CN219716868U - LED filament - Google Patents

LED filament Download PDF

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Publication number
CN219716868U
CN219716868U CN202321231404.2U CN202321231404U CN219716868U CN 219716868 U CN219716868 U CN 219716868U CN 202321231404 U CN202321231404 U CN 202321231404U CN 219716868 U CN219716868 U CN 219716868U
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China
Prior art keywords
led
filament
led light
constant
light emitting
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Active
Application number
CN202321231404.2U
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Chinese (zh)
Inventor
郭炎炎
李振华
蒋海波
李义园
张路华
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Jiangxi Simide Semiconductor Co ltd
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Jiangxi Simide Semiconductor Co ltd
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Priority to CN202321231404.2U priority Critical patent/CN219716868U/en
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Abstract

The utility model provides an LED filament, which comprises a filament support, wherein the filament support comprises a substrate, a plurality of LED circuits are arranged on the substrate, adjacent LED circuits are connected in parallel, each LED circuit comprises a plurality of LED light-emitting chips and at least one constant-current heat-sensitive IC, the adjacent two LED light-emitting chips in each LED circuit, the constant-current heat-sensitive ICs and the LED light-emitting chips are connected in series through bonding wires, one constant-current heat-sensitive IC is connected in series in each parallel circuit of the LED filament, the constant current passing through each parallel circuit in the filament is realized, the constant current passing through each parallel circuit between filaments in the LED filament lamp is realized, the current difference in each parallel circuit is eliminated, the service life of the LED filament lamp is prolonged, and the stability is better.

Description

LED filament
Technical Field
The utility model relates to the technical field of LEDs, in particular to an LED filament.
Background
The LED filament lamp is not only used as decorative illumination, but also used for functional illumination instead of bulb, and as the power for improving the luminous flux requirement is continuously increased, the improvement of the reliability of the product is also receiving more and more attention.
At present, 2000lm, 6000lm, even 10000lm high power high luminous flux LED filament lamps are put forward on the market for lighting field, in which under the condition of using traditional LED filament lamps with high voltage and small current, the number of filament parallel strips is directly increased in bulb or the number of parallel LED light emitting chips of single filament substrate is widened to increase luminous flux, both the former and the latter increase the number of parallel LED light emitting chips in bulb, in these multiple series and multiple series circuits, small voltage difference can make current in each parallel circuit also have difference, and in the circuit with low voltage in high temperature environment, current can be continuously increased along with the lengthening of service time, finally leading to the rapid shortening of service life of LED filament lamp.
Disclosure of Invention
The utility model aims to overcome the defects and shortcomings of the prior art, and provides an LED filament which aims to solve the problems in the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the LED filament comprises a filament support, wherein the filament support comprises a substrate, a plurality of LED circuits are arranged on the substrate, adjacent LED circuits are connected in parallel, each LED circuit comprises a plurality of LED light-emitting chips and at least one constant-current heat-sensitive IC, and each LED circuit is connected in series between two adjacent LED light-emitting chips and between the constant-current heat-sensitive IC and the LED light-emitting chips through bonding wires.
The beneficial effects of the utility model are as follows: the constant-current thermosensitive IC is connected in series in each parallel circuit of the LED filament, so that the constant current of each parallel circuit in the filament is realized, the constant current of each parallel circuit in the LED filament lamp is realized, the current difference in each parallel circuit is eliminated, the service life of the LED filament lamp is prolonged, and the stability is good.
Further, metal electrodes are connected to two ends of the filament support, connecting grooves are formed in the metal electrodes, and the filament support is inserted into the connecting grooves.
Further, the constant current thermosensitive IC is connected in series at the negative electrode or the positive electrode of the LED light-emitting chip.
Further, the filament support is made of one of transparent ceramics, transparent glass or sapphire.
Further, the substrate is a metal substrate.
Further, the LED light-emitting chip is an alternating current type light-emitting diode or a high voltage type light-emitting diode.
Further, the surface of the LED light-emitting chip is plated with an indium tin oxide layer.
Further, the distance between two adjacent LED light emitting chips is 2-4mm.
Further, fluorescent glue layers are coated on the front side and the back side of the filament support.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of an LED filament structure according to an embodiment of the present utility model.
Fig. 2 is a schematic diagram of an LED filament circuit according to an embodiment of the present utility model.
The LED lamp comprises a lamp holder 1, a metal electrode 2, an LED circuit 3, a constant-current thermosensitive IC4, an LED light-emitting chip 5, a bonding wire 6 and a fluorescent glue layer 7.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended to illustrate embodiments of the utility model and should not be construed as limiting the utility model.
In the description of the embodiments of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the embodiments of the present utility model and simplify description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.
In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present utility model will be understood by those of ordinary skill in the art according to specific circumstances.
The present utility model will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1-2, an LED filament according to an embodiment of the present utility model includes a filament support 1, wherein the filament support 1 includes a substrate, and specifically, the filament support 1 is one of transparent ceramic, transparent glass or sapphire,
in this embodiment, the filament support 1 is made of transparent ceramic, and the substrate is made of metal.
Specifically, the two ends of the filament support 1 are connected with metal electrodes 2, the metal electrodes 2 are provided with connecting grooves, the filament support 1 is inserted into the connecting grooves, and it is worth to say that the filament support 1 is inserted into the connecting grooves, so that the metal electrodes 2 can have good stability on the filament support 1.
Specifically, the fluorescent glue layer 7 is coated on the front and back sides of the filament support 1, and it is worth to be noted that the fluorescent glue is coated to enhance the light emitting effect of the LED filament.
A plurality of LED circuits 3 are provided on the substrate,
specifically, in this embodiment, 3 LED circuits 3 are disposed on the substrate, and the 3 LED circuits 3 are connected in parallel, where each LED circuit 3 includes a plurality of LED light emitting chips 5 and at least one constant current heat sensitive IC4, and in this embodiment, each LED circuit 3 includes one constant current heat sensitive IC4.
Specifically, the constant-current heat-sensitive IC4 is connected in series at the negative electrode or the positive electrode of the LED light-emitting chip 3, and in this embodiment, the constant-current heat-sensitive IC4 is connected in series at the positive electrode of the LED light-emitting chip 3.
Specifically, the LED light emitting chip 3 is an ac type light emitting diode or a high voltage type light emitting diode, and in this embodiment, the LED light emitting chip 3 is an ac type light emitting diode.
Specifically, the surface of the LED light-emitting chip 3 is plated with an indium tin oxide layer, which is worth to be explained, the indium tin oxide layer makes the current of the LED light-emitting chip 3 uniformly diffuse and distribute and the light-emitting efficiency also improved.
Specifically, the distance between two adjacent LED light emitting chips 3 is 2-4mm, in this embodiment, the distance between two adjacent LED light emitting chips 3 is 2mm, and it is worth to be explained that the distance between the LED light emitting chips 3 is 2mm, so that the arrangement between the LED light emitting chips is not too dense, and the heat dissipation is improved.
And every two adjacent LED light-emitting chips in each LED circuit and the constant-current thermosensitive IC4 and the LED light-emitting chips 3 are connected in series through bonding wires 6.
The utility model has the beneficial effects that: the constant-current thermosensitive IC4 is connected in series in each parallel circuit of the LED filament, so that the constant current passing through each parallel circuit in the filament is realized, the constant current passing through each parallel circuit between filaments in the LED filament lamp is realized, the current difference in each parallel circuit is eliminated, the service life of the LED filament lamp is prolonged, and the stability is good.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (9)

1. The LED lamp filament is characterized by comprising a lamp filament support, wherein the lamp filament support comprises a substrate, a plurality of LED circuits are arranged on the substrate, adjacent LED circuits are connected in parallel, each LED circuit comprises a plurality of LED light-emitting chips and at least one constant-current heat-sensitive IC, and two adjacent LED light-emitting chips in each LED circuit, the constant-current heat-sensitive ICs and the LED light-emitting chips are connected in series through bonding wires.
2. The LED filament of claim 1, wherein metal electrodes are connected to both ends of the filament support, connection grooves are formed in the metal electrodes, and the filament support is inserted into the connection grooves.
3. The LED filament of claim 1, wherein the constant current thermally sensitive IC is connected in series at a negative or positive electrode of the LED light emitting chip.
4. The LED filament of claim 1, wherein the filament support is one of transparent ceramic, transparent glass, or sapphire.
5. The LED filament of claim 1, wherein the substrate is a metal substrate.
6. The LED filament of claim 1, wherein the LED light emitting chip is an ac type light emitting diode or a high voltage type light emitting diode.
7. The LED filament of claim 1, wherein the surface of the LED light emitting chip is plated with an indium tin oxide layer.
8. The LED filament of claim 1, wherein the distance between two adjacent LED light emitting chips is 2-4mm.
9. The LED filament of claim 1, wherein the filament support is coated with a phosphor layer on the front and back sides.
CN202321231404.2U 2023-05-19 2023-05-19 LED filament Active CN219716868U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321231404.2U CN219716868U (en) 2023-05-19 2023-05-19 LED filament

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321231404.2U CN219716868U (en) 2023-05-19 2023-05-19 LED filament

Publications (1)

Publication Number Publication Date
CN219716868U true CN219716868U (en) 2023-09-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321231404.2U Active CN219716868U (en) 2023-05-19 2023-05-19 LED filament

Country Status (1)

Country Link
CN (1) CN219716868U (en)

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