CN219696167U - Glass packaged surface-mounted thermistor - Google Patents
Glass packaged surface-mounted thermistor Download PDFInfo
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- CN219696167U CN219696167U CN202223243893.1U CN202223243893U CN219696167U CN 219696167 U CN219696167 U CN 219696167U CN 202223243893 U CN202223243893 U CN 202223243893U CN 219696167 U CN219696167 U CN 219696167U
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- metal
- glass
- glass tube
- shaped leading
- out ends
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- 239000011521 glass Substances 0.000 title claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 83
- 239000002184 metal Substances 0.000 claims abstract description 83
- 238000005538 encapsulation Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 12
- 238000009413 insulation Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000011261 inert gas Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Abstract
The utility model discloses a glass-packaged surface-mounted thermistor which comprises a resistor chip, a glass tube and two metal T-shaped leading-out ends, wherein the T-shaped leading-out ends are formed by mutually connecting a metal disc and a metal cylinder, one end of each metal cylinder is connected with the center part of one side of the metal disc, the metal cylinders of the two T-shaped leading-out ends are respectively positioned at the outer sides of two ends of the resistor chip and are in surface-to-surface contact with each other, the center lines of the metal cylinders of the two T-shaped leading-out ends are mutually overlapped, the metal cylinders of the two T-shaped leading-out ends and the resistor chip are both arranged in a center through hole of the glass tube, and the outer walls of the metal cylinders of the two T-shaped leading-out ends are in surface-to-surface contact with the inner wall of the glass tube. The thermistor has strong welding resistance and other temperature impact resistance, has better protection effect on a resistor chip, and can meet the application occasion with the requirement on the insulation performance.
Description
Technical Field
The utility model relates to a surface-mounted thermistor, in particular to a glass-packaged surface-mounted thermistor.
Background
With the development of integration, miniaturization and reliability of electronic circuits, the development of miniaturization and microminiaturization of electronic components is also proceeding. Surface-mounted thermistors have been widely used for temperature measurement, temperature control and temperature compensation in miniaturized electronic circuits. With the complexity of the operating environment of electronic circuits, surface-mounted thermistors with better packaging characteristics, higher reliability and higher production efficiency are continuously demanded by the market.
As shown in fig. 1, the conventional surface-mounted thermistor is mostly manufactured by adopting a thick film process route, the resistor body 1 is generally manufactured by using semiconductor ceramics, the surface of the resistor body 1 is covered with a passivation layer 2 (an organic passivation layer or a glass passivation layer) of μm level, two terminal electrodes 3 are respectively led out from two ends of the resistor body 1, and the thickness of each terminal electrode 3 is of μm level.
The conventional surface-mounted thermistor has the following defects:
the surface of the resistor body is only provided with a passivation layer, has no insulation effect or extremely poor insulation effect, cannot meet the application occasions with requirements on insulation performance, and is low in mechanical strength, so that the resistor body is easy to damage when the resistor is used in a vibration environment; the end electrode is formed by adopting a deposition process, and the production process is complex; the thickness of the terminal electrode is very thin, when receiving thermal shock, the terminal electrode can't realize good radiating effect, and the ability of product resistant welding and other temperature impact is relatively poor, for example, under the general circumstances, same product continuous spot welding number of times can not exceed 3, otherwise easily damage the resistor body because of the high temperature, causes adverse effect to its normal welding operation in the use.
Disclosure of Invention
The utility model aims to solve the problems and provide the glass-packaged surface-mounted thermistor with good insulation effect, high mechanical strength and good heat dissipation effect.
The utility model realizes the above purpose through the following technical scheme:
the utility model provides a glass encapsulation type surface mounted thermistor, includes the resistor chip, the electrode surface at resistor chip both ends is the plane, glass encapsulation type surface mounted thermistor still includes glass pipe and two metallic "T" shape leading-out ends, "T" shape leading-out ends are formed by metal disc and metal cylinder interconnect, the diameter of metal disc is greater than the diameter of metal cylinder, the diameter of metal cylinder is not less than the biggest external diameter of resistor chip, one end of metal cylinder with one side central part of metal disc is connected, two the metal cylinder of "T" shape leading-out end is located respectively the both ends outside of resistor chip and mutual inseparable face-to-face contact, two the metal cylinder of "T" shape leading-out end and resistor chip are all arranged in the center through-hole of glass pipe and two the outer wall of the metal cylinder of "T" shape leading-out end and the mutual inseparable face-to-face contact between the inner wall of glass pipe.
Preferably, in order to improve the conductivity of the T-shaped leading-out end and improve the bonding reliability between the metal disc and the glass tube so as to improve the sealing performance of the glass tube, the metal disc is a copper disc, the metal cylinder is a Dumet wire column, and the metal disc is welded with the metal cylinder. The Dumet wire is a composite metal material, can realize good conductivity and very good bonding connection with glass, is a mature material in the prior art, and generally structurally comprises an iron-nickel alloy inner core, a copper layer is coated outside the iron-nickel alloy inner core, and borax is coated outside the copper layer.
Preferably, in order to better displace air in the glass tube with inert gas during the encapsulation process to further improve reliability and stability of the resistor, the metal disk is provided with a plurality of grooves on a side surface connected to the metal cylinder and one end of the grooves communicates with a corresponding end circumferential surface of the metal cylinder and the other end extends to an outer circumferential surface of the metal disk and is opened.
Preferably, in order to improve the welding performance of the metal disc, a tin-lead electroplated layer is arranged on the surface of the metal disc.
Preferably, the thickness of the tin-lead plating layer is > 1.5 μm in order to ensure the solderability of the metal disk.
Preferably, in order to enable the resistor to be in a relatively stable state when the resistor is mounted on the printed board and to leave a gap between the glass tube and the printed board for improving heat dissipation capability, the outer frame of the radial cross section of the glass tube has a square or square-like shape, four raised lines are formed by protruding four corners of the outer wall of the glass tube in the peripheral direction, and the vertexes of the radial cross section of the four raised lines are the intersection points of four corners of the same square.
Preferably, in order to prevent stress concentration at the corners of the outer corners of the glass tube to improve the strength of the glass tube, the radial cross section of the convex strips is triangle-like and the top arc transitions.
Preferably, in order to facilitate the encapsulation between the glass tube and the metal cylinder, the glass tube is a medium temperature glass tube.
The resistor chip is an NTC chip or a PTC chip according to application requirements. NTC is a negative temperature coefficient thermistor and PTC is a positive temperature coefficient thermistor.
The utility model has the beneficial effects that:
according to the utility model, the T-shaped leading-out ends are connected with the two electrodes of the resistor chip, and the metal cylinders of the two T-shaped leading-out ends and the resistor chip are arranged in the central through hole of the glass tube to realize good packaging, the metal disc of the T-shaped leading-out ends has larger heat dissipation space and heat dissipation distance during welding, the welding resistance and other temperature impact resistance of the product are stronger, the welding operation during use is convenient, and the resistor chip is better protected; meanwhile, the glass tube not only has good insulation effect on the resistor, can meet the application occasions with requirements on insulation performance, but also has enough mechanical strength, can protect the resistor chip from the influence of factors such as vibration environment, corrosive environment, moisture and the like, and enlarges the application range of the resistor.
Drawings
FIG. 1 is a schematic diagram of a front view of a conventional surface mount thermistor;
FIG. 2 is a schematic diagram of a front cross-sectional structure of a glass-packaged surface-mounted thermistor according to the present utility model;
FIG. 3 is a schematic diagram of the front view of the "T" shaped lead-out end of the glass-encapsulated surface mount thermistor according to the present utility model;
FIG. 4 is a schematic diagram of a left-hand structure of a "T" shaped lead-out end of a glass-encapsulated surface mount thermistor according to the present utility model;
FIG. 5 is a schematic diagram showing a front cross-sectional structure of a glass tube of the glass-packaged surface-mounted thermistor according to the present utility model;
fig. 6 is a schematic side view of a glass tube of the glass-packaged surface-mounted thermistor according to the present utility model.
Detailed Description
The utility model is further described below with reference to the accompanying drawings:
as shown in fig. 2-6, the glass-packaged surface-mounted thermistor according to the present utility model includes a resistor chip 6, a glass tube 5, and two metal "T" shaped lead-out ends 4, wherein the electrode surfaces at both ends of the resistor chip 6 are all planar, the "T" shaped lead-out ends 4 are formed by interconnecting a metal disc 43 and a metal cylinder 41, the diameter of the metal disc 43 is larger than that of the metal cylinder 41, the diameter of the metal cylinder 41 is not smaller than the maximum outer diameter of the resistor chip 6, one end of the metal cylinder 41 is connected with the central portion of one side of the metal disc 43, the metal cylinders 41 of the two "T" shaped lead-out ends 4 are respectively located at the outer sides of both ends of the resistor chip 6 and are in surface-to-surface contact with each other, the metal cylinders 41 of the two "T" shaped lead-out ends 4 and the resistor chip 6 are all placed in the central through hole 51 of the glass tube 5, and the outer walls of the metal cylinders 41 of the two "T" shaped lead-out ends 4 are in surface-to-surface contact with each other between the inner walls of the glass tube 5.
As shown in fig. 2-6, the present utility model also shows a number of more optimal specific configurations:
in order to improve the conductivity of the T-shaped leading-out end 4 and the bonding reliability between the metal disc 41 and the glass tube 5 to improve the sealing performance of the glass tube, the metal disc 43 is a copper disc, the metal disc 41 is a Dumet wire column, and the metal disc 43 and the metal disc 41 are welded.
In order to better displace the air in the glass tube 5 with the inert gas during the encapsulation process to further improve the reliability and stability of the resistor, the metal disk 43 is provided with a plurality of grooves 42 (four in the drawing) on the side surface connected to the metal cylinder 41 and one end of the grooves 42 communicates with the corresponding end circumferential surface of the metal cylinder 41, and the other end extends to the outer circumferential surface of the metal disk 43 and is opened.
To improve the solderability of the metal disk 43, the surface of the metal disk 43 is provided with a tin-lead plating layer (not shown in the figures, but easily understood).
In order to ensure the solderability of the metal disk 43, the tin-lead plating layer has a thickness of > 1.5 μm.
In order to enable a relatively stable state when the resistor is mounted on a printed board (not shown in the drawings) and to leave a gap between the glass tube 5 and the printed board to improve heat dissipation capability, the outer frame of the glass tube 5 has a square or square-like shape in radial cross section, four raised lines 52 are formed by projecting four corner portions of the outer wall of the glass tube 5 in the peripheral direction, and the vertexes of the radial cross section of the four raised lines 52 are the intersection points of four corners of the same square.
In order to prevent stress concentration at the corners of the outer corners of the glass tube 5 to improve the strength of the glass tube 5, the radial cross section of the ridge 52 is triangularly-shaped and the top circular arc thereof transitions.
In order to facilitate the encapsulation between the glass tube 5 and the metal cylinder 41, the glass tube 5 is a medium temperature glass tube.
The resistor chip 6 is an NTC chip or a PTC chip, depending on the application requirements. NTC is a negative temperature coefficient thermistor and PTC is a positive temperature coefficient thermistor.
In order to illustrate the feasibility and advantages of the glass-encapsulated type surface-mounted thermistor according to the present utility model, two production examples are described below.
Example 1:
1.1, preparing a monocrystalline silicon thermistor sheet with ohmic contact by taking a monocrystalline silicon sheet with the thickness of (0.28+/-0.02) mm and the resistivity of (160-200) omega cm as a matrix;
1.2 dicing the monocrystalline silicon thermistor piece into resistor chips 6 of (0.44×0.44×0.28) mm by dicing;
1.3, closely contacting and welding the resistor chip 6 and the metal cylinders 41 of the two T-shaped leading-out ends 4, and then packaging the glass tube 5 outside the metal cylinders 41 of the two T-shaped leading-out ends 4 under inert gas and heating environment to prepare the PTC thermistor packaged with the size of 0805. The prepared PTC thermistor has the resistance value of 2700+/-5 percent omega, the temperature coefficient of 0.75-0.80 percent/K, and the resistance temperature curve between minus 55 ℃ and 125 ℃ as shown in figure 5, and has PTC characteristics.
1.4, the insulation resistance of the prepared product is more than or equal to 1000MΩ, the medium withstand voltage of the product under normal atmospheric pressure is more than 1000V, and the medium withstand voltage under low atmospheric pressure is more than 500V, which is far higher than the index required by GJB601B-2018 general Specification for thermistors.
1.5, the prepared product has good high-temperature life performance after 1000 hours in the environment of 125+/-5 ℃, and the resistance change condition in the high-temperature life experiment process is shown in table 1.
TABLE 1 resistance change before and after 1000h lifetime of the product
1.6, the mechanical property of the prepared product is good. The prepared product is arranged on a printed board according to the requirement, 4h high-frequency vibration is respectively carried out in two mutually perpendicular directions under the condition of acceleration of 200m/s2 according to GJB360B-2009 electronic and electric element test method, then the product is respectively carried out 3 times in 4 directions of two mutually perpendicular planes under the condition of acceleration of 500m/s2 according to GJB360B-2009 electronic and electric element test method, after 12 times of impact tests, the product has no mechanical damage, the change condition of zero power resistance values at 25 ℃ before and after the test is shown in table 2, and the product has good mechanical property from data.
Table 2 resistance change before and after the products pass high-frequency vibration and impact test
1.7, the prepared product has good welding heat shock resistance. The actual use and installation requirements of the product are simulated, and the resistance change condition before and after the same product is repeatedly unwelded for 10 times is shown in table 3.
TABLE 3 resistance change before and after 10 times of product unwelding
Example 2:
2.1, preparing the thermistor ceramic body with resistivity of (400-500) omega cm by adopting metal oxide powder of manganese, cobalt, nickel, iron, copper and the like through processes of proportioning, molding, sintering and the like;
2.2 preparing the thermistor ceramic body into a resistor chip 6 with the thickness of (0.48 multiplied by 0.28) mm by slicing, electrode preparation, scribing and other processes;
2.3, closely contacting and welding the resistor chip 6 and the metal cylinders 41 of the two T-shaped leading-out ends 4, and then packaging the glass tube 5 outside the metal cylinders 41 of the two T-shaped leading-out ends 4 under inert gas and heating environment to prepare the NTC thermistor with the packaging size of 1206. The resistance value of the prepared NTC thermistor is (5000+/-1%) omega, the resistance temperature curve between the B value (3950+/-2%) K and minus 55 ℃ to 125 ℃ is shown in figure 6, and the NTC thermistor has NTC characteristics.
2.4, the insulation resistance of the prepared product is more than or equal to 1000MΩ, the medium withstand voltage of the product under normal atmospheric pressure is more than 1000V, and the medium withstand voltage under low atmospheric pressure is more than 500V, which is far higher than the index required by GJB601B-2018 general Specification for thermistors.
2.5, the prepared product has good high-temperature service life performance, good mechanical performance and good welding heat shock resistance.
The above embodiments are only preferred embodiments of the present utility model, and are not limiting to the technical solutions of the present utility model, and any technical solution that can be implemented on the basis of the above embodiments without inventive effort should be considered as falling within the scope of protection of the patent claims of the present utility model.
Claims (9)
1. The utility model provides a glass encapsulation formula surface mounted thermistor, includes the resistor chip, the electrode surface at resistor chip both ends is the plane, its characterized in that: the glass-packaged surface-mounted thermistor is characterized by further comprising a glass tube and two metal T-shaped leading-out ends, wherein the T-shaped leading-out ends are formed by mutually connecting a metal disc and a metal cylinder, the diameter of the metal disc is larger than that of the metal cylinder, the diameter of the metal cylinder is not smaller than the maximum outer diameter of the resistor chip, one end of the metal cylinder is connected with the central part of one side of the metal disc, the two metal cylinders of the T-shaped leading-out ends are respectively positioned at the outer sides of two ends of the resistor chip and are in surface-to-surface contact with each other, the central lines of the metal cylinders of the T-shaped leading-out ends are mutually overlapped, the two metal cylinders of the T-shaped leading-out ends and the resistor chip are both arranged in a central through hole of the glass tube, and the outer walls of the metal cylinders of the T-shaped leading-out ends are in surface-to-surface contact with the inner walls of the glass tube.
2. The glass-packaged surface-mounted thermistor according to claim 1, wherein: the metal disc is a copper disc, the metal cylinder is a Dumet wire cylinder, and the metal disc is welded with the metal cylinder.
3. The glass-packaged surface-mounted thermistor according to claim 2, wherein: the metal disc is provided with a plurality of grooves on the surface of one side connected with the metal cylinder, one end of each groove is communicated with the circumferential surface of the corresponding end of the metal cylinder, and the other end of each groove extends to the outer circumferential surface of the metal disc and is provided with an opening.
4. A glass-packaged surface-mount thermistor according to claim 1, 2 or 3, characterized in that: and a tin-lead electroplated layer is arranged on the surface of the metal disc.
5. The glass-encapsulated type surface-mounted thermistor according to claim 4, wherein: the thickness of the tin-lead electroplated layer is more than 1.5 mu m.
6. A glass-packaged surface-mount thermistor according to claim 1, 2 or 3, characterized in that: the outer frame of the radial section of the glass tube is square or quasi-square, four raised strips are formed by protruding the four corners of the outer wall of the glass tube towards the peripheral direction, and the vertexes of the radial section of the four raised strips are the crossing points of the four corners of the same square.
7. The glass-encapsulated type surface-mounted thermistor according to claim 6, wherein: the radial section of the raised strips is triangle-like and the top arc of the raised strips is in transition.
8. A glass-packaged surface-mount thermistor according to claim 1, 2 or 3, characterized in that: the glass tube is a medium temperature glass tube.
9. A glass-packaged surface-mount thermistor according to claim 1, 2 or 3, characterized in that: the resistor chip is an NTC chip or a PTC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223243893.1U CN219696167U (en) | 2022-12-05 | 2022-12-05 | Glass packaged surface-mounted thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223243893.1U CN219696167U (en) | 2022-12-05 | 2022-12-05 | Glass packaged surface-mounted thermistor |
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| Publication Number | Publication Date |
|---|---|
| CN219696167U true CN219696167U (en) | 2023-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223243893.1U Active CN219696167U (en) | 2022-12-05 | 2022-12-05 | Glass packaged surface-mounted thermistor |
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| Country | Link |
|---|---|
| CN (1) | CN219696167U (en) |
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- 2022-12-05 CN CN202223243893.1U patent/CN219696167U/en active Active
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