. 5), the side of the optical component 3 is completely covered by the first encapsulant. As can be seen from fig. 7, the ratio of the light output of the package structure in the blue light band (425 nm to 465 nm) to the total light output of the package structure in the visible light band (360 nm to 750 nm) is 6.9%, 1.9% and 2.6%, respectively, so that the ratio of the light output in the blue light band (425 nm to 465 nm) is preferably less than or equal to 7%, and more preferably less than or equal to 3%. On the other hand, the ratio of the light output of the three embodiments of the package structure in the green light band (500 nm to 600 nm) to the light output of the blue light band (425 nm to 465 nm) is 10.1, 41.4, 28.4, respectively, so the ratio of the light output of the green light band to the light output of the blue light band is preferably greater than or equal to 10, more preferably greater than or equal to 20.

The covered area of the second curve and the third curve is obviously smaller than that of the first curve, and the covered area of the second curve and the third curve is reduced by about 10% to 15% compared with that of the first curve. On the other hand, as shown in fig. 7, the area covered by the second curve is significantly larger than the area covered by the first curve (the area of the second curve is about 10% to 30% more), and the area covered by the third curve is slightly smaller than the area covered by the first curve (the area of the third curve is about 2% to 5% less) in the visible light band (500 nm to 600 nm) of the green light emission. Therefore, as can be seen from the comparison, the embodiment of the package structure M1 (curve two in fig. 7) with the side portion covered by the first encapsulant and the side portion covered by the second encapsulant is designed to have a better light source conversion efficiency, because it can expose the least blue light and convert the most green light.

Note that fig. 7 is a comparison of luminous efficiency (mW), but the comparison may be performed by using luminous intensity (or luminous flux) instead, and the comparison results are the same. The utility model is therefore not limited to this.

Advantageous effects of the embodiments

One of the advantages of the present utility model is that the package structure provided by the present utility model can prevent blue light exposure through the design that the first encapsulant 4 completely covers the optoelectronic component 2, and can improve the light source conversion efficiency through the design that the second encapsulant 5 completely covers the top surface 32 of the optical component 3 and partially covers the side surface 31, thereby improving the brightness.

Furthermore, the package structure provided by the utility model can enable the optical component 3 to have better heat dissipation effect and improve reliability through the design that the second package colloid 5 partially covers the side surface 31 of the optical component 3 and the top surface 32 of the optical component 3 is exposed out of the second package colloid 5.

Furthermore, in the package structure provided by the present utility model, the optical component 3 has a larger size, and the projection area of the optical component 3 projected on the surface of the carrier 1 is larger than the projection area of the emission surface 211 projected on the surface of the carrier 1. The utility model increases the light quantity received by the optical component 3 by increasing the receiving surface area of the optical component 3 so that the light emitted by the light emitting part 21 can be emitted into the optical component 3 as much as possible, thereby improving the light source conversion efficiency.

In addition, when the optical component 3 is attached to the emitting surface 211 of the light emitting portion 21, the edge of the optical component 3 protrudes from the optoelectronic component 2. Therefore, a height difference HD is designed between the emitting surface 211 and the surface of the wire bonding portion 22. By the design of the height difference HD, the metal wire 6 is not interfered by the optical component 3 when being connected to the second metal pad 12.

The foregoing disclosure is only a preferred embodiment of the present utility model and is not intended to limit the scope of the claims, so that all equivalent technical changes made by the application of the present utility model and the accompanying drawings are included in the scope of the claims.

Claims

1. A package structure, the package structure comprising:

a carrier;

the photoelectric module is arranged on the carrier;

the first packaging colloid is arranged on the carrier and surrounds the photoelectric module, a first preset height is arranged between the top surface of the first packaging colloid and the surface of the carrier, and the first preset height is smaller than or equal to the height of the photoelectric module; and

and the second packaging colloid is arranged on the first packaging colloid and covers at least part of the surface of the photoelectric module.

2. The package structure of claim 1, wherein the optoelectronic module comprises an optoelectronic component and an optical component, the optical component being disposed on the optoelectronic component.

3. The package structure according to claim 2, wherein the optoelectronic component comprises a light emitting portion or a receiving portion, and a wire bonding portion, the optical component is attached to a light emitting surface of the light emitting portion or a receiving surface of the receiving portion, and a height difference is formed between the light emitting surface or the receiving surface and a surface of the wire bonding portion.

4. A package according to claim 3, wherein the projected area of the optical component projected onto the carrier surface is greater than or equal to the projected area of the emission surface onto the carrier surface.

5. The package structure of claim 4, further comprising at least one metal wire, wherein the carrier comprises a first metal pad and a second metal pad, the optoelectronic component is disposed on the first metal pad, one end of the at least one metal wire is connected to the wire bonding portion, the other end of the at least one metal wire is connected to the second metal pad, and the highest point of the at least one metal wire is lower than the bottom of the optical component.

6. The package structure of claim 2, wherein the first encapsulant portion covers a side surface of the optical component.

7. The package structure of claim 6, wherein the optoelectronic component comprises a light emitting portion or a receiving portion, the light emitting portion has an emitting surface, the receiving portion has a receiving surface, a second predetermined height is provided between the emitting surface or the receiving surface and the carrier surface, the first predetermined height is greater than or equal to the second predetermined height, and the first predetermined height is less than or equal to 1/2 of the height of the optical component plus the sum of the second predetermined heights.

8. The package structure of claim 2, wherein the second encapsulant partially or completely covers the side surfaces of the optical component, and the top surface of the optical component is exposed to the second encapsulant.

9. The package structure of claim 2, wherein the second encapsulant partially or completely covers a side surface of the optical component and completely covers a top surface of the optical component.

10. The package structure of claim 2, wherein the first encapsulant completely covers a side surface of the optical component and the second encapsulant completely covers a top surface of the optical component.

11. The package structure according to any one of claims 1 to 10, wherein the package structure emits a total light output in a wavelength range of visible light, and a ratio of the light output emitted by the package structure in a wavelength range of 425nm to 465nm to the total light output is 7% or less; wherein the ratio of the output quantity of light emitted by the packaging structure in the wavelength range of 500nm to 600nm to the output quantity of light emitted by the packaging structure in the wavelength range of 425nm to 465nm is equal to or more than 20.

12. The package according to any one of claims 2 to 10, wherein the optical component is a radiation conversion component or a radiation filtering component.

13. The package structure of claim 12, wherein the radiation conversion element is a fluorescent glass sheet or a fluorescent ceramic sheet, and the radiation filtering element is a dye or an optical coating.

14. The package of claim 12, wherein the radiation conversion package has a thickness of 100 μm to 300 μm.

15. The package structure according to any one of claims 1 to 10, wherein the first encapsulant is a light reflective material or a light absorbing material.

16. The package structure of any one of claims 1 to 10, further comprising a wall disposed on the carrier, the wall surrounding the photovoltaic module, the first encapsulant and the second encapsulant, a top surface of the second encapsulant being at a distance from the carrier equal to or less than a height of the wall.