CN219716832U - Conveying device base for semiconductor component dicing - Google Patents
Conveying device base for semiconductor component dicing Download PDFInfo
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- CN219716832U CN219716832U CN202321364402.0U CN202321364402U CN219716832U CN 219716832 U CN219716832 U CN 219716832U CN 202321364402 U CN202321364402 U CN 202321364402U CN 219716832 U CN219716832 U CN 219716832U
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- bottom plate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 230000005540 biological transmission Effects 0.000 claims abstract description 25
- 230000008093 supporting effect Effects 0.000 claims description 21
- 238000005520 cutting process Methods 0.000 claims description 9
- 230000003014 reinforcing effect Effects 0.000 claims description 6
- 239000010687 lubricating oil Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a conveying device base for semiconductor component dicing, which comprises a mounting bottom plate, a mounting table, support plates, an adjusting plate, a connecting assembly and a driving assembly, wherein the support plates are arranged on two sides of the mounting table; the bottom of the mounting bottom plate is provided with a downward sunken transmission bin; the driving assembly comprises a driving motor arranged on the mounting bottom plate, a screw rod connected with the adjusting plate and a transmission piece arranged in the transmission bin, wherein the driving motor is connected with the screw rod through the transmission piece, the screw rod is driven by the driving motor to rotate so as to drive the adjusting plate to move up and down, and the adjusting plate drives the mounting table to move up and down when moving up and down, so that the height adjustment of the mounting table is realized. The utility model has the advantages of ingenious design, strong practicability, convenient use, short line changing time and equipment debugging time, good stability and the like.
Description
Technical Field
The utility model belongs to the field of semiconductor component dicing processing, and particularly relates to a conveying device base for semiconductor component dicing.
Background
In the semiconductor component production process, a plurality of semiconductor components are usually fixed on a semiconductor component lead frame strip for production, so as to improve the production efficiency of the semiconductor components, for example, most semiconductor components, IC products and the like are fixed by adopting the strip. After the semiconductor component is subjected to plastic package and solidification, the semiconductor component is required to be separated from the semiconductor component strip, so that the semiconductor component is obtained, and then the separated semiconductor component is transferred to a subsequent process for treatment.
At present, semiconductor component slitting is generally carried out by adopting slitting equipment, when in slitting, an operator places semiconductor component strips in a semiconductor component strip feeding box of a feeding mechanism, then clamps the semiconductor component strips in the semiconductor component strip feeding box through a three-axis manipulator, then places the semiconductor component strips on a conveying belt of a conveying mechanism, and then conveys a row of semiconductor component strips into a punching die to be slit through the conveying belt of the conveying mechanism, so that the slitting of the semiconductor component is realized.
When the dicing mechanism is used for dicing different types of semiconductor components, the dicing dies used by the dicing mechanism are different, so that the dies of different types need to be replaced for dicing. The engineer finds that after changing the different types of moulds, there is a height difference between the position of the feed inlet of the mould and the position of the output port of the conveyor belt of the conveyor, so that the height of the conveyor or the mould needs to be adjusted, so that the positions of the output port of the conveyor belt and the feed inlet of the mould are always the same. The table top of the base of the existing slitting device cannot be adjusted, and the die cutting stress is large, so that the height of the conveying device is usually adjusted; the conveying device is usually detached during adjustment, then the base is additionally provided with the base plate or the base plate is replaced, and then the conveying device is installed back to the machine table for equipment adjustment.
Therefore, research is conducted on the problem that the existing slitting equipment is in the wire replacement process, the height adjustment of the conveying device is developed and improved, the height of a discharge hole of a conveying belt of the conveying device can be adjusted according to different slitting dies, wire replacement time is shortened, wire replacement efficiency is improved, and accordingly the slitting efficiency of semiconductor components is improved.
Disclosure of Invention
The utility model aims to provide a conveying device base for semiconductor component cutting, which solves the problems that the height difference exists between an output port of a conveying device and a feed port of a cutting die after line replacement of the traditional cutting equipment, the conveying device is required to be disassembled to increase a backing plate or the backing plate is required to be replaced to adjust the height, the height is not easy to adjust, the line replacement workload is large, the debugging time is long and the like.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the conveying device base comprises a mounting bottom plate, a mounting table, supporting plates, an adjusting plate, a connecting assembly and a driving assembly, wherein the mounting bottom plate is used for mounting the conveying device base on a cutting device, the mounting table is arranged above the mounting bottom plate and used for mounting and fixing the conveying device, the supporting plates are arranged on two sides of the mounting table, the adjusting plate is arranged between the mounting bottom plate and the mounting table and is positioned in the supporting plates, the connecting assembly is arranged between the adjusting plate and the mounting table, and the driving assembly is arranged on the mounting bottom plate and used for driving the mounting table to move up and down; the bottom of the mounting bottom plate is provided with a downward sunken transmission bin; the driving assembly comprises a driving motor arranged on the mounting bottom plate, a screw rod connected with the adjusting plate and a transmission piece arranged in the transmission bin, wherein the driving motor is connected with the screw rod through the transmission piece, the screw rod is driven by the driving motor to rotate so as to drive the adjusting plate to move up and down, and the adjusting plate drives the mounting table to move up and down when moving up and down, so that the height adjustment of the mounting table is realized.
Preferably, the connecting assembly comprises a connecting rod arranged between the adjusting plate and the mounting table and a reinforcing sleeve arranged on the connecting rod.
Preferably, the transmission piece comprises a driving wheel arranged at the output end of the driving motor and connected with the output end of the driving motor and a driven wheel arranged on the screw rod; the driving wheel is meshed with the driven wheel, and lubricating oil is coated at the meshing position.
Preferably, the lower end of the screw rod is completely attached to the inner surface of the driven wheel, and the screw rod is fixed with the driven wheel through welding.
Preferably, a guide rail is arranged between the supporting plate and the adjusting plate and used for guiding the adjusting plate to move up and down; the guide rail is vertically arranged on the side wall of the inner part of the support plate, and the adjusting plate corresponding to the position of the guide rail is provided with a notch with the size matched with the guide rail; the notch of the adjusting plate is clamped into the guide rail, and the notch is matched with the guide rail to realize the adjustment of the up-and-down movement direction of the adjusting plate.
Preferably, a buffer component is further arranged between the supporting plate and the mounting bottom plate.
Preferably, the side wall of the supporting plate is provided with a limit groove; the buffer component is arranged between the mounting bottom plate and the limiting groove.
Preferably, the buffer component comprises a positioning rod, a spring and a limiting plate, wherein one end of the positioning rod is fixed on the mounting bottom plate, the other end of the positioning rod is arranged in the limiting groove, the spring is arranged in the positioning rod and positioned on the upper end face of the mounting bottom plate, and the limiting plate penetrates into the positioning rod and is arranged below the spring and the limiting groove.
Preferably, the lower end of the spring is completely attached to the upper end surface of the mounting bottom plate; the lower surface of the limiting plate is completely attached to the upper end of the spring.
Preferably, the driving motor is a servo motor; the driving motor is fixed with the mounting bottom plate through screws.
Compared with the prior art, the conveying device base has the advantages of ingenious design, strong practicability, convenience in use, short line changing time, short equipment debugging time, good stability and the like, changes the installation and fixation mode of the conveying device of the traditional slitting equipment, installs and fixes the conveying device base for slitting the semiconductor components on the slitting equipment, and then installs and fixes the conveying device on the conveying device base; when the slitting device changes the slitting die to slit the semiconductor component, if the height difference exists between the output port of the conveying belt of the conveying device and the feed port of the slitting die, only the height of the base of the conveying device is required to be adjusted, so that the height of the output port of the conveying belt of the conveying device is adjusted to correspond to the inlet of the slitting die, the workload of operators is reduced, the line changing time is shortened, and the line changing efficiency is improved; the screw rod is adopted for adjusting the base of the conveying device, so that the conveying device has the advantages of high adjustment precision, convenience and rapidness in use and the like; through locating lever and the spacing groove that set up at the backup pad lower surface, increased the stability that the backup pad removed, through locating lever lower extreme setting's limiting plate and spring, utilize the elasticity of spring, can cushion the backup pad, reduce the friction between backup pad and the mounting plate, improved the supporting effect of backup pad.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a side view of the entirety of the present utility model;
FIG. 3 is a schematic view of a partial structure of a base of the present utility model;
fig. 4 is a schematic view of a partial structure of the present utility model.
Wherein: a mounting base plate 1; a mounting table 2; a support plate 3; a limit groove 31; an adjusting plate 4; a connection assembly 5; a connecting rod 51; a reinforcing sleeve 52; a drive assembly 6; a drive motor 61; a screw 62; a transmission member 63; a drive wheel 631; driven wheel 632; a guide rail 7; a buffer assembly 8; a positioning lever 81; a spring 82; and a limiting plate 83.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
As shown in fig. 1 to 4, a conveyor base for dicing semiconductor devices includes a mounting base plate 1 for mounting the conveyor base on dicing equipment, a mounting table 2 provided directly above the mounting base plate for mounting and fixing the conveyor, support plates 3 mounted and fixed on both side walls of a lower end face of the mounting table, an adjusting plate 4 provided between the mounting base plate 1 and the mounting table 2 and located in both support plates, a connection member 5 provided between the adjusting plate 4 and the mounting table 2, and a driving member 6 mounted on the mounting base plate for driving the mounting table 2 to move up and down.
The connecting assembly 5 comprises a connecting rod 51 fixed between the upper end face of the adjusting plate 4 and the lower end face of the mounting table 2 and a reinforcing sleeve 52 arranged on the connecting rod. The number of the connecting rods 51 is four, and the connecting rods are respectively arranged at four opposite angles of the adjusting plate. The reinforcing sleeve 52 penetrates into the connecting rod 51 and is fixed at the middle position of the connecting rod, and the stress intensity of the connecting rod is increased through the reinforcing sleeve.
The driving assembly 6 comprises a driving motor 61 which is fixedly arranged on the mounting base plate 1 through a screw, a screw rod 62 which is connected with the adjusting plate 4 and a transmission piece 63 which is arranged in the transmission bin, and the driving motor 61 and the screw rod 62 are connected through the transmission piece 63. The driving motor 61 drives the screw rod to rotate, and the screw rod drives the adjusting plate to move up and down when rotating, and drives the mounting table 2 to move up and down when the adjusting plate moves up and down, so that the height of the mounting table is adjusted. Wherein, the driving motor 61 is a servo motor.
For better installation of the driving component, a transmission bin with a downward concave cuboid structure is arranged at the bottom of the installation bottom plate 1. The transmission assembly is arranged in the transmission bin. Wherein, the transmission member 63 comprises a driving wheel 631 fixed at the output end of the driving motor 61 and a driven wheel 632 matched with the driving wheel; wherein, the driving wheel and the driven wheel are gears. The driving wheel 631 is engaged with the driven wheel 632. In order to improve the transmission effect, lubricating oil is coated at the meshing position of the driving wheel 631 and the driven wheel 632, so that friction between the driving wheel 631 and the driven wheel 632 is reduced, the smoothness of gear transmission is improved, and the stability of gear operation is improved.
The lower end of the screw rod 62 is completely attached to the inner surface of the driven wheel 632, and the screw rod 62 is fixed to the driven wheel 632 by welding, so that the screw rod is driven to rotate during the transmission of the driven wheel.
In order to increase the accuracy of the up-and-down movement of the adjusting plate, a guide rail 7 is provided between the support plate 3 and the adjusting plate 4 for guiding the up-and-down movement of the adjusting plate. The number of the guide rails is two. The two guide rails 7 are vertically arranged on the support plate and positioned on the inner side wall of the support plate, and the positions of the two guide rails are corresponding. The adjusting plate 4 corresponding to the position of the guide rail is provided with a notch with the shape and the size matched with the guide rail; the two notches of the adjusting plate 4 are respectively clamped into the corresponding guide rails, and the notches are matched with the guide rails to realize the adjustment and the guide of the up-and-down movement direction of the adjusting plate.
In order to increase the stability of the up-and-down movement of the supporting plate, the self-built friction between the supporting plate and the mounting bottom plate is reduced, the buffer function is realized, the supporting effect of the supporting plate is improved, and a buffer component 8 is further arranged between the supporting plate 3 and the mounting bottom plate 1. A limit groove 31 is arranged on the side wall of the supporting plate 3; the buffer component is arranged between the mounting bottom plate 1 and the limiting groove 31. The number of the limit grooves is four, and the limit grooves are respectively arranged at two ends of the supporting piece 3. The number of the buffer assemblies 8 is four, and the positions of the buffer assemblies correspond to the positions of the limit grooves.
The buffer assembly 8 includes a positioning rod 81, a spring 82 and a limiting plate 83. One end of the positioning rod 81 is fixed on the upper end surface of the mounting bottom plate 1, and the other end penetrates into the limiting groove 31. The spring 82 penetrates into the positioning rod 81 and is positioned on the upper end face of the mounting base plate 1. Wherein the lower end of the spring 82 is completely attached to the upper end surface of the mounting base plate 1. The limiting plate 83 penetrates into the positioning rod 81 and is arranged between the spring 82 and the limiting groove 31, so that the position of the supporting plate is limited and buffered. Wherein, the lower surface of the limiting plate 83 is completely attached to the upper end of the spring 82.
When the device is used, the mounting bottom plate for mounting the base of the conveying device is fixed on the slitting equipment through screws, and the conveying device of the slitting equipment is fixed on the mounting table through screws. When the semiconductor components's cutting die changes the back, when the delivery outlet of conveyor's conveyer belt and the semiconductor components feed inlet of cutting die highly inconsistent appear, operating personnel only need control driving motor work to rotate through driving motor drive lead screw, drive the regulating plate and reciprocate when the lead screw rotates, drive the mount table and reciprocate when the regulating plate reciprocates, realize the altitude mixture control of mount table, have advantages such as regulation is simple, convenient to use. Through locating lever and the spacing groove that set up at backup pad 3 lower surface, increased the stability of backup pad reciprocates, through locating lever lower extreme setting's limiting plate and spring, utilize the elasticity of spring to cushion the backup pad, reduce the friction between backup pad and the mounting plate, improved the supporting effect of backup pad.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
1. A conveyor base for semiconductor component singulation, characterized in that: the cutting device comprises a mounting bottom plate (1) for mounting a conveying device base on cutting equipment, a mounting table (2) arranged above the mounting bottom plate (1) and used for mounting and fixing the conveying device, supporting plates (3) arranged on two sides of the mounting table (2), an adjusting plate (4) arranged between the mounting bottom plate (1) and the mounting table (2) and positioned in the supporting plates, a connecting component (5) arranged between the adjusting plate (4) and the mounting table (2) and a driving component (6) arranged on the mounting bottom plate and used for driving the mounting table (2) to move up and down; the bottom of the mounting bottom plate (1) is provided with a downward concave transmission bin; the driving assembly (6) comprises a driving motor (61) arranged on the mounting base plate (1), a screw rod (62) connected with the adjusting plate (4) and a transmission piece (63) arranged in the transmission bin, wherein the driving motor (61) and the screw rod (62) are connected through the transmission piece, the screw rod is driven by a driving motor driver to rotate to drive the adjusting plate to move up and down, and the adjusting plate drives the mounting table (2) to move up and down when moving up and down, so that the height adjustment of the mounting table is realized.
2. The carrier base for semiconductor component singulation as in claim 1, wherein: the connecting component (5) comprises a connecting rod (51) arranged between the adjusting plate (4) and the mounting table (2) and a reinforcing sleeve (52) arranged on the connecting rod.
3. The carrier base for semiconductor component singulation as recited in claim 2, wherein: the transmission part (63) comprises a driving wheel (631) connected with the output end of the driving motor and a driven wheel (632) arranged on the screw rod; the driving wheel (631) is meshed with the driven wheel (632), and the meshing part is coated with lubricating oil.
4. A conveyor base for semiconductor component singulation as in claim 3 wherein: the lower end of the screw rod (62) is completely attached to the inner surface of the driven wheel (632), and the screw rod (62) is fixed with the driven wheel (632) through welding.
5. The carrier base for semiconductor component singulation as in claim 4, wherein: a guide rail (7) between the supporting plate (3) and the adjusting plate (4) for guiding the adjusting plate to move up and down; the guide rail (7) is vertically arranged on the side wall of the inner part of the support plate, and the adjusting plate (4) corresponding to the position of the guide rail is provided with a notch with the size matched with that of the guide rail; the notch of the adjusting plate (4) is clamped into the guide rail, and the notch is matched with the guide rail to realize the adjustment of the up-and-down movement direction of the adjusting plate.
6. The carrier base for semiconductor component singulation as in claim 5, wherein: and a buffer component (8) is arranged between the supporting plate (3) and the mounting bottom plate (1).
7. The carrier base for semiconductor component singulation as in claim 6, wherein: a limit groove (31) is arranged on the side wall of the supporting plate (3); the buffer component is arranged between the mounting bottom plate (1) and the limiting groove (31).
8. The carrier base for semiconductor component singulation as in claim 7, wherein: the buffer assembly (8) comprises a positioning rod (81) with one end fixed on the mounting base plate (1) and the other end arranged in the limiting groove (31), a spring (82) arranged in the positioning rod (81) and positioned on the upper end face of the mounting base plate (1), and a limiting plate (83) penetrating into the positioning rod (81) and arranged below the spring (82) and the limiting groove (31).
9. The carrier base for semiconductor component singulation as in claim 8, wherein: the lower end of the spring (82) is completely attached to the upper end surface of the mounting bottom plate (1); the lower surface of the limiting plate (83) is completely attached to the upper end of the spring (82).
10. The carrier base for semiconductor component singulation as in claim 9, wherein: the driving motor (61) is a servo motor; the driving motor (61) is fixed with the mounting bottom plate (1) through screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321364402.0U CN219716832U (en) | 2023-05-31 | 2023-05-31 | Conveying device base for semiconductor component dicing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321364402.0U CN219716832U (en) | 2023-05-31 | 2023-05-31 | Conveying device base for semiconductor component dicing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219716832U true CN219716832U (en) | 2023-09-19 |
Family
ID=87979188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321364402.0U Active CN219716832U (en) | 2023-05-31 | 2023-05-31 | Conveying device base for semiconductor component dicing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219716832U (en) |
-
2023
- 2023-05-31 CN CN202321364402.0U patent/CN219716832U/en active Active
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