CN219696916U

CN219696916U - Blue light semiconductor laser

Info

Publication number: CN219696916U
Application number: CN202320993169.6U
Authority: CN
Inventors: 王胜伟; 孙继超; 陈梅; 曹龙义
Original assignee: Anhui Guangzhi Technology Co Ltd
Current assignee: Anhui Guangzhi Technology Co Ltd
Priority date: 2023-04-27
Filing date: 2023-04-27
Publication date: 2023-09-15
Anticipated expiration: 2033-04-27

Abstract

The utility model belongs to the technical field of lasers, and relates to a blue semiconductor laser. The blue semiconductor laser includes: the shell is of a hollow structure with two open ends; the radiator and the fan are fixedly arranged in the shell, a mounting cavity is arranged in the radiator, the mounting cavity penetrates through the outer wall of the radiator, a through hole is formed in one end, far away from the fan, of the radiator, the through hole extends along the axial direction and is communicated with the mounting cavity, and a lens is arranged in the through hole; an LD disposed within the mounting chamber; outside air is sucked into the cavity inside the housing by the fan and is discharged from the other end of the housing after exchanging heat with the radiator. The utility model can cool the LD; and the smoke dust on the light-emitting path of the laser can be blown away, so that the quality of the light beam reaching the surface of the workpiece is ensured.

Description

Blue light semiconductor laser

Technical Field

The utility model belongs to the technical field of lasers, and relates to a blue semiconductor laser.

Background

With the development needs of the modern industry, many blue semiconductor lasers are emerging.

In the process of processing a workpiece by a blue semiconductor laser, a large amount of smoke dust can appear in a processing area, so that the quality of a light beam reaching the surface of the workpiece is influenced, and the processing effect is influenced. Meanwhile, in the processing process, the temperature of the LD gradually rises along with the processing; the LD operates under long-term high-temperature working conditions, which affects the service life of the LD and finally the service life of the laser.

Disclosure of Invention

The utility model aims to solve the technical problems that: provided is a blue semiconductor laser which can reduce the influence of smoke and radiate heat to an LD.

The technical scheme provided by the utility model is as follows:

a blue semiconductor laser, comprising:

the shell is of a hollow structure with two open ends;

the radiator and the fan are fixedly arranged in the shell, a mounting cavity is arranged in the radiator, the mounting cavity penetrates through the outer wall of the radiator, a through hole is formed in one end, far away from the fan, of the radiator, the through hole extends along the axial direction and is communicated with the mounting cavity, and a lens is arranged in the through hole;

an LD disposed within the mounting chamber.

Preferably, the method further comprises:

the sealing plate is arranged at the opening of the mounting cavity, the window sheet is arranged in the through hole, and the window sheet is positioned at one side of the lens away from the LD.

Preferably, the mounting chamber extends outwards along the vertical direction of the opening of the mounting chamber to form an outer wall of the radiator, and the sealing plate is L-shaped.

Preferably, the outer wall of the radiator is provided with a plurality of fins, the fins are arranged at intervals, and the fins are arranged along the gas flowing direction.

Preferably, the method further comprises:

the fan housing, the fan housing is fixed to be set up the shell tip, the fan housing is located one side of gas outflow shell, the fan housing is both ends open-ended hollow structure, the cross-sectional area of the inside cavity of fan housing is progressively decreased in proper order along the direction of gas flow.

Preferably, a flange is arranged on one side of the outer wall of the fan housing, which is close to the shell.

Preferably, the method further comprises:

the circuit board is fixedly arranged in the shell, the LD is electrically connected with the circuit board through a wire, and the fan is electrically connected with the circuit board through a wire.

Preferably, a temperature monitoring device is further arranged in the mounting chamber, the temperature monitoring device is used for monitoring the temperature near the LD, and the temperature monitoring device is electrically connected with the circuit board through a wire.

Preferably, the temperature monitoring device is a thermistor.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the LD is arranged in the mounting cavity of the radiator, and when the air sucked into the cavity in the shell by the fan passes through the radiator, the air can exchange heat with the radiator, so that the LD is cooled; and after being discharged from the shell, the gas can blow off smoke dust on the light-emitting path of the laser, so that the quality of the light beam reaching the surface of the workpiece is ensured.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model.

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the internal structure of the present utility model;

FIG. 3 is a perspective view of a heat sink according to the present utility model;

fig. 4 is a perspective view of a fan housing of the present utility model.

In the figure: 1. an LD; 2. a lens; 3. a heat sink; 31. a mounting chamber; 32. a through hole; 33. a fin; 4. a fan; 5. a fan housing; 51. a flange plate; 6. a sealing plate; 7. a circuit board; 8. a window sheet; 9. a housing.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Example 1

Referring to fig. 1-4, a blue semiconductor laser includes:

the shell 9, the shell 9 is a hollow structure with two open ends;

a fan 4, the fan 4 being disposed within the housing 9;

the radiator 3 is fixedly arranged on the bottom surface of the inner cavity of the shell 9, the radiator 3 is positioned on one side of the fan 4, an installation cavity 31 is arranged in the radiator 3, the installation cavity 31 extends along the vertical direction and penetrates through the upper wall of the radiator 3, a through hole 32 is arranged at one end, far away from the fan 4, of the radiator 3, the through hole 32 extends along the axial direction and is communicated with the installation cavity 31, and a lens 2 is arranged in the through hole 32;

the position where the heat sink 3 is mounted is not limited to the bottom surface of the inner cavity of the housing 9, and the opening of the mounting chamber 31 is not limited to the upper side.

LD1, LD1 is provided in the mounting chamber 31, LD1 being a Laser Diode;

outside air is sucked into the cavity inside the housing 9 by the fan 4, exchanges heat with the radiator 3, and is discharged from the other end of the housing 9, so that air flow is formed on the laser light-emitting path, and smoke dust on the light-emitting path is blown away.

In order to improve the heat transfer efficiency between the LD1 and the heat sink 3, a thermally conductive silica gel may be used.

As a further scheme, the LD1 adopts a blue laser diode, and can also adopt laser diodes of other wave bands, so long as the requirements of production and processing can be met.

As a further solution, a sealing plate 6 and a window 8 are further provided, the sealing plate 6 is disposed at the opening of the mounting cavity 31, the window 8 is disposed in the through hole 32, and the window 8 is located on the side of the lens 2 away from the LD 1. The lenses 2 and LD1 are enclosed in the through hole 32 and the mounting chamber 31, and can prevent dust pollution in the processing environment. In order to facilitate the maintenance of the later stage, the sealing plate 6 and the window sheet 8 can be detachably connected. The sealing plate 6 and the window sheet 8 can be matched with a sealing ring or a rubber gasket to seal, so that the sealing effect is further ensured.

As a further solution, the mounting chamber 31 extends radially in a horizontal direction beyond the outer wall of the radiator 3, and the sealing plate 6 is correspondingly L-shaped. The installation cavity 31 horizontally penetrates through the radiator 3, so that an operator can observe the conditions in the installation cavity 31 conveniently during assembly, and the convenience of operation is improved. Meanwhile, in order to facilitate the installation of the sealing plate 6, an L-shaped step surface may be provided as shown in fig. 3.

As a further alternative, a plurality of fins 33 are provided on the outer wall of the heat sink 3, the plurality of fins 33 being provided at intervals, the fins 33 being provided in the direction of the gas flow. The position where the fins 33 are provided is not limited, and may be on one side or multiple sides of the heat sink 3. By providing the plurality of fins 33, the contact area between the radiator 3 and the air can be further increased, and the heat transfer efficiency can be ensured.

As a further scheme, the fan housing 5 is further arranged, the fan housing 5 is fixedly arranged at one end of the outer housing 9, the fan housing 5 is located at one side of the outer housing 9, the fan housing 5 is of a hollow structure with two ends open, the cross-sectional area of the cavity inside the fan housing 5 is sequentially decreased along the direction of gas flow, and the air outlet formed by the fan housing 5 is in a conical design, so that the air pressure is favorably improved, the air speed is increased, and the smoke and dust removal effect is guaranteed.

In order to facilitate the later maintenance, a flange plate 51 is arranged on one side, close to the shell 9, of the outer wall of the fan housing 5, and the flange plate 51 is fixedly connected with the shell 9 in a bolting mode.

The number of fans 4 is not limited to one, and a plurality of fans 4 may be provided, for example, each fan 4 may be provided on both sides of the radiator, so that the speed of the gas flowing out of the housing 9 is further increased.

Example two

Further improvements are made on the basis of the first embodiment.

The circuit board 7 is also arranged, the circuit board 7 is fixedly arranged on the cavity inside the shell 9, the LD1 is electrically connected with the circuit board 7 through a wire, and the fan 4 is electrically connected with the circuit board 7 through a wire, so that the fan 4 and the LD1 can be controlled to be opened and closed through the circuit board 7.

As a further alternative, a thermistor is also provided in the mounting chamber 31, and the temperature near the LD1 is monitored by the thermistor, and the data monitored by the thermistor is transmitted to the circuit board 7 through a wire.

A small hole for installing a thermistor is arranged in the vicinity of the LD1, the thermistor is connected with the circuit board 7 through a terminal, and the thermistor monitors the heat generation amount of the LD1 during working; when the temperature data of the LD1 detected by the thermistor exceeds the allowable highest temperature value, the circuit board 7 controls the LD1 to be powered off, and self-protection is carried out to prolong the service life of the laser.

The positive and negative polar line terminal of LD1 is equipped with male terminal, and the circuit board 7 is equipped with female terminal connected with the male terminal of LD 1.

Most of fans 4 in the prior art are constant rotating speed, the rotating speed cannot be automatically regulated according to heat generated by LD1, vibration and noise under the working condition of high rotating speed operation of the fans 4 are large, the service life of the fans 4 can be greatly shortened, and meanwhile, the structural strength and the processing effect of the whole device are affected to different degrees by vibration.

The fan 4 is positioned in the tail area of the product, belongs to a four-wire adjustable speed fan 4, is inserted with the circuit board 7 through a terminal, and adopts PWM to control the rotating speed. When the temperature of the area near the LD1 is lower, the fan 4 operates in a low-rotation-speed working condition; when the temperature of the area around the LD1 is high, the fan 4 is operated in a high rotation speed condition. Therefore, the fan 4 does not need to operate under the high-rotation-speed working condition for a long time, and can output a reasonable rotation speed according to the actual operation working condition of the LD1, so that vibration and noise during long-time high-rotation-speed operation are effectively reduced, and the service life of the fan 4 is prolonged. The vibration of the fan 4 has different influences on the structural strength and the processing effect of the whole device, so that the processing quality of the device can be improved by the speed-adjustable design of the fan 4, and the service life of the device can be prolonged.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A blue semiconductor laser, comprising:

the shell (9), the shell (9) is a hollow structure with two open ends;

the radiator (3) and the fan (4) are fixedly arranged in the shell (9), an installation cavity (31) is arranged in the radiator (3), the installation cavity (31) penetrates through the outer wall of the radiator (3), a through hole (32) is formed in one end, far away from the fan (4), of the radiator (3), the through hole (32) extends along the axial direction and is communicated with the installation cavity (31), and a lens (2) is arranged in the through hole (32);

-an LD (1), said LD (1) being arranged within the mounting chamber (31).

2. The blue semiconductor laser according to claim 1, further comprising:

the sealing plate (6) and the window sheet (8), the sealing plate (6) is arranged at the opening of the mounting cavity (31), the window sheet (8) is arranged in the through hole (32), and the window sheet (8) is positioned at one side of the lens (2) away from the LD (1).

3. The blue semiconductor laser according to claim 2, characterized in that the mounting chamber (31) extends outwardly from the outer wall of the heat sink (3) in a direction perpendicular to the opening thereof, and the sealing plate (6) is L-shaped.

4. The blue semiconductor laser according to claim 1, characterized in that the outer wall of the heat sink (3) is provided with a plurality of fins (33), the plurality of fins (33) being arranged at intervals, the fins (33) being arranged in the direction of the gas flow.

5. The blue semiconductor laser according to any one of claims 1 to 4, further comprising:

the fan housing (5), fan housing (5) are fixed to be set up the one end of shell (9), fan housing (5) are located one side of gaseous outflow shell (9), fan housing (5) are both ends open-ended hollow structure, the cross-sectional area of the inside cavity of fan housing (5) is progressively decreased in proper order along the direction of gaseous flow.

6. The blue semiconductor laser according to claim 5, characterized in that a flange (51) is provided on the outer wall of the fan housing (5) at a side close to the housing (9).

7. The blue semiconductor laser according to any one of claims 1 to 4, further comprising:

the circuit board (7), circuit board (7) is fixed to be set up in shell (9), LD (1) with circuit board (7) pass through the wire electricity and be connected, fan (4) with circuit board (7) pass through the wire electricity and be connected.

8. Blue semiconductor laser according to claim 7, characterized in that a temperature monitoring device is further provided in the mounting chamber (31) for monitoring the temperature in the vicinity of the LD (1), which temperature monitoring device is electrically connected to the circuit board (7) by means of a wire.

9. The blue semiconductor laser according to claim 8, wherein said temperature monitoring device is a thermistor.