CN219678791U - Substrate insulation structure - Google Patents

Abstract

The utility model relates to the technical field of motors, and provides a substrate insulation structure, which comprises: the insulating layer is formed by injection molding to cover the insulating layer and the conductive line or cover a preset area on the outer surface of the conductive line; the conductive line has an exposed portion exposed to an external environment; the exposed portion is located at an edge of the insulating layer.

Description

Substrate insulation structure

Technical Field

The utility model belongs to the technical field of motors, and particularly relates to a substrate insulation structure.

Background

In modern electromechanical devices, voice coil motors are often used in order to adjust the position of the camera. The voice coil motor may refer to: theme name: a voice coil motor, publication No.: CN 211321190U. The voice coil motor may also refer to: theme name: voice coil motor and driving method thereof, publication No.: CN105720783 a.

The voice coil motor usually requires a suspension base, and can be referred to (Chinese patent application; publication No. CN216437305U; subject name: suspension base and image stabilization suspension assembly; publication day: 2022.05.03) in the suspension base. A base plate for supporting the suspension base is also generally required in the voice coil motor, and can be referred to as a base plate in (chinese patent application; publication No. CN216436164U; subject name: ground integrated suspension base; publication date: 2022.05.03). The base plate is typically provided with conductive tracks (conductive tracks: see support plate or second conductive end in CN 216436164U). In order to insulate the base plate (or the suspension base) from the outside, a layer of glue is usually required to be brushed, and then an insulating layer (such as an insulating film) is attached to the base plate, however, the insulating layer attached to the base plate is easy to fall off, so that a dangerous situation of electric leakage is caused.

Disclosure of Invention

The utility model aims to provide a substrate insulation structure, which solves the technical problem that an insulation layer is easy to fall off when being stuck on a bottom plate through glue in the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme: provided is a substrate insulation structure including: a conductive line and an insulating layer which is formed by injection molding and wraps the conductive line or covers a preset area on the outer surface of the conductive line; the conductive line has an exposed portion exposed to an external environment; the exposed portion is located at an edge of the insulating layer.

Further, the number of the exposed portions is plural.

Further, the conductive line is in a strip shape, and the exposed part is positioned at the end part of the conductive line.

Further, the edge of the insulating layer is provided with a concave part, and the exposed part is positioned in the concave part.

Further, the conductive circuit is a conductive sheet.

Further, the conductive sheet is a copper sheet.

Further, the number of the conductive lines is a plurality; any two conductive lines are arranged at intervals.

Further, each of the conductive lines has the exposed portion, respectively.

Further, the insulating layer is a plastic layer.

Further, the insulating layer is a liquid crystal high polymer layer.

The substrate insulation structure provided by the utility model has the beneficial effects that: compared with the prior art, the substrate insulation structure provided by the utility model has the advantages that the insulation layer wraps the conductive circuit, so that the conductive circuit is reliably insulated from the outside; because the insulating layer is formed in an injection molding mode and is wrapped on the outer side of the conductive line, the insulating layer is tightly contacted with the conductive line, and the insulating layer and the conductive line are not easy to separate and fall off from each other; the conductive line is provided with an exposed part exposed in the external environment, and the exposed part is positioned at the edge of the insulating layer, so that the external circuit is convenient to form conductive connection with the conductive line through the exposed part, and the insulating layer is not easy to influence when the external circuit is connected with the exposed part.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic top view of an insulating layer for wrapping a conductive line according to an embodiment of the present utility model;

fig. 2 is a schematic top view of a conductive trace encapsulated by an insulating layer according to an embodiment of the present utility model;

fig. 3 is a schematic top view of a substrate insulation structure (a conductive circuit is wrapped by an insulation layer) according to an embodiment of the present utility model;

FIG. 4 is an exploded view of an insulating layer covering a side surface of a conductive trace according to an embodiment of the present utility model;

fig. 5 is a schematic front view of an insulating layer covering a surface of a conductive trace side according to an embodiment of the present utility model.

Wherein, each reference sign in the figure:

1-an insulating layer; 11-a recess; 2-conducting wires; 21-exposure.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It should be noted that, in the description of the embodiments of the present utility model, unless otherwise indicated, "/" means or, for example, a/B may represent a or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. Wherein A and B may be singular or plural, respectively.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1 to 3, a substrate insulation structure provided by the present utility model will be described. A substrate insulation structure comprising: the conductive line 2 and the insulating layer 1 which wraps the conductive line 2 or covers a predetermined area on the outer surface of the conductive line 2 are formed by injection molding; the conductive line 2 has an exposed portion 21 exposed to the external environment; the exposed portion 21 is located at an edge of the insulating layer 1.

Thus, the insulating layer 1 wraps the conductive line 2, thereby realizing reliable insulation between the conductive line 2 and the outside; because the insulating layer 1 is formed in an injection molding mode, and the insulating layer 1 is wrapped on the outer side of the conductive line 2, or the insulating layer 1 covers a preset area (the preset area is a local area on the outer surface of the conductive line 2, or the preset area is one side surface of the conductive line 2) on the outer surface of the conductive line 2, the insulating layer 1 and the conductive line 2 are tightly contacted, and the insulating layer 1 and the conductive line 2 are not easy to separate and fall off; the conductive line 2 is provided with an exposed part 21 exposed in the external environment, and the exposed part 21 is positioned at the edge of the insulating layer 1, so that an external circuit is convenient to form conductive connection with the conductive line 2 through the exposed part 21, and the insulating layer 1 is not easily affected when the external circuit is connected with the exposed part 21.

In one embodiment, the conductive trace 2 has an insert portion inserted into the injection molded insulating layer 1.

In one embodiment, the insulating layer 1 is provided with a through hole so that the exposed portion 21 of the conductive trace 2 can be exposed to the external environment.

In one embodiment, the insulating layer 1 is provided with a hollowed-out structure so that the exposed portion 21 on the conductive circuit 2 can be exposed to the external environment.

In one embodiment, the edge of the insulating layer 1 is notched so that the exposed portion 21 on the conductive trace 2 can be exposed to the external environment.

In one embodiment, the insulating layer 1 is a plastic plate. In one embodiment, the insulating layer 1 is a PCB board.

In one embodiment, the insulating layer 1 is injection molded.

In one embodiment, the insulating layer 1 encases a portion of the conductive trace 2.

In one embodiment, the conductive trace 2 is a copper sheet or wire.

In one embodiment, the conductive trace 2 is curved. Thus, when the insulating layer 1 wraps the conductive line 2 outside, the conductive line 2 is less likely to be separated from the insulating layer 1.

In one embodiment, the insulating layer 1 has a plate shape.

Further, referring to fig. 1 to 3, as an embodiment of the substrate insulation structure provided by the present utility model, the number of the exposed portions 21 is plural. In this way, the plurality of exposed portions 21 can be electrically connected to the plurality of external circuits, respectively.

Further, referring to fig. 1 to 3, as an embodiment of the substrate insulation structure provided by the present utility model, the conductive line 2 is in a strip shape, and the exposed portion 21 is located at an end of the conductive line 2. Thus, the long conductive line 2 is convenient to bend when being deformed by external force; the user can change the circuit direction by adjusting the bending state of the conductive circuit 2; the exposed portion 21 is located at the end of the conductive trace 2 to facilitate the user's conductive connection of an external circuit from the edge of the insulating layer 1 to the exposed portion 21.

In one embodiment, the thickness of the conductive line 2 is the same in the extending direction of the conductive line 2. Thus, the conductive circuit 2 is convenient to bend in different positions, and the bending capability is close.

Further, referring to fig. 1 to 3, as an embodiment of the substrate insulation structure provided by the present utility model, an edge of the insulation layer 1 has a recess 11, and the exposed portion 21 is located in the recess 11. In this way, the inner wall of the recess 11 can protect the inner exposed portion 21.

Further, referring to fig. 4 to 5, as an embodiment of the substrate insulation structure provided by the present utility model, the conductive circuit 2 is a conductive sheet. Thus, the sheet-shaped conductive sheet is convenient to lay on the insulating layer 1; the conductive sheet can be used for connecting an external circuit.

In one embodiment, the conductive sheet is laid on a plastic member (not shown), and the insulating layer 1 covers one side surface of the conductive sheet.

Further, referring to fig. 1 to 5, as an embodiment of the substrate insulation structure provided by the present utility model, the conductive sheet is a copper sheet. Thus, the copper sheet has good conductivity.

Further, referring to fig. 1 to 3, as a specific embodiment of the substrate insulation structure provided by the present utility model, the number of conductive traces 2 is plural; any two conductive lines 2 are arranged at intervals. In this way, the plurality of conductive traces 2 can be respectively conducted by different circuits.

Further, referring to fig. 1 to 3, as an embodiment of the substrate insulation structure provided by the present utility model, each conductive trace 2 has an exposed portion 21. In this way, the respective conductive traces 2 are facilitated to be connected to external circuits, respectively.

Further, referring to fig. 1 to 5, as an embodiment of the substrate insulation structure provided by the present utility model, the insulation layer 1 is a plastic layer. Thus, the plastic layer has good insulating property and is convenient to process.

Further, referring to fig. 1 to 5, as an embodiment of the substrate insulation structure provided by the present utility model, the insulation layer 1 is a liquid crystal polymer layer. Thus, injection molding is facilitated.

Among them, liquid crystal polymers (LCP for short) are industrialized.

The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present utility model, and these modifications and substitutions should also be considered as being within the scope of the present utility model.

Claims (10)

1. A substrate insulation structure, comprising: a conductive line and an insulating layer which is formed by injection molding and wraps the conductive line or covers a preset area on the outer surface of the conductive line; the conductive line has an exposed portion exposed to an external environment; the exposed portion is located at an edge of the insulating layer.

2. The substrate insulation structure of claim 1, wherein the number of exposed portions is a plurality.

3. The substrate insulation structure of claim 1, wherein the conductive trace is elongated, and the exposed portion is located at an end of the conductive trace.

4. The substrate insulation structure of claim 1, wherein an edge of the insulation layer has a recess, the exposed portion being located within the recess.

5. The substrate insulation structure of claim 1, wherein the conductive trace is a conductive sheet.

6. The substrate insulation structure of claim 5, wherein the conductive sheet is a copper sheet.

7. The substrate insulation structure of claim 1, wherein the number of conductive traces is a plurality; any two conductive lines are arranged at intervals.

8. The substrate insulation structure of claim 7, wherein each of the conductive traces has the exposed portion.

9. The substrate insulation structure of any of claims 1-8, wherein the insulation layer is a plastic layer.

10. The substrate insulation structure of claim 9, wherein the insulation layer is a liquid crystal high molecular polymer layer.