CN219660187U

CN219660187U - Bluetooth headset charges circuit board for storehouse

Info

Publication number: CN219660187U
Application number: CN202320425764.XU
Authority: CN
Inventors: 冯建明; 冯涛; 李后清; 蔡明祥; 戴莹琰; 王敦猛
Original assignee: Kunshan Hua Tao Electronic Co ltd
Current assignee: Kunshan Hua Tao Electronic Co ltd
Priority date: 2023-03-07
Filing date: 2023-03-07
Publication date: 2023-09-08
Anticipated expiration: 2033-03-07

Abstract

The utility model discloses a circuit board for a Bluetooth headset charging bin, and relates to the technical field of Bluetooth headset charging bins. The circuit board for the Bluetooth headset charging bin comprises an upper substrate, wherein a lower substrate is arranged below the upper substrate, the upper surface of the upper substrate and the upper surface of the lower substrate are of planar structures, an upper circuit is arranged on the upper substrate, a lower circuit is arranged on the lower substrate, and heat dissipation assemblies are arranged on the surfaces of the upper substrate and the lower substrate. The utility model has simple operation and convenient use, and the heat conducting silica gel and the heat radiating holes are arranged on the same vertical line and used for radiating the heat in the upper substrate and the lower substrate through the cooperation of the upper U-shaped convex block, the upper U-shaped groove, the lower substrate, the lower U-shaped convex block, the lower U-shaped groove, the first conduction mechanism and the second conduction mechanism, and the operation is simple and convenient, so that the rejection rate is reduced, the printing difficulty is reduced, the printing qualification rate is improved, the short circuit phenomenon is prevented, certain potential safety hazard is avoided, and the heat conducting silica gel and the heat radiating holes are arranged on the same vertical line.

Description

Bluetooth headset charges circuit board for storehouse

Technical Field

The utility model relates to the technical field of Bluetooth headset charging bins, in particular to a circuit board for a Bluetooth headset charging bin.

Background

Since most of the existing electronic products are developed toward high density, miniaturization and high reliability, it is important to reduce the volume and weight of the electronic products as much as possible.

However, the existing printed circuit boards have some defects in structural design, so that the distribution among a plurality of printed circuits is very compact for pursuing the high density and miniaturization of the printed circuit boards, the printing process is very difficult, the printing rejection rate is higher, the short circuit phenomenon is easy to occur once the printed circuit boards are put into use after being unqualified, and a certain potential safety hazard problem exists.

Based on this, a bluetooth headset charges circuit board for storehouse is proposed.

Disclosure of Invention

The utility model aims to provide a circuit board for a Bluetooth headset charging bin, which aims to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a bluetooth headset charges circuit board for storehouse, includes the upper base plate, the below of upper base plate is provided with the lower base plate, and the upper surface of upper base plate and the upper surface of lower base plate are planar structure, are provided with the upper circuit on the upper base plate, are provided with the lower circuit on the lower base plate, and the surface of upper base plate and lower base plate all is provided with radiating component.

Preferably, the upper substrate comprises an upper U-shaped lug and an upper U-shaped groove, the upper U-shaped groove is formed in the upper substrate, and the upper U-shaped lug is fixedly connected to the bottom of the upper substrate.

Preferably, the upper U-shaped grooves are formed by a plurality of groups and are arranged at intervals one by one in sequence, the upper U-shaped convex blocks are formed by a plurality of groups and are arranged at intervals one by one in sequence, and the upper substrate forms a curved surface structure through the upper U-shaped convex blocks and the upper U-shaped grooves.

Preferably, the lower substrate comprises a lower U-shaped lug and a lower U-shaped groove, the top of the lower substrate is fixedly connected with the lower U-shaped lug, and the lower substrate is provided with the lower U-shaped groove.

Preferably, the lower U-shaped protruding blocks are a plurality of groups and are arranged at intervals one by one in sequence, the lower U-shaped grooves are a plurality of groups and are arranged at intervals one by one in sequence, the lower substrate forms a curved surface structure through the lower U-shaped protruding blocks and the lower U-shaped grooves, the upper U-shaped protruding blocks and the lower U-shaped protruding blocks are in one-to-one correspondence and are in clamping connection, and the installation is convenient.

Preferably, the first conducting mechanism connected with the upper circuit is arranged at the joint of the upper U-shaped groove and the lower U-shaped convex block, the first conducting mechanism and the upper circuit are vertically distributed, the second conducting mechanism connected with the lower circuit is arranged at the joint of the upper U-shaped convex block and the lower U-shaped groove, and the second conducting mechanism and the lower circuit are vertically distributed, so that the connection tightness is ensured.

Preferably, the heat dissipation assembly comprises heat dissipation holes and heat conduction silica gel, the heat dissipation holes are formed in the surfaces of the upper substrate and the lower substrate, the heat dissipation holes are formed in multiple groups, the heat dissipation holes are provided with the heat conduction silica gel, and the heat conduction silica gel and the heat dissipation holes are arranged on the same vertical line and used for dissipating heat of the circuit board.

Compared with the prior art, the utility model has the beneficial effects that:

this bluetooth headset charges circuit board for storehouse, through last U-shaped lug, go up U-shaped recess, lower base plate, lower U-shaped lug, lower U-shaped recess, first conduction mechanism and second conduction mechanism's cooperation is used, easy operation is convenient, has reduced the disability rate, has reduced the degree of difficulty of printing, has improved the qualification rate of printing, prevents to appear the short circuit phenomenon, avoids having certain potential safety hazard, heat conduction silica gel and louvre on same perpendicular line for give off the inside heat of upper base plate and lower base plate.

Drawings

FIG. 1 is a schematic view of the structure of an upper substrate and a lower substrate in the present utility model;

FIG. 2 is a schematic front view of the present utility model;

FIG. 3 is an enlarged schematic view of portion A of the present utility model;

fig. 4 is an enlarged schematic view of the portion B in the present utility model.

In the figure: the heat conduction device comprises an upper substrate 1, an upper U-shaped lug 101, an upper U-shaped groove 102, a lower substrate 2, a lower U-shaped lug 201, a lower U-shaped groove 202, a first conduction mechanism 3, a second conduction mechanism 4, a heat dissipation component 5, a heat dissipation hole 501 and heat conduction silica gel 502.

Detailed Description

Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, greater than, less than, exceeding, etc. are understood to exclude this number, and above, below, within, etc. are understood to include this number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a bluetooth headset charges storehouse and uses circuit board, including upper base plate 1, upper base plate 1 includes U-shaped lug 101 and upper U-shaped recess 102, upper U-shaped recess 102 has been seted up on the upper base plate 1, upper U-shaped recess 102 is a plurality of groups and interval sets gradually one by one, upper base plate 1's bottom fixedly connected with upper U-shaped lug 101, upper U-shaped lug 101 is a plurality of groups and interval sets gradually one by one, upper base plate 1 constitutes curved surface structure through upper U-shaped lug 101 and upper U-shaped recess 102, upper base plate 1's below is provided with lower base plate 2, lower base plate 2 includes lower U-shaped lug 201 and lower U-shaped recess 202, the top fixedly connected with of lower base plate 2 has lower U-shaped lug 201, lower U-shaped lug 201 is a plurality of groups and interval sets gradually one by one, lower U-shaped recess 202 has been seted up on the lower base plate 2, lower U-shaped recess 202 is a plurality of groups and interval sets gradually one by one, lower base plate 2 passes through lower U-shaped lug 201 and lower U-shaped recess 202 constitutes curved surface structure, upper U-shaped recess 102 and lower U-shaped lug 201 correspond one, and for the card connection setting, upper U-shaped lug 101 and lower U-shaped recess 202 correspond one, the rate of falling down is reduced in the rate of the U-shaped lug, the upper base plate 2 has been realized, the upper base plate 2 has been reduced the rate of the side, and the U-shaped lug has been reduced the rate of the side has been reduced, and the side has been printed, the rate has been reduced, and the side has been reduced the rate has been reduced, and the rate of the side has been printed and has been easy to be easy.

The upper substrate 1 is provided with an upper circuit, the lower substrate 2 is provided with a lower circuit, the joint of the upper U-shaped groove 102 and the lower U-shaped convex block 201 is provided with a first conducting mechanism 3 connected with the upper circuit, and the first conducting mechanism 3 and the upper circuit are vertically distributed, so that the compactness of connection use is improved.

The joint of the upper U-shaped convex block 101 and the lower U-shaped groove 202 is provided with a second conduction mechanism 4 connected with a lower circuit, and the second conduction mechanism 4 and the lower circuit are vertically distributed, so that the compactness of connection use is improved.

The surface of the upper substrate 1 and the surface of the lower substrate 2 are provided with heat dissipation components 5, the heat dissipation components 5 comprise heat dissipation holes 501 and heat conduction silica gel 502, the surfaces of the upper substrate 1 and the lower substrate 2 are provided with heat dissipation holes 501, the heat dissipation holes 501 are arranged in a plurality of groups, the heat conduction silica gel 502 is arranged on the heat dissipation holes 501, and the heat conduction silica gel 502 and the heat dissipation holes 501 are arranged on the same vertical line and are used for dissipating heat inside the upper substrate 1 and the lower substrate 2.

Working principle: when the upper substrate 1 and the lower substrate 2 are used, the upper U-shaped groove 102, the lower U-shaped convex block 201, the upper U-shaped convex block 101 and the lower U-shaped groove 202 can be mutually spliced as long as the upper U-shaped groove 102, the lower U-shaped convex block 101 and the lower U-shaped groove 202 are clamped and installed, the operation is simple and convenient, the rejection rate is reduced, the printing difficulty is reduced, the printing qualification rate is improved, the occurrence of a short circuit phenomenon is prevented, and a certain potential safety hazard is avoided.

Claims

1. The utility model provides a bluetooth headset charge storehouse and use circuit board, includes upper substrate (1), its characterized in that: the upper circuit is arranged on the upper substrate (1), the lower circuit is arranged on the lower substrate (2), and heat dissipation assemblies (5) are arranged on the surfaces of the upper substrate (1) and the lower substrate (2).

2. The circuit board for a charging bin of a bluetooth headset according to claim 1, wherein: the upper substrate (1) comprises an upper U-shaped protruding block (101) and an upper U-shaped groove (102), the upper U-shaped groove (102) is formed in the upper substrate (1), and the upper U-shaped protruding block (101) is fixedly connected to the bottom of the upper substrate (1).

3. The circuit board for a charging bin of a bluetooth headset according to claim 2, wherein: the upper U-shaped grooves (102) are formed by a plurality of groups of upper U-shaped protruding blocks (101) at intervals in sequence, and the upper substrate (1) forms a curved surface structure through the upper U-shaped protruding blocks (101) and the upper U-shaped grooves (102).

4. The circuit board for a charging bin of a bluetooth headset according to claim 1, wherein: the lower substrate (2) comprises a lower U-shaped lug (201) and a lower U-shaped groove (202), the lower U-shaped lug (201) is fixedly connected to the top of the lower substrate (2), and the lower U-shaped groove (202) is formed in the lower substrate (2).

5. The circuit board for a charging bin of a bluetooth headset according to claim 4, wherein: the lower U-shaped convex blocks (201) are arranged at intervals in sequence in a plurality of groups, the lower U-shaped grooves (202) are arranged at intervals in sequence in a plurality of groups, the lower substrate (2) forms a curved surface structure through the lower U-shaped convex blocks (201) and the lower U-shaped grooves (202), the upper U-shaped grooves (102) and the lower U-shaped convex blocks (201) are in one-to-one correspondence and are in clamping connection, and the upper U-shaped convex blocks (101) and the lower U-shaped concave blocks (202) are in one-to-one correspondence and are in clamping connection.

6. The circuit board for a charging bin of a bluetooth headset according to claim 5, wherein: the circuit is characterized in that a first conducting mechanism (3) connected with an upper circuit is arranged at the joint of the upper U-shaped groove (102) and the lower U-shaped convex block (201), the first conducting mechanism (3) and the upper circuit are vertically distributed, a second conducting mechanism (4) connected with the lower circuit is arranged at the joint of the upper U-shaped convex block (101) and the lower U-shaped groove (202), and the second conducting mechanism (4) and the lower circuit are vertically distributed.

7. The circuit board for a charging bin of a bluetooth headset according to claim 1, wherein: the heat dissipation assembly (5) comprises heat dissipation holes (501) and heat conduction silica gel (502), the surfaces of the upper substrate (1) and the lower substrate (2) are provided with the heat dissipation holes (501), the heat dissipation holes (501) are arranged in multiple groups, the heat conduction silica gel (502) is arranged on the heat dissipation holes (501), and the heat conduction silica gel (502) and the heat dissipation holes (501) are on the same vertical line.