CN219695349U

CN219695349U - Wafer testing device

Info

Publication number: CN219695349U
Application number: CN202320717249.9U
Authority: CN
Inventors: 张泽栋; 戴吟洁; 陈樑; 李飞; 费春潮
Original assignee: Semiconductor Manufacturing International Shanghai Corp
Current assignee: Semiconductor Manufacturing International Shanghai Corp
Priority date: 2023-04-03
Filing date: 2023-04-03
Publication date: 2023-09-15
Anticipated expiration: 2033-04-03

Abstract

The utility model provides a wafer testing device, which comprises: the bearing table is used for bearing the wafer; and the working surface of the wafer clamp is matched with the edge of the wafer, so that the working surface of the wafer clamp is attached to the edge of the wafer when the wafer clamp works, and the upper surface of the wafer clamp and the upper surface of the wafer are coplanar. The utility model provides a wafer testing device, which utilizes a wafer clamp to be attached to an arc-shaped chamfer at the edge of a wafer, so that a test probe is prevented from being pricked on the arc-shaped chamfer to bend, damage of a probe card in the test process can be avoided, and the wafer testing efficiency is improved.

Description

Wafer testing device

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a wafer testing device.

Background

Wafer testing is an important element in the production of integrated circuits, and among them, testing probe cards is the most dominant production equipment. With the shrinking of chip design size, the size of the test pads on the wafer is smaller and smaller, and the requirements on the tip diameter of the test probes are higher and higher. The vertical probe is a test probe with a small needle tip diameter and low strength. When a probe card with vertical probes is tested in the wafer edge area, it is a major challenge in the industry that some probes will be stuck at the arcuate chamfer of the wafer edge, causing the probes to bend and damage the test probe card.

Therefore, it is desirable to provide a new probe card that avoids damage to the probe card during testing and improves wafer testing efficiency.

Disclosure of Invention

The utility model provides a wafer testing device which can avoid damage of a probe card in the testing process and improve the testing efficiency of a wafer.

The utility model provides a wafer testing device, comprising: the bearing table is used for bearing the wafer; and the working surface of the wafer clamp is matched with the edge of the wafer, so that the working surface of the wafer clamp is attached to the edge of the wafer when the wafer clamp works, and the upper surface of the wafer clamp and the upper surface of the wafer are coplanar.

In some embodiments of the present utility model, the wafer test apparatus further includes: and the auxiliary platform surrounds the bearing platform and is used for bearing and moving the wafer clamp.

In some embodiments of the utility model, the wafer chuck is removably mounted to the secondary platform.

In some embodiments of the utility model, the secondary platform includes a carrier portion and a lift portion carried on the carrier portion for controlling the height of the wafer chuck.

In some embodiments of the utility model, the lifting portion includes a rail disposed in a vertical direction, and the wafer chuck is disposed on the rail.

In some embodiments of the present utility model, the wafer test apparatus further includes: the probe card is positioned above the bearing table in working, and a plurality of vertical probes are arranged on the probe card.

In some embodiments of the utility model, the elevation includes a housing and an inner core disposed in the housing, the inner core being configured to move in a vertical direction in the housing, the wafer chuck being disposed in the inner core.

In some embodiments of the utility model, the material of the wafer holder comprises silicon carbide.

In some embodiments of the utility model, the working surface of the wafer chuck is provided with a detachable flexible portion.

In some embodiments of the utility model, the material of the flexible portion comprises rubber.

The utility model provides a wafer testing device, which utilizes a wafer clamp to be attached to an arc-shaped chamfer at the edge of a wafer, so that a test probe is prevented from being pricked on the arc-shaped chamfer to bend, damage of a probe card in the test process can be avoided, and the wafer testing efficiency is improved.

Drawings

The following drawings describe in detail exemplary embodiments disclosed in the present utility model. Wherein like reference numerals refer to like structure throughout the several views of the drawings. Those of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, and that the drawings are for illustration and description only and are not intended to limit the scope of the utility model, as other embodiments may equally well accomplish the inventive intent in this disclosure. It should be understood that the drawings are not to scale. Wherein:

FIG. 1 is a schematic diagram of a wafer test apparatus for testing a wafer;

FIG. 2 is a schematic diagram of a wafer testing apparatus according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a lifting portion of a sub-stage in a wafer testing apparatus according to some embodiments of the present utility model;

FIG. 4 is a schematic view of a lifting part of a sub-stage in a wafer testing apparatus according to other embodiments of the present utility model;

fig. 5 is a schematic structural diagram of a wafer chuck in the wafer testing apparatus according to the embodiment of the utility model.

Detailed Description

The following description provides specific applications and requirements of the utility model to enable any person skilled in the art to make and use the utility model. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the utility model. Thus, the present utility model is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.

The technical scheme of the utility model is described in detail below with reference to the examples and the accompanying drawings.

Fig. 1 is a schematic diagram of a wafer testing apparatus for performing wafer testing.

Referring to fig. 1, in performing a wafer test, a wafer 100 is disposed on a carrier (not shown), and a plurality of vertical probes 111 on a probe card 110 are pricked onto test pads on the wafer 100 to perform an electrical test on the wafer 100.

In order to save test time and test cost, multi-chip parallel test is generally adopted. Part of probes are suspended or stuck on the arc chamfer in the arc chamfer area of the wafer edge, so that the test probes are bent and the probe card is damaged.

In order to solve the above problems, in some solutions, overlapping tests are performed multiple times in the wafer edge test area, but the production efficiency is seriously affected, and meanwhile, due to too many times of needle insertion of a part of chips, the needle mark exceeds the test pad boundary or pierces through the test pad, resulting in electrical failure, appearance defects, and the like. In other schemes, part of the edge chip test was discarded, however experimental data indicate that about 2% yield loss would result.

Therefore, the wafer testing device provided by the utility model has the advantages that the wafer clamp is attached to the arc-shaped chamfer of the edge of the wafer, so that the test probe is prevented from being pricked and bent on the arc-shaped chamfer, the damage of the probe card in the test process can be avoided, and the wafer testing efficiency is improved.

Fig. 2 is a schematic structural diagram of a wafer testing apparatus according to an embodiment of the utility model. The wafer testing apparatus according to the embodiments of the present utility model will be described in detail with reference to the accompanying drawings.

The present utility model provides a wafer testing apparatus 200, as shown in fig. 2, comprising: a carrier 210 for carrying a wafer 211; a wafer chuck 230, the working surface 231 of the wafer chuck 230 is matched to the edge of the wafer 211 such that when the wafer chuck 230 is in operation, the working surface 231 of the wafer chuck 230 is in contact with the edge of the wafer 211 and the upper surface of the wafer chuck 230 is coplanar with the upper surface of the wafer 211.

With continued reference to fig. 2, the wafer test apparatus 200 further includes: the probe card 240 is located above the carrying table 210 in operation, and a plurality of vertical probes 241 are disposed on the probe card 240.

In operation, the vertical probes 241 on the probe card 240 are bumped onto the test pads on the wafer 211 to perform wafer testing such as electrical testing, reliability testing, etc. on the wafer 211. In the technical scheme of the utility model, the wafer clamp 230 is attached to the arc chamfer of the edge of the wafer 211, the upper surface of the wafer clamp 230 and the upper surface of the wafer 211 are coplanar, the vertical probe 241 positioned at the arc chamfer of the edge of the wafer 211 can be pricked on the upper surface of the wafer clamp 230, the test probe is prevented from being pricked on the arc chamfer to bend, the damage of the probe card in the test process can be avoided, and the test efficiency of the wafer is improved.

With continued reference to fig. 2, in some embodiments of the utility model, the wafer test apparatus 200 further includes: a sub-stage 220 surrounding the carrier 210 for carrying and moving the wafer chuck 230.

In some embodiments of the utility model, the wafer holder 230 is removably mounted to the sub-platform 220. When testing wafers with different thicknesses and different diameters, wafer clamps with different specifications can be replaced according to actual conditions, and perfect fit between the wafer clamps and the wafer edges is ensured.

With continued reference to fig. 2, in some embodiments of the utility model, the sub-platform 220 includes a carrier 221 and a lifting portion 222 carried on the carrier 221, the lifting portion 222 being configured to control a height of the wafer chuck 230, the wafer chuck 230 being removably mounted on the lifting portion 222. In operation, the wafer 211 is placed on the carrier 210, and then the lifting part 222 controls the wafer holder 230 to descend to the height of the wafer 211, so that the wafer holder 230 is attached to the edge of the wafer 211.

Fig. 3 is a schematic structural view of a lifting part in a sub-platform in the wafer test apparatus according to some embodiments of the present utility model. Fig. 3 is a plan view of the lifting part.

Referring to fig. 3, the lifting portion 222 is annular and surrounds the carrying platform 210. In some embodiments of the present utility model, the lifting portion 222 includes a rail 222a disposed along a vertical direction, and the wafer chuck 230 is disposed on the rail 222a. The wafer holder 230 may be vertically lifted and lowered along the rails 222a.

In some embodiments of the utility model, the number of tracks 222a is four. The tiger rail 222a is uniformly distributed on the tiger lifting part 222 along the circumferential direction.

Fig. 4 is a schematic structural view of a lifting part in a sub-platform in a wafer testing apparatus according to another embodiment of the present utility model. Fig. 4 is a plan view of the lifting part.

Referring to fig. 4, the lifting portion 222 is annular and surrounds the carrying platform 210. In other embodiments of the present utility model, the elevation 222 includes a housing 222b and a core 222c disposed in the housing 222b, the core 222c being disposed to move in a vertical direction in the housing 222b, the wafer chuck 230 being disposed on the core 222 c. That is, the elevation part 222 has a double-layered structure, the inner layer is an inner core 222c, the outer layer is an outer shell 222b sleeved outside the inner core 222c, and the inner core 222c can be elevated in the vertical direction in the outer shell 222 b. The wafer chuck 230 is mounted on the inner core 222c, and the inner core 222c drives the wafer chuck 230 to move up and down when moving up and down.

Fig. 5 is a schematic structural diagram of a wafer chuck in the wafer testing apparatus according to the embodiment of the utility model. Fig. 5 is a top view of the wafer chuck.

Referring to fig. 5, the wafer holder 230 has a ring shape, and the working surface 231 of the wafer holder 230 (i.e., the surface of the wafer holder 230 contacting the wafer 211) can exactly fit the arc chamfer of the edge of the wafer 211.

In some embodiments of the present utility model, the material of the wafer holder 230 comprises silicon carbide. Such a material is suitable for tip contact of the probe without causing damage to the tip.

In some embodiments of the present utility model, the working surface of the wafer chuck 230 is provided with a detachable flexible portion. In some embodiments of the utility model, the material of the flexible portion comprises rubber. The flexible portion avoids rigid contact of the wafer 211 of the wafer holder 230 and damage to the wafer 211. In addition, the flexible portion has a certain elasticity, so that the wafer 211 can be better fixed under the action of the elasticity, and the bonding degree of the working surface 231 of the wafer clamp 230 and the edge of the wafer 211 is improved.

The technical scheme of the utility model provides a wafer testing device which comprises a wafer clamp capable of being exactly attached to an arc chamfer of the edge of a wafer, and is suitable for testing a test probe card with a vertical probe at the edge of the wafer.

In the technical scheme of the utility model, when the edge of the wafer is tested, the vertical probe is pricked on the upper surface of the wafer clamp, so that the bending of the probe caused by the fact that the vertical probe is pricked at the arc chamfer of the edge of the wafer is avoided, and the test probe card is damaged.

According to the technical scheme, the test method for overlapping test or discarding part of edge chips during testing the edge of the wafer is avoided, and the production efficiency and the yield are improved.

In view of the foregoing, it will be evident to those skilled in the art after reading this disclosure that the foregoing application may be presented by way of example only and may not be limiting. Although not explicitly described herein, those skilled in the art will appreciate that the present utility model is intended to embrace a variety of reasonable alterations, improvements and modifications to the embodiments. Such alterations, improvements, and modifications are intended to be within the spirit and scope of the exemplary embodiments of the utility model.

It should be understood that the term "and/or" as used in this embodiment includes any or all combinations of one or more of the associated listed items. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may also be present.

Similarly, it will be understood that when an structure is referred to as being "on" another structure, it can be directly on the other structure or intervening structures may also be present. In contrast, the term "directly" means without intermediate structures. It will be further understood that the terms "comprises," "comprising," "includes" or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

It will be further understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Thus, a first element in some embodiments could be termed a second element in other embodiments without departing from the teachings of the present utility model. Like reference numerals or like reference numerals designate like elements throughout the specification.

Furthermore, the present description describes example embodiments with reference to idealized example cross-sectional and/or plan and/or perspective views. Thus, differences from the illustrated shapes, due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

Claims

1. A wafer testing apparatus, comprising:

the bearing table is used for bearing the wafer;

and the working surface of the wafer clamp is matched with the edge of the wafer, so that the working surface of the wafer clamp is attached to the edge of the wafer when the wafer clamp works, and the upper surface of the wafer clamp and the upper surface of the wafer are coplanar.

2. The wafer testing apparatus of claim 1, further comprising: and the auxiliary platform surrounds the bearing platform and is used for bearing and moving the wafer clamp.

3. The wafer testing apparatus of claim 2, wherein the wafer chuck is removably mounted to the sub-platform.

4. The wafer testing apparatus of claim 2, wherein the sub-stage comprises a carrier portion and a lifting portion carried on the carrier portion, the lifting portion being configured to control a height of the wafer chuck.

5. The wafer testing apparatus of claim 4, wherein the elevation includes a track disposed in a vertical direction, the wafer clamp being disposed on the track.

6. The wafer testing apparatus of claim 4, wherein the elevation includes a housing and an inner core disposed in the housing, the inner core being configured to move in a vertical direction in the housing, the wafer chuck being disposed in the inner core.

7. The wafer testing apparatus of claim 1, wherein the material of the wafer holder comprises silicon carbide.

8. The wafer testing apparatus of claim 1, further comprising: the probe card is positioned above the bearing table in working, and a plurality of vertical probes are arranged on the probe card.

9. The wafer testing apparatus of claim 1, wherein the working surface of the wafer chuck is provided with a detachable flexible portion.

10. The wafer testing apparatus of claim 9, wherein the material of the compliant portion comprises rubber.