CN219715867U - Heat radiation structure of LCM display module - Google Patents
Heat radiation structure of LCM display module Download PDFInfo
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- CN219715867U CN219715867U CN202320561866.4U CN202320561866U CN219715867U CN 219715867 U CN219715867 U CN 219715867U CN 202320561866 U CN202320561866 U CN 202320561866U CN 219715867 U CN219715867 U CN 219715867U
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- heat
- display module
- lcm display
- circuit board
- frame body
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- 230000005855 radiation Effects 0.000 title claims description 4
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000000741 silica gel Substances 0.000 claims description 14
- 229910002027 silica gel Inorganic materials 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract description 3
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a heat dissipation structure of an LCM display module, which comprises the following components: the LCM display module comprises a circuit board, wherein an LCM display module body is arranged on the circuit board, and a backlight source is arranged on the lower surface of the inner side of the LCM display module body; the heat conducting ceramic is arranged on the lower surface of the backlight source and used for leading out heat to the periphery; the heat conducting frame body is detachably arranged on the circuit board, the lower surface of the heat conducting frame body is provided with a connecting groove matched with the heat conducting ceramic, and the outer surface of the heat conducting frame body is provided with radiating fins for radiating heat along the circumferential direction; through being provided with heat conduction pottery, heat conduction framework, coupling groove and radiating fin, be convenient for outwards derive the heat of LCM display module assembly body inboard, avoid not fine heat dissipation, lead to LCM display module assembly body to take place thermal fatigue damage, the device does benefit to improvement and outside natural wind area of contact, improves the forced air cooling heat dissipation, and then ensures the invariable of LCM display module assembly body inboard temperature, and the later stage is convenient to the heat conduction framework dismouting, also easily later maintenance.
Description
Technical Field
The utility model relates to a heat dissipation structure of an LCM display module.
Background
LCM, i.e. LCD display module, liquid crystal module, refers to a liquid crystal display device, a connector, a peripheral circuit for control and driving, a PCB circuit board, a backlight source, and the backlight source generally includes a light guide plate, a reflective sheet, and a light bar disposed on the light guide plate (light incident surface). The LCM display module is used as a display panel of various electronic devices due to the advantages of light weight, thin thickness, low power consumption and the like.
In the use process of the existing LCM display module, as the display module works for a long time, the lamp strip at the backlight source takes place for a long time, heat can be accumulated inside the display module, long-term heat accumulation can cause thermal fatigue damage of equipment, aging is accelerated, the constancy of temperature is inconvenient to ensure, and the display mode is enabled to perform good heat dissipation and temperature reduction, so that the heat dissipation structure of the LCM display module is provided.
Disclosure of Invention
The utility model aims to provide a heat dissipation structure of an LCM display module, which solves the problems that the heat accumulated inside the display module is inconvenient to transfer out and the heat dissipation and the temperature reduction of the LCM display module are improved in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a heat dissipation structure of an LCM display module, comprising:
the LCM display module comprises a circuit board, wherein an LCM display module body is arranged on the circuit board, and a backlight source is arranged on the lower surface of the inner side of the LCM display module body;
the heat conducting ceramic is arranged on the lower surface of the backlight source and used for leading out heat to the periphery;
the heat conduction frame body is detachably arranged on the circuit board, the lower surface of the heat conduction frame body is provided with a connecting groove matched with the heat conduction ceramic, and the outer surface of the heat conduction frame body is provided with radiating fins for radiating along the circumferential direction.
Preferably, the heat conducting ceramic is strip-shaped, and an upward protrusion is arranged on the upper surface of one end of the heat conducting ceramic so as to improve the contact area with the connecting groove.
Preferably, the inner surface of the connecting groove is provided with a heat-conducting silica gel pad, and the heat-conducting silica gel pad and the connecting groove are fixed by glue adhesion.
Preferably, the heat-conducting silica gel pad is rectangular, and the thickness of the heat-conducting silica gel pad is five millimeters to two millimeters.
Preferably, the side wall of the heat conduction frame body is fixed with a mounting lug, and a bolt matched with the circuit board is arranged on the inner side of the mounting lug.
Preferably, the cross section of the heat conduction frame body is L-shaped, and a plurality of connecting grooves are formed in the circumferential direction of the heat conduction frame body.
Preferably, the circuit board is rectangular, and mounting holes are formed in the periphery of the inner side of the circuit board.
Compared with the prior art, the utility model has the beneficial effects that:
through being provided with heat conduction pottery, heat conduction framework, coupling groove and radiating fin, be convenient for outwards derive the heat of LCM display module assembly body inboard, avoid not fine heat dissipation, lead to LCM display module assembly body to take place thermal fatigue damage, the device does benefit to improvement and outside natural wind area of contact, improves the forced air cooling heat dissipation, and then ensures the invariable of LCM display module assembly body inboard temperature, and the later stage is convenient to the heat conduction framework dismouting, also easily later maintenance.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of a heat conductive frame according to the present utility model;
FIG. 3 is a schematic view of a mounting bump structure according to the present utility model;
FIG. 4 is a schematic view of a connecting groove structure according to the present utility model;
in the figure: 1. a circuit board; 2. LCM display module body; 3. a heat conductive frame; 4. a thermally conductive ceramic; 5. a connection groove; 6. a backlight; 8. a heat radiation fin; 9. mounting the protruding blocks; 10. a heat-conducting silica gel pad.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: a heat dissipation structure of an LCM display module, comprising:
the LCM display module comprises a circuit board 1, wherein an LCM display module body 2 is arranged on the circuit board 1, and a backlight source 6 is arranged on the lower surface of the inner side of the LCM display module body 2;
the heat conducting ceramic 4 is arranged on the lower surface of the backlight source 6 and used for leading out heat to the periphery, so that the heat on the inner side of the LCM display module body 2 can be conveniently led out to the outside;
the heat conduction frame body 3, demountable installation is on circuit board 1, and heat conduction frame body 3 lower surface offer with heat conduction pottery 4 matched with connection recess 5, be convenient for make heat conduction frame body 3 be connected with heat conduction pottery 4, and then improve the heat and outwards derive the effect, heat conduction frame body 3 surface is provided with along circumference and is used for radiating fin 8, be convenient for increase and outside natural wind area of contact, improvement heat dissipation.
In this embodiment, preferably, the heat conducting ceramic 4 is in a strip shape, and an upward protrusion is provided on an upper surface of one end of the heat conducting ceramic 4, so as to increase a contact area with the connecting groove 5, so that a better contact area is facilitated.
In this embodiment, preferably, the inner surface of the connection groove 5 is provided with the heat-conducting silica gel pad 10, so as to reduce the rigid collision between the heat-conducting frame body 3 and the heat-conducting ceramic 4, and facilitate increasing heat conduction, and the heat-conducting silica gel pad 10 and the connection groove 5 are adhered and fixed by glue.
In this embodiment, the thermal conductive silica gel pad 10 is preferably rectangular, and the thickness of the thermal conductive silica gel pad 10 is preferably five to two millimeters.
In this embodiment, preferably, the side wall of the heat conducting frame body 3 is fixed with a mounting bump 9, and a bolt matched with the circuit board 1 is arranged on the inner side of the mounting bump 9, so that the heat conducting frame body 3 can be conveniently and detachably mounted.
In this embodiment, preferably, the cross section of the heat conducting frame body 3 is in an L shape, and the connecting grooves 5 are arranged along the circumferential direction of the heat conducting frame body 3, so that better connection effect is facilitated.
In this embodiment, the circuit board 1 is preferably rectangular, and mounting holes are formed around the inner side of the circuit board 1.
The working principle and the using flow of the utility model are as follows: when using, make heat conduction framework 3 cooperate with heat conduction ceramic 4 through connecting groove 5, connecting groove 5 inboard is provided with heat conduction silica gel pad 10, be convenient for reduce the rigidity collision of heat conduction ceramic 4 and heat conduction framework 3, can improve the area of contact after connecting simultaneously, and then increase the heat transfer effect, then will fix heat conduction framework 3 and circuit board 1 through installation lug 9 and bolt, can accomplish the installation to heat conduction framework 3, the heat at LCM display module assembly 2 during operation passes through heat conduction ceramic 4 and transmits heat conduction framework 3 department, and then improve with outside natural wind area of contact through fin 8, and then the forced air cooling of increase device, be convenient for ensure LCM display module assembly 2 inboard is invariable, reduce the too big heat and cause its thermal fatigue damage that takes place, later stage is also comparatively convenient to heat conduction framework 3 dismantlement, do benefit to the maintenance.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a heat radiation structure of LCM display module assembly which characterized in that: comprising the following steps:
the LCM display module comprises a circuit board (1), wherein an LCM display module body (2) is arranged on the circuit board (1), and a backlight source (6) is arranged on the lower surface of the inner side of the LCM display module body (2);
the heat conducting ceramic (4) is arranged on the lower surface of the backlight source (6) and used for leading out heat to the periphery;
the heat conduction frame body (3) is detachably mounted on the circuit board (1), a connecting groove (5) matched with the heat conduction ceramic (4) is formed in the lower surface of the heat conduction frame body (3), and radiating fins (8) used for radiating are arranged on the outer surface of the heat conduction frame body (3) along the circumferential direction.
2. The heat dissipation structure of an LCM display module according to claim 1, wherein: the heat conducting ceramic (4) is of a strip shape, and an upward protrusion is arranged on the upper surface of one end of the heat conducting ceramic (4) so as to improve the contact area with the connecting groove (5).
3. The heat dissipation structure of an LCM display module according to claim 1, wherein: the inner surface of the connecting groove (5) is provided with a heat-conducting silica gel pad (10), and the heat-conducting silica gel pad (10) and the connecting groove (5) are fixed through glue adhesion.
4. The heat dissipation structure of an LCM display module according to claim 3, wherein: the heat-conducting silica gel pad (10) is rectangular, and the thickness of the heat-conducting silica gel pad (10) is five millimeters to two millimeters.
5. The heat dissipation structure of an LCM display module according to claim 1, wherein: the side wall of the heat conduction frame body (3) is fixedly provided with a mounting lug (9), and the inner side of the mounting lug (9) is provided with a bolt matched with the circuit board (1).
6. The heat dissipation structure of an LCM display module according to claim 1, wherein: the cross section of the heat conduction frame body (3) is L-shaped, and a plurality of connecting grooves (5) are formed in the circumference of the heat conduction frame body (3).
7. The heat dissipation structure of an LCM display module according to claim 1, wherein: the circuit board (1) is rectangular, and mounting holes are formed in the periphery of the inner side of the circuit board (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320561866.4U CN219715867U (en) | 2023-03-21 | 2023-03-21 | Heat radiation structure of LCM display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320561866.4U CN219715867U (en) | 2023-03-21 | 2023-03-21 | Heat radiation structure of LCM display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219715867U true CN219715867U (en) | 2023-09-19 |
Family
ID=87980745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320561866.4U Active CN219715867U (en) | 2023-03-21 | 2023-03-21 | Heat radiation structure of LCM display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219715867U (en) |
-
2023
- 2023-03-21 CN CN202320561866.4U patent/CN219715867U/en active Active
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