CN219696428U - Line changing moving jig for plastic packaging of semiconductor device - Google Patents

Abstract

The utility model discloses a line changing mobile jig for plastic packaging of a semiconductor device, which comprises a lower jig and an upper jig, wherein a positioning block is fixedly arranged in the middle of the front surface of the lower jig, a positioning device is arranged in the positioning block, the lower jig is clamped on the upper surface of the upper jig through the positioning device, two sides of the lower jig are respectively provided with a U-shaped storage groove, and handles are movably arranged in the storage grooves at two sides; the middle part of the upper jig is provided with a semiconductor device fixing position, and the semiconductor device fixing position is provided with a fixing column; the lower jig is provided with a semiconductor device pressing position; the semiconductor device compression position is provided with a fixed column fixing hole; the positions of the fixing holes of the fixing columns are matched with the positions of the corresponding fixing columns. The utility model has the advantages of high line changing movement efficiency, strong practicability, operation staff, use aspect and the like, reduces the contact frequency between the operation staff and the semiconductor device, reduces the mutual friction between the surfaces of the semiconductor device, reduces the labor intensity of the operation staff, and improves the line changing movement efficiency.

Description

Line changing moving jig for plastic packaging of semiconductor device

Technical Field

The utility model relates to the technical field of semiconductor device production, in particular to a line changing mobile jig for plastic packaging of a semiconductor device.

Background

Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion. Common semiconductor devices include diodes, triodes, field effect transistors, thyristors, darlington tubes, LEDs, and semiconductor-containing integrated blocks, chips, and the like.

In the semiconductor production process, production and processing are generally performed on a plurality of semiconductor devices fixedly arranged on one another frame, so that the production efficiency of the semiconductor devices is improved. In the production process of semiconductor devices, the semiconductor devices such as triodes and field effect transistors need to be subjected to processes such as black glue packaging, black glue curing, electroplating, slitting, data printing such as product parameters, testing, carrier tape and the like. Before packaging, the semiconductor device is fixed on a plastic package clamp through a plurality of rows of semiconductor devices, then the semiconductor device is moved into an injection molding machine for injection molding and plastic package, the plastic package clamp is taken out of the injection molding machine after plastic package, and the semiconductor device after plastic package is not completely fixed, so that the semiconductor device is required to be placed into an oven for secondary heating, and the complete black glue is solidified. At present, after the semiconductor device is subjected to the plastic packaging of the black glue, an operator takes out a row of semiconductor devices on an injection molding clamp manually, as shown in fig. 1, then places the semiconductor devices in a square line changing box, carries the semiconductor devices to a black glue curing process for treatment, and at the moment, the black glue after the plastic packaging of the semiconductor devices is not cured, and pins of the semiconductor devices are not electroplated, so that if a plurality of rows of semiconductor devices are placed on the line changing box side by side manually, then carried to a next station for processing, surfaces among the semiconductor devices are easy to rub against each other in the carrying operation process, surface abrasion is caused, the quality after curing is reduced, in addition, hands of the operator are easy to carry impurities such as water vapor, sweat and the like in the manual carrying operation process, oxidation and the like are easy to occur after the pins of the semiconductor devices are contacted, and the efficiency is low. Therefore, how to develop a semiconductor device and move to the black glue solidification technology from the injection molding fixture after the black glue plastic packaging can be processed fast, and an operator is not required to put the semiconductor device on the replacement line box manually, and the semiconductor device can be directly transferred to the replacement line movement fixture for the plastic packaging of the semiconductor device from the injection molding fixture, so that the operation is simplified, the workload of the operator is reduced, the contact frequency between the operator and the semiconductor device is reduced, the surface friction collision between the semiconductor device is reduced, a plurality of semiconductor devices can be moved to the next station at one time, the labor intensity of the operator is reduced, the replacement line movement efficiency and the production efficiency of the semiconductor device are improved, and the quality of products in the production technology of the black glue solidification semiconductor device is improved, so that the requirements of batch production of the semiconductor device are met.

Disclosure of Invention

The utility model aims to provide a line changing moving jig for plastic packaging of a semiconductor device, which solves the problem that the existing semiconductor device needs to be moved to a black glue curing process for processing after plastic packaging is finished, reduces the contact frequency between an operator and the semiconductor device and the friction between the contact frequency and the surface of the semiconductor device in the line changing moving process, improves the line changing moving efficiency of the semiconductor device and the production efficiency of the cured semiconductor device, and reduces the operation strength of the operator.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor device plastic envelope is with trading line removal tool, includes lower tool and upper jig, the middle of lower tool front surface is fixed to be equipped with the locating piece, the inside of locating piece is equipped with positioner, lower tool passes through the upper jig upper surface that positioner joint was in, the storage tank that appears is all offered to lower tool's both sides, both sides the inside of storage tank all activity is equipped with the handle; the middle part of the upper jig is provided with a plurality of groups of semiconductor device fixing positions which have the same structure and are used for fixing the semiconductor devices after plastic packaging, and the semiconductor device fixing positions are provided with fixing columns which penetrate into the semiconductor devices and are of upward protruding cylinder structures for fixing the semiconductor devices; the lower jig is provided with semiconductor device pressing positions, the number of which is the same as that of the semiconductor device fixing positions of the upper jig, and the positions of the semiconductor device pressing positions of the lower jig are in one-to-one correspondence with the positions of the semiconductor device fixing positions of the upper jig; the semiconductor device compression position is provided with a fixed column fixing hole; the positions of the fixing holes of the fixing columns are matched with the positions of the corresponding fixing columns; the lower jig is fixed in the upper jig, and the fixing column fixing holes of the semiconductor device pressing positions on the lower jig at the same position penetrate through the fixing columns in the semiconductor device fixing positions on the upper jig.

Preferably, the lower jig is of a rectangular structure, and a plurality of groups of semiconductor device pressing positions are arranged at the middle position of the lower jig; the upper jig is of a rectangular structure, and a plurality of groups of semiconductor devices are fixedly arranged at the middle position of the upper jig.

Preferably, the positioning device comprises a pull rod, the pull rod movably penetrates through one end of the positioning block, sliding grooves are formed in two sides of the positioning block, one end of the pull rod, which is positioned in the positioning block, is fixedly connected with a sliding block, and two ends of the sliding block are slidably connected in the sliding grooves.

Preferably, a spring is fixedly connected to one side of the sliding block, one end, away from the sliding block, of the spring is fixedly connected to one side of the inner wall of the positioning block, and the spring is arranged on the outer surface of the pull rod.

Preferably, one side of the slider away from the pull rod is fixedly connected with a connecting rod, one end of the connecting rod movably penetrates through a side wall of the positioning block, a limiting block is fixedly arranged in the middle of the inside of one side of the upper jig, and a limiting hole matched with the connecting rod is formed in one side of the limiting block close to the positioning block.

Preferably, clamping grooves are symmetrically formed in the two sides of the storage groove, and clamping blocks are slidably connected in the clamping grooves.

Preferably, the clamping blocks are connected with the inner side of the handle in a rotating way through the rotating shafts on two sides, and the buckling grooves are formed in the upper side and the lower side of the storage groove.

Preferably, grooves are formed in two sides of the upper surface of the lower jig, and protruding blocks matched with the grooves are fixedly arranged on two sides of the bottom end of the upper jig.

Compared with the prior art, the utility model has the advantages of high line changing movement efficiency, strong practicability, convenient and labor-saving operation, and the like, can effectively reduce the contact frequency between the operator and the semiconductor device, reduce the mutual friction between the surfaces of the semiconductor devices, improve the number of the semiconductor devices for one-time line changing movement, reduce the labor intensity of the operator, and improve the line changing movement efficiency; an operator presses the upper jig into the corresponding semiconductor device plastic package jig, then rotates the upper jig and the semiconductor plastic package jig by 180 degrees, so that the semiconductor device on the plastic package jig is transferred to the upper jig, at the moment, a fixing column in the fixing position of the semiconductor device in the upper jig is clamped into an outer frame of the semiconductor device, the semiconductor device of the packaging jig can be quickly and directly transferred to the upper jig, the workload of the operator is reduced, and the contact between the operator and the semiconductor device is reduced; the fixing column fixing holes of the semiconductor device pressing positions on the lower jig penetrate through the fixing columns in the semiconductor device fixing positions on the upper jig, the semiconductor device is firmly fixed by utilizing the combined action of the semiconductor device pressing positions of the lower jig and the semiconductor device fixing positions of the upper jig, the movement of the semiconductor device in the wire changing movement process is avoided, and the frequency of taking and contacting the semiconductor device by an operator is reduced; the pull rod on the surface of the positioning block is pulled to enable the pull rod to drive the sliding block to move along the sliding groove and extrude the spring to enable the spring to shrink, at the moment, the pull rod drives the connecting rod to move into the positioning block, the groove on the upper surface of the lower jig is aligned with the convex blocks on two sides of the lower end of the upper jig, so that the lower jig and the upper jig are connected to achieve a basic limiting effect, then after the lower jig and the upper jig are connected, the pull rod is loosened, the spring is reset to drive the connecting rod to move into the positioning block and is clamped into the limiting hole, the lower jig is limited to the upper end of the upper jig to prevent displacement, the semiconductor device is fixed better, the fixing effect is improved, then the upper jig and the lower jig are turned over 180 degrees, the lower jig is positioned at the bottom, and operators can conveniently operate and move the line-changing moving jig subsequently; when the semiconductor device is moved by changing the wires, the handles on the two sides are pulled outwards, the clamping blocks on the inner sides of the handles slide in the clamping grooves, the handles extend out of the storage grooves, the handles on the two sides are rotated upwards under the action of the rotating shaft, and the handles are erected on the upper ends of the upper jig, so that the jig is moved more conveniently and more labor-saving.

Drawings

Fig. 1 is a schematic view of a conventional injection jig for fixing a semiconductor device.

FIG. 2 is a schematic diagram of the overall structure of the present utility model;

FIG. 3 is a schematic diagram of the lower fixture of the present utility model;

FIG. 4 is a schematic diagram of the structure of the upper fixture of the present utility model;

fig. 5 is a top cross-sectional view of a positioning block of the present utility model.

In the figure: 1. a lower jig; 2. an upper jig; 3. a groove; 4. a handle; 5. a storage groove; 6. a clamping groove; 7. a clamping block; 8. a buckling groove; 9. a bump; 10. a limiting block; 11. a limiting hole; 12. a positioning block; 13. a chute; 14. a pull rod; 15. a slide block; 16. a spring; 17. a connecting rod; 18. a semiconductor device hold down bit; 19. fixing the column fixing hole; 21. a semiconductor device fixing position; 22. and fixing the column.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 2 to 5, a wire-changing moving jig for plastic packaging of semiconductor devices comprises a lower jig 1 and an upper jig 2. Wherein, go up tool 2 be rectangle structure. The middle part of the upper jig 2 is provided with a plurality of groups of semiconductor device fixing positions 21 which have the same structure and are used for fixing the semiconductor devices after plastic package, and the plurality of groups of semiconductor device fixing positions 21 are arranged at the middle position of the upper jig 2 with the rectangular structure. The semiconductor device fixing position 21 is provided with a fixing column 22 which penetrates into the semiconductor device and fixes the semiconductor device and has an upward protruding cylindrical structure, as shown in fig. 2 and 3. The lower jig 1 is also of a rectangular structure. The lower jig 1 is provided with semiconductor device pressing positions 18 which are the same in number as the semiconductor device fixing positions 21. Wherein the semiconductor device pressing positions 18 are arranged at the middle position of the lower jig 1 of the rectangular structure, and the positions of the semiconductor device pressing positions 18 arranged on the lower jig correspond to the positions of the semiconductor device fixing positions 21 arranged on the upper jig 2 one by one. The semiconductor device pressing position 18 is provided with a fixed column fixing hole 19. As shown in fig. 2 and 4. The positions of the fixing holes 19 of the fixing columns are matched with the positions of the corresponding fixing columns 22; the lower jig 1 is fixed in the upper jig 2, and at this time, the fixing post fixing holes 19 of the semiconductor device pressing position 18 on the lower jig at the same position penetrate into the fixing posts 22 in the semiconductor device fixing position 21 on the upper jig, as shown in fig. 2.

As shown in fig. 2 to 4, the number of the semiconductor device pressing sites 18 in the lower jig 1 described in the present embodiment is sixteen, wherein the number of the fixing post fixing holes 19 on each group of the semiconductor device pressing sites 18 is two. The number of the semiconductor device fixing bits 21 in the upper jig 2 is sixteen, wherein the number of the fixing columns 22 on each group of the semiconductor device fixing bits 21 is two.

As shown in fig. 2, 3 and 5, a positioning block 12 is fixedly arranged in the middle of the front surface of the lower jig 1, a positioning device is arranged in the positioning block 12, the upper jig 2 is clamped on the upper surface of the lower jig 1 through the positioning device, the two sides of the lower jig 1 are provided with storage grooves 5 which are U-shaped, and handles 4 are movably arranged in the storage grooves 5 at the two sides.

As shown in fig. 2 and 3, grooves 3 are formed on two sides of the upper surface of the lower jig 1, protrusions 9 matched with the grooves 3 are fixedly arranged on two sides of the bottom end of the upper jig 2, and the protrusions 9 on two sides of the lower end of the upper jig 2 are aligned with the grooves 3 on the upper surface of the lower jig 1, so that the upper jig 2 and the lower jig 1 are connected to play a basic limiting role.

As shown in fig. 2 to 5, the positioning device comprises a pull rod 14, the pull rod 14 movably penetrates through one end of the positioning block 12, sliding grooves 13 are formed in two sides of the positioning block 12, one end of the pull rod 14 located in the positioning block 12 is fixedly connected with a sliding block 15, two ends of the sliding block 15 are slidably connected in the sliding grooves 13, one side of the sliding block 15 is fixedly connected with a spring 16, one end of the spring 16 away from the sliding block 15 is fixedly connected with one side of the inner wall of the positioning block 12, the spring 16 is arranged on the outer surface of the pull rod 14, one side of the sliding block 15 away from the pull rod 14 is fixedly connected with a connecting rod 17, one end of the connecting rod 17 movably penetrates through one side wall of the positioning block 12, a limiting block 10 is fixedly arranged in the middle of one side of the upper jig 2, and one side of the limiting block 10, close to the positioning block 12, is provided with a limiting hole 11 matched with the connecting rod 17.

By pulling the pull rod 14 on the surface of the positioning block 12, the pull rod 14 drives the sliding block 15 to move along the sliding groove 13, and the spring 16 is extruded to shrink the spring 16, at the moment, the pull rod 14 drives the connecting rod 17 to move to the inside of the positioning block 12, after the connection between the upper jig 2 and the lower jig 1 is completed, the pull force on the pull rod 14 is released, so that the spring 16 resets to drive the connecting rod 17 to move to the inside of the positioning block 12 and is clamped to the inside of the limiting hole 11, and the upper jig 2 is limited on the lower jig 1.

As shown in fig. 2 and 3, clamping grooves 6 are symmetrically formed in the two sides of the storage groove 5, clamping blocks 7 are slidably connected in the two sides of the clamping grooves 6, one sides, away from each other, of the two sides of the clamping blocks 7 are rotatably connected with the inner side of the handle 4 through a rotating shaft, and buckling grooves 8 are formed in the upper side and the lower side of the storage groove 5.

As shown in fig. 2 and 3, the handles 4 on both sides are pulled outwards, so that the clamping blocks 7 on the inner sides of the handles 4 slide in the clamping grooves 6, the handles 4 extend out of the storage grooves 5, the handles 4 on both sides are rotated upwards under the action of the rotating shaft, the handles are erected on the upper ends of the upper jigs 2, the jigs are moved more conveniently and more easily, and the handles 4 are conveniently moved out of the storage grooves 5 through the buckling grooves 8.

The semiconductor device shown in this embodiment is a transistor. The triode fixing position of the injection molding clamp is matched with the triode of the upper jig, and sixteen triodes are arranged.

The triode is fixed on the injection molding clamp, then the triode is moved to the injection molding machine for black glue plastic package, and an operator takes out the injection molding clamp after injection molding, as shown in fig. 1. The operating personnel counterpoint with last tool and anchor clamps of moulding plastics, will go up the tool and impress on the semiconductor device plastic envelope tool that corresponds after counterpoint, then rotate 180 degrees with last tool and semiconductor plastic envelope tool altogether for semiconductor device on the plastic envelope tool shifts to on the last tool, and the frame of semiconductor device is gone into to the fixed column card in the semiconductor device fixed position in the tool this moment, and the fixed column fixed orifices of the semiconductor device compression bit on the rethread lower tool penetrates the fixed column in the semiconductor device fixed position on the tool, utilizes the semiconductor device compression bit of lower tool to carry out preliminary fixed with sixteen semiconductor device fixed positions combined action of last tool, effectually avoids operating personnel to contact with the triode, improves the quality of product. Before the lower jig is fixed on the upper jig, an operator pulls the pull rod 14 on the surface of the positioning block 12, so that the pull rod 14 drives the sliding block 15 to move along the sliding groove 13 and extrudes the spring 16 to enable the spring 16 to contract, at the moment, the pull rod 14 drives the connecting rod 17 to move into the positioning block 12, the groove 3 on the upper surface of the lower jig 1 is aligned with the convex blocks 9 on two sides of the lower end of the upper jig 2, so that the lower jig 1 and the upper jig 2 are connected to play a basic limiting role, then after the connection between the lower jig 1 and the upper jig 2 is completed, the pulling force on the pull rod 14 is released, so that the spring 16 resets to drive the connecting rod 17 to move into the positioning block 12 and is clamped into the limiting hole 11, the upper jig 2 is limited to the upper end of the lower jig 1, at the moment, the fixing column 22 of the fixing column fixing hole in the semiconductor device pressing position on the lower jig in the same position is sleeved into the fixing column 22 of the semiconductor device fixing position 21 on the upper jig 2, the three-stage transistor is positioned by utilizing the fixing column 22 and the fixing column fixing hole 19, and the semiconductor device fixing position 21 and the semiconductor device pressing position 21 and the sixteen-stage joint jig are tightly pressed by the upper jig and the lower jig, so that displacement and the three-stage transistor is prevented; after the upper jig and the lower jig are fixed, an operator turns the upper jig and the lower jig 180 degrees so that the lower jig is arranged at the bottom and the upper jig is arranged at the upper part of the lower jig. When need remove the triode after holding the plastic envelope to next operation place, through pulling down tool both sides handle 4 outside for the inside fixture block 7 of handle 4 inboard slides in the inside of draw-in groove 6, thereby extends the inside of accomodating groove 5 with handle 4, rotates both sides handle 4 upwards under the effect of pivot this moment, thereby stands the handle in the upper end of going up tool 2, makes more convenient and laborsaving with the tool removal.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (8)

1. The utility model provides a semiconductor device plastic envelope is with trading line removal tool, includes tool (1) and last tool (2), its characterized in that down: the middle of the front surface of the lower jig (1) is fixedly provided with a positioning block (12), the inside of the positioning block (12) is provided with a positioning device, the lower jig (1) is clamped on the upper surface of the upper jig (2) through the positioning device, two sides of the lower jig (1) are provided with U-shaped containing grooves (5), and handles (4) are movably arranged in the containing grooves (5) at two sides; the middle part of the upper jig (2) is provided with a plurality of groups of semiconductor device fixing positions (21) which have the same structure and are used for fixing the semiconductor devices after plastic packaging, and the semiconductor device fixing positions (21) are provided with fixing columns (22) which penetrate into the semiconductor devices and are of a cylinder structure protruding upwards for fixing the semiconductor devices; the lower jig (1) is provided with semiconductor device pressing positions (18) the same as the semiconductor device fixing positions (21) of the upper jig in number, and the positions of the semiconductor device pressing positions (18) arranged on the lower jig correspond to the positions of the semiconductor device fixing positions (21) arranged on the upper jig (2) one by one; the semiconductor device pressing position (18) is provided with a fixed column fixing hole (19); the positions of the fixing holes (19) of the fixing columns are matched with the positions of the corresponding fixing columns (22); the lower jig (1) is fixed in the upper jig (2), and at the moment, the fixing column fixing holes (19) of the semiconductor device pressing positions (18) on the lower jig at the same position penetrate into the fixing columns (22) in the semiconductor device fixing positions (21) on the upper jig.

2. The wire changing movement jig for plastic packaging of semiconductor devices according to claim 1, wherein: the lower jig (1) is of a rectangular structure, and a plurality of groups of semiconductor device pressing positions (18) are arranged at the middle position of the lower jig (1); the upper jig (2) is of a rectangular structure, and a plurality of groups of semiconductor device fixing bits (21) are arranged at the middle position of the upper jig (2).

3. The wire changing movement jig for plastic packaging of semiconductor devices according to claim 1, wherein: the positioning device comprises a pull rod (14), the pull rod (14) movably penetrates through one end of the positioning block (12), sliding grooves (13) are formed in two sides of the positioning block (12), one end of the pull rod (14) positioned in the positioning block (12) is fixedly connected with a sliding block (15), and two ends of the sliding block (15) are slidably connected in the sliding grooves (13).

4. The wire-changing moving jig for plastic packaging of semiconductor devices according to claim 3, wherein: one side of the sliding block (15) is fixedly connected with a spring (16), one end of the spring (16), which is far away from the sliding block (15), is fixedly connected with one side of the inner wall of the positioning block (12), and the spring (16) is arranged on the outer surface of the pull rod (14).

5. The wire-changing moving jig for plastic packaging of semiconductor devices according to claim 3, wherein: one side of slider (15) keeping away from pull rod (14) fixedly connected with connecting rod (17), one end activity of connecting rod (17) runs through in a side wall of locating piece (12), the inside centre of going up tool (2) one side is fixed and is equipped with stopper (10), stopper (10) are close to one side of locating piece (12) and have been seted up with connecting rod (17) assorted spacing hole (11).

6. The wire changing movement jig for plastic packaging of semiconductor devices according to claim 1, wherein: clamping grooves (6) are symmetrically formed in the two sides of the storage groove (5), and clamping blocks (7) are slidably connected in the clamping grooves (6) on the two sides.

7. The wire changing movement jig for plastic packaging of semiconductor devices according to claim 6, wherein: the two sides the side that fixture block (7) kept away from each other all rotates through the inboard of pivot and handle (4) and is connected, buckling groove (8) have all been seted up to the upper and lower both sides of accomodating groove (5).

8. The wire changing movement jig for plastic packaging of semiconductor devices according to claim 1, wherein: the two sides of the upper surface of the lower jig (1) are provided with grooves (3), and the two sides of the bottom end of the upper jig (2) are fixedly provided with lugs (9) matched with the grooves (3).