CN219656682U - Full-flexible VC temperature equalizing plate - Google Patents
Full-flexible VC temperature equalizing plate Download PDFInfo
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- CN219656682U CN219656682U CN202320513820.5U CN202320513820U CN219656682U CN 219656682 U CN219656682 U CN 219656682U CN 202320513820 U CN202320513820 U CN 202320513820U CN 219656682 U CN219656682 U CN 219656682U
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- flexible
- upper cover
- lower cover
- temperature
- cover
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- 239000000463 material Substances 0.000 claims abstract description 16
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000000835 fiber Substances 0.000 claims description 10
- 229920000728 polyester Polymers 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 7
- 238000009941 weaving Methods 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 4
- 239000002861 polymer material Substances 0.000 claims description 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 abstract description 50
- ZZZCUOFIHGPKAK-UHFFFAOYSA-N D-erythro-ascorbic acid Natural products OCC1OC(=O)C(O)=C1O ZZZCUOFIHGPKAK-UHFFFAOYSA-N 0.000 abstract description 25
- 229930003268 Vitamin C Natural products 0.000 abstract description 25
- 235000019154 vitamin C Nutrition 0.000 abstract description 25
- 239000011718 vitamin C Substances 0.000 abstract description 25
- 238000000034 method Methods 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 229920000642 polymer Polymers 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 4
- 238000009954 braiding Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000005245 sintering Methods 0.000 abstract description 2
- 230000004927 fusion Effects 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009940 knitting Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Abstract
The utility model relates to the technical field of VC (vitamin C) temperature-equalizing plates, and discloses a fully flexible VC temperature-equalizing plate, which comprises a flexible upper cover and a flexible lower cover; the flexible upper cover is provided with a cavity, a heat-conducting working medium is arranged in the cavity, and the flexible upper cover is connected with the flexible lower cover; the flexible capillary support structure is a hydrophilic organic compound material layer or a structure layer formed by stacking a plurality of hydrophilic organic compound material layers; the flexible capillary support structure and the cover body are designed integrally or separately. The utility model has the advantages that the inside of the VC temperature equalization plate is changed into a flexible capillary supporting structure by traditional manual copper mesh laying and copper mesh sintering, the structure is manufactured by adopting a braiding method, the supporting strength and the capillary layout are improved, the upper cover and the lower cover of the VC temperature equalization plate are changed into high polymer flexible covers from original metal covers, the VC temperature equalization plate has flexibility, the flexible upper cover and the flexible lower cover are connected by adopting an adhesive or fusion mode, and the upper cover and the lower cover are connected in a simple mode and have good sealing property.
Description
Technical Field
The utility model relates to the technical field of VC (vitamin C) temperature-equalizing plates, in particular to a fully flexible VC temperature-equalizing plate.
Background
The conventional VC temperature equalization plate generally adopts a metal piece as a shell or a capillary, for example, a cover plate capillary adopts copper alloy, stainless steel or other metal composite materials and the like, and is deformed when being bent by external force, and the cover plate and an internal capillary structure are damaged by stress, so that the reflux of working media is influenced, and even fatigue fracture failure occurs after repeated bending.
Meanwhile, as the form of the intelligent terminal consumer electronic product is miniaturized, light-weighted, ultrathin, foldable and evolutionary trend evolves, the integration of the fully flexible VC temperature equalizing plate brings a wider development space for the compact equipment of the intelligent terminal consumer electronic product. Therefore, we propose a fully flexible VC temperature equalizing plate.
Disclosure of Invention
Aiming at the defect that the conventional VC temperature equalization plate cannot be bent, the utility model provides a fully flexible VC temperature equalization plate which has the advantage of being capable of being bent, and solves the problems in the prior art.
The utility model provides the following technical scheme:
designing a full-flexible VC temperature equalizing plate, which comprises a flexible upper cover and a flexible lower cover;
the flexible upper cover is provided with a cavity, a heat-conducting working medium is arranged in the cavity, and the flexible upper cover is connected with the flexible lower cover;
a flexible capillary supporting structure is arranged in the cavity, and the flexible capillary supporting structure is a hydrophilic organic compound material layer or a structure layer formed by stacking a plurality of hydrophilic organic compound material layers;
the flexible capillary support structure is integrated with the flexible upper cover and the flexible lower cover, or is arranged in a cavity between the flexible upper cover and the flexible lower cover.
Preferably, the surfaces of the flexible upper cover and the flexible lower cover are provided with metal plating layers.
Preferably, the flexible upper cover and the flexible lower cover are made of high polymer materials.
Preferably, the edges of the flexible upper cover and the flexible lower cover are connected by means of heat pressing or bonding.
Preferably, the organic compound material layer is a polyester fiber layer, and the polyester fiber layer is woven by polyester fibers.
Compared with the existing VC temperature equalizing plate, the VC temperature equalizing plate has the following beneficial effects:
1. the traditional copper alloy material is changed into a high polymer, and the high polymer has a flexible bending function, so that the whole VC temperature-equalizing plate has an arbitrary bending function, is convenient to bend, and solves the problem that the traditional VC temperature-equalizing plate cannot be folded;
2. the traditional manual copper mesh laying and copper mesh sintering are changed into the placement of the flexible capillary support structure, and the structure is manufactured by adopting a braiding method, so that the internal structure of the flexible capillary support structure is varied, for example, the braiding technology such as jacquard or embroidery is adopted, the flexible capillary support structure realizes 2D/3D arrangement and supportability, the flexible capillary support structure has various spatial three-dimensional effects, the support strength and capillary layout are improved, and meanwhile, the fluidity of a heat conducting working medium is increased;
3. the soldering sealing is changed into adhesive sealing or hot pressing sealing, and the connecting mode is simple and firm, and the welding edge has no burrs.
Drawings
Fig. 1 is a schematic view of a flexible lower cover according to the present utility model.
Fig. 2 is a schematic view of a flexible upper cover according to the present utility model.
Fig. 3 is a schematic view of a flexible capillary support structure in accordance with the present utility model.
Fig. 4 is a schematic structural view of the flexible upper cover, the flexible lower cover, and the flexible capillary support structure of the present utility model after being connected.
Fig. 5 is a cross-sectional view of the flexible upper cover, flexible lower cover, and flexible capillary support structure of the present utility model after being connected.
Fig. 6 is a closed state of the present utility model.
Fig. 7 is a deployed state of the present utility model.
Fig. 8-10 are schematic views of different structures of flexible capillary support structures of the present utility model woven by a weaving process.
In the figure: 1. a flexible upper cover; 2. a flexible lower cover; 3. a flexible capillary support structure; 4. and (5) metal plating.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-10, a fully flexible VC temperature equalization plate comprises a flexible upper cover 1 and a flexible lower cover 2; the flexible upper cover 1 is provided with a cavity (not numbered in the figure), the cavity is preferably a rectangular cavity, a heat conducting working medium is arranged in the cavity, the heat conducting working medium is preferably heat conducting oil or ultrapure water, the flexible upper cover 1 is connected with the flexible lower cover 2, the cavity is completely sealed, and the airtight seal of the cavity is ensured.
The flexible upper cover 1 and the flexible lower cover 2 are made of high polymer materials, such as PI materials, PP materials, PET materials and the like;
the surfaces of the flexible upper cover 1 and the flexible lower cover 2 are provided with metal plating layers 4, the metal plating layers 4 are used for increasing the air tightness of the high polymer and preventing the evaporation, the metal plating layers 4 can also be used as heat conducting layers, and as the heat conducting effect of the metal plating layers 4 is good, heat can be quickly conducted, and the heat conducting working medium is matched with the heat conducting working medium to increase the heat conductivity of the full-flexible VC temperature equalizing plate;
in the flexible upper cover 1 cavity is connected through hot pressing or bonding between the edges of flexible upper cover 1 and flexible lower cover 2, for traditional fixed mode that brazes, bonding and hot pressing's mode can let the junction area of contact between flexible upper cover 1 and the flexible lower cover 2 bigger, and the junction can closely laminate completely, can not take place the condition of weeping moreover, and operation process is simple.
As shown in fig. 5 and 4, a flexible capillary support structure 3 is arranged in the cavity, and the flexible capillary support structure 3 is a hydrophilic organic compound material layer or a structure layer formed by stacking a plurality of hydrophilic organic compound material layers;
the flexible capillary support structure 3 and the flexible upper cover 1 and the flexible lower cover 2 are of an integrated structure, or the flexible capillary support structure 3 is arranged in a cavity between the flexible upper cover 1 and the flexible lower cover 2, and the two modes can partially meet the working requirements of the full-flexible VC temperature-equalizing plate.
Among them, the organic compound material layer is preferably a polyester fiber layer, but is not limited to polyester fibers, such as non-woven fabrics, cloths, and other hydrophilic materials, which can be used as the material of the flexible capillary support structure 3;
the polyester fiber layer is formed by weaving polyester fibers, the structure can adopt weaving technologies such as jacquard weaving or embroidery and the like to realize that the flexible capillary support structure has 2D/3D arrangement and supportability, so that the surface of the flexible capillary support structure is more attractive to liquid, and the flexible capillary support structure has bending capability and does not damage the structure of the flexible capillary support structure while bending.
The specific structure of the flexible capillary support structure is shown in fig. 8 to 10, in the knitting process, the flexible capillary support structure can be used for weaving different structures through the transformation of warps and wefts, theoretically, the flexible capillary support structure is changeable for the model selection design of different products, and fig. 8 to 10 are three different structures which are knitted through a knitting method.
The full-flexible VC temperature-equalizing plate provided by the utility model can conduct and dissipate heat on a three-dimensional surface, has the characteristic of high flexibility, and can be freely bent, rolled, twisted and subjected to three-dimensional heat transfer to a certain extent, and the flexibility of the full-flexible VC temperature-equalizing plate enables the application field and market of products to be wider.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A full-flexible VC temperature equalization plate is characterized in that: comprises a flexible upper cover (1) and a flexible lower cover (2); a cavity is arranged on the flexible upper cover (1), a heat-conducting working medium is arranged in the cavity, and the flexible upper cover (1) is connected with the flexible lower cover (2);
a flexible capillary supporting structure (3) is arranged in the cavity, and the flexible capillary supporting structure (3) is a hydrophilic organic compound material layer or a structure layer formed by stacking a plurality of hydrophilic organic compound material layers;
the flexible capillary support structure (3) and the flexible upper cover (1) and the flexible lower cover (2) are of an integrated structure, or the flexible capillary support structure (3) is arranged in a cavity between the flexible upper cover (1) and the flexible lower cover (2).
2. A fully flexible VC temperature-equalizing plate according to claim 1, wherein: the surfaces of the flexible upper cover (1) and the flexible lower cover (2) are provided with metal plating layers (4).
3. A fully flexible VC temperature-equalizing plate according to claim 1, wherein: the flexible upper cover (1) and the flexible lower cover (2) are made of high polymer materials.
4. A fully flexible VC temperature-equalizing plate according to claim 1, wherein: the edges of the flexible upper cover (1) and the flexible lower cover (2) are connected in a hot pressing or bonding mode.
5. A fully flexible VC temperature-equalizing plate according to claim 1, wherein: the organic compound material layer is a polyester fiber layer, and the polyester fiber layer is formed by weaving polyester fibers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320513820.5U CN219656682U (en) | 2023-03-16 | 2023-03-16 | Full-flexible VC temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320513820.5U CN219656682U (en) | 2023-03-16 | 2023-03-16 | Full-flexible VC temperature equalizing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219656682U true CN219656682U (en) | 2023-09-08 |
Family
ID=87862807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320513820.5U Active CN219656682U (en) | 2023-03-16 | 2023-03-16 | Full-flexible VC temperature equalizing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219656682U (en) |
-
2023
- 2023-03-16 CN CN202320513820.5U patent/CN219656682U/en active Active
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