CN219715524U - High temperature product positioning test device - Google Patents
High temperature product positioning test device Download PDFInfo
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- CN219715524U CN219715524U CN202320620044.9U CN202320620044U CN219715524U CN 219715524 U CN219715524 U CN 219715524U CN 202320620044 U CN202320620044 U CN 202320620044U CN 219715524 U CN219715524 U CN 219715524U
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- 238000012360 testing method Methods 0.000 title claims abstract description 86
- 230000007246 mechanism Effects 0.000 claims abstract description 67
- 239000004033 plastic Substances 0.000 claims abstract description 28
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 239000000523 sample Substances 0.000 claims description 44
- 238000001514 detection method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 1
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- GSFCOAGADOGIGE-UHFFFAOYSA-N 2-amino-2-methyl-3-phosphonooxypropanoic acid Chemical compound OC(=O)C(N)(C)COP(O)(O)=O GSFCOAGADOGIGE-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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Abstract
The utility model discloses a high-temperature product positioning and testing device, which comprises a carrier positioning mechanism, a plastic package body positioning mechanism, a product jacking and testing mechanism, a main body fixing circuit guiding mechanism and a carrier, wherein the carrier positioning mechanism is used for positioning the carrier filled with a product to be tested; the plastic package body positioning mechanism is used for positioning a plastic package body of a product to be tested; the product jacking testing mechanism is used for pressing a product to be tested and abutting against pins of the product to be tested; the utility model not only improves the electrical test contact yield, but also avoids the problem that pins are easy to deform in the test process, and simultaneously avoids the problem that a test mechanism is easy to produce clamping materials.
Description
Technical Field
The utility model relates to a high-temperature product positioning and testing device, and belongs to the technical field of chip testing.
Background
The test and inspection are carried out on the packaged products of TSSOP, MSOP, SOP under the high-temperature special environment, and as the packaged products have smaller volume, the pin width and the pin spacing are compact and the quantity is large, the following defects often occur during the production test:
1. the contact position of the electrical test probe and the pin of the product is not correct, the test reject ratio is high.
2. And in the test process of the pressing mechanism, the pin deformation problem of the product is easily caused by the action of external force.
3. After the test of the test mechanism is finished, the product is easy to clamp, and the problem of test quality is caused.
Disclosure of Invention
The utility model aims to: in order to overcome the defects in the prior art, the utility model provides a high-temperature product positioning and testing device.
The technical scheme is as follows: in order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a high temperature product location testing arrangement, includes carrier positioning mechanism, plastic envelope body positioning mechanism, product roof pressure testing mechanism, main part fixed circuit guiding mechanism and carrier, wherein:
the carrier is used for placing a product to be tested.
The carrier positioning mechanism is used for positioning a carrier filled with a product to be tested.
The plastic package body positioning mechanism is used for positioning the plastic package body of the product to be tested.
The product jacking testing mechanism is used for pressing the product to be tested and abutting the pins of the product to be tested.
The main body fixing circuit guiding mechanism is used for installing the carrier positioning mechanism, the plastic package body positioning mechanism and the product jacking testing mechanism and is electrically connected with the product jacking testing mechanism.
Preferably: the carrier is provided with a positioning pin hole, and the main body fixing circuit guiding mechanism comprises a main body bearing seat and a test circuit board. The carrier positioning mechanism comprises a positioning guide rod and a guide rod mounting plate, the plastic package body positioning mechanism comprises a product positioning block, a positioning block spring, a positioning block bearing and a positioning block guide rod, the product jacking testing mechanism comprises a probe mounting seat, a testing probe, a probe fixing block, a product thimble and a thimble spring, and the guide rod mounting plate, a main body bearing seat, a testing circuit board, an insulating base plate and the probe mounting seat are sequentially arranged from top to bottom. The carrier positioning guide rod passes through the test circuit board and the main body bearing seat, the top end of the carrier positioning guide rod is fixedly connected with the guide rod mounting plate, and the lower end of the carrier positioning guide rod is positioned below the main body bearing seat. The probe mounting seat is fixedly arranged on the main body bearing seat, and the test probe is fixedly arranged on the probe mounting seat through the probe fixing block. The probe mounting seat is provided with a positioning block bearing, the lower end of the positioning block guide rod penetrates through the positioning block bearing to be fixedly connected with the product positioning block, the upper end of the positioning block spring is abutted to the main body bearing seat, and the lower end of the positioning block spring is abutted to the product positioning block. The probe mounting seat is provided with a thimble mounting hole, a thimble spring is arranged in the thimble mounting hole, the top end of the product thimble is in butt joint with the thimble spring, and the lower end of the product thimble penetrates through the product positioning block and is positioned below the product positioning block.
Preferably: the carrier positioning mechanism comprises a tension adjusting bolt and a guide rod tensioning spring, the guide rod tensioning spring is sleeved on the tension adjusting bolt, a threaded section of the tension adjusting bolt is in threaded connection with a guide rod mounting plate, the lower end of the threaded section of the tension adjusting bolt is abutted to a main body bearing seat, and the upper end of the guide rod tensioning spring is abutted to the tension adjusting bolt.
Preferably: and the guide rod mounting plate is provided with an in-place detection block.
Preferably: and the test circuit board is connected with a circuit quick connector.
Preferably: an insulating base plate is arranged between the test circuit board and the probe mounting seat.
Preferably: and a buffer rubber cushion is arranged on the carrier positioning guide rod between the guide rod mounting plate and the main body bearing seat.
Preferably: the carrier positioning guide rod is in sliding connection with the main body bearing seat through the positioning outer bushing bearing and the positioning inner bushing bearing.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the carrier (6) is positioned through the carrier positioning mechanism, the plastic package body of the product to be tested is positioned through the plastic package body positioning mechanism, the product to be tested is pressed and abutted against the pins of the product to be tested through the product jacking testing mechanism, so that the accurate positioning and repeated position consistency of each product is realized, the electrical test probe is accurately aligned with the pins of the product, the electrical test contact yield is improved, the problem that the pins are deformed easily in the test process is avoided, and the problem that the testing mechanism is stuck easily is avoided.
Drawings
FIG. 1 is a schematic perspective view of a test system according to the present utility model;
FIG. 2 is a front view of the test system of the present utility model;
FIG. 3 is a left side view of the present utility model;
FIG. 4 is a B-B cross-sectional view of FIG. 3;
FIG. 5 is a schematic diagram of an explosion structure of the test system according to the present utility model;
FIG. 6 is a schematic diagram of a test structure according to the present utility model;
FIG. 7 is a flow chart of a testing method of the present utility model.
Detailed Description
The present utility model is further illustrated in the accompanying drawings and detailed description which are to be understood as being merely illustrative of the utility model and not limiting of its scope, and various equivalent modifications to the utility model will fall within the scope of the utility model as defined in the appended claims after reading the utility model.
1-5, including carrier positioning mechanism, plastic envelope body positioning mechanism, product roof pressure testing mechanism, main part fixed circuit guiding mechanism and carrier 6, wherein:
the carrier 6 is used for placing a product to be tested, a plastic package body with the product to be tested and positioned upwards is designed on the carrier, the lower surface of the plastic package body is inverted, the lower surface is used for limiting the moving range of the product in production, and meanwhile, a pair of positioning pin holes 61 are designed on two sides of the positioning inverted die, and are used for accurately positioning the carrier by the positioning guide rod 21.
The carrier positioning mechanism is used for positioning a carrier 6 filled with a product to be tested. The carrier positioning mechanism comprises a positioning guide rod 21, a positioning outer bushing bearing 22, a positioning inner bushing bearing 23, a buffer rubber pad 24, a guide rod mounting plate 25, a tension adjusting bolt 26, a guide rod tensioning spring 27 and an in-place detection block 28.
The plastic package body positioning mechanism is used for positioning the plastic package body of the product to be tested. The plastic package body positioning mechanism comprises a product positioning block 31, a positioning block spring 32, a positioning block bearing 33 and a positioning block guide rod 34.
The product jacking testing mechanism is used for pressing the product to be tested and abutting the pins of the product to be tested. The product jacking testing mechanism comprises a probe mounting seat 41, a testing probe 42, a probe fixing block 43, a product thimble 44 and a thimble spring 45,
the main body fixing circuit guiding mechanism is used for installing the carrier positioning mechanism, the plastic package body positioning mechanism and the product jacking testing mechanism and is electrically connected with the product jacking testing mechanism. Which functions as a body mount and circuit guide. The main body fixing circuit guiding mechanism comprises a main body bearing seat 11, a test circuit board 12, a circuit quick connector 14 and an insulating base plate 13.
The guide rod mounting plate 25, the main body bearing seat 11, the test circuit board 12, the insulating base plate 13 and the probe mounting seat 41 are sequentially arranged from top to bottom, and the test circuit board 12 is electrically connected with the test probe 42.
The positioning guide rod 21 sequentially penetrates through the insulating base plate 13, the test circuit board 12 and the main body bearing seat 11 from bottom to top, the top end of the carrier positioning guide rod 21 is fixedly connected with the guide rod mounting plate 25, the lower end of the carrier positioning guide rod 21 is positioned below the main body bearing seat 11, the guide rod tensioning spring 27 is sleeved on the tension adjusting bolt 26, the threaded section of the tension adjusting bolt 26 is in threaded connection with the guide rod mounting plate 25, and the upper end of the guide rod tensioning spring 27 is in butt joint with the tension adjusting bolt 26. The carrier positioning guide rod 21 is slidably connected with the main body bearing seat 11 through the positioning outer bushing bearing 22 and the positioning inner bushing bearing 23, so that the carrier positioning guide rod 21 can slide up and down with the main body bearing seat 11. Therefore, the tension between the positioning guide rod 21 and the main body bearing seat 11 can be adjusted through the tension adjusting bolt 26, so that when the positioning guide rod 21 is inserted into the positioning pin hole 61, the tension of the positioning pin hole 61 is convenient for positioning the carrier 6.
The probe mount 41 is fixedly mounted on the main body bearing housing 11, and the test probe 42 is fixedly mounted on the probe mount 41 by a probe fixing block 43. The probe mounting seat 41 is provided with a positioning block bearing 33, the lower end of the positioning block guide rod 34 passes through the positioning block bearing 33 and is fixedly connected with the product positioning block 31, the upper end of the positioning block spring 32 is abutted with the main body bearing seat 11, and the lower end of the positioning block spring 32 is abutted with the product positioning block 31. The probe mounting seat 41 is provided with a thimble mounting hole, a thimble spring 45 is arranged in the thimble mounting hole, the top end of the product thimble 44 is abutted with the thimble spring 45, and the lower end of the product thimble 44 passes through the product positioning block 31 and is positioned below the product positioning block 31.
When the main body bearing seat 11 moves downwards to a first limit position, the carrier positioning guide rod 21 stretches into the positioning pin hole 61, the product thimble 44 is abutted against the product to be tested, the product thimble 44 compresses the thimble spring 45 to a first limit position I, the product positioning block 31 is abutted against the product to be tested, the product positioning block 31 compresses the positioning block spring 32 to a second limit position II, at this time, the lower end of the test probe 42 is located below the product positioning block 31, and the test probe 42 is abutted against the pin 71 of the product 7 to be tested. Through the product thimble 44, the product locating piece 31 secondary positioning of the product to be tested, make the product 7 to be tested keep stationary, when the main body bearing seat 11 continues to move downwards, make the test probe 42 aim at the pin 71 and move until the test probe 42 is abutted with the pin 71.
The test circuit board 12 has a circuit board connector 14 connected thereto. An insulating pad 13 is disposed between the test circuit board 12 and the probe mount 41. A buffer rubber cushion 24 is arranged on the carrier positioning guide rod 21 between the guide rod mounting plate 25 and the main body bearing seat 11.
The external mechanism moves from top to bottom, after two positioning guide rods are simultaneously inserted into the positioning pin holes of the carrier, the ejector pin mechanism presses the upper surface of the product to prevent the product from moving, then the positioning mechanism corrects the product position by using the designed product upper surface reverse die, and then the upper surface of each pin of the product extends out of the testing probe to perform accurate positioning test.
The accurate positioning test method for the high-temperature product is shown in fig. 6-7, and comprises the following steps:
step 1, placing the product 7 to be tested into the carrier 6. The insertion tension of the carrier positioning guide 21 is adjusted by adjusting the tension adjusting bolt 26.
Step 2, the main body bearing seat 11 moves downwards, and the carrier positioning guide rod 21 is inserted into the positioning pin hole 61 to correct the carrier position.
And 3, continuously moving the main body bearing seat 11 downwards, continuously inserting the carrier positioning guide rod 21 into the positioning pin hole 61, finishing correcting the carrier position, pressing the lower end of the product thimble 44 on the upper surface of the plastic package body of the product to be tested, and compressing the thimble spring 45 by the product thimble 44.
Step 4, the main body bearing seat 11 continues to move downwards, the product ejector pins 44 continue to compress the ejector pin springs 45, the product positioning block 31 is pressed on the upper surface of the plastic package body of the product to be tested, and the product positioning block 31 compresses the positioning block springs 32.
Step 5, when the main body bearing seat 11 moves downwards to the first limit position, the carrier positioning guide rod 21 stretches into the positioning pin hole 61, the product thimble 44 is pressed on the upper surface of the plastic package body of the product to be tested, the product thimble 44 compresses the thimble spring 45 to the first limit position one, the product positioning block 31 is pressed on the upper surface of the plastic package body of the product to be tested, the product positioning block 31 compresses the positioning block spring 32 to the first limit position two, at this time, the lower end of the test probe 42 is positioned below the product positioning block 31, and the test probe 42 is abutted against the pin 71 of the product to be tested, so that the electrical test is performed on the product 7 to be tested.
In step 6, the product 7 to be tested is tested electrically, the main body bearing seat 11 moves upwards, and the test probes 42 leave the pins 71 of the product 7 to be tested.
And 7, continuously moving the main body bearing seat 11 upwards, and resetting the positioning block spring 32 until the product positioning block 31 leaves the upper surface of the plastic package body of the product to be tested.
And 8, continuously moving the main body bearing seat 11 upwards, and resetting the thimble springs 45 until the product thimble 44 leaves the upper surface of the plastic package body of the product to be tested.
In step 9, the main body bearing housing 11 continues to move upward, and the carrier positioning guide 21 is pulled out from the positioning pin hole 61 and separated from the carrier 6.
The foregoing is only a preferred embodiment of the utility model, it being noted that: it will be apparent to those of ordinary skill in the art that, without departing from the principles of the utility model, several improvements and modifications can also be made, which are also considered to be within the scope of the present utility model.
Claims (8)
1. A high temperature product positioning test device is characterized in that: the device comprises a carrier positioning mechanism, a plastic package body positioning mechanism, a product jacking testing mechanism, a main body fixing circuit guiding mechanism and a carrier (6), wherein:
the carrier (6) is used for placing a product to be tested;
the carrier positioning mechanism is used for positioning a carrier (6) filled with a product to be tested;
the plastic package body positioning mechanism is used for positioning a plastic package body of a product to be tested;
the product jacking testing mechanism is used for pressing a product to be tested and abutting against pins of the product to be tested;
the main body fixing circuit guiding mechanism is used for installing the carrier positioning mechanism, the plastic package body positioning mechanism and the product jacking testing mechanism and is electrically connected with the product jacking testing mechanism.
2. The high temperature product positioning test device of claim 1, wherein: the carrier (6) is provided with a positioning pin hole (61), and the main body fixing circuit guiding mechanism comprises a main body bearing seat (11) and a test circuit board (12); the carrier positioning mechanism comprises a carrier positioning guide rod (21) and a guide rod mounting plate (25), the plastic package body positioning mechanism comprises a product positioning block (31), a positioning block spring (32), a positioning block bearing (33) and a positioning block guide rod (34), the product jacking testing mechanism comprises a probe mounting seat (41), a test probe (42), a probe fixing block (43), a product thimble (44) and a thimble spring (45), and the guide rod mounting plate (25), a main body bearing seat (11), a test circuit board (12), an insulating base plate (13) and the probe mounting seat (41) are sequentially arranged from top to bottom; the carrier positioning guide rod (21) passes through the test circuit board (12) and the main body bearing seat (11), the top end of the carrier positioning guide rod (21) is fixedly connected with the guide rod mounting plate (25), and the lower end of the carrier positioning guide rod (21) is positioned below the main body bearing seat (11); the probe mounting seat (41) is fixedly arranged on the main body bearing seat (11), and the test probe (42) is fixedly arranged on the probe mounting seat (41) through the probe fixing block (43); the probe mounting seat (41) is provided with a positioning block bearing (33), the lower end of the positioning block guide rod (34) penetrates through the positioning block bearing (33) to be fixedly connected with the product positioning block (31), the upper end of the positioning block spring (32) is abutted with the main body bearing seat (11), and the lower end of the positioning block spring (32) is abutted with the product positioning block (31); the probe mounting seat (41) is provided with a thimble mounting hole, a thimble spring (45) is arranged in the thimble mounting hole, the top end of the product thimble (44) is abutted with the thimble spring (45), and the lower end of the product thimble (44) passes through the product positioning block (31) and is positioned below the product positioning block (31).
3. The high temperature product positioning test device of claim 2, wherein: the carrier positioning mechanism comprises a tension adjusting bolt (26) and a guide rod tensioning spring (27), wherein the guide rod tensioning spring (27) is sleeved on the tension adjusting bolt (26), a threaded section of the tension adjusting bolt (26) is in threaded connection with a guide rod mounting plate (25), the lower end of the threaded section of the tension adjusting bolt (26) is abutted with a main body bearing seat (11), and the upper end of the guide rod tensioning spring (27) is abutted with the tension adjusting bolt (26), and the lower end of the guide rod tensioning spring (27) is abutted with the guide rod mounting plate (25).
4. A high temperature product positioning test apparatus as defined in claim 3, wherein: and the guide rod mounting plate (25) is provided with an in-place detection block (28).
5. The high temperature product positioning test device of claim 4, wherein: the test circuit board (12) is connected with a circuit quick connector (14).
6. The high temperature product positioning test device of claim 5, wherein: an insulating base plate (13) is arranged between the test circuit board (12) and the probe mounting seat (41).
7. The high temperature product positioning test device of claim 6, wherein: a buffer rubber cushion (24) is arranged on the carrier positioning guide rod (21) between the guide rod mounting plate (25) and the main body bearing seat (11).
8. The high temperature product positioning test device of claim 7, wherein: the carrier positioning guide rod (21) is in sliding connection with the main body bearing seat (11) through the positioning outer bushing bearing (22) and the positioning inner bushing bearing (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320620044.9U CN219715524U (en) | 2023-03-14 | 2023-03-14 | High temperature product positioning test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320620044.9U CN219715524U (en) | 2023-03-14 | 2023-03-14 | High temperature product positioning test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219715524U true CN219715524U (en) | 2023-09-19 |
Family
ID=87996742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320620044.9U Active CN219715524U (en) | 2023-03-14 | 2023-03-14 | High temperature product positioning test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219715524U (en) |
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2023
- 2023-03-14 CN CN202320620044.9U patent/CN219715524U/en active Active
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