CN219738917U - Pin supporting device for semiconductor packaging - Google Patents
Pin supporting device for semiconductor packaging Download PDFInfo
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- CN219738917U CN219738917U CN202320726371.2U CN202320726371U CN219738917U CN 219738917 U CN219738917 U CN 219738917U CN 202320726371 U CN202320726371 U CN 202320726371U CN 219738917 U CN219738917 U CN 219738917U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 95
- 238000004806 packaging method and process Methods 0.000 title abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 12
- 230000003139 buffering effect Effects 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 5
- 230000000703 anti-shock Effects 0.000 claims 3
- 238000007791 dehumidification Methods 0.000 claims 2
- 238000012360 testing method Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- GQWNECFJGBQMBO-UHFFFAOYSA-N Molindone hydrochloride Chemical compound Cl.O=C1C=2C(CC)=C(C)NC=2CCC1CN1CCOCC1 GQWNECFJGBQMBO-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
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Abstract
The utility model discloses a pin supporting device for semiconductor packaging, which relates to the technical field of auxiliary devices for semiconductor packaging pin supporting, and is characterized in that a dustproof upper cover is arranged above a semiconductor pin supporting main body, an inner fixing transverse plate is arranged at the upper end of the inside of the semiconductor pin supporting main body, one end of the inner fixing transverse plate is provided with a semiconductor pin extending groove, more than two bristle fixing blocks are arranged on the two sides of the semiconductor pin extending groove, the bristle fixing blocks are fixedly connected with the inner fixing transverse plate, pin cleaning bristles are arranged on one side of each bristle fixing block, and the pin cleaning bristles are adhered and connected with the bristle fixing blocks.
Description
Technical Field
The utility model relates to the technical field of auxiliary devices for supporting pins of semiconductor packages, in particular to a pin supporting device for semiconductor packages.
Background
Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high power conversion, etc., and diodes are devices fabricated using semiconductors, and various auxiliary devices are used in semiconductor processing, among which the most frequently used are pin-holding devices for semiconductor packaging.
China patent grant publication No. CN217180976U, grant publication No. 2022, no. 08, no. 12, a chip test pin supporting device, comprising: the base body is used for being detachably connected to the chip testing equipment; the insulation support bar is detachably inserted and assembled with the base body along the vertical direction, the insulation support bar is provided with a chip pin sliding surface which is vertically arranged, the lower end of the chip pin sliding surface is horizontally provided with a chip pin positioning surface, the base body is provided with a first limiting surface, and the insulation support bar is provided with a second limiting surface; the second limiting surface is propped against the first limiting surface from top to bottom.
Although the above scheme improves the connection precision of the insulating support bar and the base body, the dimensional precision of the falling channel defined by the chip test pin supporting device is correspondingly higher, but the problem that equipment cannot be used normally due to insufficient dust treatment on the semiconductor pins when the chip test pin supporting device is used is solved.
Disclosure of Invention
The utility model aims to provide a pin supporting device for semiconductor packaging, which solves the problem that the service life of equipment is greatly reduced due to insufficient dust treatment outside pins when the pin supporting device for semiconductor packaging is used in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a pin supporting device for semiconductor package comprises a semiconductor pin supporting body,
a dustproof upper cover arranged above the semiconductor pin supporting main body, wherein the upper end of the semiconductor pin supporting main body is provided with an internal fixing transverse plate, one end of the internal fixing transverse plate is provided with a semiconductor pin extending groove, and the semiconductor pin extending groove is provided with more than two,
the semiconductor device comprises a semiconductor pin, a bristle fixing block, an inner fixing transverse plate and a pin cleaning bristle, wherein the bristle fixing block is arranged on two sides of the semiconductor pin extending into the groove, the bristle fixing block is fixedly connected with the inner fixing transverse plate, the pin cleaning bristle is arranged on one side of the bristle fixing block, and the pin cleaning bristle is adhered and connected with the bristle fixing block.
Preferably, a fixed lower plate block is arranged below the inside of the semiconductor pin supporting main body, the fixed lower plate block is fixedly connected with the semiconductor pin supporting main body through an electric push rod, and a push rod protection outer block is arranged outside the electric push rod.
Preferably, the top of fixed lower plate piece is provided with the propelling movement soft block, and the propelling movement soft block passes through ejecting awl piece fixed connection with fixed lower plate piece, ejecting awl piece is provided with more than two, four corners of semiconductor pin support main part below all are provided with unable adjustment base, and unable adjustment base and semiconductor pin support main part paste and be connected.
Preferably, the intermediate position department of semiconductor pin support main part one side is provided with the access cover board, the lower extreme of access cover board is provided with out the cross handle, one side of access cover board is provided with range sensor, and range sensor passes through electric connection with electric putter, the top of dustproof top lid is provided with the protection and goes up the soft piece, and the protection goes up soft piece and passes through draw-in groove fixed connection with dustproof top lid, the both ends of dustproof top lid one side all are provided with and pull the recess, and pull the recess and be provided with more than two.
Preferably, the middle position department of dustproof top lid below is provided with the upper block in the shock-proof, the outside of upper block is provided with spacing lower circle piece in the shock-proof, the outside of spacing lower circle piece is provided with prevents rocking rubber ring, the outside of preventing rocking rubber ring top is provided with the soft circle piece of buffering.
Preferably, the outside of buffering soft circle piece is provided with prevents rocking down the circle piece, and prevents rocking down circle piece and dustproof top lid fixed connection, the inner wall of preventing rocking down the circle piece is provided with spacing toper piece, and spacing toper piece is connected with preventing rocking down the circle piece paste, spacing toper piece is provided with more than two, the both sides of internal fixation diaphragm top all are provided with the damp removal internal block, and the damp removal internal block passes through draw-in groove fixed connection with semiconductor pin support main part.
Compared with the prior art, the utility model has the beneficial effects that:
1. this kind of semiconductor packaging is with pin strutting arrangement compares with current semiconductor packaging pin strutting arrangement, has equipped with brush hair fixed block and pin clearance brush hair, and the fixed more convenient of pin clearance brush hair can be let in the design of brush hair fixed block, can effectively with remaining the better processing of the outside dust of pin through the integrated design of brush hair fixed block and pin clearance brush hair, has solved current semiconductor packaging and has often because the problem to lead to equipment life greatly reduced to the outside dust processing of pin is not enough when using with pin strutting arrangement.
2. This kind of semiconductor package is with pin strutting arrangement compares with current semiconductor package pin strutting arrangement, has equipped with range sensor and electric putter, and range sensor's design can let electric putter's action more convenient, and range sensor and electric putter's integrated design can let the semiconductor pin more convenient when ejecting, has solved current semiconductor package and has used pin strutting arrangement often because take out inconvenient and the problem that leads to staff's operation degree of difficulty to increase inadequately to the semiconductor pin when using.
Drawings
FIG. 1 is a perspective view of the overall structure of the present utility model;
FIG. 2 is a cross-sectional view of the overall structure of the present utility model;
FIG. 3 is an enlarged view of a portion of the area A of FIG. 2 in accordance with the present utility model;
fig. 4 is an enlarged view of a portion of the area B of fig. 2 in accordance with the present utility model.
In the figure: 1. a semiconductor pin supporting body; 2. a dust-proof upper cover; 3. protecting the upper soft block; 4. pulling the groove; 5. a ranging sensor; 6. an access panel; 7. digging out a transverse handle; 8. the push rod protects the outer block; 9. an electric push rod; 10. a fixed base; 11. fixing the lower plate; 12. removing the damp inner block; 13. an inner fixed transverse plate; 14. an anti-impact inner upper block; 15. buffering the soft ring block; 16. a limit conical block; 17. anti-shake lower ring block; 18. limiting the lower ring block; 19. anti-shaking rubber ring; 20. the semiconductor pins extend into the slots; 21. a bristle fixing block; 22. cleaning brush hair on the pin; 23. pushing out the cone block; 24. pushing the soft block.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, an embodiment of the present utility model is provided: a pin supporting device for semiconductor package includes a semiconductor pin supporting body 1,
a dust-proof upper cover 2 provided above the semiconductor pin supporting body 1, and an inner fixing cross plate 13 is provided at an upper end of an inside of the semiconductor pin supporting body 1, and a semiconductor pin inserting groove 20 is provided at one end of the inner fixing cross plate 13, and two or more semiconductor pin inserting grooves 20 are provided,
and a bristle fixing block 21 which is arranged at two sides of the semiconductor pins extending into the groove 20, wherein the bristle fixing block 21 is fixedly connected with the inner fixing transverse plate 13, one side of the bristle fixing block 21 is provided with pin cleaning bristles 22, and the pin cleaning bristles 22 are adhered and connected with the bristle fixing block 21.
When the pin supporting device for semiconductor packaging is used, the pin supporting device for semiconductor packaging is moved to a position where the pin supporting device is required to be used, then the dustproof upper cover 2 can be taken down from the upper side of the semiconductor pin supporting main body 1, at the moment, the semiconductor pins required to be supported can be placed into the semiconductor pin extending groove 20, then the pin cleaning bristles 22 and the bristle fixing blocks 21 on two sides of the semiconductor pin extending groove 20 can effectively treat residues remained outside the semiconductor pins.
Referring to fig. 1, an access cover plate 6 is arranged at the middle position of one side of a semiconductor pin supporting main body 1, a digging-out transverse handle 7 is arranged at the lower end of the access cover plate 6, a ranging sensor 5 is arranged at one side of the access cover plate 6, the ranging sensor 5 is electrically connected with an electric push rod 9, a protection upper soft block 3 is arranged above a dustproof upper cover 2, the protection upper soft block 3 is fixedly connected with the dustproof upper cover 2 through a clamping groove, the connection between the protection upper soft block 3 and the dustproof upper cover 2 is firmer, a pulling groove 4 is formed at two ends of one side of the dustproof upper cover 2, and more than two pulling grooves 4 are formed;
referring to fig. 2, a fixed lower plate 11 is disposed below the inside of the semiconductor pin supporting body 1, the fixed lower plate 11 is fixedly connected with the semiconductor pin supporting body 1 through an electric push rod 9, so that the connection between the fixed lower plate 11 and the semiconductor pin supporting body 1 is firmer, a push rod protection outer block 8 is disposed outside the electric push rod 9, fixing bases 10 are disposed at four corners below the semiconductor pin supporting body 1, the fixing bases 10 are in adhesive connection with the semiconductor pin supporting body 1, so that the connection between the fixing bases 10 and the semiconductor pin supporting body 1 is firmer, an anti-impact inner upper block 14 is disposed at the middle position below the dustproof upper cover 2, moisture removing inner blocks 12 are disposed on two sides above the inner fixed transverse plate 13, and the moisture removing inner blocks 12 are fixedly connected with the semiconductor pin supporting body 1 through clamping grooves, so that the connection between the moisture removing inner blocks 12 and the semiconductor pin supporting body 1 is firmer;
referring to fig. 3 and 4, a pushing soft block 24 is disposed above the fixed lower plate 11, and the pushing soft block 24 is fixedly connected with the fixed lower plate 11 through a pushing cone block 23, so that the connection between the pushing soft block 24 and the fixed lower plate 11 is firmer, the pushing cone block 23 is provided with more than two limiting lower ring blocks 18, the outer part of the upper block 14 is provided with a shaking preventing rubber ring 19, the outer part of the limiting lower ring blocks 18 is provided with a buffering soft ring block 15, the outer part of the buffering soft ring block 15 is provided with a shaking preventing lower ring block 17, the shaking preventing lower ring block 17 is fixedly connected with the dustproof upper cover 2, the shaking preventing lower ring block 17 is more firmly connected with the dustproof upper cover 2, the inner wall of the shaking preventing lower ring block 17 is provided with a limiting cone block 16, the limiting cone block 16 is in adhesive connection with the shaking preventing lower ring block 17, the connection between the limiting cone block 16 and the shaking preventing lower ring block 17 is firmer, and the limiting cone block 16 is provided with more than two shaking preventing lower ring blocks 17.
Working principle: when the pin supporting device for semiconductor packaging is used, firstly, the pin supporting device for semiconductor packaging is moved to a position where the pin supporting device is required to be used, then the dustproof upper cover 2 can be taken down from the upper side of the semiconductor pin supporting main body 1, at the moment, the semiconductor pins which need to be supported can be placed into the semiconductor pin inserting groove 20, then the pin cleaning bristles 22 and the bristle fixing blocks 21 on two sides of the semiconductor pin inserting groove 20 can effectively treat residues outside the semiconductor pins, when the reported pin is required to be taken out, the hand can be placed on one side of the ranging sensor 5, then the ranging sensor 5 can transmit signals to the electric push rod 9, at the moment, the electric push rod 9 can act upwards, and the pushing cone block 23 and the pushing soft block 24 which are arranged at the upper end of the fixed lower plate 11 can better push the semiconductor pins.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A pin supporting device for semiconductor package, comprising a semiconductor pin supporting body (1), characterized in that:
a dustproof upper cover (2) which is arranged above the semiconductor pin supporting main body (1), wherein an inner fixing transverse plate (13) is arranged at the upper end of the inside of the semiconductor pin supporting main body (1), one end of the inner fixing transverse plate (13) is provided with a semiconductor pin extending groove (20), and more than two semiconductor pin extending grooves (20) are arranged,
the semiconductor device comprises a bristle fixing block (21), wherein the bristle fixing block (21) is arranged on two sides of the inside of a semiconductor pin extending into a groove (20), the bristle fixing block (21) is fixedly connected with an inner fixing transverse plate (13), pin cleaning bristles (22) are arranged on one side of the bristle fixing block (21), and the pin cleaning bristles (22) are adhered to the bristle fixing block (21).
2. The pin supporting device for semiconductor package according to claim 1, wherein: the semiconductor pin support comprises a semiconductor pin support main body (1), wherein a fixed lower plate block (11) is arranged below the inside of the semiconductor pin support main body (1), the fixed lower plate block (11) is fixedly connected with the semiconductor pin support main body (1) through an electric push rod (9), and a push rod protection outer block (8) is arranged outside the electric push rod (9).
3. The pin supporting device for semiconductor package according to claim 2, wherein: the upper side of fixed lower plate (11) is provided with propelling movement soft block (24), and propelling movement soft block (24) and fixed lower plate (11) pass through ejecting awl piece (23) fixed connection, ejecting awl piece (23) are provided with more than two, four corners of semiconductor pin support main part (1) below all are provided with unable adjustment base (10), and unable adjustment base (10) are connected with semiconductor pin support main part (1) paste.
4. A pin supporting device for semiconductor package according to claim 3, wherein: the semiconductor pin supporting body is characterized in that an overhaul cover plate (6) is arranged at the middle position of one side of the semiconductor pin supporting body (1), a transverse handle (7) is arranged at the lower end of the overhaul cover plate (6), a distance measuring sensor (5) is arranged on one side of the overhaul cover plate (6), the distance measuring sensor (5) is electrically connected with an electric push rod (9), a protection upper soft block (3) is arranged above the protection upper soft block (2), the protection upper soft block (3) is fixedly connected with the protection upper soft block (2) through a clamping groove, pulling grooves (4) are formed in two ends of one side of the protection upper soft block (2), and the pulling grooves (4) are formed in more than two sides.
5. The pin supporting device for semiconductor package according to claim 4, wherein: the anti-shock anti-vibration device is characterized in that an anti-shock inner upper block (14) is arranged at the middle position below the anti-dust upper cover (2), a limiting lower ring block (18) is arranged outside the anti-shock inner upper block (14), an anti-vibration rubber ring (19) is arranged outside the limiting lower ring block (18), and a buffer soft ring block (15) is arranged outside the upper part of the anti-vibration rubber ring (19).
6. The pin supporting device for semiconductor package according to claim 5, wherein: the outside of buffering soft circle piece (15) is provided with prevents rocking down circle piece (17), and prevents rocking down circle piece (17) and dustproof top lid (2) fixed connection, the inner wall of preventing rocking down circle piece (17) is provided with spacing toper piece (16), and spacing toper piece (16) are connected with preventing rocking down circle piece (17) paste, spacing toper piece (16) are provided with more than two, the both sides of internal fixation diaphragm (13) top all are provided with in the dehumidification piece (12), and in the dehumidification piece (12) and semiconductor pin support main part (1) pass through draw-in groove fixed connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320726371.2U CN219738917U (en) | 2023-03-27 | 2023-03-27 | Pin supporting device for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320726371.2U CN219738917U (en) | 2023-03-27 | 2023-03-27 | Pin supporting device for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219738917U true CN219738917U (en) | 2023-09-22 |
Family
ID=88060781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320726371.2U Active CN219738917U (en) | 2023-03-27 | 2023-03-27 | Pin supporting device for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219738917U (en) |
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2023
- 2023-03-27 CN CN202320726371.2U patent/CN219738917U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |