CN219704632U - Tilting device - Google Patents
Tilting device Download PDFInfo
- Publication number
- CN219704632U CN219704632U CN202321054426.6U CN202321054426U CN219704632U CN 219704632 U CN219704632 U CN 219704632U CN 202321054426 U CN202321054426 U CN 202321054426U CN 219704632 U CN219704632 U CN 219704632U
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- China
- Prior art keywords
- tilting device
- base
- abutment
- central shaft
- abutting
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- 238000000034 method Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052710 silicon Inorganic materials 0.000 abstract description 8
- 239000010703 silicon Substances 0.000 abstract description 8
- 238000005299 abrasion Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The utility model discloses a tilting device which is used for adjusting the dip angle between a base and a grinding device, wherein the grinding device comprises an abutting part and an operating part, the tilting device comprises an adjusting component and a driving component connected to the base, the adjusting component comprises a central shaft, a fastening piece and an elastic piece, the central shaft is connected to the base, the abutting part abuts against the base, the central shaft passes through the abutting part and then is connected with the fastening piece, and the elastic piece is sleeved on the central shaft and is at least partially arranged between the fastening piece and the abutting part; the operating part is at least partially arranged in the driving assembly, and the driving assembly controls the abutting part to horizontally rotate and/or longitudinally rotate through the operating part. Through the arrangement, the inclination angle between the base and the grinding device can be adjusted, and meanwhile, the processing quality of the silicon wafer is improved.
Description
Technical Field
The utility model relates to the technical field of silicon wafer processing, in particular to an inclination device for adjusting an inclination angle between a base and a grinding device.
Background
In the prior art, the grinding head of the grinding mechanism is disposed on the base. When the grinding head needs to be subjected to angle adjustment, a user is required to manually perform the angle adjustment, and the working efficiency is low. For example, in adjusting the inclination angle of the grinding head in the front-rear direction, the grinding head is required to be disposed on the front-rear sides of the base, and adjusting screws are respectively provided on the front-rear surfaces thereof. At this time, the user needs to adjust the inclination of the grinding head in the front-rear direction by manually adjusting the position of the screw. The adjusting mode is characterized in that the positions of the screws are required to be manually adjusted, so that the adjusting difficulty is high, and if two screws are simultaneously adjusted, the adjusting angle is large, the adjusting accuracy of the inclination angle of the grinding head is not improved, and the grinding accuracy of the grinding mechanism is affected.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model aims to provide a tilting device capable of improving grinding accuracy.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the tilting device is used for adjusting the tilt angle between the base and the grinding device, the grinding device comprises an abutting part and an operating part, the tilting device comprises an adjusting component and a driving component connected to the base, the adjusting component comprises a central shaft, a fastening piece and an elastic piece, the central shaft is connected to the base, the abutting part abuts against the base, the central shaft passes through the abutting part and then is connected with the fastening piece, and the elastic piece is sleeved on the central shaft and is at least partially arranged between the fastening piece and the abutting part; the operating part is at least partially arranged in the driving assembly, and the driving assembly controls the abutting part to horizontally rotate and/or longitudinally rotate through the operating part.
Further, the adjusting assembly further comprises an adjusting block, the adjusting block is in a semi-cylindrical shape, the adjusting block is provided with a through hole which extends along the axial direction of the central shaft and penetrates through the adjusting block, and the central shaft penetrates through the through hole and the abutting portion and then is connected with the fastening piece.
Further, an abutting groove is formed in one side, close to the adjusting block, of the abutting portion, and the cylindrical surface of the adjusting block abuts against the inner wall of the abutting groove.
Further, the contour of the inner wall of the abutment groove coincides with the contour of the cylindrical surface of the adjustment block.
Further, an abrasion-resistant layer is arranged on the inner wall of the abutting groove; the upper surface of the base is provided with a wear-resistant layer along the up-down direction of the tilting device.
Further, the adjusting block is rotatably connected with the central shaft.
Further, the adjusting assembly further comprises an abutting piece, the abutting piece is sleeved on the central shaft, the abutting piece is arranged between the fastening piece and the adjusting block, and the elastic piece is at least partially arranged between the abutting portion and the abutting piece.
Further, the fastener, the abutting portion, and the adjusting block are disposed in this order from top to bottom along the up-down direction of the tilting device.
Further, the lower end of the central shaft is in threaded connection with the base.
Further, the driving assembly comprises a first driving piece and a second driving piece which are connected to the base, the operation part is at least partially arranged in the first driving piece, the operation part is also at least partially arranged in the second driving piece, the first driving piece controls the abutting part to horizontally rotate through the operation part, and the second driving piece controls the abutting part to longitudinally rotate through the operation part.
According to the tilting device provided by the utility model, the operation part is controlled by the driving component to drive the abutting part to move, so that the abutting part horizontally rotates and/or longitudinally rotates, the inclination angle between the base and the grinding device is adjusted, and the processing quality of the silicon wafer is improved.
Drawings
Fig. 1 is a front view of the tilting device of the present utility model.
Fig. 2 is a schematic structural view of the tilting device of the present utility model.
Fig. 3 is a partial structural sectional view of the tilting device of the present utility model.
Fig. 4 is an enlarged view of a portion of fig. 3 a in accordance with the present utility model.
Fig. 5 is a schematic view of another angle structure of the tilting device of the present utility model.
Detailed Description
In order to make the present utility model better understood by those skilled in the art, the technical solutions in the specific embodiments of the present utility model will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model.
As shown in fig. 1 and 2, an inclination apparatus 100 is used for adjusting an inclination angle between a susceptor 200 and a grinding apparatus 300, thereby realizing adjustment of a grinding angle of a silicon wafer to improve grinding accuracy of the grinding apparatus 300. Specifically, the tilting device 100 is at least partially disposed on the base 200, and the grinding device 300 is at least partially disposed on the base 200 through the tilting device 100. Wherein, the tilting device 100 can be provided with a plurality of groups, the grinding device 300 can also be provided with a plurality of groups, and the number of the grinding devices 300 is consistent with the number of the tilting devices 100, thereby being beneficial to improving the processing quality of the silicon wafer. The present utility model is described by taking one set of tilting devices 100 and one set of grinding devices 300 associated with the tilting devices 100 as an example. For clarity of explanation of the technical solution of the present utility model, the front side, the rear side, the left side, the right side, the upper side and the lower side are also defined as shown in fig. 3.
As shown in fig. 2, 3, and 4, as one implementation, the grinding device 300 includes an abutment portion 31 and an operation portion 32. The tilting device 100 includes an adjustment assembly 11 and a drive assembly 12. The adjustment assembly 11 is connected to the base 200 and the drive assembly 12 is also connected to the base 200. Specifically, the adjustment assembly 11 includes a central shaft 112, a fastener 113, and an elastic member 114.
The central shaft 112 is connected to the base 200, the abutting portion 31 abuts against the base 200, and the central shaft 112 passes through the abutting portion 31 and is connected to the fastener 113. The elastic member 114 is sleeved on the central shaft 112 and at least partially disposed between the fastening member 113 and the abutting portion 31. As an alternative implementation, the elastic member 114 may be provided as a compression spring; the central shaft 112 and the fastener 113 may be provided as a threaded connection. Through the above arrangement, the elastic force generated by the elastic member 114 can be controlled by the fastener 113, so that the control of the moving difficulty of the elastic member 114 to the abutting portion 31 is facilitated, that is, the adjustment accuracy of the inclination angle between the base 200 and the grinding device 300 can be improved, and the grinding accuracy of the grinding device 300 can be further improved.
The operation portion 32 is at least partially provided in the driving assembly 12, and the driving assembly 12 controls the abutting portion 31 to horizontally rotate and/or longitudinally rotate through the operation portion 32. Wherein the abutment 31 rotates horizontally and the abutment 31 rotates around the axis of the central shaft 112, and the abutment 31 swings longitudinally and the abutment 31 swings in the left-right direction of the tilting device 100.
Through the arrangement, the driving assembly 12 can control the operation part 32 to move so as to drive the abutting part 31 integrated with the operation part 32 to move, so that the abutting part 31 horizontally rotates and/or longitudinally rotates, the inclination angle between the base 200 and the grinding device 300 is adjusted, and the processing quality of the silicon wafer is improved.
As one implementation, the adjustment assembly 11 further includes an adjustment block 115. The adjusting block 115 is in a semi-cylinder shape, and the abutting portion 31 abuts against the cylindrical surface of the adjusting block 115, so that a movement track is provided for the abutting portion 31 through the cylindrical surface of the adjusting block 115, and the inclination angle between the base 200 and the grinding device 300 can be stably adjusted by the inclination device 100. Wherein a longitudinal rotation of the abutment 31 means that the abutment 31 moves in the circumferential direction of the adjustment block 115.
More specifically, the adjustment block 115 is provided with a through hole 116 extending axially along the central axis 112 and penetrating the adjustment block 115. Wherein, the axial extension of the through hole 116 along the central shaft 112 means that the adjusting block 115 extends in the up-down direction of the tilting device 100. In the present embodiment, the center shaft 112 passes through the through hole 116 and the abutting portion 31 and is then connected to the fastener 113.
As shown in fig. 4, as one implementation, an abutment groove 311 is provided on a side of the abutment portion 31 near the adjustment block 115, and the cylindrical surface of the adjustment block 115 abuts against the inner wall of the abutment groove 311. Due to the fact that the adjusting block 115 is in the semi-cylindrical shape, through the arrangement, under the condition that the driving assembly 12 controls the operating part 32 to drive the abutting part 31, the abutting part 31 can move axially along the adjusting block 115 and/or radially along the adjusting block 115, and therefore the inclination angle between the base 200 and the grinding device 300 can be adjusted, and accurate grinding of the silicon wafer can be achieved. Wherein the abutment 31 axially moves along the adjustment block 115 and/or radially moves along the adjustment block 115 means that the abutment 31 swings in the left-right direction and/or moves in the front-rear direction of the tilting device 100. In addition, through the above arrangement, the inclination angle adjustment between the grinding device 300 and the base 200 can be realized through the abutting of the adjusting block 115 and the abutting groove 311, so that the inclination angle adjusting structure between the grinding device 300 and the base 200 is simplified, and the grinding accuracy and the working efficiency of the grinding device 300 are improved.
Specifically, the contour of the inner wall of the abutment groove 311 coincides with the contour of the cylindrical surface of the adjustment block 115. By the above arrangement, the abutment stability of the abutment portion 31 and the adjustment block 115 is advantageously improved, thereby improving the working stability and the working efficiency of the grinding apparatus 300, while also reducing the difficulty in adjustment of the tilting apparatus 100.
More specifically, the inner wall of the abutment groove 311 is provided with a wear layer, and the upper surface of the base 200 is provided with a wear layer in the up-down direction of the tilting device 100. By the arrangement, the abrasion of the abutting groove 311 and the adjusting block 115 caused by friction can be reduced, and the abrasion of the base 200 and the adjusting block 115 caused by friction can be reduced, which is beneficial to prolonging the service lives of the base 200, the abutting part 31 and the adjusting block 115.
As one implementation, the adjustment block 115 is rotatably coupled to the central shaft 112. By the above arrangement, the adjustment block 115 can be rotated along with the abutting portion 31 and always kept in the abutting state, so that interference between the abutting portion 31 and the adjustment block 115 is avoided, and abrasion between the abutting portion 31 and the adjustment block 115 is reduced.
As one implementation, the adjustment assembly 11 further includes an abutment 117. The abutment 117 is sleeved on the central shaft 112, and the abutment 117 is arranged between the fastener 113 and the adjusting block 115. Through the arrangement, the fastener 113 and the abutting piece 117 can axially move along the central shaft 112, and meanwhile, the arrangement of the abutting piece 117 is beneficial to reducing vibration of the fastener 113 in the working process, so that the service life of the fastener 113 is prolonged. Specifically, the elastic member 114 is at least partially disposed between the abutment 31 and the abutment 117. Through the arrangement, as the fastening piece 113 is in threaded connection with the central shaft 112, the distance between the abutting piece 117 and the adjusting block 115 can be adjusted by rotating the fastening piece 113, so that the fastening piece 113 can adjust the pretightening force of the elastic piece 114, the pretightening force of the elastic piece 114 can be applied between the adjusting block 115 and the abutting piece 117, the stretching amount of the elastic piece 114 can be controlled by the fastening piece 113, the moving difficulty of the abutting portion 31 can be adjusted, and the grinding accuracy can be improved. In addition, the contact area between the abutting piece 117 and the elastic piece 114 can be increased, which is beneficial to improving the stability of the elastic piece 114.
As shown in fig. 3 and 4, as an implementation manner, along the up-down direction of the tilting device 100, the fastener 113, the abutment portion 31, and the adjusting block 115 are sequentially disposed from top to bottom, so that the efficiency of transmission of the adjusting assembly 11 is improved, the space of the tilting device 100 is saved, and the compactness of the adjusting assembly 11 is improved.
As one implementation, the lower end of the central shaft 112 is screw-coupled with the base 200, thereby improving the coupling stability of the central shaft 112 and the base 200.
As shown in fig. 5, as one implementation, the driving assembly 12 includes a first driving member 121 and a second driving member 122 connected to the base 200, the operating portion 32 is at least partially disposed in the first driving member 121, and the operating portion 32 is also at least partially disposed in the second driving member 122. Wherein the first driving piece 121 controls the abutting portion 31 to horizontally rotate through the operation portion 32, and the second driving piece 122 controls the abutting portion 31 to longitudinally rotate through the operation portion. Through the arrangement, the driving assembly 12 can control the operation part 32 to drive the abutting part 31, so that the inclination angle between the base 200 and the grinding device 300 is adjusted, and accurate grinding of the silicon wafer is realized.
It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.
Claims (10)
1. A tilting device for adjusting the tilt angle between a base and a grinding device,
it is characterized in that the method comprises the steps of,
the grinding device comprises an abutting part and an operating part,
the tilting device comprises an adjustment assembly and a drive assembly connected to the base,
the adjusting assembly comprises a central shaft, a fastening piece and an elastic piece, wherein the central shaft is connected to the base, the abutting part abuts against the base, the central shaft penetrates through the abutting part and then is connected with the fastening piece, and the elastic piece is sleeved on the central shaft and is at least partially arranged between the fastening piece and the abutting part;
the operating part is at least partially arranged in the driving assembly, and the driving assembly controls the abutting part to horizontally rotate and/or longitudinally rotate through the operating part.
2. The tilting device according to claim 1, wherein the adjustment assembly further comprises an adjustment block having a semi-cylindrical shape, the adjustment block being provided with a through hole extending axially along the central axis and penetrating the adjustment block, the central axis being connected to the fastener after passing through the through hole and the abutment.
3. The tilting device according to claim 2, wherein the abutting portion is provided with an abutting groove on a side thereof close to the adjustment block, and the cylindrical surface of the adjustment block abuts against an inner wall of the abutting groove.
4. A tilting device according to claim 3, wherein the contour of the inner wall of the abutment groove coincides with the contour of the cylindrical surface of the adjustment block.
5. A tilting device according to claim 3, wherein the inner wall of the abutment groove is provided with a wear layer; and a wear-resistant layer is arranged on the upper surface of the base along the up-down direction of the tilting device.
6. A tilting device according to claim 2 or 3, wherein the adjustment block is rotatably connected to the central shaft.
7. A tilting device according to claim 2 or 3, wherein the adjustment assembly further comprises an abutment member which is sleeved on the central shaft, the abutment member being arranged between the fastener and the adjustment block, the resilient member being at least partially arranged between the abutment portion and the abutment member.
8. The tilting device according to claim 2, wherein the fastener, the abutment portion, and the adjustment block are disposed in this order from top to bottom in the up-down direction of the tilting device.
9. The tilting device according to claim 8, wherein the lower end of the central shaft is screw-coupled to the base.
10. A tilting device according to claim 1 or 2, wherein the drive assembly comprises a first drive member and a second drive member connected to the base, the operating portion being at least partially arranged in the first drive member, the operating portion also being at least partially arranged in the second drive member, the first drive member controlling the abutment to rotate horizontally via the operating portion, the second drive member controlling the abutment to rotate longitudinally via the operating portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321054426.6U CN219704632U (en) | 2023-04-28 | 2023-04-28 | Tilting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321054426.6U CN219704632U (en) | 2023-04-28 | 2023-04-28 | Tilting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219704632U true CN219704632U (en) | 2023-09-19 |
Family
ID=87981330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321054426.6U Active CN219704632U (en) | 2023-04-28 | 2023-04-28 | Tilting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219704632U (en) |
-
2023
- 2023-04-28 CN CN202321054426.6U patent/CN219704632U/en active Active
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