CN219676335U

CN219676335U - Multichannel active optical cable photon integrated chip and active optical cable

Info

Publication number: CN219676335U
Application number: CN202222526091.5U
Authority: CN
Inventors: 郭德汾; 李显尧; 孙雨舟
Original assignee: Suzhou Paisi Technology Co ltd
Current assignee: Suzhou Paisi Technology Co ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2023-09-12
Anticipated expiration: 2032-09-23
Also published as: WO2024060818A1

Abstract

The utility model relates to the technical field of active optical cables, in particular to a multichannel active optical cable photon integrated chip and an active optical cable. The multichannel active optical cable photon integrated chip comprises a transmitting end device and a receiving end device, wherein the transmitting end device comprises two light-in coupling structures, two light-splitting structures, 2n modulators, n wavelength division multiplexers and n first optical fiber coupling structures, and n is a positive integer; the receiving end device comprises n second optical fiber coupling structures, n polarization independent wavelength division multiplexing structures and 2n optical detectors. Based on the wavelength division multiplexing/wavelength division demultiplexing structure, the active optical cable photon integrated chip can effectively reduce the number of ports of a transmitting end and a receiving end, thereby reducing the area and the cost of the optical chip.

Description

Multichannel active optical cable photon integrated chip and active optical cable

Technical Field

The utility model relates to the technical field of optical communication, in particular to a multichannel active optical cable photon integrated chip and an active optical cable.

Background

Currently, the global optical fiber communication industry is developing towards high integration and low power consumption, and an optical communication device is used as an upstream product of the optical communication industry and plays a key role in the field of data communication. The current data communication field has higher and higher requirements on information transmission rate, and the optical module is used as a core device in an optical fiber communication system, so that the high-speed information transmission requires the optical module to continuously improve the integration level and realize miniaturized packaging. The silicon optical chip is adopted to replace the optical element in the free space in the original optical module, so that the integration level is effectively improved, and the miniaturized packaging of the optical module is facilitated.

The active optical cable (Active Optical Cables, AOC) includes a middle transmission cable and optical modules at both ends thereof, with the optical modules of current active optical cables typically employing VCSEL laser chips and detector chips coupled to silicon optical chips. The VCSEL is a multimode laser chip, correspondingly, the optical fibers of the active optical cable also adopt multimode optical fibers, a single optical fiber can only transmit one path of multimode optical signals, the number of uploading optical fibers and downloading optical fibers for the optical signals of more channels is more than that for the optical signals of more channels, and meanwhile, the same number of input ports and output ports are required to be designed on the silicon optical chip. When the active optical cable speed is increased and the channel is expanded, for example, an 8-channel active optical cable, 16 multimode optical fibers are needed, and 18 fiber-PIC (fiber-Photonic Integrated Circuit, fiber-photon integrated chip) coupling ports are needed to be arranged in the silicon optical chip structure in the optical module, wherein the 16 coupling ports are respectively butted with corresponding multimode optical fibers, and 2 ports are coupled with two VCSEL lasers. However, the ports need to be spaced apart from each other to be coupled with the optical fibers, so that the more the ports are disposed, the larger the area of the optical chip is, the higher the manufacturing cost of each chip is, and the downsizing packaging of the optical module is not facilitated.

Disclosure of Invention

Based on the above, it is necessary to provide a multi-channel active optical cable photonic integrated chip and an active optical cable, which solve the problems of large area and high manufacturing cost of the existing multi-channel active optical cable optical chip.

A multi-channel active optical cable photon integrated chip comprises a substrate layer and a waveguide layer, wherein the waveguide layer is provided with a transmitting end device and a receiving end device,

the transmitting end device comprises:

the two light-in coupling structures are respectively used for receiving a first optical signal and a second optical signal, and the first optical signal and the second optical signal are single-mode optical signals with different wavelengths;

the two light splitting structures are respectively connected with the two light in-coupling structures, each light splitting structure is used for dividing a first optical signal or a second optical signal received by the corresponding light in-coupling structure into n sub-optical signals, and n is an integer larger than 1;

2n modulators respectively connected with the two light splitting structures, wherein the 2n modulators respectively receive the 2n sub-optical signals output by the two light splitting structures, the 2n sub-optical signals are in one-to-one correspondence with the 2n modulators, and n is a positive integer;

n wavelength division multiplexers and n first optical fiber coupling structures, wherein each wavelength division multiplexer comprises two input ends and one output end, the two input ends are respectively connected with two modulators, the output ends are respectively connected with one first optical fiber coupling structure, and the two modulators connected with the same wavelength division multiplexer are respectively connected with different light splitting structures;

According to the mode that the sub optical signals of one path of modulated first optical signals and the sub optical signals of one path of modulated second optical signals are respectively transmitted to two input ends of the same wavelength division multiplexer, the sub optical signals of n paths of first optical signals and the sub optical signals of n paths of second optical signals are respectively connected into n wavelength division multiplexers, and each wavelength division multiplexer is used for combining the received two paths of sub optical signals into one path of composite optical signals, outputting the composite optical signals to the first optical fiber coupling structure and outputting the composite optical signals through the first optical fiber coupling structure;

the receiving-end device includes:

n second optical fiber coupling structures, each of which is used for receiving a path of composite optical signals with two different wavelengths input from the outside;

the optical fiber optical system comprises n polarization independent wavelength division multiplexing structures and 2n optical detectors, wherein two ends of each wavelength division multiplexing structure are respectively connected with one second optical fiber coupling structure and two optical detectors, and the optical detectors are used for demultiplexing the composite optical signals into two paths of optical signals with different wavelengths and transmitting the two paths of optical signals with different wavelengths to the two optical detectors respectively.

In one embodiment, the active optical cable photonic integrated chip further comprises:

the at least n first monitoring structures are arranged at the input end or one path of output end of each light splitting structure and are used for monitoring optical signals input into the modulator;

and the 2n second monitoring structures are respectively arranged in the output ends of the 2n modulators and are used for monitoring the optical signals modulated and output by the modulators.

In one of the embodiments of the present invention,

when n is 2, each light splitting structure comprises a first-stage beam splitter, and the first optical signal or the second optical signal input from the corresponding light in-coupling structure is divided into two sub-optical signals and then is respectively transmitted to two modulators in the 2n modulators;

or when n is 4, each light splitting structure comprises a first-stage beam splitter and two second-stage beam splitters, the first-stage beam splitters divide a first optical signal or a second optical signal input from the corresponding light in-coupling structure into two paths and respectively input the two paths of the first optical signal or the second optical signal to the two second-stage beam splitters, and the two second-stage beam splitters divide the respectively received optical signals into 2 sub-optical signals and respectively output the 2 sub-optical signals to 4 modulators corresponding to the 2n modulators.

In one embodiment, the splitters in the optical splitting structure are 3dB splitters, and the first monitoring structure is disposed at an input end of each 3dB splitter or one of two output ends of each 3dB splitter connected to the 2n modulators to monitor input optical power of two modulators connected to the 3dB splitter.

In one embodiment, the number of the first monitoring structures is 2n, and the first monitoring structures are respectively disposed between each modulator and the beam splitting structure.

In one embodiment, the first monitoring structure and the second monitoring structure each include a small split ratio coupler and a monitoring detector, and the small split ratio coupler is used for splitting monitoring light with a small optical power from the optical path to the monitoring detector so as to monitor the power of the optical signal transmitted by the optical path.

In one embodiment, each of the wavelength division multiplexing structures includes a polarization rotation separator and two wavelength division multiplexers, and the polarization rotation separator divides the composite optical signal received by the corresponding second optical fiber coupling structure into two paths of linearly polarized light and transmits the two paths of linearly polarized light to the two wavelength division multiplexers respectively; the two wavelength division demultiplexers respectively demultiplex the respectively received linear polarized light into two paths of optical signals with different wavelengths, and respectively transmit the optical signals to the two optical detectors connected with the two wavelength division demultiplexers, and the optical signals with the same wavelength output by the two wavelength division demultiplexers are transmitted to the same optical detector.

In one embodiment, the n first optical fiber coupling structures are arranged side by side to form an output optical fiber array coupling structure, and the n second optical fiber coupling structures are arranged side by side to form an input optical fiber array coupling structure;

or the n first optical fiber coupling structures and the n second optical fiber coupling structures are arranged side by side to form an optical fiber array coupling structure.

In one embodiment, the transmitting end device and the receiving end device are disposed on the same photonic integrated chip, or the transmitting end device and the receiving end device are disposed on different photonic integrated chips, respectively.

In one embodiment, the photonic integrated chip is a silicon-based photonic chip and the modulator is a Mach-Zehnder modulator.

An active optical cable, in one embodiment, comprises an array of optical fibers and optical modules at both ends thereof, each of the optical modules comprising:

the multi-channel active optical cable photonic integrated chip of any one of the above;

the first single-mode laser is used for generating a first optical signal and coupling the first optical signal to an in-coupling structure of the active optical cable photon integrated chip;

and the second single-mode laser is used for generating a second optical signal and coupling the second optical signal to another in-coupling structure of the active optical cable photon integrated chip, and the first optical signal and the second optical signal are single-mode optical signals with different wavelengths.

In one embodiment, the optical fiber array includes 2n optical fibers, where the n optical fibers respectively butt-joint n first optical fiber coupling structures in the optical module at one end and n second optical fiber coupling structures in the optical module at the other end; in addition, the n optical fibers are respectively butted with n second optical fiber coupling structures in the optical module at one end of the n optical fibers and n first optical fiber coupling structures in the optical module at the other end of the n optical fibers.

In one embodiment, the optical fiber is a single mode optical fiber, and the first optical fiber coupling structure and the second optical fiber coupling structure are both matched with the single mode optical fiber.

According to the multi-channel active optical cable photon integrated chip, the single-mode optical signals with two different wavelengths are respectively divided into n paths by utilizing the optical splitting structure in the transmitting end, then the 2n sub optical signals are subjected to wavelength division multiplexing by utilizing the n wavelength division multiplexers to synthesize composite optical signals with two different wavelengths, and the composite optical signals are output through the n optical fiber coupling structures, namely, the 2n optical signals can be transmitted by utilizing the n output ports, and the number of the output ports in the transmitting end is effectively reduced. Meanwhile, the receiving end receives n input composite optical signals by using n optical fiber coupling structures, n input composite optical signals can be decomposed into 2n paths of optical signals by using n polarization-independent wave decomposition multiplexing structures, namely, the receiving of 2n paths of optical signals can be realized by using n input ports, and the number of the input ports in the receiving end is effectively reduced. The multichannel active optical cable chip structure provided by the disclosure is based on the wavelength division multiplexing/wavelength division demultiplexing structure, and the number of input/output ports can be effectively reduced, so that the area of an optical chip is reduced, the cost of the optical chip is reduced, the number of optical fibers butted with the optical chip can be reduced, and the cost of the optical fibers is saved.

Drawings

In order to more clearly illustrate the embodiments of the present description or the technical solutions in the prior art, the following description will briefly explain the embodiments or the drawings used in the description of the prior art, and it is obvious that the drawings in the following description are only some embodiments described in the present description, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an 8-channel silicon optically active optical cable optical chip extended along a current structure;

FIG. 2 is a schematic diagram of the optical fiber connection between two modules of an active optical cable based on the 8-channel silicon optical active optical cable optical chip structure of FIG. 1;

FIG. 3 is a schematic diagram of a connection of a multi-channel active optical cable in one embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an active optical cable photonic integrated chip in accordance with one embodiment of the present disclosure;

FIG. 5 is a schematic diagram of an 8-channel active optical cable photonic integrated chip in accordance with one embodiment of the present disclosure;

FIG. 6 is a schematic diagram of a 4-channel active optical cable photonic integrated chip in accordance with one embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of an active optical cable photonic integrated chip in accordance with another embodiment of the present disclosure.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," "upper," "lower," "front," "rear," "circumferential," and the like as used herein are based on the orientation or positional relationship shown in the drawings and are merely for convenience of description and to simplify the description, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the utility model.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The active optical cable (Active Optical Cables, AOC) is widely applied to high-performance computers and data centers, and can realize high-speed and reliable data transmission by utilizing optical fiber transmission through electric-optical conversion, and when the active optical cable speed is increased, the data transmission with higher speed is realized by expanding more channels. Fig. 1 is a schematic structural diagram of an 8-channel silicon optical active optical cable optical chip structure extended by a typical AOC structure based on a silicon optical chip, where the 8-channel silicon optical active optical cable optical chip structure includes a transmitting end and a receiving end. The transmitting device includes two in-coupling structures (fiber-PIC coupling structures), 8 first fiber coupling structures (fiber-PIC coupling structures), an 8-way modulator, 6 beam splitters, and waveguides connecting these structures. The light source of the traditional active optical cable is a VCSEL multimode laser, after expansion, multimode optical signals emitted by 2 VCSEL multimode lasers can be respectively received through two light-in coupling structures, light emitted by each laser is divided into 4 parts by three cascaded beam splitters and respectively connected into 4 modulators, and 8 sub optical signals separated by 2 paths of multimode optical signals are respectively modulated by the modulators and then are output by 8 first optical fiber coupling structures. The receiving end comprises 8 second optical fiber coupling structures (fiber-PIC coupling structures), 8 detectors and waveguides connecting the coupling structures and the detectors.

It can be seen that an 8-channel silicon optical chip structure extended along a typical structure requires a total of 18 fiber-PIC coupling structures. The main problem with the above structure is that the optical chip requires multiple input/output ports (fiber-PIC coupling structure). However, when each port in the optical chip is damaged, the optical chip cannot work normally, and therefore, the more ports in the optical chip, the higher the failure rate of the whole chip. And a certain distance is needed between the ports of the optical chip to be coupled with the optical fiber, so that the more the ports of the optical chip are, the larger the chip area is and the higher the cost of the chip is.

The optical fiber connection method between the active optical cable optical modules based on the structure is shown in fig. 2, when the active optical cable optical modules use the 8-channel silicon active optical cable optical chips shown in fig. 1, the number of transmission optical fibers is required to be consistent with the number of channels and the number of coupling ports, the optical fiber cost is high, the coupling difficulty between the optical fibers and the chips is also improved, and the production efficiency is influenced, so that the manufacturing cost of the active optical cable is also higher, and the miniaturized packaging of the active optical cable is also not facilitated.

The present disclosure provides an active optical cable, in which a light source (VCSEL multimode laser) of a conventional AOC module is changed into two single-mode lasers with different wavelengths, and the two single-mode lasers are combined with a photonic chip of an integrated design, so that the number of ports of the optical chip and the number of transmission fibers are reduced, the transmission rate of a single fiber is increased, the area of the optical chip is reduced, the production cost of the optical chip and the overall failure rate of the optical chip are reduced, the fiber cost is reduced, and the cost and the failure rate of the active optical cable are further reduced, and the miniaturized package of the active optical cable is facilitated.

Fig. 3 is a schematic connection diagram of a multi-channel active optical cable in one embodiment of the present disclosure, in which the active optical cable includes an array of optical fibers and optical modules (AOC modules) at both ends thereof.

Each optical module includes a multi-channel active optical cable photonic integrated chip 10, a first laser 20, and a second laser 30, each of which is a single-mode laser.

The first laser 20 is optically coupled to the active optical cable photonic integrated chip 10 for generating a first optical signal and coupling the first optical signal to an in-coupling structure of the active optical cable photonic integrated chip. A second laser 30 is optically interfaced with the active optical cable photonic integrated chip 10 for generating a second optical signal and coupling the second optical signal to another in-coupling structure of the active optical cable photonic integrated chip. And the first optical signal and the second optical signal are single-mode optical signals with different wavelengths.

The active optical cable photonic integrated chip 10 can divide the received first optical signal into n paths, divide the received second optical signal into n paths, respectively perform wavelength division multiplexing on the n paths of first optical signals and the n paths of second optical signals to form n paths of output composite optical signals, and realize the transmission of 2n paths of optical signals through n output ports (first optical fiber coupling structures), thereby effectively reducing the number of output ports in the transmitting end. Meanwhile, the active optical cable photon integrated chip 10 can also receive n input composite optical signals, and the n input composite optical signals are subjected to wave-division multiplexing into 2n paths of optical signals, namely, the 2n paths of optical signals are received by utilizing n input ports (second optical fiber coupling structures), so that the number of the input ports in the receiving end is effectively reduced. As shown in fig. 3, compared with the conventional optical chip structure, when receiving/transmitting optical signals with the same number of channels, the active optical cable photonic integrated chip 10 provided by the present disclosure has fewer ports, so that the area of the photonic integrated chip can be effectively reduced, and the cost is reduced. Therefore, the active optical cable can effectively reduce the production cost and the overall failure rate.

In one embodiment, as shown in FIG. 3, the fiber array 40 may include 2n fibers.

N optical fibers in the 2n optical fibers are respectively butted with n first optical fiber coupling structures in the optical module at one end of the optical fiber array 40 and n second optical fiber coupling structures in the optical module at the other end of the optical fiber array 40. Wherein, the two ends of each optical fiber in the n optical fibers are respectively abutted with a first optical fiber coupling structure in the optical module at one end and a second optical fiber coupling structure in the optical module at the other end.

The other n optical fibers in the n optical fibers are respectively butted with the n second optical fiber coupling structures in the optical module at one end and the n first optical fiber coupling structures in the optical module at the other end. Wherein, the two ends of each optical fiber in the n optical fibers are respectively abutted with a second optical fiber coupling structure in the optical module at one end and a first optical fiber coupling structure in the optical module at the other end.

As an example, the optical fiber may be a single mode optical fiber. The first optical fiber coupling structure and the second optical fiber coupling structure of the active optical cable photon integrated chip are matched with the single mode optical fiber mode.

In practice, optical coupling to an array of ports in an optical chip is typically accomplished using an array of optical fibers. However, there may be an error in the pitch of adjacent optical fibers in the optical fiber array, so when the number of ports in the optical chip is increased, the number of optical fibers is increased, the error accumulated in the pitch in the optical fiber array is increased, and the coupling loss between the optical fiber array and the port array is increased. In addition, when the number of optical fibers in the optical fiber array is large, the optical fiber cost in the production cost of the active optical cable is correspondingly increased.

Accordingly, the active optical cable provided by the present disclosure may correspondingly reduce the number of optical fibers in the optical fiber array by reducing the number of ports of the active optical cable photonic integrated chip 10. Thus, when the fiber array is coupled to the port array of the active optical fiber photonic integrated chip 10, the distance error accumulation of the spacing between adjacent fibers in the fiber array is smaller than in conventional structures, and the loss accumulated by the fiber array and port coupling is less. In addition, the number of optical fibers in the optical fiber array is reduced, and the material cost of the optical fibers in the production cost is correspondingly reduced, so that the production cost of the active optical cable is effectively reduced.

Based on the description of the active optical cable embodiments above, the present disclosure also provides an active optical cable photonic integrated chip. Based on the same innovative concept, embodiments of the present disclosure provide an active optical cable photonic integrated chip in one or more embodiments as described in the following embodiments. As used below, the term "unit" or "structure" may be a combination of hardware that implements a predetermined function.

In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments.

The present disclosure proposes a multi-channel active optical cable photonic integrated chip based on an on-chip wavelength division multiplexing/wavelength division demultiplexing structure, which can effectively reduce the number of input/output ports (optical fiber coupling structures) of the integrated chip. Fig. 4 is a schematic structural diagram of a multi-channel active optical cable photonic integrated chip in one embodiment of the present disclosure, where the active optical cable photonic integrated chip includes a substrate layer and a waveguide layer, and the waveguide layer is provided with a transmitting end device and a receiving end device.

The transmitting end device and the receiving end device may be disposed on the same photonic integrated chip. Alternatively, the transmitting-end device and the receiving-end device may be disposed on different photonic integrated chips, respectively.

The transmitting-end device may include two in-coupling structures 510, two optical splitting structures (the two optical splitting structures may be the first optical splitting structure 100 and the second optical splitting structure 200, respectively), 2n modulators 300, n wavelength division multiplexers 400, and n first optical fiber coupling structures 520, and n is a positive integer. In some embodiments of the present disclosure, the value of n may be a positive even number.

The two in-coupling structures 510 are configured to receive a first optical signal and a second optical signal, respectively, where the first optical signal and the second optical signal are single-mode optical signals with different wavelengths.

The first optical signal may be generated by a first laser, where one in-coupling structure 510 interfaces with the optical coupling of the first laser, so that the first optical signal emitted by the first laser may be coupled into the active optical cable photonic integrated chip 10 through the in-coupling structure 510. Likewise, a second optical signal may be generated by a second laser, and another optical coupling structure 500 is optically coupled to the second laser, so that the second optical signal emitted by the second laser may also be coupled into the active optical cable photonic integrated chip 10 through the in-coupling structure 510.

The first optical splitting structure 100 is connected to an in-coupling structure 510 for receiving a first optical signal. The first optical splitting structure 100 may be used to perform optical splitting processing on the first optical signal. The first optical signal emitted by the first laser may be divided into n sub-optical signals after being transmitted to the first optical splitting structure 100 through the in-coupling structure 510. The n modulators are respectively connected with the first light splitting structure and are used for receiving n sub-optical signals output by the first light splitting structure. After the first optical signal is divided into n paths by the first optical splitting structure 100, n sub-optical signals are respectively transmitted to the n modulators 300 for modulation. Modulator 300 may cause a high-speed electrical signal to be loaded onto the first optical signal for transmission.

The second optical splitting structure 200 is connected to an in-coupling structure 510 for receiving a second optical signal. The second optical splitting structure 200 may be used to split the second optical signal. The second optical signal emitted by the second laser may also be divided into n sub-optical signals after being transmitted to the second optical splitting structure 200 through the in-coupling structure 510. And the n modulators are respectively connected with the second light splitting structure and are used for receiving n sub-optical signals output by the second light splitting structure. After the second optical signal is split into n paths by the second optical splitting structure 200, n sub-optical signals are respectively transmitted to n modulators 300 for modulation. Modulator 300 may cause the high-speed electrical signal to be loaded onto the second optical signal for transmission.

As an example, the photonic integrated chip may be provided as a silicon-based photonic chip, and the modulator 300 is a mach-zehnder modulator.

Each of the n wavelength division multiplexers includes two inputs and one output. The two input ends are respectively connected with two modulators 300, the output ends are respectively connected with one first optical fiber coupling structure, the two modulators connected with the same wavelength division multiplexer are respectively connected with different light splitting structures, namely, one modulator is connected with the first light splitting structure, and the other modulator is connected with the second light splitting structure in the two modulators connected with the same wavelength division multiplexer. The n first optical fiber coupling structures can then be regarded as n output ports for outputting optical signals.

As shown in fig. 4, the sub-optical signals of the n first optical signals and the sub-optical signals of the n second optical signals are respectively connected to the n wavelength division multiplexers 400 in such a manner that the sub-optical signals of one modulated first optical signal and the sub-optical signals of one modulated second optical signal are transmitted to the same wavelength division multiplexer 400.

Wavelength division multiplexer 400 is a device that can combine two or more optical carrier signals carrying information at different wavelengths and couple the signals into the same optical waveguide of an optical line for transmission. Therefore, after the modulated sub-optical signals of the first optical signal and the modulated sub-optical signals of the second optical signal are transmitted to the same wavelength division multiplexer 400, the wavelength division multiplexer 400 can combine the sub-optical signals of the first optical signal and the sub-optical signals of the second optical signal together to form an output composite optical signal, and couple the combined first optical signal and second optical signal into the same optical fiber through the first optical fiber coupling structure 520, so that two optical signals with different wavelengths can be transmitted through the same optical fiber waveguide.

Because the wavelength division multiplexer/demultiplexer performs the combination/separation of two or more optical signals with different wavelengths, in some embodiments of the present disclosure, the first optical signal and the second optical signal have different wavelengths, so as to ensure that the wavelength division multiplexer can multiplex the first optical signal and the second optical signal with different wavelengths to one output, and the wavelength division multiplexer can also receive the combined optical signal and separate the first optical signal and the second optical signal combined therein. The active optical cable photon integrated chip is based on an on-chip wavelength division multiplexing/wavelength division demultiplexing structure, can realize multiplexing/demultiplexing of two optical signals with different wavelengths, and effectively reduces the number of input and output ports.

The sub-signals of the n paths of first optical signals and the sub-signals of the n paths of second optical signals are alternately connected into the n wavelength division multiplexers 400 in a mode that the sub-signals of the one path of first optical signals and the sub-signals of the one path of second optical signals are transmitted to the same wavelength division multiplexer 400. By arranging the wavelength division multiplexer 400, the sub-signals of the first optical signal and the second optical signal can be multiplexed to one path for output by using the wavelength division multiplexing technology, that is, the two paths of optical signals can share one output port and optical fiber to realize data transmission. Accordingly, the n first optical fiber coupling structures 520 respectively connected with the n wavelength division multiplexers 400 are used as signal output ports, and the n output ports can be used for realizing the signal output of 2n paths of optical signals, so that the number of the output ports is effectively reduced.

In the optical chip structure of the conventional AOC optical module, one output port is required to be correspondingly set for one optical signal to realize signal output, that is, 2n output ports are required to be set for 2n optical signals. It can be seen that the present disclosure provides fewer output ports at the transmitting end than existing structures. Therefore, the chip port failure rate of the active optical cable photon integrated chip provided by the disclosure is lower than that of the traditional optical chip structure, so that the overall failure rate of the chip is lower. In addition, a certain distance is needed between the ports, and under the condition that the number of the output ports is reduced in the disclosure, the area of the optical chip is correspondingly reduced, so that the production cost of the chip is reduced, and the miniaturized packaging of the active optical cable is facilitated.

The receiving-end device of the active optical fiber photonic integrated chip may include n second optical fiber coupling structures 530, n polarization-independent wavelength-division multiplexing structures 600, and 2n detectors 630. Demultiplexing the n-way composite optical signal into 2 n-way optical signals is achieved using n polarization independent wavelength division multiplexing structures 600 and transmitted to 2n optical detectors 630, respectively.

The n second optical fiber coupling structures and the n first optical fiber coupling structures may be arranged side by side to form an optical fiber array coupling structure.

Alternatively, n first optical fiber coupling structures may be disposed side by side to form an output optical fiber array coupling structure, and n second optical fiber coupling structures may be disposed side by side to form an input optical fiber array coupling structure.

One end of each wavelength division multiplexing structure 600 is connected to one of the second optical fiber coupling structures 530, while the other end is connected to two of the optical detectors 630.

As an example, one wavelength-division-demultiplexing structure 600 may include one polarization rotating separator 610, two wavelength-division-demultiplexers 620.

The second optical fiber coupling structure 530 may be used as an input port of a receiving end, and receives an optical signal input by an external device, where the received optical signal is an input composite optical signal formed by combining two optical signals with different wavelengths. The second optical fiber coupling structure 530 is connected to the polarization rotation splitter 610, and the polarization rotation splitter 610 can split the input composite optical signal received by the second optical fiber coupling structure 530 into two paths of linearly polarized light. And the two paths of linearly polarized light are respectively transmitted to the two wave-division demultiplexer. The two optical signals split by the polarization rotation splitter 610 remain as a composite optical signal.

Specifically, the polarization rotating separator 610 includes a first output terminal connected to one of the wavelength division demultiplexers 620 and a second output terminal connected to the other wavelength division demultiplexer 620.

The main function of the wavelength demultiplexer 620 is to separate out the multiple wavelength signals transmitted in one optical waveguide. The wavelength division demultiplexer 620 may separate a composite optical signal including two different wavelengths from the linearly polarized light transmitted from the first output or the second output of the polarization rotation separator 610.

The two wavelength division demultiplexers 620 respectively demultiplex the respective received linearly polarized light into two optical signals of different wavelengths, and respectively transmit the two optical signals to the two optical detectors 630 connected thereto. The optical signals of the same wavelength output from the two wavelength demultiplexers 620 are transmitted to the same optical detector 630.

Specifically, as shown in fig. 4, a first output terminal of the first wavelength division demultiplexer 620 is connected to a first terminal of the first optical detector 630, and a second output terminal of the first wavelength division demultiplexer 620 is connected to a first terminal of the second optical detector 630. Similarly, a first output of the second wavelength-division-demultiplexer 620 is connected to a second end of the first photodetector 630, and a second output of the second wavelength-division-demultiplexer 620 is connected to a second end of the second photodetector 630. That is, two optical signals separated by one wavelength division demultiplexer 620 are transmitted to different optical detectors 630 for detection. And, of the four optical signals separated by the two wavelength demultiplexers 620, two optical signals with the same wavelength are transmitted to the same optical detector 630 for detection.

In some embodiments of the present disclosure, the light detector 630 may be a high-speed detector. In practical applications, the signal received by the input end of the optical chip is usually a high-frequency signal, so that the high-speed detector is used to detect the high-frequency input optical signal. In addition, the high-speed detector can also acquire the optical power of the optical signal.

The first photodetector 630 can detect the optical signal at the first wavelength separated by the two wavelength demultiplexers 620. Meanwhile, the first photodetector 630 may also acquire the optical power of the first wavelength optical signal. Likewise, a second photodetector 630 can detect an optical signal at a second wavelength. Meanwhile, the second photodetector 630 can also acquire the optical power of the optical signal with the second wavelength.

In some embodiments of the present disclosure, the transmitting device may use the first optical fiber coupling structure as an output port to implement connection with an external device, the receiving device may use the second optical fiber coupling structure as an input port to implement connection with an external device, and the first optical fiber coupling structure and the second optical fiber coupling structure in the present disclosure may be fiber-PIC coupling structures.

By arranging the wavelength division demultiplexer 620, the active optical cable photonic integrated chip can separate two paths of optical signals in the composite optical signal by using a wavelength division demultiplexing technology, that is, one input port can receive two paths of input optical signals, and the two paths of optical signals can share one input port to realize signal input. With the n second optical fiber coupling structures 530 in the n wavelength division multiplexing structures 600 as signal input ports of the receiving end, the n input ports can receive 2n input optical signals, thereby effectively reducing the number of input ports in the receiving end.

In the optical chip structure of the conventional active optical cable, one input port and one transmission optical fiber are required to be correspondingly arranged for one input optical signal, namely 2n input ports are required to be arranged for 2n input optical signals. It can be seen that the receiving end provided by the present disclosure may be provided with fewer input ports than existing structures. Therefore, the chip port failure rate of the active optical cable photon integrated chip provided by the disclosure is lower than that of the traditional optical chip structure, and the overall failure rate of the chip is lower. The ports are required to have a certain distance, after the number of the input ports is reduced, the area of the optical chip is correspondingly reduced, the production cost of the chip is also reduced, and the miniaturized packaging of the active optical cable is facilitated.

Fig. 5 is a schematic structural diagram of an 8-channel active optical fiber photonic integrated chip according to one embodiment of the present disclosure, where in one embodiment, when n has a value of 4, the active optical fiber photonic integrated chip may implement input or output of an 8-channel optical signal. When n has a value of 4, the first optical splitting structure 100 may include three beam splitters, and the first optical signal is split into 4 paths of first optical signals by using the three beam splitters. The three beam splitters may include one first stage beam splitter and two second stage beam splitters. The first stage beam splitter of the first beam splitting structure 100 may be a beam splitter 101. The two second stage beamsplitters of the first beam splitting structure 100 may be a beam splitter 102 and a beam splitter 103, respectively.

A beam splitter is an optical device that can divide a beam of light into two or more beams of light according to a predetermined ratio, for example, the beam splitter can divide a beam of light into two beams of light, or can divide a beam of light into two beams of light according to 2:8 is divided into two beams. In some embodiments of the present disclosure, the beam splitter selected is a beam splitter that divides one beam of light into two beams of light.

The beam splitter 101 is connected to an in-coupling structure 510 for receiving a first optical signal, which after being transmitted into the beam splitter 101 via the in-coupling structure 510, the beam splitter 101 may split the first optical signal into two paths. The first output end of the beam splitter 101 is connected to the beam splitter 102, i.e. one of the optical signals split by the beam splitter 101 is transmitted to the beam splitter 102 for splitting again. The beam splitter 102 may subdivide one of the optical signals split by the beam splitter 101 into two sub-optical signals of the first optical signal. The second output end of the beam splitter 101 is connected to the beam splitter 103, i.e. the other optical signal split by the beam splitter 101 is transmitted to the beam splitter 103 for splitting again. The beam splitter 103 may subdivide the other optical signal split by the beam splitter 101 into sub-optical signals of the two first optical signals.

The optical path structure of the second optical splitting structure 200 is the same as that of the first optical splitting structure 100, and the second optical splitting structure 200 may include three beam splitters, and the second optical signal may be split into 4 paths of second optical signals by using the three beam splitters. The three beam splitters may include one first stage beam splitter and two second stage beam splitters. The first stage beam splitter of the second beam splitting structure 200 may be beam splitter 104. The two second stage beamsplitters of the second beam splitting structure 200 may be a beam splitter 105 and a beam splitter 106, respectively.

The splitter 104 is connected to an in-coupling structure 510 for receiving a second optical signal, and after the second optical signal is transmitted into the splitter 104 through the in-coupling structure 510, the splitter 104 splits the second optical signal into two paths and transmits the second optical signal to the splitter 105 and the splitter 106, respectively. The beam splitter 105 may divide one optical signal split by the beam splitter 104 into two sub-signals of the second optical signal, and the beam splitter 106 may divide the other optical signal split by the beam splitter 104 into two sub-signals of the second optical signal.

In some embodiments of the present disclosure, when a wavelength division multiplexer is used to multiplex two optical signals into one path, the wavelengths of the two input optical signals are different, and when a plurality of optical devices in an optical chip structure are arranged, the situation that optical paths are crossed inevitably occurs is considered. Therefore, the arrangement of the optical paths in the optical chip can be better realized by utilizing the cross waveguide, and the circuit design in the optical chip is simplified. Thus, three crossover waveguides, namely a first crossover waveguide 107, a second crossover waveguide 108 and a third crossover waveguide 109, may also be included in the 8-channel active optical cable photonic integrated chip.

As shown in fig. 5, the optical signal split at the first output end of the beam splitter 101 is directly transmitted to the beam splitter 102 for splitting, and the second output end of the beam splitter 101 is connected to the first end of the first cross waveguide 107. The optical signal split at the first output end of the beam splitter 104 is directly transmitted to the beam splitter 105 for splitting, and the second output end of the beam splitter 104 is connected to the second end of the first cross waveguide 107. Thus, the second optical signal split by the beam splitter 101 may implement interleaving with the second optical signal path split by the beam splitter 104.

The third end of the first cross waveguide 107 is connected to the beam splitter 102, the optical signal split at the second output end of the beam splitter 101 is transmitted to the beam splitter 103 through the first cross waveguide 107, and the beam splitter 102 can divide the optical signal split at the first output end of the first-stage beam splitter 601 into two paths. Thus far, the first optical signal is split into 4 paths after being split by three beam splitters, that is, the beam splitter 101, the beam splitter 102, and the beam splitter 103. Likewise, the fourth end of the first cross waveguide 107 is connected to the beam splitter 105, the optical signal split at the second output end of the beam splitter 104 is transmitted to the beam splitter 106 through the first cross waveguide 107, and the beam splitter 106 can divide the optical signal split at the second output end of the beam splitter 104 into two paths. The second optical signal is split into 4 paths after passing through three beam splitters of beam splitter 104, beam splitter 105 and beam splitter 106.

In fig. 5, the 8 modulators in the transmitting end are shown as modulator 301, modulator 302, modulator 303, modulator 304, modulator 305, modulator 306, and modulator 308, respectively. The 4 wavelength division multiplexers in the transmitting end are respectively a wavelength division multiplexer 401, a wavelength division multiplexer 402, a wavelength division multiplexer 403 and a wavelength division multiplexer 404.

The sub-signals of the second optical signal split at the first output end of the beam splitter 106 are transmitted to the modulator 302 through the second cross waveguide 108, so that the sub-signals of the second optical signal output at the first output end of the beam splitter 106 are adjusted by the modulator 302. The sub-signal of the other first optical signal split at the second output end of the beam splitter 102 is transmitted to the modulator 303 through the second cross waveguide 108, so that the sub-signal of the first optical signal output at the second output end of the beam splitter 102 is adjusted by using the modulator 303.

The sub-signal of the second optical signal output at the first output of the beam splitter 105 is transmitted to the modulator 306 through the third cross waveguide 109 to adjust the sub-signal of the second optical signal by the modulator 306. The sub-signal of the other first optical signal split at the second output end of the beam splitter 103 is transmitted to the modulator 307 through the third cross waveguide 109, so that the sub-signal of the first optical signal output at the second output end of the beam splitter 103 is adjusted by the modulator 307.

For specific connection modes of the second cross waveguide and the third cross waveguide, please refer to the first cross waveguide.

The first optical signal and the second optical signal with different wavelengths can be respectively divided into 4 paths by the first optical splitting structure 100 and the second optical splitting structure 200, and respectively connected to 8 paths of different modulators. The sub-signals of the 4 paths of first optical signals and the sub-signals of the 4 paths of second optical signals are alternately connected into the 4 wavelength division multiplexers 400 in a mode that the sub-signals of the one path of first optical signals and the sub-signals of the one path of second optical signals are connected into the same wavelength division multiplexer 400. By using 4 wavelength division multiplexers 400, 8 optical signals can be multiplexed into 4 optical signals, so that the number of output ports in the transmitting end is effectively reduced.

In some other embodiments, the first optical splitting structure 100 and the second optical splitting structure 200 of other structures may be used to split the first optical signal into 4 paths and the second optical signal into 4 paths. The first optical signal and the second optical signal may be divided into other numbers of optical signals by using the first optical splitting structure 100 and the second optical splitting structure 200 according to practical application requirements.

Fig. 6 is a schematic structural diagram of a 4-channel active optical cable photonic integrated chip according to one embodiment of the present disclosure, where in one embodiment, when n has a value of 2, the active optical cable photonic integrated chip may implement input or output of a 4-channel optical signal. When n has a value of 2, the first optical splitting structure 100 and the second optical splitting structure 200 may each include a first-stage beam splitter.

The first stage beam splitter of first beam splitting structure 100 may be beam splitter 110. Beam splitter 110 is coupled to in-coupling structure 510 for receiving a first optical signal, which is transmitted into beam splitter 110 via in-coupling structure 510, and beam splitter 110 may split the first optical signal into two paths.

The optical path structure of the second light splitting structure 200 is the same as that of the first light splitting structure 100, and the first-stage beam splitter of the second light splitting structure 200 may be the beam splitter 111. The beam splitter 111 is connected to an in-coupling structure 510 for receiving a second optical signal, which after being transmitted into the beam splitter 111 through the in-coupling structure 510, the beam splitter 111 may split the second optical signal into two paths.

Likewise, the arrangement of the light paths in the optical chip can be better realized by utilizing the crossed waveguide in the 4-channel active optical cable photonic integrated chip, so that the circuit design in the optical chip is simplified. Thus, a crossover waveguide 112 may also be included in the 4-channel active optical cable photonic integrated chip. In fig. 6, the 4 modulators in the transmitting-end device are shown as modulator 309, modulator 310, modulator 311, and modulator 312, respectively. The 2 wavelength division multiplexers in the transmitting device are respectively a wavelength division multiplexer 405 and a wavelength division multiplexer 406.

As shown in fig. 6, the first output terminal of the beam splitter 110 is connected to the modulator 309, so that the sub-signal of the first optical signal output from the first output terminal of the beam splitter 110 is adjusted by the modulator 309. A second output of beam splitter 110 is connected to a first end of crossover waveguide 112. A first output of the beam splitter 111 is connected to a second end of the cross waveguide 112. Crossing waveguide 112 may effect a crossing between the two optical paths of the second output of beam splitter 110 and the first output of beam splitter 111.

The fourth end of the cross waveguide 112 is connected to the modulator 310, i.e. the sub-signal of the second optical signal split at the first output end of the beam splitter 111 is transmitted to the modulator 310 through the cross waveguide 112, so that the sub-signal of the second optical signal output at the first output end of the beam splitter 111 is adjusted by the modulator 310. The output terminal of the modulator 309 and the output terminal of the modulator 310 are both connected to the input terminal of the wavelength division multiplexer 405, that is, the sub-signal of the first optical signal split by the beam splitter 110 and the sub-signal of the first second optical signal split by the beam splitter 111 can be modulated and multiplexed into one output composite optical signal by using the wavelength division multiplexer 405.

The third end of the cross waveguide 112 is connected to the modulator 311, that is, the sub-signal of the other first optical signal split by the second output end of the beam splitter 110 is transmitted to the modulator 311 through the cross waveguide 112, so that the sub-signal of the first optical signal output by the second output end of the beam splitter 110 is adjusted by using the modulator 311. A second output of the beam splitter 111 is connected to a modulator 312 for adjusting a sub-signal of the second optical signal output by the second output of the beam splitter 111 by means of a modulator 321. The output end of the modulator 311 and the output end of the modulator 312 are both connected to the input end of the wavelength division multiplexer 406, that is, the wavelength division multiplexer 406 can be used to modulate and multiplex the sub-signals of the second path of the first optical signal split by the beam splitter 110 and the sub-signals of the second path of the second optical signal split by the beam splitter 111 into one path of output composite optical signals.

The sub-signals of the first optical signal and the sub-signals of the second optical signal with different wavelengths can be respectively divided into 2 paths by the first optical splitting structure 100 and the second optical splitting structure 200, and respectively connected to 4 paths of different modulators. The sub-signals of the 2 paths of the first optical signals and the sub-signals of the 2 paths of the second optical signals are alternately connected into the 2 wavelength division multiplexers 400 in a mode that the sub-signals of the one path of the first optical signals and the sub-signals of the one path of the second optical signals are connected into the same wavelength division multiplexer 400. The sub-signals of the 4 optical signals can be multiplexed into 2 optical signals by using the 2 wavelength division multiplexers 400, so that the number of output ports in the transmitting end is effectively reduced.

In some other embodiments, the first optical splitting structure 100 and the second optical splitting structure 200 of other structures may be used to split the first optical signal into 2 paths and the second optical signal into 2 paths.

Fig. 7 is a schematic structural diagram of an active optical cable photonic integrated chip in another embodiment of the present disclosure, in one embodiment, the active optical cable photonic integrated chip may further include at least n first monitoring structures 700 and 2n second monitoring structures 800.

At least n first monitoring structures 700 are disposed at the input end or one of the output ends of each of the optical splitting structures, and are used for monitoring the optical signals input to the modulator.

As an example, the splitters in the beam splitting structure are all 3dB splitters. For example, referring to fig. 5, beam splitter 101, beam splitter 102, beam splitter 103, beam splitter 104, beam splitter 105, beam splitter 106 are all 3dB beam splitters. As another example, referring to fig. 6, beam splitter 110 and beam splitter 111 are both 3dB beam splitters.

The 3dB beam splitter splits light very accurately, and the two paths of split light power are basically equal, so that the light power of two output branches of the 3dB beam splitter can be calculated only by monitoring one path of split light power or the light power before splitting light at the input end of the 3dB beam splitter.

Accordingly, an active optical cable photonic integrated chip may be provided that may also include n first monitoring structures 700. The input end of each 3dB splitter specifically configured to connect to the 2n modulators is provided with a first monitoring structure 700. At the moment, by monitoring the optical power before the light is split at the input end of one 3dB beam splitter, the monitoring of the input optical power of two modulators connected with the 3dB beam splitter can be effectively realized.

Alternatively, an active optical cable photonic integrated chip may also be provided that further includes n first monitoring structures 700. One of the two output ends of the 3dB splitter, which is specifically configured to be connected to each of the 2n modulators, is provided with the first monitoring structure 700. At this time, the monitoring of the input optical power of two modulators connected with the 3dB beam splitter is realized by monitoring the optical power of one path of optical signal split by the 3dB beam splitter.

Of course, it is also possible to provide that both output terminals of the 3dB splitter connected to each of the 2n modulators (corresponding to the input terminal of each modulator) are provided with the first monitoring structure 700.

The beam splitters in the beam splitting structures (the first beam splitting structure and the second beam splitting structure) are not limited to 3dB beam splitters, and the types of the beam splitters may be the same or different.

For example, the beam splitters in the beam splitting structures (the first beam splitting structure and the second beam splitting structure) may be Y-beam splitters, multimode beam splitters (MMI), or the like. In this case, the optical powers of the two optical signals split by the same splitter may be different.

Thus, as another example, an active optical cable photonic integrated chip may also be provided, and the active optical cable photonic integrated chip may further include 2n first monitoring structures 700, and 2n first monitoring structures 700 are respectively disposed between each of the modulators and the optical splitting structures.

Specifically, two output ends of each beam splitter, which are connected with the 2n modulators, are provided with a first monitoring structure 700. At this time, as shown in fig. 7, the input end of the first monitoring structure 700 is connected to one output end of the first optical splitting structure 100 or the second optical splitting structure 200, and the output end is connected to the input end of one modulator 300.

The sub-signals of the n paths of first optical signals split by the first optical splitting structure 100 are monitored by n first monitoring structures 700, so as to realize monitoring of optical signals input into n modulators therein. The sub-signals of the n second optical signals split by the second optical splitting structure 200 are monitored by the n first monitoring structures 700 respectively, so as to realize monitoring of the optical signals input into the n modulators.

Meanwhile, 2n second monitoring structures 800 are respectively disposed in the output ends of the 2n modulators, and are used for monitoring the optical signals modulated by the modulators and output.

An input terminal of one second monitoring structure 800 is connected to an output terminal of one modulator 300, and sub-signals of n first optical signals after modulation are monitored by n second monitoring structures 800, respectively. The sub-signals of the modulated n paths of second optical signals are monitored by another n second monitoring structures 800, respectively.

The active optical cable photon integrated chip can realize real-time monitoring of sub-signals of the first optical signals and sub-signals of the second optical signals before and after modulation by arranging at least n first monitoring structures 700 and 2n second monitoring structures 800, and can also control working points and loss of the modulator according to monitoring conditions to judge whether a modulation result meets an expected effect or not, so that the problem that normal work of a transmitting end is influenced due to the fact that the modulator is abnormal is prevented.

In one embodiment, a first monitoring structure 700 may include a small split coupler 701 and a monitoring detector 702. The small split ratio coupler is used for splitting monitoring light with smaller optical power from the optical path to the monitoring detector so as to monitor the power of the optical signal transmitted by the optical path.

A small split ratio coupler is a device that can divide an input signal into two or more optical signals according to a preset ratio. For example, the input optical signal may be processed as per 95:5 or 9:1 or 8: the ratio of 2 is divided into two parts.

An input of the small split ratio coupler 701 is connected to an output of the first splitting structure 100 or an output of the second splitting structure 200, and a smaller split output of the small split ratio coupler 701 is connected to an input of the monitor detector 702. The small split ratio coupler 701 may split the optical signal split by the beam splitter into two parts according to a preset ratio. The 2n small split ratio couplers 701 in the 2n first monitoring structures are respectively connected with n output ends of the first optical splitting structure 100 and n output ends of the second optical splitting structure 200 correspondingly, and are used for respectively monitoring sub-signals of n paths of first optical signals and sub-signals of n paths of second optical signals.

The split smaller proportion of the optical signal may be input to the monitor detector 702 and the split larger proportion of the optical signal may be input to the modulator 300 for modulation. The monitor detector 702 may acquire the optical power of a sub-signal of the first optical signal or a sub-signal of the second optical signal before modulation. By inputting a smaller proportion of the optical signal into the monitor detector 702 for detection, the sub-signal loss for either the first optical signal or the second optical signal prior to modulation can be reduced.

Taking the 4-channel active optical cable photonic integrated chip shown in fig. 7 as an example, the small optical ratio coupler 701 may output the first optical signal from the first output end of the beam splitter 110 according to 95:5, and inputting a part of the first optical signal with the proportion of 5% into the monitoring detector 702, wherein the monitoring detector 702 can determine the optical power value of the first optical signal according to the received first optical signal. A portion of the sub-signal of the first optical signal with a proportion of 95% is input to the modulator 309, and then, of the sub-signals of the first optical signal split at the first output end of the beam splitter 110, 95% of the sub-signals can be transmitted to the device at the subsequent stage.

The optical path structure of the second monitoring structure 800 may be the same as that of the first monitoring structure 700, and also includes a small split ratio coupler and a monitoring detector. And dividing the modulated sub-signal of the first optical signal or the modulated sub-signal of the second optical signal into two parts by using a small optical splitting ratio coupler. The smaller proportion of the optical signals are input into the monitoring detector for monitoring, and the larger proportion of the optical signals are input into the wavelength division multiplexer 400 for transmission. The monitoring detector may acquire the optical power of the sub-signal of the modulated first optical signal or the sub-signal of the second optical signal. By inputting a smaller proportion of the optical signal into the monitoring detector for detection, loss of the modulated first optical signal or second optical signal can be reduced.

In some embodiments of the present disclosure, the transmitting end portion and the receiving end portion of the active optical cable photonic integrated chip may be disposed on the same chip. In some other embodiments, the transmitting end portion and the receiving end portion of the active optical cable photonic integrated chip may also be disposed on two different chips. The active optical cable photonic integrated chip can be arranged on a silicon optical chip.

It will be understood that each embodiment of the above-described systems, methods, etc. in this specification are described in an incremental manner, and the same/similar parts of each embodiment are referred to each other, and each embodiment focuses on a difference from the other embodiments. For relevance, reference should be made to the description of other method embodiments.

In the description of the present specification, reference to the terms "some embodiments," "other embodiments," "desired embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

The above-described embodiments may be arbitrarily combined with each other, and all possible combinations of the features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model, which are within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. A multi-channel active optical cable photon integrated chip is characterized by comprising a substrate layer and a waveguide layer, wherein the waveguide layer is provided with a transmitting end device and a receiving end device,

the transmitting end device comprises:

The receiving-end device includes:

2. The active optical cable photonic integrated chip of claim 1, wherein the active optical cable photonic integrated chip further comprises:

3. The active optical cable photonic integrated chip of claim 2, wherein,

4. An active optical cable photonic integrated chip in accordance with claim 3, wherein the splitters in the optical splitting structure are 3dB splitters, and the first monitoring structure is provided at an input end of each of the 3dB splitters or at one of two output ends thereof connected to the 2n modulators to monitor input optical power of two modulators connected to the 3dB splitter.

5. The active optical cable photonic integrated chip of claim 2, wherein the number of the first monitoring structures is 2n, and the first monitoring structures are respectively arranged between each modulator and the light splitting structure.

6. The active optical cable photonic integrated chip of claim 2, wherein the first monitoring structure and the second monitoring structure each comprise a small split ratio coupler and a monitoring detector, the small split ratio coupler being configured to split a monitoring light of a smaller optical power from the optical path to the monitoring detector to monitor the power of the optical signal transmitted by the optical path.

7. The active optical cable photonic integrated chip of claim 1, wherein each of the wavelength division multiplexing structures comprises a polarization rotating splitter and two wavelength division multiplexers, the polarization rotating splitter splits the composite optical signal received by the corresponding second optical fiber coupling structure into two paths of linearly polarized light and transmits the two paths of linearly polarized light to the two wavelength division multiplexers respectively; the two wavelength division demultiplexers respectively demultiplex the respectively received linear polarized light into two paths of optical signals with different wavelengths, and respectively transmit the optical signals to the two optical detectors connected with the two wavelength division demultiplexers, and the optical signals with the same wavelength output by the two wavelength division demultiplexers are transmitted to the same optical detector.

8. The active optical cable photonic integrated chip of any of claims 1-7, wherein the n first fiber coupling structures are arranged side-by-side as an output fiber array coupling structure and the n second fiber coupling structures are arranged side-by-side as an input fiber array coupling structure;

9. The active optical cable photonic integrated chip of any of claims 1-7, wherein the transmitting end device and the receiving end device are disposed on the same photonic integrated chip or the transmitting end device and the receiving end device are disposed on different photonic integrated chips, respectively.

10. The active optical cable photonic integrated chip of any of claims 1-7, wherein the photonic integrated chip is a silicon-based photonic chip and the modulator is a mach-zehnder modulator.

11. An active optical cable comprising an array of optical fibers and optical modules at each end thereof, each of said optical modules comprising:

the multi-channel active optical cable photonic integrated chip of any of claims 1-9;

12. The active optical cable of claim 11, wherein the fiber array comprises 2n fibers, wherein the n fibers respectively interface n first fiber coupling structures in the optical module at one end thereof with n second fiber coupling structures in the optical module at the other end thereof; in addition, the n optical fibers are respectively butted with n second optical fiber coupling structures in the optical module at one end of the n optical fibers and n first optical fiber coupling structures in the optical module at the other end of the n optical fibers.

13. The active optical cable of claim 12, wherein the optical fiber is a single mode optical fiber, and the first and second optical fiber coupling structures each mode match the single mode optical fiber.