CN219727541U - Micropore atomizing piece chip mounter - Google Patents

Abstract

The utility model belongs to the technical field of microporous atomizing sheet processing, and relates to a microporous atomizing sheet chip mounter, which comprises a machine table, wherein a ceramic sheet feeding mechanism for feeding ceramic sheets is arranged on the machine table, a support plate is arranged on one side of the ceramic sheet feeding mechanism, a ceramic sheet bearing platform is rotatably connected to one side of the support plate away from the machine table, the ceramic sheet bearing platform is a hollow table, a chip bearing groove is formed in one side of the ceramic sheet bearing platform away from the support plate, a vacuum component is communicated with the bottom of the chip bearing groove through the inside of the ceramic sheet bearing platform, a scraping sliding table is arranged between the support plate and the machine table, a sliding component for driving the support plate to move along the scraping sliding table is arranged between the support plate and the scraping sliding table, a substrate storage plate is arranged on one side of the scraping sliding table along the length direction, a positioning area for positioning an atomized substrate is arranged on one side of the substrate storage plate away from the machine table, and a printing mechanism is arranged on the other side of the substrate storage plate. The utility model has the effect of carrying out batch operation.

Description

Micropore atomizing piece chip mounter

Technical Field

The utility model relates to the field of microporous atomizing sheet processing, in particular to a microporous atomizing sheet chip mounter.

Background

The micropore atomizing piece has the effect that utilizes electron high frequency oscillation to atomize liquid, and micropore atomizing piece includes atomizing substrate and piezoceramics piece, and wherein, the production process of micropore atomizing piece includes the paster process, and to be about to atomize substrate and piezoceramics piece and pass through glue bonding, the laminating of micropore atomizing piece accessible chip mounter realization atomizing substrate and piezoceramics piece.

The existing chip mounter generally comprises a machine table, wherein a feeding mechanism for ceramic sheet feeding is arranged on the machine table, the feeding mechanism comprises an adsorption nozzle for vacuum adsorption of ceramic sheets, one side of the feeding mechanism is provided with a laminating bearing platform for placing the ceramic sheets to be laminated, a driving mechanism is arranged between the laminating bearing platform and the machine table, and a dispensing mechanism and an adsorption mechanism are arranged on one side of the laminating bearing platform away from the machine table.

The feeding mechanism can adsorb the ceramic wafer on the laminating cushion cap, and when the actuating mechanism drive laminating cushion cap rotated to the point mechanism of gluing, the point mechanism of gluing is in the surperficial point coating glue of ceramic wafer. After the ceramic wafer is glued, the driving mechanism drives the laminating cushion cap to rotate to the adsorption mechanism, and the adsorption mechanism adsorbs the gluing surface of atomizing substrate to piezoceramics wafer to accomplish the laminating of micropore atomizing piece.

However, the existing chip mounter can only finish the lamination of a plurality of microporous atomization sheets at a time generally, batch lamination operation cannot be performed, and the lamination defective rate is high.

Disclosure of Invention

In order to solve the problems that the conventional chip mounter can only finish the lamination of a plurality of microporous atomization sheets at a time, the batch lamination operation cannot be performed, and the lamination defective rate is high, the utility model provides the microporous atomization sheet chip mounter.

The micropore atomization sheet chip mounter provided by the utility model adopts the following technical scheme:

micropore atomizing piece chip mounter, including the board, be provided with the ceramic chip feed mechanism that is used for ceramic chip material loading on the board, one side of ceramic chip feed mechanism is provided with the backup pad, and one side that the backup pad was kept away from the board rotates and is connected with the ceramic chip cushion cap, and the ceramic chip cushion cap is hollow platform, and the ceramic chip cushion cap is kept away from one side of backup pad and is offered and hold the piece groove, and the tank bottom of holding the piece groove has vacuum assembly through the inside intercommunication of ceramic chip cushion cap, is provided with the scraping slip table between backup pad and the board, is provided with the slip subassembly that is used for driving the backup pad and follow the scraping slip table and remove between backup pad and the scraping slip table, and one side that the scraping slip table is provided with the substrate stock along length direction, and one side that the substrate stock plate was kept away from the board is provided with the location area that is used for atomizing the substrate location, and the opposite side is provided with seal mechanism.

Through adopting above-mentioned technical scheme, when micropore atomizing piece paster, the potsherd adsorbs to the spangle inslot through potsherd adsorption equipment, and vacuum assembly will hold the air in spangle inslot and the potsherd cushion cap to take out, holds the spangle inslot to be fixed in under the pressure effect and holds the spangle inslot. The sliding driving assembly drives the supporting plate to move along the scraping sliding table, the supporting plate drives the ceramic chip bearing platform to move to the glue printing mechanism, and the ceramic chip finishes glue coating in the glue printing mechanism. The sliding driving assembly drives the supporting plate to move to the substrate storage plate along the scraping sliding table, and the supporting plate drives the ceramic chip bearing platform to move. When the ceramic chip is conveyed to the substrate storage plate along with the ceramic chip bearing platform, the ceramic chip bearing platform is rotated, the ceramic chip bearing platform is turned over and covered on a positioning area of the substrate storage plate, the ceramic chip is turned over along with the ceramic chip bearing platform and is attached to an atomized substrate placed in the positioning area, the ceramic chip bearing platform is rotated again, and the attached microporous atomized chips are adsorbed in the chip carrying groove through the vacuum component, so that batch attaching operation of the chip mounter can be realized.

Optionally, set up the correction board between ceramic chip adsorption equipment and the ceramic chip cushion cap, correction hole has been run through to one side that the board was kept away from to the correction board, is provided with the lifter plate between correction board and the board, and one side that the lifter plate is close to the correction board is connected with the jack-prop with correction hole looks adaptation, and one side that the lifter plate is close to the board is connected with lift drive assembly.

Through adopting above-mentioned technical scheme, the potsherd adsorbs to correction board department through potsherd adsorption equipment to fall into the correction downthehole, in order to inject the position that the potsherd is located the correction board, when needs shift the potsherd to the spangle inslot of potsherd cushion cap, lift drive assembly drive lifter plate rises, and the lifter plate drives the nail post and upwards moves in order to jack up the potsherd. At this moment, the slip drive assembly drives the backup pad and moves to one side of correcting plate along the frictioning platform that slides, rotates the ceramic chip cushion cap so that ceramic chip cushion cap lid closes in the corresponding side of correcting plate, and vacuum assembly adsorbs the ceramic chip of jack-up in holding the piece inslot through the pressure effect, and the correction is accomplished to the ceramic chip, is favorable to improving the regularity when ceramic chip and atomizing substrate subsides in order to reduce the defective products rate of laminating.

Optionally, the slip subassembly is including installing in the deflector of one side that the frictioning slip table is close to the backup pad, and the outer wall cover of deflector is equipped with the guide ring, and the outer wall and the backup pad of guide ring are connected, and the guide ring wears to be equipped with the lead screw along the one end of the direction of movement of backup pad, is connected with the motor on the lead screw.

Through adopting above-mentioned technical scheme, the motor drives the lead screw and rotates, and lead screw and guide ring threaded connection drive the guide ring and follow the deflector and remove, and then the guide ring moves the backup pad and remove, simple operation.

Optionally, seal and glue the mechanism including installing in the support of board, the support is provided with the seal and glues the screen frame in one side of keeping away from the board, and the seal is glued the screen frame and is provided with the scraper in one side of keeping away from the board, and one side of scraper is provided with the gumming mouth, and one side of keeping away from the seal and glues the screen frame is connected with the movable plate, and the movable plate is connected with the frictioning drive assembly that is used for driving the movable plate to remove.

Through adopting above-mentioned technical scheme, when the backup pad moves to seal gum mechanism along the frictioning slip table through the subassembly drive that slides, frictioning drive assembly drives the connecting plate and removes, and glue is poured out to the gumming mouth, and the connecting plate drives the scraper and removes and pass through seal gum screen frame coating on the corresponding face of potsherd, can realize the batch brush of potsherd and glue, improves the convenience of potsherd rubber coating.

Optionally, a substrate stock plate is provided with the back-up table along one side of the length direction of frictioning slip table, is provided with the connecting plate between back-up table and the board.

Through adopting above-mentioned technical scheme, after the laminating with atomizing substrate is accomplished to the potsherd, rotate the potsherd cushion cap to on the back cushion cap, close vacuum assembly after, by gravity effect, hold the micropore atomizing piece of piece inslot completion paster and can drop to on the back cushion cap, can realize the batch unloading of micropore atomizing piece, improve the convenience of operation.

Optionally, the substrate storage plate is provided with a plurality of positioning through grooves in the positioning area.

Through adopting above-mentioned technical scheme, during atomizing substrate material loading, can place atomizing substrate in logical inslot, atomizing substrate realizes the location so that laminating with the potsherd, simple structure and easy operation.

Optionally, the bottom wall of the chip supporting groove is concavely formed with a concave end towards the inside of the ceramic chip bearing platform.

Through adopting above-mentioned technical scheme, the potsherd is placed in and is held the piece inslot, when the broken or other circumstances that need take out the potsherd by holding the piece inslot of potsherd appear, stretches into in the concave end and can be convenient for collude the potsherd, improves the convenience of operation.

Optionally, the lift drive assembly is including installing in the lifter plate one side of keeping away from the correction board, and the guide bar is the telescopic link, and the one end that the lifter plate was kept away from to the guide bar is connected with the bottom plate, and one side that the lifter plate is close to the board is connected with the gas.

Through adopting above-mentioned technical scheme, cylinder drive lifter plate goes up and down, and the guide bar is flexible in order to play spacing and guiding effect to lifter plate's elevating movement to improve lifter plate stability of going up and down.

In summary, the utility model has the following beneficial technical effects:

1. when the hole atomizes the chip patch, the ceramic chip is absorbed into the chip bearing groove through the ceramic chip absorption mechanism. The sliding driving assembly drives the supporting plate to move along the scraping sliding table, and the supporting plate drives the ceramic chip bearing platform to move to the glue printing mechanism so as to finish glue coating. The sliding driving assembly drives the supporting plate to move to the substrate storage plate along the scraping sliding table, the ceramic chip bearing platform is rotated, and the ceramic chip bearing platform is turned over and covered on the positioning area at the substrate storage plate to enable the ceramic chip to be attached to the atomized substrate, so that batch attaching operation of the chip mounter can be realized;

2. the ceramic chip is adsorbed by the ceramic chip adsorption mechanism and is placed in the correction hole, and the ceramic chip can be corrected by the arrangement of the correction plate, so that the regularity of the ceramic chip when the ceramic chip is attached to the atomized substrate is improved, and the attaching defective rate is reduced;

drawings

Fig. 1 is a schematic structural view of a microporous atomizing sheet chip mounter.

FIG. 2 is a schematic diagram showing a partial structure at a tile cap.

Fig. 3 is a schematic diagram showing a partial structure at the correction plate.

FIG. 4 is a schematic diagram showing the structure of the substrate stock plate and the tile cap.

Fig. 5 is a schematic view of the structure at the glue printing mechanism.

Fig. 6 is a schematic structural view showing a doctor blade sliding table after hiding a guide plate.

Reference numerals illustrate:

1. a machine table; 2. a ceramic chip adsorption mechanism; 3. a ceramic chip bearing platform; 31. a wafer carrying groove; 311. a recessed end; 32. a support plate; 33. a vacuum assembly; 331. a vacuum tube; 332. a vacuum pump; 4. a scraping sliding table; 41. a guide plate; 42. a guide ring; 43. a screw rod; 44. a motor; 5. a substrate stock plate; 51. a positioning area; 511. positioning through grooves; 52. a film backing bearing platform; 53. a connecting plate; 6. a glue printing mechanism; 61. a bracket; 62. printing a glue screen frame; 63. a scraper; 64. a glue flowing nozzle; 65. a moving plate; 66. a doctor blade moving assembly; 661. a roller; 662. a synchronous belt; 663. a glue printing mobile motor; 7. a correction plate; 71. a correction hole; 72. a lifting plate; 721. a top column; 722. a guide rod; 723. a cylinder; 724. a bottom plate; 8. a ceramic sheet; 9. atomizing the substrate;

Detailed Description

The present utility model will be described in further detail below.

The embodiment of the utility model discloses a micropore atomization chip mounter, which comprises a machine table 1, wherein a ceramic chip adsorption mechanism 2 is arranged on the machine table 1, a ceramic chip bearing table 3 is arranged on one side of the ceramic chip adsorption mechanism 2, a scraping sliding table 4 is arranged between the ceramic chip bearing table 3 and the machine table 1, a substrate storage plate 5 is arranged on one side of the scraping sliding table 4 along the length direction, a printing mechanism 6 is arranged on the other side of the scraping sliding table, and a correction plate 7 is arranged on one side of the substrate storage plate 5.

Referring to fig. 2 and 3, a tile adsorption mechanism 2 is provided on a machine 1, a correction plate 7 is provided on one side of the tile adsorption mechanism 2, the correction plate 7 is a horizontally provided gate plate, an opening end of the correction plate 7 faces the machine 1, a plurality of correction holes 71 are provided on one side of the correction plate 7 away from the machine 1 in a penetrating manner, the correction holes 71 are uniformly distributed on the correction plate 7, the correction holes 71 are round through holes matched with the ceramic tiles 8, and an axial direction of the correction holes is perpendicular to a length direction of the correction plate 7. The correction board 7 is provided with the lifter plate 72 near one side of board 1, and lifter plate 72 is the long board that the level set up, and the length direction of lifter plate 72 is unanimous with the length direction of correction board 7. The lifting plate 72 is connected with a jack 721 at one side close to the correction plate 7, the jack 721 is a round rod matched with the correction hole 71, and one end of the jack 721 far away from the lifting plate 72 penetrates through the correction hole 71.

One side of the lifting plate 72 far away from the correction plate 7 is connected with a guide rod 722, the guide rod 722 is a telescopic round rod which is vertically arranged, and the axial direction of the guide rod 722 is vertical to the length direction of the lifting plate 72. The guide bar 722 is connected to a bottom plate 724 at one end far away from the lifting plate 72, and the bottom plate 724 is mounted on the machine 1. The bottom plate 724 is a horizontally arranged long plate, the length direction is consistent with the length direction of the lifting plate 72, an air cylinder 723 is arranged between the bottom plate 724 and the lifting plate 72, and the piston rod end of the air cylinder 723 is connected with the corresponding side of the lifting plate 72.

Referring to fig. 4, a substrate stock plate 5 is provided at one side of the correction plate 7, the substrate stock plate 5 is a horizontally-arranged long plate, and the length direction of the substrate stock plate 5 is parallel to the length direction of the correction plate 7. A supporting seat for supporting the substrate stock plate 5 is arranged between the substrate stock plate 5 and the machine 1, a positioning area 51 is arranged on one side of the substrate stock plate 5 away from the machine 1, a positioning through groove 511 is formed in the positioning area 51 in a penetrating mode of the substrate stock plate 5, the positioning through groove 511 is a contracted circular through groove, the axial direction of the positioning through groove 511 is perpendicular to the length direction of the substrate stock plate 5, the open end of the positioning through groove 511 is located in the positioning area 51, and the necking end of the positioning through groove 511 is located on one side of the substrate stock plate 5 close to the machine 1. The aperture of the reduced end of the positioning through groove 511 is smaller than the diameter of the atomized substrate 9.

The substrate stock board 5 is kept away from one side of correcting board 7 and is provided with connecting plate 53, and connecting plate 53 is the L template of vertical setting, and the horizontal section of connecting plate 53 is installed on board 1, and the reverse pile cap 52 is installed to one side that board 1 was kept away from to the vertical section of connecting plate 53, and reverse pile cap 52 is the long platy that the level set up, and the length direction of reverse pile cap 52 is unanimous with the length direction of substrate stock board 5.

Referring to fig. 6, the rewind table 52 is provided with a doctor blade 4 along one side of the alignment plate 7, the substrate stock plate 5, and the rewind table 52 in the distribution direction, the doctor blade 4 is in the form of a horizontally-disposed bar, and the length direction of the doctor blade 4 is identical to the distribution direction of the alignment plate 7, the substrate stock plate 5, and the rewind table 52. One side of the scraping sliding table 4, which is far away from the machine table 1, is inwards recessed to form a groove, the scraping sliding table 4 is rotationally connected with a screw rod 43 in the groove, the axial direction of the screw rod 43 is consistent with the length direction of the scraping sliding table 4, and one end of the screw rod 43 along the axial direction is connected with a motor 44. The guide plate 41 is installed at the notch of the groove in the scraping sliding table 4, the guide plate 41 is a horizontally arranged long plate, and the length direction is consistent with the length direction of the scraping sliding table 4. The outer wall of the guide plate 41 is sleeved with a guide ring 42, the guide ring 42 is a rectangular ring which is horizontally arranged, and the inner annular wall of the guide ring 42 is connected with the outer wall of the guide plate 41 in a sliding manner. The guide ring 42 extends in the groove of the lateral scraping sliding table 4 close to the scraping sliding table 4 and is sleeved on the outer wall of the screw rod 43, and the guide ring 42 is in threaded connection with the screw rod 43.

Referring to fig. 2 and 4, one end of the guide ring 42, which is far away from the scraping sliding table 4, is connected with two support plates 32, the two rotation plates are distributed along the length direction of the scraping sliding table 4, the support plates 32 are horizontally arranged long plates, and the length direction of the support plates 32 is perpendicular to the length direction of the scraping sliding table 4. One end of the support plate 32 far away from the guide ring 42 is connected with a ceramic chip bearing platform 3, the ceramic chip bearing platform 3 is a hollow long plate which is horizontally arranged, and the length direction of the ceramic chip bearing platform 3 is consistent with the length direction of the support plate 32. The ceramic chip bearing platform 3 is far away from the side of the supporting plate 32 and provided with a chip bearing groove 31, the chip bearing groove 31 is a circular groove matched with the ceramic chip 8, the groove bottom of the chip bearing groove 31 is communicated with the inside of the ceramic chip bearing platform 3, and the groove bottom of the chip bearing groove 31 is inwards recessed to form a recessed end 311. The ceramic chip bearing platform 3 is close to the vacuum assembly 33 of one side intercommunication of backup pad 32, and vacuum assembly 33 includes the vacuum tube 331 with ceramic chip bearing platform 3 intercommunication, and the vacuum pump 332 is kept away from to one side intercommunication of ceramic chip bearing platform 3 to vacuum tube 331.

Referring to fig. 5, a glue printing mechanism 6 is disposed on a side of the glue scraping sliding table 4 away from the rewinding table 52, the glue printing mechanism 6 includes a support 61 mounted on the machine 1, a glue printing screen frame 62 is mounted on a side of the support 61 away from the machine 1, the glue printing screen frame 62 is a screen frame disposed horizontally, and a length direction of the glue printing screen frame 62 is perpendicular to a length direction of the glue scraping sliding table 4. One side of seal gum screen frame 62 far away from board 1 is provided with scraper 63, scraper 63 is the scraper blade that the level set up, and one side of scraper 63 along seal gum screen frame 62's length direction is provided with the gumming mouth 64 that is used for out the glue, and one side of scraper 63 far away from seal gum screen frame 62 is connected with movable plate 65, and movable plate 65 is the long board that the level set up, and the length direction of movable plate 65 is mutually perpendicular with the length direction of seal gum screen frame 62. One side of the moving plate 65 in the length direction is connected with a synchronous belt 662, one end of the synchronous belt 662 along the moving direction of the moving plate 65 is sleeved with a roller 661, and the other end is sleeved with a glue printing moving motor 663.

The implementation principle of the microporous atomizing sheet chip mounter provided by the embodiment of the utility model is as follows: referring to fig. 3 and 4, when the microporous atomizing sheet is attached, the ceramic sheet 8 is adsorbed in the correction hole 71 by the ceramic sheet adsorption mechanism 2, the air cylinder 723 drives the lifting plate 72 to lift, and the lifting plate 72 drives the nail column to move upwards so as to jack up the ceramic sheet 8. At this time, the supporting plate 32 moves to one side of the correction plate 7 along the doctor-blade sliding table, and rotates the tile cap 3 to make the tile cap 3 cover the corresponding side of the correction plate 7, and the vacuum assembly 33 adsorbs the lifted ceramic tile 8 in the tile receiving slot 31 under the pressure action. Referring to fig. 6, the motor 44 drives the screw 43 to rotate, the screw 43 drives the guide ring 42, the support plate 32 and the ceramic chip carrier 3 to move along the doctor-blading sliding table 4, referring to fig. 5, the support plate 32 drives the ceramic chip carrier 3 to move to the glue printing mechanism 6, and the ceramic chip 8 finishes the glue coating in the glue printing mechanism 6.

The glue flowing nozzle 64 is used for discharging glue on the glue printing screen frame 62 and scraping and coating the glue onto the ceramic wafer 8 through scraping and guiding, and the motor 44 drives the screw rod 43 to rotate, and finally drives the supporting plate 32 to move to the position of the substrate storage plate 5 along the glue scraping sliding table 4. Referring to fig. 4, when the ceramic chip 8 is transported to the substrate storage plate 5 along with the ceramic chip carrier 3, the ceramic chip carrier 3 is rotated, the ceramic chip carrier 3 is turned over and covers the positioning area 51 at the substrate storage plate 5, the ceramic chip 8 is turned over along with the ceramic chip carrier 3 and is attached to the atomized substrate 9 placed in the positioning area 51, the ceramic chip carrier 3 is rotated again, and the attached microporous atomized chip is adsorbed in the chip carrying groove 31 through the vacuum component 33, so that batch attaching operation of the chip mounter can be realized.

The above embodiments are not intended to limit the scope of the present utility model, so: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.

Claims (8)

1. Micropore atomizing piece chip mounter, including board (1), be provided with on board (1) and be used for ceramic chip (8) material loading ceramic chip adsorption equipment (2), its characterized in that: one side of ceramic chip adsorption device (2) is provided with backup pad (32), one side that backup pad (32) were kept away from board (1) rotates and is connected with ceramic chip cushion cap (3), ceramic chip cushion cap (3) are hollow platform, one side that backup pad (32) was kept away from to ceramic chip cushion cap (3) has been seted up and has been held piece groove (31), the inside intercommunication of holding piece groove (31) through ceramic chip cushion cap (3) has vacuum assembly (33), be provided with between backup pad (32) and board (1) and scrape gluey slip table (4), be provided with between backup pad (32) and the scrape gluey slip table (4) and be used for driving backup pad (32) along the slip subassembly that scrapes gluey slip table (4) and remove, one side that scrapes gluey slip table (4) along length direction is provided with substrate stock board (5), one side that substrate stock board (5) were kept away from board (1) is provided with location area (51) that are used for atomizing substrate (9) location, the opposite side is provided with seal gluey mechanism (6).

2. The micro-porous atomized sheet chip mounter according to claim 1, wherein: correction plate (7) is arranged between the ceramic chip adsorption mechanism (2) and the ceramic chip bearing platform (3), one side, far away from the machine table (1), of the correction plate (7) is provided with a correction hole (71) in a penetrating mode, lifting plates (72) are arranged between the correction plate (7) and the machine table (1), one side, close to the correction plate (7), of each lifting plate (72) is connected with a jacking column (721) matched with the correction hole (71), and one side, close to the machine table (1), of each lifting plate (72) is connected with a lifting driving assembly.

3. The micro-porous atomized sheet chip mounter according to claim 1, wherein: the sliding assembly comprises a guide plate (41) arranged on one side, close to the supporting plate (32), of the scraping sliding table (4), a guide ring (42) is sleeved on the outer wall of the guide plate (41), the outer wall of the guide ring (42) is connected with the supporting plate (32), a screw rod (43) is arranged on one side, along the moving direction of the supporting plate (32), of the guide plate (41), and a motor (44) is connected to the screw rod (43).

4. The micro-porous atomized sheet chip mounter according to claim 1, wherein: the seal gum mechanism (6) is including installing in support (61) of board (1), and one side that board (1) was kept away from to support (61) is provided with seal gum screen frame (62), and one side that board (1) was kept away from to seal gum screen frame (62) is provided with scraper (63), and one side of scraper (63) is provided with gumming mouth (64), and one side that seal gum screen frame (62) was kept away from to scraper (63) is connected with movable plate (65), and movable plate (65) are connected with the frictioning drive assembly that is used for driving movable plate (65) to remove.

5. The micro-porous atomized sheet chip mounter according to claim 1, wherein: a rewinding bearing platform (52) is arranged on one side of the substrate storage plate (5) along the length direction of the scraping sliding table (4), and a connecting plate (53) is arranged between the rewinding bearing platform (52) and the machine table (1).

6. The micro-porous atomized sheet chip mounter according to claim 1, wherein: the substrate storage plate (5) is internally provided with a plurality of positioning through grooves (511) in a penetrating way in the positioning area (51).

7. The micro-porous atomized sheet chip mounter according to claim 1, wherein: the bottom wall of the chip supporting groove (31) is concavely provided with a concave end (311) towards the inside of the ceramic chip bearing platform (3).

8. The micro-porous atomized sheet chip mounter according to claim 2, wherein: the lifting drive assembly comprises a guide rod (722) arranged on one side, far away from the correction plate (7), of the lifting plate (72), the guide rod (722) is a telescopic rod, a bottom plate (724) is connected to one end, far away from the lifting plate (72), of the guide rod (722), and an air cylinder (723) is connected to one side, close to the machine table (1), of the lifting plate (72).