CN219658724U - Chip source placement structure and system for chip diffusion - Google Patents

Abstract

The disclosure provides a chip source placement structure and a chip source placement system for chip diffusion, and belongs to the technical field of chip diffusion equipment. The chip diffusion chip source placing structure is provided with a supporting surface and a diffusion inclined surface; the supporting surface and the diffusion inclined surface are oppositely arranged; the diffusion inclined plane is obliquely arranged and is arranged at an angle with the supporting surface; the diffusion inclined plane is uniformly provided with a plurality of boat grooves for placing the wafer sources at intervals; the size of the boat groove is larger than that of the sheet source so that the sheet source is movably inserted into the boat groove, and all the sheet sources incline towards the same side under the action of self gravity so as to be perpendicular to the diffusion inclined plane; the groove length direction of the boat groove extends along the second direction, the groove width direction of the boat groove extends along the inclined direction of the diffusion inclined plane, and the groove depth direction of the boat groove is perpendicular to the diffusion inclined plane. The method and the device enable the spacing between adjacent sheet sources to be the same, ensure that diffusion air flow can uniformly fill the two sides of each sheet source, reduce the fluctuation of the doping concentration of the surface of the sheet source, and eliminate the adverse factors that the doping effect of each sheet source is different due to inconsistent sheet spacing.

Description

Chip source placement structure and system for chip diffusion

Technical Field

The disclosure relates to the technical field of chip diffusion equipment, in particular to a chip source placement structure and a chip source placement system for chip diffusion.

Background

The technology for manufacturing chips, particularly photodiode chips, has matured gradually, and the chip diffusion doping process flow has fixed flow and equipment.

As shown in fig. 3, in order to avoid the chip sources 3 being broken by the boat grooves of the existing quartz boat 01 during actual operation, the boat grooves of the existing quartz boat 01 are generally made wider than the chip sources 3, but the improvement can simultaneously lead the chip sources 3 to incline left and right in the boat grooves, so that all the chip sources 3 have different intervals due to random inclination (any chip source 3 can approach or separate from the adjacent chip sources 3 along the width direction), but the different intervals can lead the furnace gas (and diffusion gas flow) of the existing furnace tube cavity 02 to enter from the cavity gas inlet pipeline 021 and flow through the chip sources 3 and then flow out from the cavity gas outlet pipeline 022, the furnace gas cannot uniformly fill the two sides of each chip source 3, the fluctuation of the surface doping concentration of the chip sources 3 is finally large, the uniformity in the chip sheets of the operation chip source characterization parameters and the delay of the chip spacing are not effectively improved, and the above problems become a big bottleneck for improving the performance of key chips.

Disclosure of Invention

One technical problem to be solved by the present disclosure is: how to improve the interval consistency of adjacent sheet sources so as to improve the uniformity in the sheet resistance and the interval uniformity of the characterization parameters of the operation sheet sources.

In order to solve the above technical problems, an embodiment of the present disclosure provides a chip source placement structure for chip diffusion, which has a supporting surface and a diffusion inclined surface; wherein the supporting surface and the diffusion inclined surface are oppositely arranged; the diffusion inclined plane is obliquely arranged along the first direction and is arranged at an angle with the supporting surface; the diffusion inclined plane is uniformly provided with a plurality of boat grooves for placing the sheet sources at intervals along the self inclined direction; the size of the boat groove is larger than that of the sheet source so that the sheet source is movably inserted into the boat groove, and all the sheet sources incline towards the same side under the action of self gravity so as to be perpendicular to the diffusion inclined plane; the groove length direction of the boat groove extends along the second direction, the groove width direction of the boat groove extends along the inclined direction of the diffusion inclined plane, and the groove depth direction of the boat groove is perpendicular to the diffusion inclined plane.

In some embodiments, the diffusion ramp forms an angle with the support surface of no more than 2 °.

In some embodiments, the diffusion ramp forms an angle with the support surface of no less than 0.5 °.

In some embodiments, the diffusion ramp forms an angle of 6-15 ° with the support surface.

In some embodiments, the diffusion ramp is disposed obliquely from top to bottom or bottom to top along the first direction.

To solve the above technical problems, an embodiment of the present disclosure provides a chip source placement system for chip diffusion, including: the chip diffusion chip source placing structure is used for inserting a chip source; the furnace tube cavity is provided with an air inlet pipeline and an air outlet pipeline; the chip diffusion chip source placing structure is arranged in the furnace tube cavity, and diffusion air flow enters the furnace tube cavity through the air inlet pipeline and flows out through the air outlet pipeline after flowing through the chip source.

In some embodiments, the air inlet pipeline is arranged on a first side wall of the furnace tube cavity, the air outlet pipeline is arranged on a second side wall of the furnace tube cavity, and the first side wall and the second side wall are oppositely arranged along a first direction so as to realize that diffusion air flows enter and exit the furnace tube cavity to a vertical sheet source.

In some embodiments, the inlet line is higher than the outlet line.

In some embodiments, the inlet line is lower than the outlet line.

In some embodiments, the direction of the diffusing gas flow forms an angle of no more than 2 ° with the support surface of the chip-diffusing sheet source placement structure.

Through above-mentioned technical scheme, chip diffusion is with piece source and is placed structure and system that this disclosure provided includes following beneficial effect:

the diffusion inclined plane of this disclosure inclines and sets up for the piece source is inserted and to be established and can all be leaned on the same side (lower lateral wall) of boat groove because of the action of gravity when being big than its self size in the boat groove, and all piece sources incline towards one side promptly, thereby make the interval between the adjacent piece sources the same, and then ensure that the diffusion air current can be even when flowing through the piece source and be full of the both sides of every piece source, reduce piece source surface doping concentration fluctuation, thereby eliminate the adverse factor that produces the difference because of each piece source doping effect that the piece interval is inconsistent leads to, effectively promote the characteristic parameter sheet resistance inboard homogeneity and the piece interval homogeneity of operation piece source, promoted the photoelectric parameter homogeneity of whole wafer.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.

FIG. 1 is a cross-sectional view of a chip-diffusion sheet source placement structure disclosed in an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a chip-source placement system for chip diffusion according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram of a prior art structure.

Reference numerals illustrate:

01. an existing quartz boat; 02. the existing furnace tube cavity; 021. a cavity air inlet pipeline; 022. a cavity air outlet pipeline; 3. a sheet source; 1. chip source placement structure for chip diffusion; 11. a support surface; 12. a diffusion slope; 13. a boat trough; 2. a furnace tube cavity; 21. an air intake line; 22. and an air outlet pipeline.

Detailed Description

Embodiments of the present disclosure are described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the disclosure and not to limit the scope of the disclosure, which may be embodied in many different forms and not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.

The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.

In the description of the present disclosure, unless otherwise indicated, the meaning of "plurality" is greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present disclosure. When the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.

Furthermore, the use of the terms first, second, and the like in this disclosure do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.

It should also be noted that, in the description of the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present disclosure may be understood as appropriate by those of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.

All terms used in the present disclosure have the same meaning as understood by one of ordinary skill in the art to which the present disclosure pertains, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.

As shown in fig. 1 and 2, the embodiment of the present disclosure provides a chip-diffusion-use chip source placement structure having a support surface 11 and a diffusion slope 12; wherein the supporting surface 11 and the diffusion inclined surface 12 are oppositely arranged; the diffusion inclined surface 12 is obliquely arranged along the first direction and is arranged at an angle with the supporting surface 11; the diffusion inclined plane 12 is uniformly provided with a plurality of boat grooves 13 for placing the wafer sources 3 at intervals along the self-inclined direction; the size of the boat groove 13 is larger than that of the sheet source 3 so that the sheet source 3 is movably inserted into the boat groove 13, and all the sheet sources 3 incline towards the same side under the action of self gravity so as to be perpendicular to the diffusion inclined plane 12; the groove length direction of the boat groove 13 extends in the second direction, the groove width direction of the boat groove 13 extends in the inclined direction of the diffusion slope 12, and the groove depth direction of the boat groove 13 is perpendicular to the diffusion slope 12.

In this embodiment, when the sheet sources 3 are inserted into the boat slots 13, the size of the boat slots 13 is larger than that of the sheet sources 3 (so that the boat slots 13 cannot clamp the sheet sources 3, and ensure the integrity of the sheet sources 3) and the inclined arrangement of the diffusion inclined planes 12, so that when the sheet source placement structure 1 for chip diffusion is placed in the furnace tube cavity 2 and supported by the supporting surface 11, the supporting surface 11 and the diffusion inclined planes 12 are arranged at an angle, and therefore all the sheet sources 3 incline towards the lower side of the diffusion inclined planes 12 under the action of gravity of the supporting surface 11, and the thickness dimension (the dimension along the width direction of the boat slots 13) of the sheet sources 3, the distance between the boat slots 13 and the like of the sheet sources 13 are the same, so that the distance between two adjacent sheet sources 3 is also the same, and further ensure that the diffusion air flow enters the inside the furnace tube cavity 2 and can uniformly fill both sides of each sheet source 3 when flowing through the sheet sources 3, thereby eliminating the fluctuation of the surface doping concentration of the sheet sources 3, thereby eliminating the difference of each sheet source 3 caused by the non-uniform sheet source distance between the sheet sources 3, and improving the uniformity of the sheet source 3, and the uniformity of the wafer process parameters. In practical applications, the supporting surface 11 is preferably a plane, so that the chip-diffusion-sheet-source-placing structure 1 is directly and horizontally placed in the furnace tube cavity 2.

As shown in fig. 1 and 2, in some embodiments, the diffusion ramp 12 forms an angle with the support surface 11 of no more than 2 °. In this embodiment, if the size of the interior of the furnace chamber 2 is large enough, the forming angle between the diffusion inclined plane 12 and the supporting surface 11 is greater than 0 ° and not greater than 2 °. The inclined slope 12 of diffusion is gentle to ensure that the chip diffusion is used the chip source and is placed the structure 1 under the circumstances that the boat groove 13 quantity is more can not lead to the high size of structure 1 too big, and then make this chip diffusion be used the chip source and place the structure 1 and be applicable to current boiler tube cavity 2, reduce the chip diffusion cost. Of course, in practical application, the angle between the diffusion inclined plane 12 and the supporting surface 11, the size of the chip diffusion sheet source placement structure 1, the size of the furnace tube cavity 2 and the size of the working sheet source should be adapted, and then the cost reduction is considered.

As shown in fig. 1 and 2, in some embodiments, the diffusion ramp 12 forms an angle with the support surface 11 of no less than 0.5 °. In this embodiment, the forming angle between the diffusion inclined plane 12 and the supporting surface 11 is not smaller than 0.5 ° and not larger than 2 °, so that the forming angle is ensured to be capable of ensuring that the sheet source 3 automatically inclines toward the same side when the boat 13 is formed, and the sheet source 3 cannot fall from the boat 13 due to excessive inclination, and the sheet source placing structure 1 for chip diffusion can be ensured to have enough loading capacity of the sheet source 3.

As shown in fig. 1 and 2, in some embodiments, the diffusion ramp 12 forms an angle of 6-15 ° with the support surface 11. In this embodiment, when the size of the furnace tube cavity 2 is not large enough, the forming angle is not larger than the corresponding value when the sheet source 3 falls from the boat 13, so that the forming angle is ensured to be capable of ensuring that the sheet source 3 automatically inclines towards the same side when the boat 13 is formed and the sheet source 3 does not fall from the boat 13 due to excessive inclination.

As shown in fig. 1 and 2, in some embodiments, the diffusion ramp 12 is disposed obliquely from top to bottom or bottom to top in a first direction. In this embodiment, the diffusion air flow may pass through two sides of the sheet source 3 from bottom to top, and the diffusion air flow may also pass through two sides of the sheet source 3 from top to bottom.

As shown in fig. 1 and 2, an embodiment of the present disclosure provides a chip-source placement system for chip diffusion, including: the chip diffusion chip source placing structure 1 for inserting a chip source 3; and a furnace tube cavity 2 provided with an air inlet pipeline 21 and an air outlet pipeline 22; the chip diffusion sheet source placing structure 1 is arranged in the furnace tube cavity 2, and diffusion air flows into the furnace tube cavity 2 through the air inlet pipeline 21 and flows out through the air outlet pipeline 22 after flowing through the sheet source 3.

In this embodiment, the chip-diffusion sheet source placement structure 1 is placed at the placement position of the furnace tube cavity 2: one end of the diffusion inclined plane 12 along the self inclined direction (or the first direction) is close to the air inlet pipeline 21, and the other end is close to the air outlet pipeline 22, so that the flow direction of the diffusion air flow faces the surface of the sheet source 3, the distribution uniformity of the diffusion air flow on the sheet source 3 is improved, and the fluctuation of the doping concentration on the surface of the sheet source 3 is reduced to ensure the high consistency of the doping concentration on the surface of the sheet source; meanwhile, as the sheet spacing among the sheet sources 3 is consistent, the adverse factor that the doping effect of the sheet sources 3 is different due to inconsistent sheet spacing is eliminated, the uniformity in the sheet resistance sheet and the sheet spacing uniformity of the characterization parameters of the operation sheet sources are effectively improved, and the photoelectric parameter uniformity of the whole wafer is improved. In practical applications, the inlet pipe 21 and the outlet pipe 22 may be a part of the furnace cavity 2 or a pipe installed in the furnace cavity 2.

As shown in fig. 1 and 2, in some embodiments, the air inlet pipeline 21 is disposed on a first side wall of the furnace cavity 2, the air outlet pipeline 22 is disposed on a second side wall of the furnace cavity 2, and the first side wall and the second side wall are disposed opposite to each other along a first direction, so as to realize that the diffusion airflow goes into and out of the furnace cavity 2 to the vertical slice source 3.

In this embodiment, the first direction is that the diffusion air flow is blown to the surface of the sheet source 3 closest to the air inlet pipeline 21 when the diffusion air flow goes into the inner space of the furnace tube cavity 2 from the air inlet pipeline 21, and then is equally divided by the sheet source 3 and flows to the air outlet pipeline 22 side along the surface of the sheet source 3 towards the outer peripheral side, in this process, the equally divided air flow and the air flow originally around the outer peripheral side of the sheet source 3 are converged together to evenly fill both sides of each sheet source 3, so that the uniformity of the surface doping concentration of the sheet source 3 is higher. It should be noted that the first direction, the second direction and the up-down direction are perpendicular to each other, and are three directions of the three-dimensional coordinate system.

As shown in fig. 1 and 2, in some embodiments, the inlet line 21 is higher than the outlet line 22. The diffusion air flow vertically blows to the middle part of the sheet source 3 along the inclined direction of the diffusion inclined plane 12 (namely, the sheet source 3 is obliquely arranged from top to bottom, and the diffusion air flow also flows from top to bottom in the inlet and outlet directions of the furnace tube cavity 2), so that the diffusion air flow vertically blows to the surface of the sheet source 3 from top to bottom along the inclined direction of the diffusion inclined plane 12 to be equally divided by the diffusion air flow, the arrangement is more stable, and the uniformity of the sheet spacing of the sheet source 3 and the uniformity of the diffusion air flow dispersion are ensured because the air flow direction is consistent with the inclined direction of the sheet source 3, and the sheet source 3 always maintains to incline towards the same side in the diffusion process. In practical applications, the angle formed by the diffusion inclined plane 12 and the supporting surface 11 should be determined by simulation experiments, considering the influence of the diffusion air flow, so as to avoid the falling of the wafer source 3 from the boat 13 due to the flow of the air flow diffusion.

In some embodiments, unlike the embodiments described above, the inlet line 21 is lower than the outlet line 22. That is, the diffusion air flow blows to the middle part of the sheet source 3 vertically along the direction of inclination of the diffusion inclined plane 12 (i.e. the sheet source 3 is obliquely arranged from top to bottom, and the direction of the diffusion air flow in and out of the furnace tube cavity 2 is from bottom to top), in practical application, the angle formed by the diffusion inclined plane 12 and the supporting surface 11 should consider the influence of the diffusion air flow, so as to avoid inconsistent sheet spacing of the sheet source 3 due to the flow of air flow diffusion, and in particular, the determination of the angle forming range can be performed through simulation experiments.

As shown in fig. 1 and 2, in some embodiments, the direction of the diffusing gas flow forms an angle of no more than 2 ° with the support surface 11 of the chip-diffusing sheet source placement structure 1. In this embodiment, if the size of the interior of the furnace chamber 2 is large enough, the forming angle between the diffusion inclined plane 12 and the supporting surface 11 is greater than 0 ° and not greater than 2 °. The inclined slope 12 of diffusion is gentle to ensure that the chip diffusion is used the chip source and is placed the structure 1 under the circumstances that the boat groove 13 quantity is more can not lead to the high size of structure 1 too big, and then make this chip diffusion be used the chip source and place the structure 1 and be applicable to current boiler tube cavity 2, reduce the chip diffusion cost. Of course, in practical application, the angle between the diffusion inclined plane 12 and the supporting surface 11, the size of the chip diffusion sheet source placement structure 1, the size of the furnace tube cavity 2 and the size of the working sheet source should be adapted, and then the cost reduction is considered.

Thus, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concepts of the present disclosure, some details known in the art are not described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.

Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It will be understood by those skilled in the art that the foregoing embodiments may be modified and equivalents substituted for elements thereof without departing from the scope and spirit of the disclosure. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict.

Claims (10)

1. A chip source placement structure for chip diffusion is characterized by comprising a supporting surface (11) and a diffusion inclined surface (12); wherein the supporting surface (11) and the diffusion inclined surface (12) are oppositely arranged; the diffusion inclined plane (12) is obliquely arranged along a first direction and is arranged at an angle with the supporting surface (11); the diffusion inclined plane (12) is uniformly provided with a plurality of boat grooves (13) for placing the sheet sources (3) at intervals along the self inclined direction; the size of the boat groove (13) is larger than that of the sheet source (3) so that the sheet source (3) is movably inserted into the boat groove (13) to realize that all the sheet sources (3) incline towards the same side under the action of self gravity so as to be perpendicular to the diffusion inclined plane (12); the groove length direction of the boat groove (13) extends along the second direction, the groove width direction of the boat groove (13) extends along the inclined direction of the diffusion inclined plane (12), and the groove depth direction of the boat groove (13) is perpendicular to the diffusion inclined plane (12).

2. The chip-diffusion sheet source placement structure according to claim 1, wherein the diffusion slope (12) forms an angle of not more than 2 ° with the support surface (11).

3. The chip-diffusion sheet source placement structure according to claim 2, wherein the diffusion slope (12) forms an angle of not less than 0.5 ° with the support surface (11).

4. The chip-diffusion sheet source placement structure according to claim 1, wherein the diffusion slope (12) forms an angle of 6 to 15 ° with the support surface (11).

5. The chip-diffusion sheet source placement structure according to claim 1, wherein the diffusion slope (12) is disposed obliquely from top to bottom or from bottom to top in the first direction.

6. A chip-source placement system for chip diffusion, comprising:

the chip-diffusion sheet source holding structure (1) according to any one of claims 1 to 5, which is used for inserting a sheet source (3); the method comprises the steps of,

the furnace tube cavity (2) is provided with an air inlet pipeline (21) and an air outlet pipeline (22);

the chip diffusion sheet source placing structure (1) is arranged in the furnace tube cavity (2), and diffusion air flow enters the furnace tube cavity (2) through the air inlet pipeline (21) and flows out through the air outlet pipeline (22) after flowing through the sheet source (3).

7. The chip diffusing patch source placement system according to claim 6, wherein the air inlet pipeline (21) is disposed on a first side wall of the furnace tube cavity (2), the air outlet pipeline (22) is disposed on a second side wall of the furnace tube cavity (2), and the first side wall and the second side wall are disposed opposite to each other along a first direction so as to realize that the diffusion airflow is perpendicular to the patch source (3) in and out of the furnace tube cavity (2).

8. The chip-diffusing sheet source placement system according to claim 7, wherein said air inlet pipe (21) is higher than said air outlet pipe (22).

9. The chip-diffusing sheet source placement system according to claim 7, wherein said air inlet line (21) is lower than said air outlet line (22).

10. Chip-diffusion sheet source placement system according to claim 8 or 9, characterized in that the in-and-out trend of the diffusion air flow forms an angle of not more than 2 ° with the support surface (11) of the chip-diffusion sheet source placement structure (1).