CN219759543U - Transfer mechanism and sorting machine - Google Patents
Transfer mechanism and sorting machine Download PDFInfo
- Publication number
- CN219759543U CN219759543U CN202223254801.XU CN202223254801U CN219759543U CN 219759543 U CN219759543 U CN 219759543U CN 202223254801 U CN202223254801 U CN 202223254801U CN 219759543 U CN219759543 U CN 219759543U
- Authority
- CN
- China
- Prior art keywords
- transfer mechanism
- support
- assembly
- main shaft
- picking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims abstract description 34
- 238000003466 welding Methods 0.000 claims abstract description 31
- 230000006835 compression Effects 0.000 claims description 16
- 238000007906 compression Methods 0.000 claims description 16
- 230000003014 reinforcing effect Effects 0.000 claims description 14
- 230000002787 reinforcement Effects 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
Abstract
The utility model discloses a transfer mechanism and a sorting machine, wherein the transfer mechanism is applied to chips which are oversized and hollow in the middle, the transfer mechanism comprises a taking and placing assembly, the taking and placing assembly comprises a bracket and at least four taking welding heads, the at least four taking welding heads are distributed in rectangular four points, one end of each taking welding head is connected with the bracket, and one end of each taking welding head connected with the bracket is positioned in the same plane; each take-off head is resiliently movable in a direction in which it is connected to the support. The picking and placing assembly is provided with a plurality of picking welding heads, so that chips with oversized sizes and hollowed-out middle parts can be picked up at multiple points; the material taking welding heads can elastically move in the connection direction of the material taking welding heads and the support, so that coplanarity among the material taking welding heads when the chips are sucked is ensured, and the chips are prevented from being crushed.
Description
Technical Field
The utility model relates to chip sorting equipment, in particular to a transfer mechanism and a sorting machine.
Background
At present, various small-size chips are widely applied to various fields, and the current sorting machine is suitable for the small-size chips. But the use requirement of large-size chips, such as 80mmx80mm silicon substrate chips with hollowed-out middle, is not poor, the size of the silicon substrate chips is far beyond the chip loading capacity of the current sorting machine, when the oversized chips are sucked, the oversized chips are difficult to peel from a blue film, and no proper sorting device is used for taking the oversized chips into a tray for sorting at present.
Disclosure of Invention
In view of the foregoing drawbacks and shortcomings of the prior art, it is desirable to provide a transfer mechanism and a sorter.
In a first aspect, an embodiment of the present utility model provides a transfer mechanism, which is applied to a chip with an oversized size and a hollowed-out middle, where the transfer mechanism includes a pick-and-place assembly, the pick-and-place assembly includes a support and at least four pick-up bonding heads, at least four pick-up bonding heads are distributed in rectangular four points, one end of each pick-up bonding head is connected with the support, and one end of each pick-up bonding head connected with the support is located in the same plane; each of the take-out heads is resiliently movable in a direction in which it is connected to the support.
In some examples, the pick-and-place assembly further includes at least four elastic connectors, the elastic connectors being in one-to-one correspondence with the pick-up heads, the pick-up heads being connected to the support by the elastic connectors.
In some examples, the resilient connection comprises a compression spring.
In some examples, the elastic connection piece comprises a connection shaft, a compression spring sleeved on the connection shaft and a nut;
one end of the connecting shaft is fixedly connected with the material taking welding head, the other end of the connecting shaft penetrates through the support to be in threaded connection with the nut, the compression spring is located between the support and the material taking welding head, and the connecting shaft is movable relative to the support in the axial direction of the connecting shaft.
In some examples, the support includes a main shaft and a support portion perpendicularly connected to the main shaft, the support portion including at least four intersecting support tabs, each of the support tabs being perpendicular to the main shaft, an end of each of the support tabs remote from the main shaft being connected to the take out horn.
In some examples, the bracket further comprises a reinforcement portion located between the spindle and the support portion;
one side of the reinforcing part is connected with the main shaft in the axial direction of the main shaft, and the other side of the reinforcing part is connected with the intersection of each supporting piece;
the width of the reinforcing portion is larger than the diameter width of the main shaft in the circumferential direction of the main shaft.
In some examples, the transfer mechanism further includes a thimble assembly disposed below the pick-and-place assembly, the thimble assembly being configured to puncture a blue film carrying the chip and lift the chip for the pick-and-place assembly to suck.
In some examples, the thimble assembly includes a thimble seat and a plurality of thimbles disposed on the thimble seat, the plurality of thimbles being distributed in a zigzag shape.
In a second aspect, an embodiment of the present utility model further provides a sorting machine, including a workbench and the transfer mechanism as described above, where the workbench has a material taking station, the transfer mechanism is disposed at the material taking station, a material taking and placing assembly in the transfer mechanism is disposed above the workbench, and a thimble assembly in the transfer mechanism is disposed below the workbench.
The technical scheme provided by the embodiment of the utility model can comprise the following beneficial effects:
according to the transfer mechanism and the sorting machine provided by the embodiment of the utility model, the picking and placing component is provided with the plurality of picking and placing welding heads, so that chips with oversized sizes and hollowed-out middle parts can be sucked at multiple points; the material taking welding heads can elastically move in the connection direction of the material taking welding heads and the support, so that coplanarity among the material taking welding heads when the chips are sucked is ensured, and the chips are prevented from being crushed; preferably, the plurality of ejector pins are distributed in a shape like a Chinese character 'hui', so that hollowed-out parts in the middle of the chip are avoided, and the chip can be effectively lifted up for the pick-and-place assembly to suck and move the chip.
Drawings
Other features, objects and advantages of the present utility model will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a picking and placing component in a transfer mechanism according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of an oversized chip with a hollowed-out middle according to an embodiment of the present utility model.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the utility model are shown in the drawings.
It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.
The embodiment of the utility model provides a transfer mechanism which is applied to chips with oversized and hollowed-out middle parts. For example, the size of the oversized and middle hollowed-out chip is 88mmx88mm, which is far beyond the current chip loading capability of 22mm.
As shown in fig. 1, the transfer mechanism provided by the embodiment of the utility model comprises a picking and placing assembly 10, wherein the picking and placing assembly 10 comprises a bracket 11 and at least four picking welding heads 12, the at least four picking welding heads 12 are distributed in rectangular four points, one end of each picking welding head 12 is connected with the bracket 11, and one end of each picking welding head 12 connected with the bracket 11 is positioned in the same plane; each dispensing horn 12 is resiliently movable in the direction in which it is connected to the support 11.
The transfer mechanism provided by the embodiment is applied to the oversized and hollowed-out middle chip, wherein the picking and placing assembly 10 is provided with a plurality of picking and placing welding heads 12, and can absorb the oversized and hollowed-out middle chip at multiple points; the material taking welding heads 12 can elastically move in the connection direction of the material taking welding heads and the support 11, so that coplanarity among the material taking welding heads 12 during chip sucking is ensured, and the chip is prevented from being crushed.
Preferably, the pick-and-place assembly 10 includes four pick-and-place horns 12. The chip is square structure, and four get material bonding tool 12 correspond four corners of chip respectively, can effectively avoid the through-hole at chip center, can stably, absorb the chip reliably.
In some exemplary embodiments, the bracket 11 further includes at least four elastic connectors, which are in one-to-one correspondence with the picking heads, and the picking heads 12 are connected to the bracket by the elastic connectors.
For example, the elastic connection member is a compression spring, and the material taking welding head 12 is connected with the bracket 11 through the compression spring. The device has a simple structure, can ensure the coplanarity of each material taking welding head when the chip is sucked, and avoid the chip from being crushed due to the non-coplanarity of the material taking welding heads.
Alternatively, referring to fig. 1, the elastic connector includes a connecting shaft 13, a compression spring 14 sleeved on the connecting shaft 13, and a nut 15;
one end of the connecting shaft 13 is fixedly connected with the material taking welding head 12, the other end of the connecting shaft 13 penetrates through the bracket 11 to be in threaded connection with the nut 15, the compression spring 14 is located between the bracket 11 and the material taking welding head 12, and the connecting shaft 13 is movable relative to the bracket 11 in the axial direction of the connecting shaft.
The connecting shaft 13 can drive the material taking welding head 12 to move relative to the bracket 11, the connecting shaft 13 is sleeved with the compression spring 14, and the connecting shaft 13 and the material taking welding head 12 can be ensured to be fixed relative to the bracket 11 by utilizing the compression spring 14.
For example, pick-and-place assembly 10 includes four pick-and-place heads 12; referring to fig. 2, four pick-up heads 12 are attached to four die corners at locations A, B, C, D. If the position A, B, C is in the same plane, the position D is slightly higher than the other three positions, and when the pick-and-place assembly 10 sucks the chip, the compression amount of the compression spring corresponding to the pick-up head 12 at the position D is slightly greater than the compression amount of the compression spring corresponding to the pick-up heads at the other three positions, so that each pick-up head 12 of the pick-and-place assembly 10 can be ensured to reliably suck the chip.
In some exemplary embodiments, referring to fig. 1, the stand 11 includes a main shaft 111 and a support portion connected perpendicularly to the main shaft 111, the support portion including at least four intersecting support tabs 112, each support tab 112 being perpendicular to the main shaft 111, an end of each support tab 112 remote from the main shaft 111 being connected to the take-out head 12. The design is such that the individual dispensing heads 12 in the dispensing and dispensing assembly 10 are in the same plane.
Further, the bracket 11 further includes a reinforcing portion 113, the reinforcing portion 113 being located between the main shaft 111 and the supporting portion; in the axial direction of the main shaft 111, one side of the reinforcing portion 113 is connected to the main shaft 111, and the other side of the reinforcing portion 113 is connected to the intersection of the respective support pieces 112; the width of the reinforcing portion 113 is larger than the diameter width of the main shaft 111 in the circumferential direction of the main shaft 111.
Preferably, the reinforcing portion 113 is a reinforcing block. The strength of the connection between each support piece 112 and the main shaft 111 is enhanced by the reinforcing portion 113, and the support of the material taking bonding head 12 by the auxiliary support portion enables the material taking bonding heads 12 to which each support piece 112 is connected to be in the same plane.
In some exemplary embodiments, referring to fig. 1, the transfer mechanism further includes a spike assembly 20 disposed below the pick-and-place assembly 10, the spike assembly 20 being configured to puncture a blue film carrying a chip and lift the chip for pick-and-place assembly 10 to aspirate. The chip is lifted up after the blue film is pierced through the thimble assembly 20, so that the chip and the blue film are stripped, and the picking and placing assembly 10 is convenient to pick up the chip.
In some exemplary embodiments, the ejector pin assembly 20 includes an ejector pin seat 21 and a plurality of ejector pins 22 disposed on the ejector pin seat 21, the plurality of ejector pins 22 being distributed in a zigzag shape. The plurality of ejector pins 22 are distributed in a shape like a Chinese character 'hui', so that a through hole in the middle of a chip can be avoided, the chip can be effectively lifted up from the blue film, and the chip and the blue film are stripped.
The embodiment of the utility model also provides a sorting machine, which comprises a workbench and the transfer mechanism, wherein the workbench is provided with a material taking station 31, the transfer mechanism is arranged at the material taking station, a material taking and placing assembly 10 in the transfer mechanism is arranged above the workbench, and a thimble assembly 20 in the transfer mechanism is arranged below the workbench.
Typically, the work table is a horizontal table. The material taking station is provided with a blue film tray for placing chips, the material taking and placing assembly 10 is arranged above the blue film tray, and the thimble assembly 20 is arranged below the blue film tray.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
The present utility model employs first, second, etc. to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, a first message may also be referred to as a second message, and similarly, a second message may also be referred to as a first message, without departing from the scope of the utility model.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The above description is only illustrative of the preferred embodiments of the present utility model and of the principles of the technology employed. It will be appreciated by persons skilled in the art that the scope of the utility model referred to in the present utility model is not limited to the specific combinations of the technical features described above, but also covers other technical features formed by any combination of the technical features described above or their equivalents without departing from the inventive concept. Such as the above-mentioned features and the technical features disclosed in the present utility model (but not limited to) having similar functions are replaced with each other.
Claims (9)
1. The transfer mechanism is characterized by comprising a picking and placing assembly, wherein the picking and placing assembly comprises a bracket and at least four picking and placing heads, the at least four picking and placing heads are distributed in rectangular four points, one end of each picking and placing head is connected with the bracket, and one end of each picking and placing head connected with the bracket is positioned in the same plane; each of the take-out heads is resiliently movable in a direction in which it is connected to the support.
2. The transfer mechanism of claim 1, wherein the pick-and-place assembly further comprises at least four elastic connectors, the elastic connectors are in one-to-one correspondence with the pick-up heads, and the pick-up heads are connected with the support through the elastic connectors.
3. The transfer mechanism of claim 2, wherein the resilient connection comprises a compression spring.
4. The transfer mechanism according to claim 2, wherein the elastic connecting member comprises a connecting shaft, a compression spring sleeved on the connecting shaft, and a nut;
one end of the connecting shaft is fixedly connected with the material taking welding head, the other end of the connecting shaft penetrates through the support to be in threaded connection with the nut, the compression spring is located between the support and the material taking welding head, and the connecting shaft is movable relative to the support in the axial direction of the connecting shaft.
5. The transfer mechanism of any one of claims 1-4, wherein the support comprises a main shaft and a support portion vertically connected to the main shaft, the support portion comprising at least four intersecting support pieces, each of the support pieces being perpendicular to the main shaft, an end of each of the support pieces remote from the main shaft being connected to the take out horn.
6. The transfer mechanism of claim 5, wherein the rack further comprises a reinforcement portion, the reinforcement portion being located between the spindle and the support portion;
one side of the reinforcing part is connected with the main shaft in the axial direction of the main shaft, and the other side of the reinforcing part is connected with the intersection of each supporting piece;
the width of the reinforcing portion is larger than the diameter width of the main shaft in the circumferential direction of the main shaft.
7. The transfer mechanism of claim 5, further comprising a spike assembly disposed below the pick-and-place assembly, the spike assembly configured to puncture a blue film carrying the chip and lift the chip for the pick-and-place assembly to suck.
8. The transfer mechanism of claim 7, wherein the ejector pin assembly comprises an ejector pin seat and a plurality of ejector pins arranged on the ejector pin seat, the plurality of ejector pins being distributed in a zigzag shape.
9. A sorting machine, characterized by comprising a workbench and the transfer mechanism as claimed in claim 7 or 8, wherein the workbench is provided with a material taking station, the transfer mechanism is arranged at the material taking station, a material taking and placing assembly in the transfer mechanism is arranged above the workbench, and a thimble assembly in the transfer mechanism is arranged below the workbench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223254801.XU CN219759543U (en) | 2022-12-05 | 2022-12-05 | Transfer mechanism and sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223254801.XU CN219759543U (en) | 2022-12-05 | 2022-12-05 | Transfer mechanism and sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219759543U true CN219759543U (en) | 2023-09-26 |
Family
ID=88088580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223254801.XU Active CN219759543U (en) | 2022-12-05 | 2022-12-05 | Transfer mechanism and sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219759543U (en) |
-
2022
- 2022-12-05 CN CN202223254801.XU patent/CN219759543U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2277069C (en) | Integrated circuit tray with self aligning pocket | |
| TW583718B (en) | Thin wafer insert | |
| US6478533B2 (en) | Method of using a tube feeder for circuit board components | |
| US6462533B1 (en) | IC test system for testing BGA packages | |
| CN103523553A (en) | Material taking mechanism | |
| CN219759543U (en) | Transfer mechanism and sorting machine | |
| CN210996959U (en) | Multi-purpose automatic soldering tin machine | |
| CN210214047U (en) | Transparent part carrying mechanism | |
| US8002558B2 (en) | Electrical connector defining plurality of discrete interconnecting sectors for respectively receiving individual IC package thereon | |
| US6550133B1 (en) | Surface mounting apparatus installed with tray feeder | |
| US4511421A (en) | Component-insertion table for manually equipping circuit carriers | |
| CN107134429B (en) | Vacuum adsorption-carrying tabletting mechanism on platform without vacuum holes and working method thereof | |
| CN212353219U (en) | Printing platen and vacuum screen printing machine | |
| CN213007041U (en) | PIN positioning nail and vacuum screen printing machine | |
| CN201608310U (en) | Electric connector | |
| KR20170137329A (en) | Apparatus for binding dies | |
| CN216122999U (en) | Power board structure | |
| CN213754682U (en) | Camera module gets material instrument of putting fast | |
| CN216370566U (en) | Combined jig and processing equipment | |
| CN212659528U (en) | MELF glass body encapsulation diode anti-static suction nozzle suitable for mecani full-automatic mounting machine | |
| CN216029144U (en) | Upper cover equipment for processing electronic components | |
| CN201298966Y (en) | Surface mounting part | |
| CN113347868B (en) | Pick-up device for holding electronic components | |
| JP3208580B2 (en) | Die bonding method and semiconductor device manufacturing method | |
| CN214203612U (en) | Bonding positioning device for plug-in type packaged monolithic integrated circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |