CN219660274U

CN219660274U - Heat radiation structure of power module and power module

Info

Publication number: CN219660274U
Application number: CN202320957806.4U
Authority: CN
Inventors: 李红娟; 徐舒舒; 孙纬; 孙德明
Original assignee: Leihuo Electronic Technology Shanghai Co ltd
Current assignee: Leihuo Electronic Technology Shanghai Co ltd
Priority date: 2023-04-25
Filing date: 2023-04-25
Publication date: 2023-09-08
Anticipated expiration: 2033-04-25

Abstract

The utility model discloses a heat radiation structure of a power module and the power module in the technical field of semiconductors, which comprises a power module shell, wherein clamping grooves are formed below the outer walls of two sides of the power module shell, a power circuit board is arranged in the power module shell, and the power module is reasonable in structure.

Description

Heat radiation structure of power module and power module

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a heat dissipation structure of a power module and the power module.

Background

The power module is a power supply which can be directly mounted on a printed circuit board and is characterized in that the power module can provide power for an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a microprocessor, a memory, a Field Programmable Gate Array (FPGA) and other digital or analog loads. Generally, such modules are referred to as load (POL) power supply systems or point-of-use power supply systems (PUPS). Because of the great advantages of the modular structure, the modular power supply is widely used in the communication fields of switching equipment, access equipment, mobile communication, microwave communication, optical transmission, routers and the like, and in automotive electronics, aerospace and the like.

The defects of the heat radiation structure of the existing power supply module and the power supply module are as follows: when the power module is used for a part for power supply, the longer the power module is in the power supply treatment process, the larger the generated heat is, so that the power module is easy to operate in a high-temperature state, the different temperatures are born by the power module, the different operating states are different, and meanwhile, the power module in the high-temperature state is easy to fail, so that the durability of the power module is reduced, and the use effect of the power module is also affected.

It is therefore necessary to develop a heat dissipation structure of a power module and a power module.

Disclosure of Invention

The utility model aims to provide a heat radiation structure of a power module and the power module, wherein two groups of heat radiation mechanisms are respectively arranged at two sides of the inside of a power module shell, a power circuit board is arranged between the two groups of heat radiation mechanisms, the heat radiation mechanisms are used for mounting and radiating effects, and a plurality of ventilation grooves on the power module shell are matched, so that heat generated by the power circuit board in the use process can be timely discharged by the heat radiation mechanisms and the ventilation grooves, the situation that the heat generated by the power circuit board is too high to cause damage or failure is avoided, the heat radiation treatment of the power module is effectively realized, the durability and the use effect of the power module are also effectively improved, and the problem that the power module is difficult to radiate and is easy to damage or failure is solved in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a heat radiation structure of power module, includes the power module casing, the draw-in groove has all been seted up to power module casing's both sides outer wall below, the internally mounted of power module casing has the power circuit board, mounting hole A has all been seted up to power circuit board's surface both sides, the top cap is installed at power module casing's top, all install heat radiation mechanism on the both sides inner wall of power module casing;

the heat dissipation mechanism comprises two groups of installation seats, and the two groups of installation seats are respectively installed on the inner walls of the two sides of the power module shell.

Preferably, the fixed plates are arranged below the outer walls of the two sides of the power module shell, and the center positions of the surfaces of the outer walls of the two sides of the power module shell are provided with ventilation grooves.

Preferably, elastic pieces are arranged on the inner walls of the two sides of the top cover, a clamping block is arranged below the outer wall of one side of the elastic piece, and the outer wall of the clamping block is in sliding connection with the inner wall of the clamping groove.

Preferably, the placing plate is installed at the center of the outer wall of one side of the mounting seat, the mounting hole B is formed in the center of the surface of the placing plate, and the radiating holes are formed in the upper portion and the lower portion of the outer wall of one side of the mounting seat.

Preferably, the heat dissipation holes are formed in the outer wall of the other side of the mounting seat, a U-shaped seat is arranged at the center of the bottom end inside the mounting seat, and a slot is formed in the center of the upper surface of the mounting seat.

Preferably, a filter plate is installed in the slot, the outer wall of the filter plate is in sliding connection with the inner wall of the slot, and a pull plate is installed at the top of the filter plate.

A power module comprises the heat dissipation structure of the power module.

Compared with the prior art, the utility model has the beneficial effects that:

through being equipped with cooling mechanism, install the inside both sides at power module casing respectively with two sets of cooling mechanism to place power circuit board between two sets of cooling mechanism, utilize cooling mechanism to have installation and radiating effect, a plurality of ventilation slots on the cooperation power module casing make power circuit board in the use, produced heat can carry out timely emission processing by cooling mechanism and ventilation slot to the heat in the power module casing, so that the condition that the too high heat that produces of power circuit board leads to damaging or trouble takes place, the effectual realization carries out the heat dissipation to power module and handles, also the effectual durability and the result of use that improves power module.

Drawings

FIG. 1 is a front cross-sectional view of the present utility model;

FIG. 2 is a front view of the present utility model;

FIG. 3 is a front cross-sectional view of a heat dissipating mechanism according to the present utility model;

FIG. 4 is a perspective view of a power module housing structure provided by the present utility model;

fig. 5 is a perspective view of a part of a heat dissipation mechanism according to the present utility model.

In the figure: 1. a power module housing; 101. a clamping groove; 102. a fixing plate; 103. a ventilation groove; 2. a power circuit board; 201. a mounting hole A; 3. a top cover; 301. an elastic sheet; 302. a clamping block; 4. a heat dissipation mechanism; 401. a mounting base; 402. placing a plate; 403. a mounting hole B; 404. a heat radiation port; 405. a heat radiation hole; 406. a U-shaped seat; 407. a slot; 408. a filter plate; 409. pulling the plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides the following technical scheme: the utility model provides a heat radiation structure of power module, can be effectual in the use has the radiating effect to the power module setting, increased cooling mechanism 4, please refer to fig. 1-5, including power module casing 1, draw-in groove 101 has all been seted up to power module casing 1's both sides outer wall below, fixed plate 102 is all installed to power module casing 1's both sides outer wall below, ventilation groove 103 has all been seted up to power module casing 1's both sides outer wall surface central point, set up a plurality of ventilation grooves 103 on the both sides outer wall of power module casing 1, make ventilation groove 103 keep power module casing 1 inside in ventilation state, power module casing 1's internally mounted has power circuit board 2, power circuit board 2's surface both sides all have seted up mounting hole A201, top cap 3 is installed at power module casing 1's top, the elastic sheets 301 are arranged on the inner walls of the two sides of the top cover 3, the clamping blocks 302 are arranged below the outer walls of one side of the elastic sheets 301, the outer walls of the clamping blocks 302 are in sliding connection with the inner walls of the clamping grooves 101, four groups of the elastic sheets 301 are uniformly distributed and arranged on the inner walls of the two sides of the top cover 3, the clamping blocks 302 are arranged below the outer walls of one side of the elastic sheets 301, the elastic sheets 301 have the effect of elastically deforming and rebounding, when the top cover 3 is covered above the power module shell 1, the clamping blocks 302 are limited by the inner walls of the power module shell 1, the elastic sheets 301 are in a deformation state, when the clamping blocks 302 are arranged at the clamping grooves 101 on the power module shell 1, the elastic sheets 301 in the deformation state push the clamping blocks 302 to be clamped into the clamping grooves 101, so that the top cover 3 can be installed and fixed, the clamping blocks 302 are separated from the clamping grooves 101, and the top cover 3 can be disassembled, the inner walls of the two sides of the power module shell 1 are provided with heat dissipation mechanisms 4;

the heat dissipation mechanism 4 comprises a mounting seat 401, wherein the two groups of mounting seats 401 are respectively arranged on the inner walls of the two sides of the power module shell 1, a placing plate 402 is arranged at the center position of the outer wall of one side of the mounting seat 401, a mounting hole B403 is arranged at the center position of the surface of the placing plate 402, the surface of the placing plate 402 on the outer wall of one side of the mounting seat 401 is provided with the mounting hole B403, the power circuit board 2 is placed on the placing plate 402, the mounting holes A201 and the mounting holes B403 are penetrated in a threaded connection manner by fastening bolts, the mounting and fixing of the power circuit board 2 can be achieved, the upper part and the lower part of the outer wall of one side of the mounting seat 401 are provided with heat dissipation holes 404, the outer wall of the other side of the mounting seat 401 is provided with heat dissipation holes 405, the outer wall of one side of the mounting seat 401 is uniformly distributed with the two heat dissipation holes 404, the outer wall of the other side of the mounting seat 401 is provided with a plurality of heat dissipation holes 405, the heat generated in the subsequent use process of the power circuit board 2 can be effectively discharged and radiated by the radiating opening 404, the radiating hole 405 and the ventilation groove 103, the U-shaped seat 406 is arranged at the central position of the inner bottom end of the mounting seat 401, the slot 407 is arranged at the central position of the upper surface of the mounting seat 401, the filter plate 408 is arranged in the slot 407, the outer wall of the filter plate 408 is in sliding connection with the inner wall of the slot 407, the pull plate 409 is arranged at the top of the filter plate 408, the filter plate 408 is inserted into the slot 407 on the mounting seat 401 in a sliding manner, and reaches the inside of the U-shaped seat 406, so that the filter plate 408 is mounted, dust particles in filtered air can be utilized to effectively prevent dust from entering the inside of the power module shell 1, static electricity is caused to the power circuit board 2, damage is caused to electronic elements, and the stability is also influenced, the service life is reduced, and the heat generated by the power circuit board 2 in the power module shell 1 is timely discharged, so that the damage or failure caused by the overhigh heat generated by the power circuit board 2 is avoided.

A power module comprises the heat dissipation structure of the power module.

Working principle: when the utility model is used, the outer walls of the two sides of the power module shell 1 are provided with a plurality of ventilation grooves 103, the ventilation grooves 103 keep the inside of the power module shell 1 in a ventilation state, four groups of elastic sheets 301 are uniformly distributed and arranged on the inner walls of the two sides of the top cover 3, a clamping block 302 is arranged below the outer wall of one side of the elastic sheets 301, the elastic sheets 301 have the effect of elastically deforming and rebounding, when the top cover 3 is covered above the power module shell 1, the clamping block 302 is limited by the inner wall of the power module shell 1, the extrusion phenomenon is generated, the elastic sheets 301 are in a deformation state, when the clamping block 302 is arranged at the clamping groove 101 on the power module shell 1, the elastic sheets 301 in the deformation state push the clamping block 302 to be clamped into the clamping groove 101, so that the top cover 3 can be installed and fixed, and the clamping block 302 is separated from the clamping groove 101, so that the top cover 3 can be disassembled, the power circuit board 2 is placed on the placing plate 402 by correspondingly arranging two groups of mounting seats 401 on the heat dissipation mechanism 4 on the inner walls of the two sides of the power module shell 1, arranging mounting holes B403 on the surface of the placing plate 402 on the outer wall of one side of the mounting seat 401, arranging a U-shaped seat 406 in the mounting seat 401, inserting a filter plate 408 into a slot 407 on the mounting seat 401 in a sliding manner to reach the inside of the U-shaped seat 406 by arranging the U-shaped seat 406 in the mounting seat 401, thereby reach and install the processing to filter 408, but through utilizing the dust particulate matter in the filterable air of filter 408, the effectual dust that avoids gets into the inside of power module casing 1, and cause static and damage to electronic component to power circuit board 2, also influence its stability, life all the circumstances that decline take place, in time discharge the processing through the heat to the power circuit board 2 that produces in the power module casing 1, so that the condition that the heat that the power circuit board 2 produced is too high and lead to damaging or trouble takes place, the effectual realization carries out the heat dissipation to power module and handles, also the effectual durability and the result of use that improves power module.

Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner so long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of brevity and resource saving. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. The utility model provides a heat radiation structure of power module, includes power module casing (1), draw-in groove (101) have all been seted up to power module casing (1) both sides outer wall below, power module casing (1) internally mounted has power circuit board (2), mounting hole A (201) have all been seted up to power circuit board (2) surface both sides, top cap (3) are installed at power module casing (1) top, its characterized in that: the inner walls of the two sides of the power module shell (1) are provided with heat dissipation mechanisms (4);

the heat dissipation mechanism (4) comprises two mounting seats (401), wherein the two groups of the mounting seats (401) are respectively arranged on the inner walls of the two sides of the power module shell (1).

2. The heat dissipation structure of a power module of claim 1, wherein: the power module is characterized in that fixing plates (102) are arranged below the outer walls of the two sides of the power module shell (1), and ventilation grooves (103) are formed in the center positions of the surfaces of the outer walls of the two sides of the power module shell (1).

3. The heat dissipation structure of a power module of claim 1, wherein: elastic pieces (301) are arranged on the inner walls of the two sides of the top cover (3), clamping blocks (302) are arranged below the outer walls of one side of the elastic pieces (301), and the outer walls of the clamping blocks (302) are in sliding connection with the inner walls of the clamping grooves (101).

4. The heat dissipation structure of a power module of claim 1, wherein: the mounting seat is characterized in that a placing plate (402) is arranged at the center position of one side outer wall of the mounting seat (401), a mounting hole B (403) is formed in the center position of the surface of the placing plate (402), and heat dissipation openings (404) are formed in the upper portion and the lower portion of one side outer wall of the mounting seat (401).

5. The heat dissipation structure of a power module of claim 1, wherein: the heat dissipation holes (405) are formed in the outer wall of the other side of the mounting seat (401), a U-shaped seat (406) is arranged at the center position of the inner bottom end of the mounting seat (401), and a slot (407) is formed in the center position of the upper surface of the mounting seat (401).

6. The heat dissipation structure of a power module of claim 5, wherein: the inside of slot (407) is installed filter (408), the outer wall of filter (408) and the inner wall sliding connection of slot (407), arm-tie (409) are installed at the top of filter (408).

7. A power module, characterized by: a heat dissipation structure comprising a power module as recited in any one of claims 1-6.