CN219668618U - Constant-heating integrated circuit packaging equipment - Google Patents
Constant-heating integrated circuit packaging equipment Download PDFInfo
- Publication number
- CN219668618U CN219668618U CN202320663067.8U CN202320663067U CN219668618U CN 219668618 U CN219668618 U CN 219668618U CN 202320663067 U CN202320663067 U CN 202320663067U CN 219668618 U CN219668618 U CN 219668618U
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- shell
- bottom end
- electric telescopic
- integrated circuit
- wall
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 239000012785 packaging film Substances 0.000 claims abstract description 32
- 229920006280 packaging film Polymers 0.000 claims abstract description 32
- 238000004804 winding Methods 0.000 claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 238000005538 encapsulation Methods 0.000 claims description 26
- 230000001681 protective effect Effects 0.000 claims description 5
- 239000012528 membrane Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The utility model discloses a constant-heating integrated circuit packaging device, which relates to the technical field of integrated circuit science and comprises a shell and a long groove, wherein the long groove is formed in the bottom end of the inner wall of the shell, a heat sealing mechanism is arranged on the top surface of the inner wall of the shell and is used for heating at constant temperature and packaging a circuit board, a winding mechanism is arranged on the bottom surface of the inner wall of the shell and is used for storing and conveying packaging films. According to the utility model, the shell is contacted with the top end surface of the packaging film when the first electric telescopic rod moves, the packaging film is propped against the surface of the circuit board, the heat conduction pipe is contacted with the packaging film when the first electric telescopic rod moves to the tail end, the packaging film is propped against the concave texture, the heat conduction plate is used for heating and softening the packaging film, and limit textures are engraved on the edge of the softened packaging film, so that the sealing strength between the packaging film can be enhanced.
Description
Technical Field
The utility model relates to the technical field of integrated circuit science, in particular to an integrated circuit packaging device with constant heating.
Background
The packaging machine is a machine for packaging and sealing products, so that the packaging machine is mostly used for sealing various products, and the packaging machine mostly adopts a hot melting process and applies high-pressure impact to achieve the purpose of packaging the target object at a packaging opening, and is generally applied to various large fields.
The packaging machine is generally made of metal and plastic materials, is generally matched with a packaging film, the packaging film is covered on the surface of an article by a machine, and then the packaging film is melted by the high temperature generated by a heat sealing assembly. However, since the integrated circuit packaging apparatus of the prior art generally packages a single object by cooperating with a pipeline, the technology is used in the technical field of integrated circuit packaging, resulting in excessive waste of packaging films and excessive trouble of disassembly when an integrated circuit board is required, resulting in increased production cost.
Disclosure of Invention
The utility model provides an integrated circuit packaging device with constant heating, which has the advantage of simultaneously packaging a plurality of integrated circuits, so as to solve the problems that the integrated circuit packaging device in the prior art is used for packaging a single object through matching with a production line, but the technology is used in the technical field of integrated circuit packaging, so that packaging films are excessively wasted, and the integrated circuit board is excessively troublesome to detach when in use, so that the production cost is increased.
In order to achieve the purpose of packaging a plurality of packages simultaneously, the utility model provides the following technical scheme: the utility model provides an integrated circuit encapsulation equipment of heating constancy, includes shell and elongated slot, the inner wall bottom at the shell is seted up to the elongated slot, the inner wall top surface heat sealing mechanism of shell, heat sealing mechanism is used for constant temperature heating to encapsulate the circuit board, the inner wall bottom surface mounting of shell has a winding mechanism, winding mechanism is used for storing and carrying the encapsulation membrane, the winding is used with heat sealing mechanism cooperation.
As a preferable technical scheme of the utility model, the heat sealing mechanism comprises a pressure component, the pressure component is arranged on the top surface of the shell, the bottom end of the inner wall of the shell is provided with a clamping component, and the clamping component is matched with the pressure component for use.
As a preferable technical scheme of the utility model, the pressure assembly comprises a first electric telescopic rod, the first electric telescopic rod is arranged at the top end of the inner wall of the shell, a limiting ring is arranged on the outer side surface of the first electric telescopic rod, a telescopic spring is arranged on the bottom end surface of the limiting ring, a protective shell is arranged on the bottom end surface of the telescopic spring, a heating plate is arranged on the bottom end surface of the first electric telescopic rod, and a heat conducting plate is arranged on the bottom end surface of the heating plate.
As a preferable technical scheme of the utility model, the clamping assembly comprises a cylinder, the cylinder is arranged on one side surface of the long groove, a first clamping plate is arranged on one side surface of the cylinder and one side surface of the long groove, and concave grains are formed at the bottom end of the inner wall of the shell.
As a preferable technical scheme of the utility model, the winding mechanism comprises a winding assembly, the winding assembly is arranged on the bottom end surface of the shell, the top end of the inner wall of the shell is provided with a film pulling assembly, and the film pulling assembly is matched with the winding assembly for use.
As a preferable technical scheme of the utility model, the winding assembly comprises a mounting plate, wherein the mounting plate is mounted on the bottom end surface of the shell, a mounting column is mounted on one side surface of the mounting plate, and a winding pipe is movably mounted on the outer side surface of the mounting column.
As a preferable technical scheme of the utility model, the film pulling assembly comprises a second electric telescopic rod, the second electric telescopic rod is arranged at the top end of the inner wall of the shell, a long rod is arranged on the bottom end surface of the second electric telescopic rod, a circular ring is arranged on the outer side surface of the long rod, a motor is arranged on one side surface of the circular ring, a second clamping plate is arranged on one side surface of each of the circular ring and the long rod, and the second clamping plate is matched with the first clamping plate for use.
Compared with the prior art, the utility model provides the integrated circuit packaging equipment with constant heating, which has the following beneficial effects:
1. when the integrated circuit packaging equipment with constant heating is needed, the heating plate arranged on the bottom surface of the first electric telescopic rod can emit high temperature and conduct the high temperature emitted by the heating plate to the heat conducting plate arranged on the bottom surface of the first electric telescopic rod, at the moment, the circuit board to be packaged is placed at the bottom end of the inner wall of the shell, the circuit board is pushed forward, the circuit board moves and contacts with the packaging film fixed by the second clamping plate, the packaging film arranged on the outer side surface of the winding tube is pulled when the circuit board moves forward, the packaging film is prolonged when the packaging film is pulled, and contact with the bottom surface of circuit board, when the circuit board moved to the end, first electric telescopic handle can drive the hot plate and remove this moment, the shell can contact with the top surface of encapsulation membrane when first electric telescopic handle removes to support the encapsulation membrane at the surface of circuit board, when first electric telescopic handle moved to the end this moment the heat pipe can contact with encapsulation membrane, and support the encapsulation membrane on sunken texture, at this moment the heat pipe can encapsulate the membrane and heat and soften, and make softened encapsulation membrane edge imprint go up spacing texture, can strengthen the seal strength between encapsulation membrane and the encapsulation membrane.
2. This heating invariable integrated circuit encapsulation equipment, when the encapsulation finishes, the motor can rotate this moment, can drive the ring and rotate when the motor rotates, can drive its one side surface mounting's second splint when the ring is rotatory and remove, at this moment, two second splint can not be fixed the encapsulation membrane, the cylinder starts simultaneously, can drive its one side surface mounting's first splint and remove when the cylinder starts, at this moment the cylinder can drive first splint and remove towards another splint, can realize fixed effect to the encapsulation membrane between two first splint, at this moment take out the circuit board that finishes to encapsulate, realize the effect to the circuit board encapsulation, when taking out, at this moment the second electric telescopic handle can move to in the elongated slot, and at this moment the second splint can contact with first splint, at this moment the motor starts, can drive the second splint and carry out the adjustment of angle when the motor starts, at this moment the protection membrane that first splint was cliied is held and is fixed, at this moment after the second splint is fixed, the cylinder can reset, and drive first splint and can not be fixed the encapsulation membrane to the encapsulation membrane, the second electric telescopic handle can be in the state when the second telescopic handle, when the second telescopic handle is in the encapsulation membrane again. .
Drawings
FIG. 1 is a schematic view of the external structure of the present utility model;
FIG. 2 is a schematic view of another angular outer structure of the present utility model;
FIG. 3 is a schematic diagram of the internal structure of the present utility model.
In the figure: 1. a housing; 2. a long groove; 3. a first electric telescopic rod; 4. a limiting ring; 5. a telescopic spring; 6. a protective shell; 7. a heating plate; 8. a heat conductive plate; 9. a cylinder; 10. a first clamping plate; 11. concave lines; 12. a mounting plate; 13. a mounting column; 14. a winding pipe; 15. a second electric telescopic rod; 16. a long rod; 17. a circular ring; 18. a motor; 19. and a second clamping plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the utility model discloses an integrated circuit packaging device with constant heating, which comprises a shell 1 and a long groove 2, wherein the long groove 2 is arranged at the bottom end of the inner wall of the shell 1, a heat sealing mechanism is arranged at the top end surface of the inner wall of the shell 1 and is used for heating at constant temperature and packaging a circuit board, a winding mechanism is arranged at the bottom end surface of the inner wall of the shell 1 and is used for storing and conveying packaging films, and the winding mechanism is matched with the heat sealing mechanism for use.
Specifically, the heat-seal mechanism comprises a pressure component, the pressure component is arranged on the top surface of the shell 1, the bottom end of the inner wall of the shell 1 is provided with a clamping component, and the clamping component is matched with the pressure component for use.
Further, the pressure component includes first electric telescopic handle 3, first electric telescopic handle 3 installs on the inner wall top of shell 1, the outside surface mounting of first electric telescopic handle 3 has spacing ring 4, the bottom surface mounting of spacing ring 4 has telescopic spring 5, telescopic spring 5's bottom surface mounting has protective housing 6, first electric telescopic handle 3's bottom surface mounting has hot plate 7, hot plate 7's bottom surface mounting has hot plate 8, when the invariable integrated circuit packaging equipment of needs use heating, first electric telescopic handle 3 bottom surface mounting's hot plate 7 can send the high temperature, and conduct its high temperature that sends to its bottom surface mounting's hot plate 8, at this moment place the circuit board that needs the encapsulation in shell 1's inner wall bottom.
Further, the clamping assembly comprises an air cylinder 9, the air cylinder 9 is arranged on one side surface of the long groove 2, a first clamping plate 10 is arranged on one side surface of the air cylinder 9 and one side surface of the long groove 2, and concave grains 11 are formed in the bottom end of the inner wall of the shell 1.
Further, the winding mechanism comprises a winding component, the winding component is arranged on the bottom end surface of the shell 1, the top end of the inner wall of the shell 1 is provided with a film pulling component, and the film pulling component is matched with the winding component.
Further, the winding assembly comprises a mounting plate 12, wherein the mounting plate 12 is mounted on the bottom end surface of the shell 1, a mounting column 13 is mounted on one side surface of the mounting plate 12, and a winding tube 14 is movably mounted on the outer side surface of the mounting column 13.
Further, the film pulling component comprises a second electric telescopic rod 15, the second electric telescopic rod 15 is installed at the top end of the inner wall of the shell 1, a long rod 16 is installed on the bottom end surface of the second electric telescopic rod 15, a circular ring 17 is installed on the outer side surface of the long rod 16, a motor 18 is installed on one side surface of the circular ring 17, a second clamping plate 19 is installed on one side surface of the circular ring 17 and one side surface of the long rod 16, the second clamping plate 19 is matched with the first clamping plate 10, the second electric telescopic rod 15 moves into the long groove 2, at the moment, the second clamping plate 19 is contacted with the first clamping plate 10, at the moment, the motor 18 is started, the second clamping plate 19 is driven to conduct angle adjustment when the motor 18 is started, at the moment, the second clamping plate 19 clamps and fixes the protective film clamped by the first clamping plate 10, at the moment, the cylinder 9 is reset and drives the first clamping plate 10 to reset, at the moment, the first clamping plate 10 is not fixed on the packaging film, at the moment, the second electric telescopic rod 15 is reset, the second clamping plate 15 is contacted with the first clamping plate 10, at the moment, the second clamping plate 3 is reset, the packaging film is pulled again, and the packaging film is packaged when the first electric telescopic rod is reset.
The working principle and the using flow of the utility model are as follows: when the integrated circuit packaging equipment with constant heating is needed, the heating plate 7 arranged on the bottom end surface of the first electric telescopic rod 3 can emit high temperature, the emitted high temperature is conducted to the heat conducting plate 8 arranged on the bottom end surface of the first electric telescopic rod, at the moment, the circuit board to be packaged is placed at the bottom end of the inner wall of the shell 1 and pushed forward, when the circuit board moves, the packaging film fixed with the second clamping plate 19 is contacted with each other, when the circuit board moves forward, the packaging film arranged on the outer side of the winding pipe 14 is pulled, when the packaging film is pulled, the packaging film can be prolonged and contacted with the bottom end surface of the circuit board, when the circuit board moves to the tail end, the first electric telescopic rod 3 can drive the heating plate 7 to move, when the first electric telescopic rod 3 moves, the shell 1 can be contacted with the top end surface of the packaging film, the packaging film is abutted against the surface of the circuit board, when the first electric telescopic rod 3 moves to the tail end, the heat conducting pipe can be contacted with the packaging film, the packaging film is abutted against the concave grain 11, at the moment, the heat conducting plate 8 can soften the packaging film, the softened packaging film can strengthen the sealing strength between the sealing grain and the sealing grain.
When encapsulation is finished, the motor 18 can rotate at this moment, can drive ring 17 and rotate when motor 18 rotates, can drive its one side surface mounting's second splint 19 when ring 17 rotates and remove, at this moment, two second splint 19 can not be fixed the encapsulation membrane, cylinder 9 starts simultaneously, can drive its one side surface mounting's first splint 10 and remove when cylinder 9 starts, at this moment cylinder 9 can drive first splint 10 and move to another splint, can realize fixed effect to the encapsulation membrane between two first splint 10, at this moment take out the circuit board that will encapsulate completely, realize the effect to the encapsulation of circuit board, when taking out, at this moment, second electric telescopic handle 15 can move to in the elongated slot 2, and at this moment second splint 19 can contact with first splint 10, at this moment motor 18 starts, can drive second splint 19 and carry out the adjustment of angle when motor 18 starts, at this moment, cylinder 9 can reset after second splint 9 is fixed to another splint, and drive first splint 10 and reset the first telescopic handle the encapsulation membrane can be carried out to the encapsulation membrane after the first splint 10, at this moment reset handle the first telescopic handle 15, can be in the state when the first telescopic handle is reset membrane is fixed to the first clamp 10, at this moment, when the second telescopic handle is reset membrane is reset to the second telescopic handle is fixed to the first 3, when the encapsulation membrane is in the state.
It should be noted that in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a heating invariable integrated circuit encapsulation equipment, includes shell (1) and elongated slot (2), elongated slot (2) are seted up in the inner wall bottom of shell (1), its characterized in that: the packaging machine comprises a shell (1), and is characterized in that the heat sealing mechanism is used for heating at constant temperature and packaging a circuit board, a winding mechanism is mounted on the surface of the bottom end of the inner wall of the shell (1), and the winding mechanism is used for storing and conveying packaging films.
2. A constant heating integrated circuit package apparatus according to claim 1, wherein: the heat sealing mechanism comprises a pressure component, the pressure component is arranged on the top surface of the shell (1), the bottom end of the inner wall of the shell (1) is provided with a clamping component, and the clamping component is matched with the pressure component for use to fix the circuit board.
3. A constant heating integrated circuit package apparatus according to claim 2, wherein: the pressure assembly comprises a first electric telescopic rod (3), the first electric telescopic rod (3) is arranged at the top end of the inner wall of the shell (1), a limiting ring (4) is arranged on the outer side surface of the first electric telescopic rod (3), a telescopic spring (5) is arranged on the bottom end surface of the limiting ring (4), a protective shell (6) is arranged on the bottom end surface of the telescopic spring (5), a heating plate (7) is arranged on the bottom end surface of the first electric telescopic rod (3), and a heat conducting plate (8) is arranged on the bottom end surface of the heating plate (7).
4. A constant heating integrated circuit package apparatus according to claim 2, wherein: the clamping assembly comprises an air cylinder (9), the air cylinder (9) is arranged on one side surface of the long groove (2), a first clamping plate (10) is arranged on one side surface of the air cylinder (9) and one side surface of the long groove (2), and concave grains (11) are formed in the bottom end of the inner wall of the shell (1).
5. A constant heating integrated circuit package apparatus according to claim 1, wherein: the winding mechanism comprises a winding assembly, the winding assembly is arranged on the bottom end surface of the shell (1), the top end of the inner wall of the shell (1) is provided with a film pulling assembly, and the film pulling assembly is matched with the winding assembly for use.
6. A constant heating integrated circuit package apparatus according to claim 5, wherein: the winding assembly comprises a mounting plate (12), wherein the mounting plate (12) is mounted on the bottom end surface of the shell (1), a mounting column (13) is mounted on one side surface of the mounting plate (12), and a winding pipe (14) is movably mounted on the outer side surface of the mounting column (13).
7. A constant heating integrated circuit package apparatus according to claim 5, wherein: the film pulling assembly comprises a second electric telescopic rod (15), the second electric telescopic rod (15) is arranged at the top end of the inner wall of the shell (1), a long rod (16) is arranged on the bottom end surface of the second electric telescopic rod (15), a circular ring (17) is arranged on the outer side surface of the long rod (16), a motor (18) is arranged on one side surface of the circular ring (17), a second clamping plate (19) is arranged on one side surface of the circular ring (17) and one side surface of the long rod (16), and the second clamping plate (19) is matched with the first clamping plate (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320663067.8U CN219668618U (en) | 2023-03-30 | 2023-03-30 | Constant-heating integrated circuit packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320663067.8U CN219668618U (en) | 2023-03-30 | 2023-03-30 | Constant-heating integrated circuit packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219668618U true CN219668618U (en) | 2023-09-12 |
Family
ID=87896700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320663067.8U Active CN219668618U (en) | 2023-03-30 | 2023-03-30 | Constant-heating integrated circuit packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219668618U (en) |
-
2023
- 2023-03-30 CN CN202320663067.8U patent/CN219668618U/en active Active
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