CN219678791U - Substrate insulation structure - Google Patents

Abstract

The utility model relates to the technical field of motors and provides a substrate insulation structure, which includes: a conductive line and an insulating layer formed by injection molding to wrap the insulating layer and the conductive line or cover a predetermined area on the outer surface of the conductive line. ; The conductive line has an exposed portion exposed to the external environment; the exposed portion is located at the edge of the insulating layer.

Description

Base board insulation structure

Technical field

The utility model belongs to the technical field of motors, and more specifically, relates to a substrate insulation structure.

Background technique

In modern electromechanical equipment, voice coil motors are often used to adjust the position of the camera. For voice coil motors, please refer to: "Topic Name: A Voice Coil Motor, Publication Number: CN211321190U". For voice coil motors, you can also refer to: "Topic Name: Voice Coil Motor and Its Driving Method, Publication Number: CN105720783A".

A suspension base is usually required in voice coil motors. You can refer to the suspension base in (Chinese Utility Model Patent; Publication Number: CN216437305U; Subject Name: Suspension Base and Image Stabilization Suspension Component; Publication Date: 2022.05.03) . Voice coil motors usually also need to use a base plate to support the suspension base. You can refer to the base plate in (Chinese Utility Model Patent; Publication Number: CN216436164U; Subject Name: Grounded Integrated Suspension Base; Publication Date: 2022.05.03). The base plate is usually provided with conductive circuits (conductive circuits: please refer to the support plate or second conductive end in CN216436164U). In order to insulate the base plate (or suspension base) from the outside, it is usually necessary to apply a layer of glue first, and then attach an insulating layer (such as an insulating film) to the base plate. However, the insulating layer pasted on the base plate can easily fall off, thus Dangerous situation resulting in electric leakage.

Utility model content

The purpose of this utility model is to provide a substrate insulation structure to solve the technical problem in the prior art that the insulation layer attached to the base plate through glue is easy to fall off.

In order to achieve the above object, the technical solution adopted by the present invention is to provide a substrate insulation structure, including: a conductive line and an insulating layer formed by injection molding to wrap the conductive line or cover a predetermined area on the outer surface of the conductive line; The conductive line has an exposed portion exposed to the external environment; the exposed portion is located at an edge of the insulating layer.

Further, the number of the exposed parts is multiple.

Further, the conductive line is in a long strip shape, and the exposed portion is located at an end of the conductive line.

Further, the edge of the insulating layer has a recessed part, and the exposed part is located in the recessed part.

Further, the conductive lines are conductive sheets.

Further, the conductive sheet is a copper sheet.

Further, the number of the conductive lines is multiple; any two of the conductive lines are spaced apart from each other.

Further, each of the conductive lines has the exposed portion.

Further, the insulating layer is a plastic layer.

Further, the insulating layer is a liquid crystal polymer layer.

The beneficial effects of the substrate insulation structure provided by the utility model are: compared with the prior art, the insulation layer of the substrate insulation structure provided by the utility model wraps the conductive lines, thereby achieving reliable insulation between the conductive lines and the outside; because the insulation layer It is formed by injection molding, and the insulating layer is wrapped around the outside of the conductive line, so that the insulating layer and the conductive line are in close contact, and the insulating layer and the conductive line are not easy to separate from each other and fall off; the conductive line has the ability to be exposed to the external environment The exposed portion is located at the edge of the insulating layer, so that the external circuit can easily form a conductive connection with the conductive line through the exposed portion, and the insulating layer is not easily affected when the external circuit is connected to the exposed portion.

Description of drawings

In order to explain the technical solutions in the embodiments of the present invention more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of the present utility model. For some embodiments of the new type, those of ordinary skill in the art can also obtain other drawings based on these drawings without exerting any creative effort.

Figure 1 is a schematic top view of an insulating layer used to wrap conductive lines provided by an embodiment of the present invention;

Figure 2 is a schematic top view of a conductive line wrapped by an insulating layer provided by an embodiment of the present invention;

Figure 3 is a schematic top view of the substrate insulation structure (the conductive lines are wrapped by the insulation layer) provided by the embodiment of the present invention;

Figure 4 is an exploded schematic diagram of the insulating layer covering one side surface of the conductive line provided by the embodiment of the present invention;

FIG. 5 is a schematic front view of an insulating layer covering a surface on the side of a conductive line according to an embodiment of the present invention.

Among them, each figure in the figure is marked with:

1-insulating layer; 11-recessed part; 2-conductive line; 21-exposed part.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model more clear, the present utility model will be further described in detail below with reference to the drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention and are not intended to limit the present invention.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

It should be noted that in the description of the embodiments of this application, unless otherwise stated, "/" means or, for example, A/B can mean A or B; "and/or" in this article is just one Describing the association relationship of associated objects, it means that there can be three relationships. For example, A and/or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. Among them, A and B can be singular or plural respectively.

It should be understood that the terms "length", "width", "top", "bottom", "front", "back", "left", "right", "vertical", "horizontal", "top" The directions or positional relationships indicated by "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying. The devices or components must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be construed as a limitation of the present invention.

In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise clearly and specifically limited.

Please refer to Figures 1 to 3 together to describe the substrate insulation structure provided by the present invention. The substrate insulation structure includes: a conductive line 2 and an insulating layer 1 formed by injection molding to wrap the conductive line 2 or cover a predetermined area on the outer surface of the conductive line 2; the conductive line 2 has an exposed portion 21 exposed to the external environment; the exposed portion 21 Located at the edge of the insulation layer 1.

In this way, the insulating layer 1 wraps the conductive line 2, thereby achieving reliable insulation between the conductive line 2 and the outside; because the insulating layer 1 is formed by injection molding, and the insulating layer 1 wraps the outside of the conductive line 2, or the insulating layer 1 covers A predetermined area on the outer surface of the conductive line 2 (the predetermined area is: a local area on the outer surface of the conductive line 2; or the predetermined area is: one side surface of the conductive line 2), so that the insulating layer 1 and the conductive line 2 are in close contact, The insulating layer 1 and the conductive circuit 2 are not easy to separate and fall off from each other; the conductive circuit 2 has an exposed portion 21 exposed to the external environment, and the exposed portion 21 is located at the edge of the insulating layer 1 so that external circuits can easily pass through the exposed portion 21 A conductive connection is formed with the conductive circuit 2, and the insulating layer 1 is not easily affected when an external circuit is connected to the exposed portion 21.

In one embodiment, the conductive trace 2 has an insertion portion inserted into the injection-molded insulating layer 1 .

In one embodiment, through holes are opened in the insulating layer 1 so that the exposed portions 21 on the conductive lines 2 can be exposed to the external environment.

In one embodiment, a hollow structure is provided on the insulating layer 1 so that the exposed portion 21 on the conductive line 2 can be exposed to the external environment.

In one embodiment, a gap is opened on the edge of the insulating layer 1 so that the exposed portion 21 on the conductive line 2 can be exposed to the external environment.

In one embodiment, the insulating layer 1 is a plastic plate. In one embodiment, the insulation layer 1 is a PCB board.

In one embodiment, the insulating layer 1 is formed by injection molding.

In one embodiment, the insulating layer 1 wraps part of the conductive lines 2 .

In one embodiment, the conductive lines 2 are copper sheets or copper wires.

In one embodiment, the conductive lines 2 are curved. In this way, when the insulating layer 1 wraps the conductive lines 2 on the outside, the conductive lines 2 and the insulating layer 1 are less likely to be separated.

In one embodiment, the insulating layer 1 is plate-shaped.

Further, please refer to FIGS. 1 to 3 . As a specific implementation of the substrate insulation structure provided by the present invention, the number of exposed portions 21 is multiple. In this way, the multiple exposed portions 21 can be electrically connected to multiple external circuits respectively.

Further, please refer to Figures 1 to 3. As a specific implementation of the substrate insulation structure provided by the present invention, the conductive line 2 is in a long strip shape, and the exposed portion 21 is located at the end of the conductive line 2. In this way, the long conductive line 2 is easy to bend when deformed by external force; it is also convenient for the user to change the circuit direction by adjusting the bending state of the conductive line 2; the exposed portion 21 is located at the end of the conductive line 2, making it convenient for the user to remove the external circuit from the The edge of the insulating layer 1 is electrically connected to the exposed portion 21 .

In one embodiment, the thickness of the conductive lines 2 is the same in the extending direction of the conductive lines 2 . In this way, the bending capabilities of the conductive line 2 are similar when being bent at different locations.

Further, please refer to FIGS. 1 to 3 . As a specific implementation of the substrate insulation structure provided by the present invention, the edge of the insulating layer 1 has a recessed portion 11 , and the exposed portion 21 is located in the recessed portion 11 . In this way, the inner wall of the recessed portion 11 can protect the inner exposed portion 21 .

Further, please refer to Figures 4 to 5. As a specific implementation of the substrate insulation structure provided by the present invention, the conductive line 2 is a conductive sheet. In this way, the sheet-shaped conductive sheet can be easily laid on the insulating layer 1; the conductive sheet can be used for connection to external circuits.

In one embodiment, the conductive sheet is laid on a plastic part (not shown), and the insulating layer 1 covers one side surface of the conductive sheet.

Further, please refer to Figures 1 to 5. As a specific implementation of the substrate insulation structure provided by the present invention, the conductive sheet is a copper sheet. In this way, the copper sheet has good electrical conductivity.

Further, please refer to Figures 1 to 3. As a specific embodiment of the substrate insulation structure provided by the present invention, the number of conductive lines 2 is multiple; any two conductive lines 2 are spaced apart from each other. In this way, the plurality of conductive lines 2 can provide conduction for different circuits respectively.

Further, please refer to FIGS. 1 to 3 . As a specific implementation of the substrate insulation structure provided by the present invention, each conductive line 2 has an exposed portion 21 respectively. In this way, it is convenient for each conductive line 2 to be connected to an external circuit respectively.

Further, please refer to Figures 1 to 5. As a specific implementation of the substrate insulation structure provided by the present invention, the insulation layer 1 is a plastic layer. In this way, the plastic layer has good insulation properties and is easy to process.

Further, please refer to Figures 1 to 5. As a specific implementation of the substrate insulation structure provided by the present invention, the insulation layer 1 is a liquid crystal polymer layer. In this way, injection molding is facilitated.

Among them, industrial liquid crystal polymer (LCP for short).

The above are only preferred embodiments of the present invention. It should be pointed out that those skilled in the art can make several improvements and substitutions without departing from the technical principles of the present invention. These improvements and replacement should also be regarded as the protection scope of the present utility model.

Claims (10)

1. A substrate insulation structure, comprising: a conductive line and an insulating layer which is formed by injection molding and wraps the conductive line or covers a preset area on the outer surface of the conductive line; the conductive line has an exposed portion exposed to an external environment; the exposed portion is located at an edge of the insulating layer.

2. The substrate insulation structure of claim 1, wherein the number of exposed portions is a plurality.

3. The substrate insulation structure of claim 1, wherein the conductive trace is elongated, and the exposed portion is located at an end of the conductive trace.

4. The substrate insulation structure of claim 1, wherein an edge of the insulation layer has a recess, the exposed portion being located within the recess.

5. The substrate insulation structure of claim 1, wherein the conductive trace is a conductive sheet.

6. The substrate insulation structure of claim 5, wherein the conductive sheet is a copper sheet.

7. The substrate insulation structure of claim 1, wherein the number of conductive traces is a plurality; any two conductive lines are arranged at intervals.

8. The substrate insulation structure of claim 7, wherein each of the conductive traces has the exposed portion.

9. The substrate insulation structure of any of claims 1-8, wherein the insulation layer is a plastic layer.

10. The substrate insulation structure of claim 9, wherein the insulation layer is a liquid crystal high molecular polymer layer.