CN219759569U - Semiconductor device packaging structure - Google Patents

Abstract

The utility model discloses a semiconductor device packaging structure, which comprises an upper shell and a lower shell arranged on the upper shell, wherein a plurality of semiconductor pins are arranged on the lower shell, a protection assembly is arranged on the upper shell and comprises a transverse plate arranged on the upper shell, and a protection plate is arranged on the transverse plate; the transverse plate is provided with a fixing component, and the protection plate is fixed on the outer side of the semiconductor pins through the fixing component and used for protecting the semiconductor pins. This semiconductor device packaging structure through setting up the mutual cooperation between casing, lower casing, semiconductor pin, protection subassembly and the fixed subassembly, through setting up casing and lower casing installation back, keeps off in the outside of semiconductor pin through the guard plate on the last casing, can effectually avoid the semiconductor pin to receive the outside collision to take place the circumstances of deformation, can carry out effectual protection to the semiconductor pin, has stronger practicality.

Description

Semiconductor device packaging structure

Technical Field

The utility model relates to the technical field of semiconductor devices, in particular to a semiconductor device packaging structure.

Background

Semiconductor devices are electronic devices that have electrical conductivity between good conductors and insulators, utilize the special electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals and perform energy conversion.

The application number is as follows: 202222389905.5A Chinese patent entitled fully-packaged internal insulation semiconductor device, discloses a fully-packaged internal insulation semiconductor device, which comprises a semiconductor body and a packaging shell, wherein the semiconductor body is protected by the packaging shell, so that the problem of electric leakage and short circuit of the semiconductor body caused by damage of an external insulation layer is avoided, the packaging shell comprises a lower shell and an upper shell, the upper shell and the lower shell are fixed by bolting through bolts, and the device is easy to detach after being mounted, convenient to maintain and replace, and saves the maintenance cost of the semiconductor body; through set up the protective component between encapsulation shell and pin, be convenient for protect the junction of semiconductor body pin and encapsulation shell through the protective component, carry out the joint fixedly to elastic rubber pad and insulating rubber circle through lower U type lag and last U type lag block, protect semiconductor body pin through elastic rubber pad and insulating rubber circle, can avoid external dust or gas to corrode encapsulation shell and its inner assembly through this junction simultaneously, increase device life.

In the above patent, the U-shaped protecting sleeve, the elastic rubber pad and the insulating rubber ring are used for sealing and protecting the semiconductor body pins, so that the service life of the device is prolonged in sequence, and as known, when the semiconductor body pins are generally arranged outside the device directly, the semiconductor body pins are subjected to collision to deform and break during installation, and certain defects exist.

Disclosure of Invention

The present utility model is directed to a semiconductor device package structure that overcomes the above-mentioned shortcomings of the prior art.

In order to achieve the above object, the present utility model provides the following technical solutions: the semiconductor device packaging structure comprises an upper shell and a lower shell arranged on the upper shell, wherein a plurality of semiconductor pins are arranged on the lower shell, a protection assembly is arranged on the upper shell, the protection assembly comprises a transverse plate arranged on the upper shell, and a protection plate is arranged on the transverse plate; the transverse plate is provided with a fixing component, and the protection plate is fixed on the outer side of the semiconductor pins through the fixing component and used for protecting the semiconductor pins.

Further, the fixed component comprises a connecting plate fixedly connected to the protection plate, bolts are arranged on the connecting plate, a thread groove is formed in the transverse plate, and the thread groove is in threaded connection with the bolts.

Further, a semiconductor assembly is arranged in the lower shell, the semiconductor assembly comprises a supporting block fixedly connected in the lower shell, a semiconductor body is arranged on the supporting block, and wires are connected between the semiconductor body and the semiconductor pins.

Further, be provided with seal assembly between last casing and the lower casing, seal assembly is including setting up the annular seal circle on last casing, be provided with concave type sealing washer on the lower casing, annular seal circle sets up in concave type sealing washer.

Further, a heat radiation component is arranged on the upper shell and comprises heat radiation fins arranged on the upper shell, heat radiation fin frames are connected to the heat radiation fins in a sliding mode, and the heat radiation fin frames are in contact with the semiconductor body; a spring is arranged between the radiating fins and the radiating fin frame, and the elastic force of the spring drives the radiating fins to be far away from the upper shell.

In the above technical solution, the semiconductor device packaging structure provided by the present utility model has the beneficial effects that: this semiconductor device packaging structure through setting up the mutual cooperation between casing, lower casing, semiconductor pin, protection subassembly and the fixed subassembly, through setting up casing and lower casing installation back, keeps off in the outside of semiconductor pin through the guard plate on the last casing, can effectually avoid the semiconductor pin to receive the outside collision to take place the circumstances of deformation, can carry out effectual protection to the semiconductor pin, has stronger practicality.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.

FIG. 1 is a schematic diagram of an overall structure according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of an upper housing according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a lower housing structure according to an embodiment of the present utility model;

FIG. 4 is a schematic longitudinal section of an overall structure according to an embodiment of the present utility model;

FIG. 5 is an enlarged view of FIG. 4 at A;

fig. 6 is an enlarged view at B in fig. 4.

Reference numerals illustrate:

1. an upper housing; 2. a lower housing; 3. a semiconductor pin; 401. a cross plate; 402. a protection plate; 501. a connecting plate; 502. a bolt; 503. a thread groove; 601. a support block; 602. a semiconductor body; 603. a wire; 701. an annular seal ring; 702. a concave sealing ring; 801. a heat radiation fin; 802. a heat dissipation fin frame; 803. and (3) a spring.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.

Referring to fig. 1-6, a semiconductor device package structure includes an upper case 1 and a lower case 2 mounted on the upper case 1, wherein a plurality of semiconductor pins 3 are disposed on the lower case 2, a protection component is disposed on the upper case 1, the protection component includes a transverse plate 401 disposed on the upper case 1, and the transverse plate 401 is provided with a protection plate 402; the transverse plate 401 is provided with a fixing component, and the protection plate 402 is fixed on the outer side of the semiconductor pins 3 through the fixing component and is used for protecting the semiconductor pins 3.

Specifically, the semiconductor device packaging structure comprises an upper shell 1 and a lower shell 2 mounted on the upper shell 1, the upper shell 1 and the lower shell 2 form an existing semiconductor device packaging frame, which is a conventional known technology, and not described in detail herein, a plurality of semiconductor pins 3 are arranged on the lower shell 2, the semiconductor pins 3 are distributed on the lower shell 2 in a linear array, the semiconductor pins 3 are fixed in the lower shell 2, the tightness between the semiconductor pins 3 and the lower shell 2 can be improved, a protection component is arranged on the upper shell 1, the protection component comprises a transverse plate 401 arranged on the upper shell 1, the transverse plate 401 is arranged above the semiconductor pins 3, the transverse plate 401 is provided with a protection plate 402, a groove for the protection plate 402 to move is arranged inside the transverse plate 401, and the protection plate 402 can be fixed on the upper shell 1 through the transverse plate 401; the transverse plate 401 is provided with a fixing component, the protection plate 402 is fixed on the outer side of the semiconductor pin 3 through the fixing component and used for protecting the semiconductor pin 3, and external collision force can be shielded through the protection plate 402, so that external force cannot directly act on the semiconductor pin 3, and a certain protection effect is achieved.

In a further embodiment of the present utility model, the fixing assembly includes a connection plate 501 fixedly connected to the protection plate 402, a bolt 502 is disposed on the connection plate 501, a threaded groove 503 is disposed on the cross plate 401, and the threaded groove 503 is in threaded connection with the bolt 502.

Preferably, the fixing assembly includes a connection plate 501 fixedly connected to the guard plate 402, a bolt 502 is provided on the connection plate 501, a threaded groove 503 is provided on the cross plate 401, the threaded groove 503 is in threaded connection with the bolt 502, and the connection plate 501 is connected to the baffle plate through the bolt 502 and is connected to the threaded groove 503, so that the guard plate 402 is fixed to the outer side of the semiconductor pin 3.

In a further provided embodiment of the present utility model, a semiconductor assembly is disposed in the lower housing 2, and the semiconductor assembly includes a supporting block 601 fixedly connected in the lower housing 2, a semiconductor body 602 is disposed on the supporting block 601, and wires 603 are connected between the semiconductor body 602 and the plurality of semiconductor pins 3.

Preferably, a semiconductor component is disposed in the lower housing 2, the semiconductor component includes a supporting block 601 fixedly connected in the lower housing 2, a semiconductor body 602 is disposed on the supporting block 601, the semiconductor body 602 is adhered to the supporting block 601 through a heat-conducting silica gel layer, the semiconductor body 602 can be better firmly adhered to the supporting block 601 through the heat-conducting silica gel layer, and a wire 603 is connected between the semiconductor body 602 and the plurality of semiconductor pins 3.

In a further provided embodiment of the present utility model, a sealing assembly is disposed between the upper housing 1 and the lower housing 2, the sealing assembly includes an annular sealing ring 701 disposed on the upper housing 1, a concave sealing ring 702 is disposed on the lower housing 2, and the annular sealing ring 701 is disposed in the concave sealing ring 702.

Preferably, a sealing assembly is arranged between the upper casing 1 and the lower casing 2, the sealing assembly comprises an annular sealing ring 701 arranged on the upper casing 1, a concave sealing ring 702 is arranged on the lower casing 2, the annular sealing ring 701 is arranged in the concave sealing ring 702, and the sealing effect of multiple times of sealing can be achieved through contact between the annular sealing ring 701 and the concave sealing ring 702, so that the sealing performance of the semiconductor device packaging structure is further improved.

In a further provided embodiment of the present utility model, a heat dissipation assembly is disposed on the upper housing 1, the heat dissipation assembly includes a heat dissipation fin 801 disposed on the upper housing 1, a heat dissipation fin frame 802 is slidingly connected to the heat dissipation fin 801, and the heat dissipation fin frame 802 contacts with the semiconductor body 602; a spring 803 is arranged between the heat dissipation fin 801 and the heat dissipation fin frame 802, and the elastic force of the spring 803 drives the heat dissipation fin 801 to be far away from the upper shell 1.

Preferably, a heat dissipation assembly is disposed on the upper housing 1, the heat dissipation assembly includes a heat dissipation fin 801 disposed on the upper housing 1, a heat dissipation fin frame 802 is slidably connected to the heat dissipation fin 801, and the heat dissipation fin frame 802 contacts with the semiconductor body 602; the spring 803 is arranged between the radiating fin 801 and the radiating fin frame 802, the elastic force of the spring 803 drives the radiating fin 801 to be far away from the upper shell 1, the radiating fin 801 and the radiating fin frame 802 are made of existing radiating materials, the radiating fin frame 802 on the radiating fin 801 is convenient to push to move through the arrangement of the spring 803, and the radiating fin frame is contacted with the semiconductor body 602 on the supporting block 601, so that the semiconductor body 602 can radiate heat.

Working principle: during operation, the semiconductor body 602 is stuck on the supporting block 601, then the semiconductor body 602 is connected with the semiconductor pins 3 by using the wires 603, at the moment, the upper shell 1 is fixed on the lower shell 2, after the fixing, the protection plate 402 on the transverse plate 401 is pushed to move until the connecting plate 501 on the protection plate 402 contacts with the top of the transverse plate 401, at the moment, the bolts 502 are rotated to enable the bolts 502 to enter the thread grooves 503 on the transverse plate 401, the connecting plate 501 is fixed on the transverse plate 401, at the moment, the protection plate 402 is fixedly blocked on one side of the semiconductor pins 3, and the semiconductor pins 3 can be protected.

It should be noted that the electric equipment and the external power supply related to the utility model can be powered by the storage battery.

While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.

Claims (5)

1. A semiconductor device package structure comprising an upper case (1) and a lower case (2) mounted on the upper case (1), characterized in that:

the semiconductor packaging structure comprises a lower shell (2), wherein a plurality of semiconductor pins (3) are arranged on the lower shell (2), a protection component is arranged on the upper shell (1), the protection component comprises a transverse plate (401) arranged on the upper shell (1), and the transverse plate (401) is provided with a protection plate (402);

the transverse plate (401) is provided with a fixing component, and the protection plate (402) is fixed on the outer side of the semiconductor pins (3) through the fixing component and used for protecting the semiconductor pins (3).

2. The semiconductor device packaging structure according to claim 1, wherein the fixing component comprises a connecting plate (501) fixedly connected to the protection plate (402), a bolt (502) is arranged on the connecting plate (501), a thread groove (503) is formed in the transverse plate (401), and the thread groove (503) is in threaded connection with the bolt (502).

3. A semiconductor device package structure according to claim 1, wherein a semiconductor component is provided in the lower case (2), the semiconductor component including a supporting block (601) fixedly connected in the lower case (2), a semiconductor body (602) is provided on the supporting block (601), and a wire (603) is connected between the semiconductor body (602) and the plurality of semiconductor pins (3).

4. The semiconductor device packaging structure according to claim 1, wherein a sealing assembly is arranged between the upper housing (1) and the lower housing (2), the sealing assembly comprises an annular sealing ring (701) arranged on the upper housing (1), a concave sealing ring (702) is arranged on the lower housing (2), and the annular sealing ring (701) is arranged in the concave sealing ring (702).

5. A semiconductor device package according to claim 3, wherein a heat dissipating component is provided on the upper case (1), the heat dissipating component comprising a heat dissipating fin (801) provided on the upper case (1), the heat dissipating fin (801) being slidably connected with a heat dissipating fin frame (802), the heat dissipating fin frame (802) being in contact with the semiconductor body (602);

a spring (803) is arranged between the radiating fin (801) and the radiating fin frame (802), and the elastic force of the spring (803) drives the radiating fin (801) to be far away from the upper shell (1).