CN219704618U - Wafer surface grinding device - Google Patents
Wafer surface grinding device Download PDFInfo
- Publication number
- CN219704618U CN219704618U CN202320567735.7U CN202320567735U CN219704618U CN 219704618 U CN219704618 U CN 219704618U CN 202320567735 U CN202320567735 U CN 202320567735U CN 219704618 U CN219704618 U CN 219704618U
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- Prior art keywords
- block
- wafer surface
- frame
- grinding
- push rod
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- 238000005498 polishing Methods 0.000 claims abstract description 42
- 238000009434 installation Methods 0.000 claims abstract description 31
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000007664 blowing Methods 0.000 claims abstract description 12
- 239000002344 surface layer Substances 0.000 claims abstract description 3
- 239000012530 fluid Substances 0.000 claims description 33
- 239000007921 spray Substances 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 25
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The utility model provides a wafer surface grinding device. The grinding device solves the technical problems that residual grinding liquid on the surface of the wafer can drip out when the existing grinding device is taken after grinding is completed. The wafer surface layer grinding device comprises a frame, wherein a first push rod motor is installed at the bottom of the frame, a first installation block is connected to the rod part of the first push rod motor, a first rotating motor is installed on the first installation block, a second installation block is connected to the output shaft of the first rotating motor, a first grinding block is installed on the first installation block, a placing disc is arranged above the first grinding block, a mounting frame is further connected to the upper side of the frame, a second push rod motor is installed on the mounting frame, a third installation block is connected to the rod part of the second push rod motor, a second rotating motor is installed in the third installation block, a second grinding block is connected to the output shaft of the second rotating motor, a fourth installation block is installed on the second grinding block, an annular blowing fan is installed on the fourth installation block, and the third installation block is further connected with an auxiliary mechanism. The utility model can effectively reduce the adhesion amount of the polishing liquid on the surface of the wafer.
Description
Technical Field
The utility model belongs to the technical field of wafer processing, and relates to a grinding device, in particular to a wafer surface layer grinding device.
Background
The wafer is used as a semiconductor material, and the surface of the wafer is required to have certain flatness when the wafer is used, so that a special grinding device is required to grind the wafer, grinding liquid is added when the conventional grinding device grinds, more grinding liquid is always remained on the surface of the wafer after grinding, and the wafer can be dripped out when being taken, therefore, in order to reduce the residual quantity of the grinding liquid on the surface of the wafer after grinding, the wafer surface grinding device is very necessary to be designed.
Disclosure of Invention
The present utility model is directed to solving the above-mentioned problems of the prior art and providing a wafer surface polishing apparatus.
The aim of the utility model can be achieved by the following technical scheme: the utility model provides a wafer surface grinding device, includes the frame, a serial communication port, push rod motor I is installed to the frame bottom, push rod motor I's pole portion is connected with installation piece I, installs rotating electrical machines I on the installation piece I, is connected with installation piece II on the output shaft of rotating electrical machines I, installs on the installation piece and polishes piece I, it is provided with the placing tray that is used for placing the wafer to polish piece I top, the frame top still is connected with the mounting bracket, install push rod motor II on the mounting bracket, push rod motor II's pole portion is connected with installation piece III, installs rotating electrical machines II in the installation piece III, be connected with polishing piece II on rotating electrical machines's the output shaft, install installation piece IV in the central point of polishing piece II, install annular air blower on the installation piece IV, installation piece III still links to each other with an assist mechanism that is used for adding the lapping liquid.
The placing plate is further connected with a driving mechanism capable of enabling the placing plate to rotate, the driving mechanism comprises a driving motor, the driving motor is arranged on the frame, a driving gear is arranged on an output shaft of the driving motor, a tooth groove part is arranged on the side face of the placing plate, and the tooth groove part is meshed with the driving gear.
The annular blowing fan comprises a shell, a rotating motor III, an air ejector pipe and an air pump air ejector module, wherein the shell is arranged on a mounting block IV, an annular opening is formed in the shell, the rotating motor III is arranged inside the shell, the air pump air ejector module is arranged on an output shaft of the rotating motor III, the air ejector pipe is connected to the air pump air ejector module, and the air ejector pipe is slidably connected in the annular opening.
The working principle of the utility model is as follows: placing a wafer to be surface-ground in a placing disc, driving a first push rod motor and a second push rod motor to enable a first polishing block and a second polishing block to press the placing disc, starting a first rotating motor and a second rotating motor after pressing, controlling the first polishing block and the second polishing block to reversely rotate, and simultaneously starting a driving motor to enable the placing disc to rotate at a certain speed, so that the grinding effect is improved, and continuously adding grinding liquid during the grinding period through an auxiliary mechanism; when the polishing is completed, the push rod motor contracts downwards for a part of distance, so that a certain gap is formed between the polishing block and the placing plate, the gap is smaller than the height of the wafer, and meanwhile, the push rod motor contracts to enable the air outlet of the annular blowing fan to be aligned with the gap, and the annular blowing fan is started to blow away the polishing liquid.
The auxiliary mechanism comprises an outer grinding fluid box, a conveying pipe, an inner grinding fluid box and spray heads, wherein the outer grinding fluid box is arranged at the top of the mounting frame and connected with the inner grinding fluid box through the conveying pipe, the inner grinding fluid box is arranged inside the mounting block, and a plurality of spray heads are arranged at the bottom of the inner grinding fluid box.
By adopting the structure, the grinding fluid in the grinding fluid outer box is conveyed to the grinding fluid inner box through the conveying pipe and sprayed out through the spray head.
And a first hydraulic support rod group is connected between the first push rod motor and the first mounting block.
By adopting the structure, the first installation block is supported in an auxiliary mode.
And a second hydraulic support rod group is connected between the mounting frame and the third mounting block.
By adopting the structure, the third installation block is fixedly arranged in an auxiliary manner.
The machine frame is provided with a guide groove for collecting grinding fluid, the guide groove is communicated with a collecting groove, and the collecting groove is communicated with an external grinding fluid collecting box.
By adopting the structure, the grinding fluid is convenient to collect.
And a mounting block five is arranged on the rotary motor I, and a supporting piece is connected between the mounting block five and the mounting block II.
By adopting the structure, the installation block five is supported in an auxiliary mode.
The polishing device comprises a polishing block I, a polishing block II and a polishing block II, wherein a plurality of guide holes I for the outflow of polishing liquid are formed in the polishing block I, a collecting groove is communicated with the guide holes I, and a plurality of guide holes II for the outflow of polishing liquid are formed in the polishing block II.
With the above structure, the polishing liquid on the inner side is collected through the first guide hole, and the polishing liquid is assisted to flow out onto the placing plate through the second guide hole.
Compared with the prior art, the wafer surface grinding device has the advantages that: according to the utility model, the annular blowing fan is arranged at the center of the polishing block II, and the polishing liquid remained on the wafer after polishing can be blown into the collecting tank through the gap to be collected through synchronous control of the push rod motor I and the push rod motor II, so that the adhesion quantity of the polishing liquid on the surface of the wafer is effectively reduced.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic view of the structure of the placing tray in the present utility model.
Fig. 3 is a schematic structural view of the annular blowing fan of the present utility model.
Fig. 4 is a partial enlarged view at a in the present utility model.
In the figure, 1, a rack; 2. a push rod motor I; 3. a first mounting block; 4. a first rotating electric machine; 5. a second mounting block; 6. polishing the first block; 7. placing a tray; 8. a mounting frame; 9. a push rod motor II; 10. a third mounting block; 11. a second rotating electric machine; 12. polishing a second block; 13. a mounting block IV; 14. an annular blowing fan; 15. a driving motor; 16. a drive gear; 17. a housing; 18. a third rotating electric machine; 19. a gas lance; 20. an air pump air injection module; 21. an outer case for grinding fluid; 22. a delivery tube; 23. an inner tank of grinding fluid; 24. a spray head; 25. a first hydraulic support rod group; 26. a second hydraulic support rod group; 27. a guide groove; 28. a collection tank; 29. a mounting block V; 30. a support; 31. the first guide hole; 32. and a second guide hole.
Detailed Description
The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.
As shown in fig. 1-4, the wafer surface grinding device comprises a frame 1, wherein a push rod motor 12 is installed at the bottom of the frame 1, a mounting block 13 is connected to the rod part of the push rod motor 1, a rotating motor 4 is installed on the mounting block 3, a mounting block second 5 is connected to the output shaft of the rotating motor 4, a grinding block first 6 is installed on the mounting block, a placing disc 7 for placing a wafer is arranged above the grinding block first 6, a mounting frame 8 is further connected above the frame 1, a push rod motor second 9 is installed on the mounting frame 8, a mounting block third 10 is connected to the rod part of the push rod motor second 9, a rotating motor second 11 is installed in the mounting block third 10, a grinding block second 12 is connected to the output shaft of the rotating motor second 11, a mounting block fourth 13 is installed at the center position of the grinding block second 12, an annular air blowing fan 14 is installed on the mounting block fourth 13, and the mounting block third 10 is further connected with an auxiliary mechanism for adding grinding liquid.
In the utility model, a plurality of placing grooves for placing wafers are arranged in the placing tray 7, and different placing trays 7 can be replaced according to the sizes of the wafers.
The placing plate 7 is also connected with a driving mechanism capable of rotating the placing plate 7, the driving mechanism comprises a driving motor 15, the driving motor 15 is arranged on the frame 1, a driving gear 16 is arranged on an output shaft of the driving motor 15, a tooth groove part is arranged on the side face of the placing plate 7, and the tooth groove part is meshed with the driving gear 16.
The annular blowing fan 14 comprises a shell 17, a rotating motor III 18, an air jet pipe 19 and an air pump air jet module 20, wherein the shell 17 is arranged on a mounting block IV 13, an annular opening is formed in the shell 17, the rotating motor III 18 is arranged in the shell 17, the air pump air jet module 20 is arranged on an output shaft of the rotating motor III 18, the air jet pipe 19 is connected to the air pump air jet module 20, and the air jet pipe 19 is slidably connected in the annular opening.
The air pump and air injection module 20 of the present utility model is formed by combining an existing air pump and air injection equipment.
The auxiliary mechanism comprises an outer grinding fluid box 21, a conveying pipe 22, an inner grinding fluid box 23 and spray heads 24, wherein the outer grinding fluid box 21 is arranged at the top of the mounting frame 8, the inner grinding fluid box 23 is connected with the outer grinding fluid box 21 through the conveying pipe 22, the inner grinding fluid box 23 is arranged inside the mounting block III 10, and a plurality of spray heads 24 are arranged at the bottom of the inner grinding fluid box 23.
A first hydraulic support rod group 25 is connected between the first push rod motor 2 and the first mounting block 3.
And a second hydraulic support rod group 26 is connected between the mounting frame 8 and the third mounting block 10.
The first hydraulic support rod group 25 and the second hydraulic support rod group 26 adopt the existing hydraulic rod structure.
The frame 1 is provided with a guide groove 27 for collecting grinding fluid, the guide groove 27 is communicated with a collecting groove 28, and the collecting groove 28 is communicated with an external grinding fluid collecting box.
The first rotating motor 4 is provided with a mounting block five 29, and a supporting piece 30 is connected between the mounting block five 29 and the mounting block two 5.
In the utility model, one end of a supporting piece 30 is rotationally connected with a mounting block five 29, and the other end of the supporting piece 30 is rotationally connected with a mounting block two 5.
The first polishing block 6 is provided with a plurality of first guide holes 31 for the outflow of the polishing liquid, the first guide holes 31 are communicated with the collecting tank 28, and the second polishing block 12 is provided with a plurality of second guide holes 32 for the outflow of the polishing liquid.
The working principle of the utility model is as follows: placing a wafer to be surface-ground in a placing disc 7, driving a first push rod motor 2 and a second push rod motor 9 to enable a first polishing block 6 and a second polishing block 12 to press the placing disc 7, starting a first rotating motor 4 and a second rotating motor 11 after pressing, controlling the first polishing block 6 and the second polishing block 12 to reversely rotate, and simultaneously starting a driving motor 15 to enable the placing disc 7 to rotate at a certain speed, so that the grinding effect is improved, and continuously adding grinding liquid during grinding through an auxiliary mechanism; when the grinding is finished, the first push rod motor 2 is contracted downwards for a part of distance, so that a certain gap is formed between the grinding block and the placing disc 7, the gap is smaller than the height of the wafer, and meanwhile, the second push rod motor 9 is contracted, so that the air outlet of the annular blowing fan 14 is aligned with the gap, and the annular blowing fan 14 is started to blow away grinding liquid.
The mechanisms are connected through the prior art, and synchronous control is realized through the control panel.
All the components are general standard components or components known to the person skilled in the art, and the structures and principles of the components are known to the person skilled in the art through technical manuals or through routine experimental methods.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.
Claims (9)
1. The utility model provides a wafer surface grinding device, includes frame (1), its characterized in that, frame (1) bottom is installed one push rod motor (2), the pole portion of push rod motor (2) is connected with installation piece one (3), installs rotating electrical machines one (4) on installation piece one (3), is connected with installation piece two (5) on the output shaft of rotating electrical machines one (4), installs on the installation piece and polishes piece one (6), be provided with place dish (7) that are used for placing the wafer above polishing piece one (6), frame (1) top still is connected with mounting bracket (8), install push rod motor two (9) on mounting bracket (8), the pole portion of push rod motor two (9) is connected with installation piece three (10), installs rotating electrical machines two (11) in installation piece three (10), be connected with on the output shaft of rotating electrical machines two (11) and polish piece two (12) central point put and install installation piece four (13), install annular fan (14) on installation piece four (13), install three (10) and still link to each other with supplementary grinding fluid.
2. A wafer surface grinding device according to claim 1, characterized in that the placement disc (7) is further connected to a driving mechanism capable of rotating the placement disc, the driving mechanism comprises a driving motor (15), the driving motor (15) is mounted on the frame (1), a driving gear (16) is mounted on an output shaft of the driving motor (15), a tooth groove portion is arranged on a side face of the placement disc (7), and the tooth groove portion is meshed with the driving gear (16).
3. The wafer surface grinding device according to claim 1, wherein the annular blowing fan (14) comprises a housing (17), a rotary motor III (18), an air jet pipe (19) and an air pump air jet module (20), the housing (17) is mounted on a mounting block IV (13), an annular opening is formed in the housing (17), the rotary motor III (18) is arranged in the housing (17), an air pump air jet module (20) is mounted on an output shaft of the rotary motor III (18), the air jet pipe (19) is connected to the air pump air jet module (20), and the air jet pipe (19) is slidably connected in the annular opening.
4. The wafer surface layer grinding device according to claim 1, wherein the auxiliary mechanism comprises an outer grinding fluid tank (21), a conveying pipe (22), an inner grinding fluid tank (23) and a spray nozzle (24), the outer grinding fluid tank (21) is installed at the top of the installation frame (8), the outer grinding fluid tank (21) is connected with the inner grinding fluid tank (23) through the conveying pipe (22), the inner grinding fluid tank (23) is installed inside the installation block III (10), and a plurality of spray nozzles (24) are arranged at the bottom of the inner grinding fluid tank (23).
5. The polishing apparatus for wafer surface according to claim 1, wherein a hydraulic support rod group (25) is connected between the push rod motor (2) and the mounting block (3).
6. A wafer surface grinding device according to claim 1, characterized in that a second hydraulic support bar set (26) is connected between the mounting frame (8) and the third mounting block (10).
7. The wafer surface grinding device according to claim 1, wherein the frame (1) is provided with a guide groove (27) for collecting grinding fluid, the guide groove (27) is communicated with a collecting groove (28), and the collecting groove (28) is communicated with an external grinding fluid collecting box.
8. The wafer surface grinding device according to claim 1, wherein a fifth mounting block (29) is mounted on the first rotating electric machine (4), and a supporting member (30) is connected between the fifth mounting block (29) and the second mounting block (5).
9. The polishing apparatus for a wafer surface according to claim 1, wherein the polishing block 1 (6) is provided with a plurality of first guide holes 31 for the polishing liquid to flow out, the first guide holes 31 are communicated with the collecting tank 28, and the polishing block 12 is provided with a plurality of second guide holes 32 for the polishing liquid to flow out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320567735.7U CN219704618U (en) | 2023-03-17 | 2023-03-17 | Wafer surface grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320567735.7U CN219704618U (en) | 2023-03-17 | 2023-03-17 | Wafer surface grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219704618U true CN219704618U (en) | 2023-09-19 |
Family
ID=88001017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320567735.7U Active CN219704618U (en) | 2023-03-17 | 2023-03-17 | Wafer surface grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219704618U (en) |
-
2023
- 2023-03-17 CN CN202320567735.7U patent/CN219704618U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |