CN219738925U - Special frame for cleaning silicon wafer - Google Patents
Special frame for cleaning silicon wafer Download PDFInfo
- Publication number
- CN219738925U CN219738925U CN202321325780.8U CN202321325780U CN219738925U CN 219738925 U CN219738925 U CN 219738925U CN 202321325780 U CN202321325780 U CN 202321325780U CN 219738925 U CN219738925 U CN 219738925U
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- frame
- silicon wafers
- rack
- cleaning
- spring
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 107
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 98
- 239000010703 silicon Substances 0.000 title claims abstract description 98
- 238000004140 cleaning Methods 0.000 title claims abstract description 48
- 235000012431 wafers Nutrition 0.000 claims abstract description 75
- 238000004804 winding Methods 0.000 claims abstract description 27
- 230000002457 bidirectional effect Effects 0.000 claims description 21
- 229920000742 Cotton Polymers 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims 5
- 230000035939 shock Effects 0.000 claims 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 12
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000005096 rolling process Methods 0.000 description 6
- 230000002441 reversible effect Effects 0.000 description 5
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000000670 limiting effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a special frame for cleaning silicon wafers, which relates to the technical field of silicon wafer cleaning and comprises an anti-adhesion unit and a placing frame; the automatic feeding and discharging device is characterized in that the upper surface and the lower surface of the placing frame are respectively provided with a support, the external material taking manipulator carries and moves the placing frame through the supports, the side face of the placing frame is provided with an adjusting unit, two sides of the placing frame are respectively and slidably connected with a saw-tooth frame, the saw-tooth frames are connected with the adjusting unit, and inserting sheet grooves, grooves and anti-adhesion units are formed in opposite side faces of the two saw-tooth frames at equal distances. The beneficial effects are that: according to the utility model, the wire rope is in a tight state through the guide plate, the sliding seat and the winding wheel, the wire rope is prevented from touching the silicon wafers, the wire rope is enabled to move between two adjacent silicon wafers through the guide plate, the sliding seat, the sliding rod and the spring I, water flow between the two adjacent silicon wafers is disturbed, and the silicon wafers are prevented from being adhered by the water flow, so that the cleaning quality of the silicon wafers is affected.
Description
Technical Field
The utility model relates to the technical field of silicon wafer cleaning, in particular to a special frame for cleaning silicon wafers.
Background
In semiconductor device fabrication, about 20% of the processes are associated with wafer cleaning. After the silicon wafer is processed by different working procedures such as slicing, chamfering, grinding, surface treatment, polishing, epitaxy and the like, the surface is seriously polluted, and the aim of cleaning is to remove the pollution of particles, metal ions, organic matters and the like on the surface of the silicon wafer.
Through searching, the patent with the publication number of CN206742270U discloses a solar silicon wafer cleaning frame, which mainly performs fixed limit on a silicon wafer placed on a special cleaning frame so as to avoid collision damage of the silicon wafer during cleaning.
The special cleaning rack provided with the silicon wafers in the patent is placed in a cleaning machine, when the silicon wafers are washed, water flows towards one direction when passing through between the two silicon wafers, so that the adjacent two silicon wafers are mutually attracted and adhered together, the cleaning of the silicon wafers is influenced, and the silicon wafers are easily damaged.
Disclosure of Invention
The utility model aims to solve the problems and provide a special frame for cleaning silicon wafers.
The utility model realizes the above purpose through the following technical scheme:
a special frame for cleaning silicon wafers comprises an anti-adhesion unit and a placement frame; the upper surface and the lower surface of the rack are both provided with supports, the external material taking manipulator carries and moves the rack through the supports, the side surface of the rack is provided with an adjusting unit, the two sides of the rack are respectively and slidably connected with a saw tooth rack, the saw tooth rack is connected with the adjusting unit, the opposite side surfaces of the two saw tooth racks are provided with an inserting sheet groove, a groove and an anti-adhesion unit at equal distances, the saw tooth rack is supported and limited through the rack, the saw tooth rack is moved in a certain range through the adjusting unit, the distance between the inserting sheet grooves on the two saw tooth racks is adjusted, so that silicon wafers with different sizes in a certain size range can be supported and placed, the silicon wafers are placed in the inserting sheet groove, the contact area between the silicon wafers and the inserting sheet groove is reduced through the groove, water flow can enter the inserting sheet groove through the groove, thereby facilitating cleaning of the silicon chip part in the inserting sheet groove, the anti-adhesion unit comprises a through groove, a sliding seat and a rope, the through groove penetrates through the sawtooth frame and the placing frame, sliding rods are equidistantly arranged in the through groove on the placing frame, the sliding rods are positioned between two adjacent inserting sheet grooves, a first spring is sleeved on the sliding rods and connected with the sawtooth frame and the sliding seat, guide plates are obliquely arranged on two sides of the sliding seat, the sliding seat is in sliding connection with the sliding rod, a rolling assembly is arranged in the sliding seat, two ends of the rope are respectively connected with the rolling assembly in the sliding seat, the placing frame filled with the silicon chip is placed in a cleaning machine, when the silicon chip is cleaned by water flow in cleaning, the sliding seat is enabled to slide along the sliding rod by applying acting force to the sliding seat through the obliquely arranged guide plates, and stretch the spring one, rethread spring one's elasticity is to the slide reverse tension, thereby make two slides along slide bar reciprocating motion, make the distance between two slides change, the slide is receive and release the wire rope through the rolling subassembly, make the cotton rope remove between two adjacent silicon chips, and carry out tensioning through the rolling subassembly, avoid the cotton rope to touch the silicon chip, the rivers flow direction between two adjacent silicon chips is disturbed through the cotton rope, avoid two adjacent silicon chips to be in the same place because of the unanimity silicon chip adhesion that leads to of rivers flow direction influences abluent efficiency or damage silicon chip, thereby can be better wash the silicon chip, guarantee abluent efficiency.
Further, the winding component comprises a torsion spring and a placing cavity, the placing cavity is arranged in the sliding seat, a rotating shaft is rotationally connected in the placing cavity, the rotating shaft is connected with a winding wheel, the winding wheel is connected with a wire rope, the torsion spring is sleeved on the rotating shaft, two ends of the torsion spring are respectively connected with the winding wheel and the sliding seat, when the two sliding seats are located at the shortest distance, the part of the wire rope between the two silicon wafers is in a horizontal state, at the moment, the torsion spring is in a normal state, when the distance between the two sliding seats is prolonged, the wire rope pulls the winding wheel, the winding wheel rotates to pay off the wire rope, when the winding wheel rotates, the torsion spring is stressed to deform and apply a reverse acting force to the wire rope, so that the wire rope is in a tightening state, the wire rope is prevented from being contacted with the silicon wafers due to the fact that the wire rope is prolonged, and damage to the wire rope is avoided.
Further, the rack includes the apron, apron altogether two and connect backup pad and side shield's upper and lower both ends respectively, apron sliding connection the sawtooth frame, the side shield is located the both sides of backup pad, be provided with on the side shield logical groove supports spacingly through apron, backup pad and side shield to the sawtooth frame, carries out spacingly through the backup pad to the silicon chip of placing on the sawtooth frame.
Further, the adjusting unit comprises a bidirectional screw and a guide rod, threads at two ends of the bidirectional screw are opposite in direction, the bidirectional screw is rotationally connected with the supporting plate, threads at two ends of the bidirectional screw are respectively connected with the two saw-tooth frames in a threaded mode, a knob is arranged at the end portion of the bidirectional screw, the guide rod is arranged at two sides of the supporting plate and is respectively connected with the two guide rods in a sliding mode, the two saw-tooth frames are driven to move through the bidirectional screw, the distance between the two saw-tooth frames is adjusted, the silicon wafer is placed conveniently and better, the saw-tooth frames can be placed and supported on silicon wafers with different sizes in a certain size change range, and limiting and guiding are carried out when the saw-tooth frames move through the guide rod.
Further, still include buffer unit, buffer unit is including the spring two, the spring two cup joints on the support, the protection casing with the apron is connected respectively at the both ends of spring two, protection casing sliding connection the support with accomodate the groove, accomodate the groove setting and be in on the apron, protection casing and accomodate the groove and be the frustum type, when the rack was placed into the cleaning machine, the rack was in the level and was placed, when outside material taking manipulator moved the rack through the support, carried out buffer protection to the rack on outside material taking manipulator through spring two and protection casing, avoided getting material in-process outside material taking manipulator and rack collision and caused the damage to the silicon chip.
Further, still include snubber block and cushion, the snubber block sets up on the apron with on the side that backup pad looks parallel and level, carry out buffer protection through snubber block to the apron, avoid placing the silicon chip when into the cleaning machine, bump and cause the silicon chip damage because of the apron bumps the cleaning machine appearance, the blotter sets up in the backup pad, just the blotter is located two between the sawtooth frame, buffer protection is carried out to the silicon chip through the blotter, bumps the backup pad and takes place to damage when avoiding the silicon chip to place.
Compared with the prior art, the utility model has the following beneficial effects:
1. the water flow in the cleaning machine applies acting force to the sliding seat through the deflector which is obliquely arranged, and the sliding seat is made to reciprocate through the sliding rod and the spring I, so that the rope is driven to move between two adjacent silicon wafers, the phenomenon that the silicon wafers are adhered together due to the fact that the flow directions of the two adjacent silicon wafers are consistent to affect cleaning efficiency or damage the silicon wafers is avoided, the silicon wafers can be better cleaned, cleaning efficiency is guaranteed, and meanwhile, the rope is in a tight state through the torsion spring, the rotating shaft and the winding wheel, and damage to the silicon wafers due to the fact that the rope is prolonged and touched to the silicon wafers is avoided.
2. The knob and the bidirectional screw rod drive the sawtooth rack to move, so that the width between the two corresponding insert slots is adjusted, and therefore, the insert placement support can be carried out on silicon wafers with different sizes in a certain size change range according to requirements, the sawtooth rack does not need to be replaced frequently, and the application range is improved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic view of the whole structure of a special frame for cleaning silicon wafers in the vertical placement;
FIG. 2 is a schematic view of a part of the enlarged structure of the special frame for cleaning silicon wafer in FIG. 1A;
FIG. 3 is a schematic side view of a special frame for cleaning silicon wafers;
FIG. 4 is a schematic top sectional view of a special frame for cleaning silicon wafers according to the present utility model;
FIG. 5 is a schematic view of a part of the enlarged structure of the special frame for cleaning silicon wafer shown in FIG. 4;
FIG. 6 is a schematic view of the overall structure of a special frame for cleaning silicon wafers in the transverse direction;
FIG. 7 is a schematic view of a part of the enlarged structure of the special frame for cleaning silicon wafer shown in FIG. 6;
FIG. 8 is a schematic view of a partial cross-sectional structure of a special frame for cleaning silicon wafers according to the present utility model;
the reference numerals are explained as follows:
1. a support; 2. an anti-blocking unit; 21. a through groove; 22. a slide bar; 23. a first spring; 24. a slide; 25. a deflector; 26. a torsion spring; 27. a rotating shaft; 28. a reel; 29. a string; 210. a placement cavity; 3. a placing rack; 31. a cover plate; 32. a support plate; 33. side baffles; 4. an adjusting unit; 41. a guide rod; 42. a bidirectional screw; 43. a knob; 5. a buffer unit; 51. a storage groove; 52. a second spring; 53. a protective cover; 6. a saw tooth rack; 7. an insert slot; 8. a groove; 9. a damper block; 10. and a cushion pad.
Description of the embodiments
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.
The utility model is further described below with reference to the accompanying drawings:
examples
As shown in fig. 1 to 8, a special frame for cleaning silicon wafers comprises an anti-adhesion unit 2 and a placing frame 3; the upper surface and the lower surface of the placing frame 3 are both provided with a support 1, an external material taking manipulator carries and moves the placing frame 3 through the support 1, the side surface of the placing frame 3 is provided with an adjusting unit 4, two sides of the placing frame 3 are respectively and slidably connected with a saw tooth frame 6, the saw tooth frames 6 are connected with the adjusting unit 4, the equal distances on the opposite side surfaces of the two saw tooth frames 6 are provided with an inserting sheet groove 7, a groove 8 and an anti-adhesion unit 2, the saw tooth frames 6 are supported and limited through the placing frame 3, the saw tooth frames 6 are moved in a certain range through the adjusting unit 4, the distance between the inserting sheet grooves 7 on the two saw tooth frames 6 is adjusted, silicon wafers are supported and placed in the inserting sheet groove 7 in different sizes within a certain size range, the contact area between the silicon wafers and the inserting sheet groove 7 is reduced through the groove 8, so that water flow can enter the inserting sheet groove 7 through the groove 8, thereby facilitating the cleaning of the silicon chip parts in the inserting grooves 7, the anti-adhesion unit 2 comprises a through groove 21, a sliding seat 24 and a thread rope 29, the through groove 21 penetrates through the sawtooth frame 6 and the placing frame 3, a sliding rod 22 is equidistantly arranged in the through groove 21 on the placing frame 3, the sliding rod 22 is positioned between two adjacent inserting grooves 7, a first spring 23 is sleeved on the sliding rod 22, the first spring 23 is connected with the sawtooth frame 6 and the sliding seat 24, two sides of the sliding seat 24 are obliquely provided with guide plates 25, the sliding seat 24 is in sliding connection with the sliding rod 22, a winding component is arranged in the sliding seat 24, two ends of the thread rope 29 are respectively connected with the winding component in the sliding seat 24, the placing frame 3 filled with silicon chips is placed in a cleaning machine, when the silicon chips are cleaned by the water flow, the water flow exerts acting force on the sliding seat 24 through the obliquely arranged guide plates 25, so that the sliding seat 24 slides along the sliding rod 22, and stretch the first spring 23, the elasticity of rethread first spring 23 is to slide 24 reverse tension, thereby make two slide 24 follow slide bar 22 reciprocating motion, make the distance between two slide 24 change, slide 24 receive and release wire rope 29 through the rolling subassembly, make wire rope 29 remove between two adjacent silicon chips, and carry out tensioning to wire rope 29 through the rolling subassembly, avoid wire rope 29 touching the silicon chip, the rivers flow direction between two adjacent silicon chips is disturbed through wire rope 29, avoid two adjacent silicon chips to be in the same place because of the rivers flow direction leads to the silicon chip adhesion to influence abluent efficiency or damage silicon chip, thereby can be better wash the silicon chip, guarantee abluent efficiency.
The winding assembly comprises a torsion spring 26 and a placing cavity 210, the placing cavity 210 is arranged in the sliding seat 24, a rotating shaft 27 is rotationally connected to the placing cavity 210, the rotating shaft 27 is connected with a winding wheel 28, the winding wheel 28 is connected with a wire rope 29, the torsion spring 26 is sleeved on the rotating shaft 27, two ends of the torsion spring 26 are respectively connected with the winding wheel 28 and the sliding seat 24, when the two sliding seats 24 are at the shortest distance, the part of the wire rope 29 between two silicon wafers is in a horizontal state, at the moment, the torsion spring 26 is in a normal state, when the distance between the two sliding seats 24 is prolonged, the wire rope 29 pulls the winding wheel 28, the winding wheel 28 rotates, the wire rope 29 is paid off, when the winding wheel 28 rotates, the torsion spring 26 is stressed to deform, and a reverse acting force is applied to the wire rope 29, so that the wire rope 29 is in a tight state, the wire rope 29 is prevented from touching the silicon wafers due to extension, the wire rope 29 is prevented from being in contact with the silicon wafers, and damage to the wire rope 29 is avoided.
The rack 3 comprises a cover plate 31, the cover plate 31 is connected with the upper end and the lower end of a supporting plate 32 and the upper end and the lower end of a side baffle 33 respectively, the cover plate 31 is connected with the saw-tooth rack 6 in a sliding mode, the side baffle 33 is located on two sides of the supporting plate 32, through grooves 21 are formed in the side baffle 33, the saw-tooth rack 6 is supported and limited through the cover plate 31, the supporting plate 32 and the side baffle 33, and silicon chips placed on the saw-tooth rack 6 are limited through the supporting plate 32.
The adjusting unit 4 comprises a bidirectional screw rod 42 and a guide rod 41, threads at two ends of the bidirectional screw rod 42 are opposite in direction, the bidirectional screw rod 42 is rotationally connected with the supporting plate 32, threads at two ends of the bidirectional screw rod 42 are respectively connected with the two sawtooth frames 6 in a threaded mode, a knob 43 is arranged at the end portion of the bidirectional screw rod 42, the guide rod 41 is arranged at two sides of the supporting plate 32 and is respectively connected with the two guide rods 41 in a sliding mode, the bidirectional screw rod 42 is rotated through the knob 43, the two sawtooth frames 6 are driven to move, accordingly, the distance between the two sawtooth frames 6 is adjusted, silicon wafers are placed conveniently and better, the sawtooth frames 6 can be placed and supported in different-size silicon wafers within a certain size change range, and limiting and guiding are carried out when the sawtooth frames 6 are moved through the guide rod 41.
Still include buffer unit 5, buffer unit 5 is including spring two 52, spring two 52 cup joints on support 1, protection casing 53 and apron 31 are connected respectively at the both ends of spring two 52, protection casing 53 sliding connection support 1 and accomodate groove 51, accomodate groove 51 setting on apron 31, protection casing 53 and accomodate groove 51 are the frustum, when rack 3 was placed into the cleaning machine, rack 3 was in the level and was placed, outside material taking manipulator moved rack 3 through support 1, through spring two 52 and protection casing 53 to rack 3 carry out buffer protection on outside material taking manipulator, avoid getting material in-process outside material taking manipulator and rack 3 collision and cause the damage to the silicon chip.
Still include snubber block 9 and cushion 10, snubber block 9 sets up on apron 31 and the side of backup pad 32 looks parallel and level, carries out buffer protection through snubber block 9 to apron 31, avoids placing the silicon chip into the cleaning machine, causes the silicon chip damage because of the jolt that apron 31 collided the cleaning machine to appear, and cushion 10 sets up in backup pad 32, and cushion 10 is located between two sawtooth framves 6, carries out buffer protection through cushion 10 to the silicon chip, and the collision takes place to damage to backup pad 32 when avoiding the silicon chip to place.
Working principle: according to the size of the silicon wafer to be cleaned, the knob 43 is rotated, the bidirectional screw 42 is driven to rotate through the knob 43, the two saw-tooth frames 6 are driven to move through the bidirectional screw 42, the width between the two corresponding inserting grooves 7 is adjusted, the placing frames 3 are vertically placed, the placing frames 3 are supported through the support 1, the silicon wafer to be cleaned is sequentially inserted into the inserting grooves 7, the silicon wafer is protected through the cushion pad 10, damage to the supporting plate 32 caused by collision in the silicon wafer placing process is avoided, when the inserting is performed, when the two sliding seats 24 are located at the shortest distance, the part of the wire rope 29 between the two silicon wafers is in a horizontal state, after the silicon wafer placing is completed, the placing frames 3 are horizontally placed through the support 1, the supporting plate 32 is positioned below the silicon wafer, the opening direction of the placing frames 3 is upward, the cover plate 31 is supported through the shock-absorbing block 9, the placing frames 3 are moved into the cleaning machine through the support 1, in the moving process, the external material taking manipulator is buffered and protected on the external manipulator through the spring two 52 and the protective cover 53, damage caused by collision of the placing frames 3 in the external manipulator in the process is avoided, when the silicon wafer placing frames are placed, when the silicon wafer is placed, the silicon wafer is placed between the two sliding seats 24 and the sliding seats 24 are pulled along the sliding seat 24, the sliding guide plate 24 is pulled by the sliding rod 24, the water flow, and the water flow is stretched, when the sliding seat 24 is stretched, and the sliding plate 24 is stretched, and the water flow is stretched, and the distance is stretched, and the sliding plate 24 is stretched, and the sliding plate is 24 is stretched, the winding wheel 28 rotates, the winding wheel 28 pays off the wire rope 29, when the winding wheel 28 rotates, the torsion spring 26 deforms under force and applies reverse acting force to the wire rope 29, so that the wire rope 29 is in a horizontal tightening state, the wire rope 29 is prevented from being contacted with silicon wafers due to extension, the water flow direction between two adjacent silicon wafers is disturbed through the wire rope 29, and the silicon wafers are prevented from being adhered together due to the consistent water flow direction to affect the cleaning efficiency or damage the silicon wafers.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (6)
1. The special frame for cleaning the silicon wafer is characterized by comprising the following components: an anti-adhesion unit (2) and a placement frame (3); the utility model discloses a winding device, including rack (3), adjusting unit (4) are all provided with on the upper and lower surface of rack (3), the both sides of rack (3) are sliding connection respectively has sawtooth frame (6), sawtooth frame (6) are connected adjusting unit (4), two equal distance is provided with inserted sheet groove (7), recess (8) and anti-adhesion unit (2) on the opposite side of sawtooth frame (6), anti-adhesion unit (2) are including logical groove (21), slide (24) and cotton rope (29), logical groove (21) run through sawtooth frame (6) with rack (3), logical inslot equidistance on rack (3) is provided with slide bar (22), slide bar (22) are located between two adjacent inserted sheet grooves (7), cup joint spring one (23) on slide bar (22) connect sawtooth frame (6) with slide (24), slide (24) are provided with slide (24) are connected to slide bar (24), slide bar (24) are provided with in the slope, and two ends of the rope (29) are respectively connected with the winding assembly in the sliding seat (24).
2. The special frame for cleaning silicon wafers according to claim 1, wherein: the winding assembly comprises a torsion spring (26) and a placing cavity (210), the placing cavity (210) is arranged in the sliding seat (24), a rotating shaft (27) is connected in the placing cavity (210) in a rotating mode, the rotating shaft (27) is connected with a winding wheel (28), the winding wheel (28) is connected with a rope (29), the torsion spring (26) is sleeved on the rotating shaft (27), and two ends of the torsion spring (26) are respectively connected with the winding wheel (28) and the sliding seat (24).
3. The special frame for cleaning silicon wafers according to claim 1, wherein: the rack (3) comprises cover plates (31), the cover plates (31) are respectively connected with the upper end and the lower end of the supporting plate (32) and the upper end and the lower end of the side baffle plates (33), the cover plates (31) are connected with the sawtooth rack (6) in a sliding mode, the side baffle plates (33) are located on two sides of the supporting plate (32), and the through grooves (21) are formed in the side baffle plates (33).
4. A special frame for cleaning silicon wafers as set forth in claim 3, wherein: the adjusting unit (4) comprises a bidirectional screw (42) and a guide rod (41), threads at two ends of the bidirectional screw (42) are opposite in direction, the bidirectional screw (42) is rotationally connected with the supporting plate (32), threads at two opposite ends of the bidirectional screw (42) are respectively connected with the saw tooth frame (6) in a threaded mode, knobs (43) are arranged at the ends of the bidirectional screw (42), and the guide rod (41) is arranged at two sides of the supporting plate (32) and is respectively connected with the two guide rods (41) in a sliding mode.
5. A special frame for cleaning silicon wafers as set forth in claim 3, wherein: still include buffer unit (5), buffer unit (5) are including spring two (52), spring two (52) cup joint on support (1), protection casing (53) are connected respectively at the both ends of spring two (52) with apron (31), protection casing (53) sliding connection support (1) and accomodate groove (51), accomodate groove (51) setting and be in on apron (31).
6. A special frame for cleaning silicon wafers as set forth in claim 3, wherein: the novel saw tooth rack is characterized by further comprising a shock absorption block (9) and a shock absorption cushion (10), wherein the shock absorption block (9) is arranged on the cover plate (31) and on the side surface of the supporting plate (32) which is flush, the shock absorption cushion (10) is arranged on the supporting plate (32), and the shock absorption cushion (10) is arranged between the two saw tooth racks (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321325780.8U CN219738925U (en) | 2023-05-29 | 2023-05-29 | Special frame for cleaning silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321325780.8U CN219738925U (en) | 2023-05-29 | 2023-05-29 | Special frame for cleaning silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219738925U true CN219738925U (en) | 2023-09-22 |
Family
ID=88063011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321325780.8U Active CN219738925U (en) | 2023-05-29 | 2023-05-29 | Special frame for cleaning silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219738925U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117096075A (en) * | 2023-10-18 | 2023-11-21 | 长春市元尚欣信息科技有限公司 | Silicon wafer loader capable of preventing silicon wafer adhesion |
-
2023
- 2023-05-29 CN CN202321325780.8U patent/CN219738925U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117096075A (en) * | 2023-10-18 | 2023-11-21 | 长春市元尚欣信息科技有限公司 | Silicon wafer loader capable of preventing silicon wafer adhesion |
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