CN219677221U

CN219677221U - Splash-proof liquid supply device and single wafer processing equipment

Info

Publication number: CN219677221U
Application number: CN202320447728.3U
Authority: CN
Inventors: 黄立佐; 张修凯; 吴进原; 许明哲
Original assignee: Grand Plastic Technology Corp
Current assignee: Grand Plastic Technology Corp
Priority date: 2023-03-10
Filing date: 2023-03-10
Publication date: 2023-09-12
Anticipated expiration: 2033-03-10

Abstract

The utility model discloses an anti-splashing liquid supply device and single wafer processing equipment. A splash preventing liquid supply includes a rotating column, a cantilever, a nozzle, a first shroud, a second shroud, and a discharge line. One end of the cantilever is connected to the rotating upright. The nozzle is fixed at the other end of the cantilever, and when the rotating upright rotates, the nozzle is driven by the cantilever to reciprocate above the wafer and spray the process liquid. The first shade and the second shade are coaxially fixed on the nozzle, and the second shade covers the first shade. The exhaust pipeline is connected to the second shade and is configured to form a negative pressure space between the first shade and the second shade and absorb splash of process liquid from the wafer and/or splash of reaction products of the process liquid and the wafer through the negative pressure space.

Description

Splash-proof liquid supply device and single wafer processing equipment

Technical Field

The present utility model relates to a wet processing apparatus, and more particularly, to a splash preventing liquid supply device and a single wafer processing apparatus using the same.

Background

In semiconductor processing, wafers undergo multiple processing procedures such as etching, cleaning, etc. With the increasing complexity of the process, a single wafer rotating wet processing machine has been developed. The single wafer spin wet processing station can apply process liquids of different chemical properties to the wafer on the spin stand to etch and clean the metal layer or material film layer on the wafer.

However, with the use of Wafer stack packaging such as three-dimensional integrated circuits (3D-ICs), the Wafer surface often has a Chip-to-Wafer bonding (Chip-on Wafer) structure rather than a flat surface, so that when a single Wafer spin wet processing tool is used to etch and clean the non-flat Wafer surface, the splashing of the liquid or the splashing of the reaction products during processing of the non-flat Wafer surface may cause particles to float back to the Wafer surface or the Chip-to-Wafer interface, causing more serious Wafer contamination problems.

In view of the foregoing, there is a need for a splash-proof liquid supply device and a single wafer processing apparatus that solve the above-mentioned problems.

Disclosure of Invention

In order to solve the above-mentioned problems of the prior art, an object of the present utility model is to provide a splash preventing liquid supply device and a single wafer processing apparatus using the same, so as to reduce or avoid the problem of wafer contamination caused by liquid splash when a process liquid is applied to process the wafer surface.

In order to achieve the above object, the present utility model provides a splash-proof liquid supply device, comprising: the rotary column, the cantilever, the nozzle, the first mask, the second mask and the discharge line. One end of the cantilever is connected to the rotating upright. The nozzle is fixed at the other end of the cantilever, and when the rotating upright rotates, the nozzle is driven by the cantilever to reciprocate above the wafer and spray the process liquid. The first mask and the second mask are coaxially fixed on the nozzle, the second mask covers the first mask, the first mask and the second mask are respectively provided with a first opening and a second opening facing the wafer, and the second opening is closer to the wafer than the first opening. The exhaust pipeline is connected to the second shade and is configured to form a negative pressure space between the first shade and the second shade and absorb splash of process liquid from the wafer and/or splash of reaction products of the process liquid and the wafer through the negative pressure space.

In some embodiments, the splash preventing liquid supply device further includes a plurality of chips bonded to the surface of the wafer, respectively.

In some embodiments, the process liquid is etching liquid or deionized water.

In some embodiments, the first mask has a spacing of about 3 millimeters from the second mask, the first mask is about 5-8 millimeters from the surface of the wafer, and the second mask is about 2-5 millimeters from the surface of the wafer.

In some embodiments, the first mask and the second mask may be the same or different in shape.

The present utility model also provides a single wafer processing apparatus comprising: the device comprises a rotary table, a splash-proof liquid supply device and a liquid recovery device. The turntable is configured to place a wafer. The splash liquid supply device is the splash liquid supply device described above, and is disposed above the turntable and configured to apply a process liquid to the wafer. The liquid recovery device is circumferentially arranged around the rotary table and is configured to collect the process liquid thrown out of the rotary table.

Compared with the prior art, the utility model has the advantages that the first shade and the second shade are coaxially fixed on the nozzle in the anti-splashing liquid supply device in the single-wafer processing equipment, the second shade covers the first shade, the discharge pipeline is connected with the second shade, and the discharge pipeline is configured to form a negative pressure space between the first shade and the second shade, so that the splash of the process liquid from the wafer and/or the splash of the reaction product of the process liquid and the wafer are sucked through the negative pressure space, and the splash is prevented from becoming particles to float and be adhered to the surface of the wafer or the interface between the chip and the wafer, thereby reducing or even avoiding the problem of polluting the wafer.

Drawings

The technical solution and other advantageous effects of the present utility model will be made apparent by the following detailed description of the specific embodiments of the present utility model with reference to the accompanying drawings.

FIG. 1 shows a schematic diagram of a single wafer processing apparatus according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a splash preventing liquid supply and a turntable in the single wafer processing apparatus of FIG. 1;

FIG. 3 is a schematic view showing the components of the anti-splash liquid supply device according to an embodiment of the present utility model;

FIG. 4 is a schematic view of a splash liquid supply device according to another embodiment of the present utility model;

FIG. 5 is a schematic view of a splash liquid supply device according to yet another embodiment of the present utility model;

fig. 6 shows a schematic diagram of a single wafer processing apparatus according to another embodiment of the present utility model.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

Referring to fig. 1, a schematic diagram of a single wafer processing apparatus 10 according to an embodiment of the utility model is shown. In the present embodiment, the single wafer processing apparatus 10 mainly includes a rotary table 110, a splash preventing liquid supply device 120, and a liquid recovery device 140. The turntable 110 is configured to hold a wafer 20. Alternatively, the top of the turntable 110 is provided with a vacuum chuck, and the wafer 20 may be fixed on the turntable 110 by suction force applied by the vacuum chuck. The rotary table 110 is further provided with a driving mechanism for driving the rotary table 110 to rotate around the shaft. Alternatively, in some embodiments, other means may be used to secure the wafer 20 to the turntable 110, such as, but not limited to, a clamping device or the like.

As shown in fig. 1, a splash preventing liquid supply 120 is provided above the turntable 110 for applying a process liquid to the wafer 20. In the present embodiment, the liquid supply device 120 includes a rotating column 121, a cantilever 122, a nozzle 123, a first mask 124 and a second mask 126.

As shown in fig. 1, the rotation column 121 is laterally adjacent to the rotation table 110. The cantilever 122 includes opposite ends, one of which is connected to the rotation column 121 and the other of which extends above the rotation table 110. The nozzle 123 is fixed to the other end of the cantilever 122, and the nozzle 123 is reciprocated above the wafer 20 by the cantilever 122 and sprays the process liquid when the rotating column 121 rotates.

As shown in fig. 1, the first mask 124 and the second mask 126 are coaxially fixed on the nozzle 123 and have a first opening 125 and a second opening 127 facing the turntable 110 and the wafer 20, respectively. The second mask 126 encloses the first mask 124, the first opening 125 and the second opening 127 are closer to the turntable 110 and the wafer 20 than the nozzles 123, and the second opening 127 is closer to the turntable 110 and the wafer 20 than the first opening 125.

As shown in fig. 1, a nozzle 123 is connected to one end of the liquid supply line 128 for spraying the process liquid during operation of the anti-splash liquid supply device 120 to perform etching or cleaning operations on the wafer 20. The other end of the liquid supply line 128 is connected to a supply of a particular process liquid, such as deionized water (d.i. water) or an etching solution. The second mask 126 is connected to one end of the exhaust line 129, and the other end of the exhaust line 129 is connected to a pumping device such as a vacuum pump (not shown), so that a negative pressure space is formed between the first mask 124 and the second mask 126 through the exhaust line 129 when the anti-splash liquid supply device 120 is operated, thereby sucking the process liquid splash and/or the process liquid splash (not shown) with the reaction product of the wafer 20 or the chip 22 caused by the non-flat surface of the wafer 20. Accordingly, the anti-splash liquid supply device 120 can be controlled to apply the corresponding process liquid to the wafer 20 on the turntable 110 according to the process requirements, while suppressing or preventing the splash behavior on the surface of the wafer 20.

As shown in fig. 1, the liquid recovery device 140 is circumferentially disposed around the rotary table 110 for collecting the liquid thrown out of the rotary table 110.

Referring to fig. 2, a schematic diagram of the anti-splash liquid supply device 120 and the turntable 110 in the single wafer processing apparatus 10 of fig. 1 is shown. Here, the wafer 20 is, for example, a stacked wafer, and includes a plurality of chips 22 bonded to the wafer 20 on a surface thereof, so that the surface of the wafer 20 is a non-planar surface. When the single wafer processing apparatus 10 of fig. 1 is used to process a wafer 20, the process liquid (indicated by dotted lines) sprayed through the nozzles 123 in the anti-splash liquid supply device 120 reaches the non-planar surface formed by the chip 22 and the wafer 20 to etch and/or clean, and the splashes 200 of process liquid and/or reaction products generated by the process liquid reach the non-planar surface are sucked through the negative pressure space formed between the first mask 124 and the second mask 126, and then the splashed process liquid and reaction products are discharged through the discharge pipeline 129, so that the process liquid and reaction products are prevented from becoming floating particles and being adhered back to the surface of the wafer 20 or the interface between the chip 22 and the wafer 20, thereby reducing or even avoiding the problem of wafer contamination caused by the operation of the anti-splash liquid supply device 120.

Referring to FIG. 3, a schematic diagram of some components of the anti-splash liquid supply device 120 of FIGS. 1-2, such as the nozzle 123, the first mask 124, and the second mask 126, is shown. In the present embodiment, the first mask 124 and the second mask 126 are symmetrically disposed according to the position relative to the nozzle 123. Here, the first mask 124 and the second mask 126 have a distance D1, the first mask 124 is spaced apart from the surface of the wafer 20 by a distance D3, and the second mask 126 is spaced apart from the surface of the wafer 20 by a distance D2. In one embodiment, the distance D1 is about 3 mm, the distance D2 is about 2-5 mm, and the distance D3 is about 5-8 mm.

Referring to fig. 4-5, schematic diagrams of a splash liquid shield 120 according to other embodiments are shown. The embodiment of fig. 4-5 is similar to the embodiment of fig. 2, and the difference between fig. 4-5 and fig. 2 is that the shape of the first mask 124 and the second mask 126 are different. For example, as shown in fig. 2, the first mask 124 and the second mask 126 are shaped as rectangular sections. Alternatively, the first mask 124 and the second mask 126 may be different in shape as shown in FIGS. 4-5. As shown in fig. 4, the first mask 124 is triangular in shape and the second mask 126 is semi-circular in shape. Or as shown in fig. 5, the first mask 124 is triangular in shape and the second mask 126 is polygonal in shape. The shapes of the first mask 124 and the second mask 126 are not limited to the shapes shown in fig. 2 and 4-5, as long as the shapes can conform to the ranges of the distance D1 and the distances D2 and D3, so that the process liquid and the reaction residue can be sucked and discharged by forming a negative pressure space between the first mask 124 and the second mask 126, so that the process liquid and the reaction residue can not become particles to float and be adhered to the wafer surface or the chip and wafer interface, thereby reducing or even avoiding the problem of wafer pollution.

Fig. 6 shows a schematic diagram of a single wafer processing apparatus 10' according to another embodiment of the present utility model. Here, the anti-splash liquid supply device in the single wafer processing apparatus 10 'shown in fig. 6 is similar to the anti-splash liquid supply device in the single wafer processing apparatus 10 shown in fig. 1, and the difference between the two is that a plurality of nozzles 123 are used in the anti-splash liquid supply device in the single wafer processing apparatus 10' shown in fig. 6, and different nozzles 123 can supply different process liquids to the surface of the wafer 20 through the different liquid supply lines 128 connected thereto, thereby providing a wafer processing process with less wafer contamination problems.

In addition, when the anti-splash liquid supply device in the single wafer processing apparatus as shown in fig. 1-2 and fig. 4-6 is disposed after the wafer processing process is completed, the nozzle cantilever 122 drives the nozzle 123 and the first mask 124 and the second mask 125 to move to the nozzle origin region (not shown), then the wafer processing apparatus is immersed in deionized water (DI water) for cleaning, and then the nozzle cantilever 122 drives the nozzle 123 and the first mask 124 and the second mask 125 to rise and blow-dry with nitrogen gas, thereby achieving the purpose of cleaning the nozzle 123 and the first mask 124 and the second mask 125, and facilitating the cleaning operation of the subsequent wafer processing process.

In summary, compared with the prior art, the present utility model provides a splash-proof liquid supply device and a single wafer processing apparatus. By coaxially fixing the first and second masks on the nozzles in the anti-splash liquid supply device in the single wafer processing apparatus and forming a negative pressure space between the first and second masks, the process liquid from the wafer and/or the splash of the reaction product of the process liquid and the wafer are sucked through the negative pressure space, so that the process liquid from the wafer is prevented from becoming particles to float and be adhered back to the wafer surface or the chip-wafer interface, thereby reducing or even avoiding the problem of wafer pollution.

The foregoing describes in detail a splash-preventing liquid supply device and a single wafer processing apparatus provided by the embodiments of the present utility model, and specific embodiments are applied to describe the principles and implementations of the present utility model, where the description of the foregoing embodiments is only for helping to understand the technical solution and the core idea of the present utility model. Those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some of the technical features thereof can be replaced by equivalents. Such modifications and substitutions do not depart from the spirit of the utility model.

Claims

1. A splash liquid supply device, characterized in that the splash liquid supply device comprises:

rotating the upright post;

a cantilever, wherein one end of the cantilever is connected to the rotating post;

a nozzle fixed at the other end of the cantilever, and driven by the cantilever to reciprocate above the wafer and spray process liquid when the rotating column rotates;

a first mask and a second mask coaxially fixed on the nozzle, wherein the second mask covers the first mask, the first mask and the second mask respectively have a first opening and a second opening facing the wafer, and the second opening is closer to the wafer than the first opening; and

and a discharge line connected to the second mask and configured to form a negative pressure space between the first mask and the second mask and to suck up a splash of the process liquid from the wafer and/or a splash of a reaction product of the process liquid and the wafer through the negative pressure space.

2. The splash liquid supply of claim 1, wherein the splash liquid supply further comprises a plurality of chips, the plurality of chips being bonded to the surface of the wafer, respectively.

3. The splash liquid supply of claim 1 wherein the process liquid is etching liquid or deionized water.

4. The splash liquid supply of claim 1, wherein the first mask and the second mask have a 3 mm spacing therebetween, the first mask being spaced from the surface of the wafer by a distance of 5-8 mm, and the second mask being spaced from the surface of the wafer by a distance of 2-5 mm.

5. The splash liquid supply apparatus according to claim 1, wherein the first mask and the second mask are identical or different in shape.

6. A single wafer processing apparatus, characterized in that the single wafer processing apparatus comprises:

a turntable configured to place a wafer;

a splash liquid supply disposed above the turntable and configured to apply a process liquid to the wafer, wherein the splash liquid supply comprises:

rotating the upright post;

a cantilever, wherein one end of the cantilever is connected to the rotating upright, and the other end of the cantilever extends above the rotating table;

a nozzle fixed at the other end of the cantilever, and driven by the cantilever to reciprocate above a wafer and spray a process liquid when the rotating column rotates;

a drain line coupled to the second mask, configured to form a negative pressure space between the first mask and the second mask, and to draw in a splash of the process liquid from the wafer and/or a splash of a reaction product of the process liquid and the wafer through the negative pressure space;

a kind of electronic device with high-pressure air-conditioning system;

and a liquid recovery device which is circumferentially arranged around the rotary table and is configured to collect the process liquid thrown out from the rotary table.

7. The single wafer processing apparatus of claim 6, further comprising a plurality of chips bonded to a surface of the wafer, respectively.

8. The single wafer processing apparatus of claim 6, wherein the process liquid is an etching solution or deionized water.

9. The single wafer processing apparatus of claim 6, wherein the first mask and the second mask have a 3 mm spacing therebetween, the first mask being spaced from the surface of the wafer by a distance of 5-8 mm and the second mask being spaced from the surface of the wafer by a distance of 2-5 mm.

10. The single wafer processing apparatus of claim 6, wherein the first mask and the second mask are the same or different in shape.