CN219648266U - Integrated circuit board soldering tin cleaning equipment - Google Patents
Integrated circuit board soldering tin cleaning equipment Download PDFInfo
- Publication number
- CN219648266U CN219648266U CN202320399511.XU CN202320399511U CN219648266U CN 219648266 U CN219648266 U CN 219648266U CN 202320399511 U CN202320399511 U CN 202320399511U CN 219648266 U CN219648266 U CN 219648266U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- soldering tin
- integrated circuit
- water tank
- plates
- Prior art date
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 238000005476 soldering Methods 0.000 title claims abstract description 45
- 238000004140 cleaning Methods 0.000 title claims abstract description 38
- 238000003825 pressing Methods 0.000 claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 59
- 239000010902 straw Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 241001233242 Lontra Species 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
Abstract
The utility model provides an integrated circuit board soldering tin cleaning device. The integrated circuit board soldering tin cleaning device includes: an adjustable workbench; the two supporting plates are fixedly arranged at the top of the adjustable workbench; the placing frame is rotatably arranged on the two supporting plates; the handle is fixedly arranged on the output rod of the placement frame; the first pressing plates are arranged on the placing frame; the first screwing rods are respectively and threadedly mounted on the first pressing plates, and are in threaded connection with the placing frame. The integrated circuit board soldering tin cleaning equipment provided by the utility model has the advantages that the limiting and fixing of the circuit board are convenient, and the electronic elements on the circuit board are ensured not to be contacted with the tabletop, so that the soldering tin can be conveniently cleaned by workers.
Description
Technical Field
The utility model relates to the technical field of integrated circuit board cleaning equipment, in particular to integrated circuit board soldering tin cleaning equipment.
Background
The integrated circuit board adopts a semiconductor manufacturing process to manufacture a plurality of transistors, resistors, capacitors and other components on a small monocrystalline silicon wafer, and forms a complete electronic circuit by a multi-layer wiring and tunnel wiring method, and the integrated circuit board can be divided into two major types of analog integrated circuit boards and digital integrated circuit boards according to different functional structures, however, when the integrated circuit board is produced or detached, soldering slag left by soldering tin is remained on the integrated circuit board, and before the integrated circuit board is used, the soldering slag is cleaned, so that the soldering slag is prevented from influencing the use of the circuit board;
because when the soldering tin is cleaned, the electronic components on the circuit board are different in height, the phenomenon that the circuit board is inclined when placed on a table top is caused, the soldering tin is inconvenient to clean by workers, and meanwhile, when the circuit board is in an inclined state, the workers are subjected to downward pressure through the tin absorber, the electric iron and the air heater when the surface of the circuit board is operated, and pins of the electronic components are easily damaged.
Therefore, it is necessary to provide a new integrated circuit board solder cleaning apparatus to solve the above technical problems.
Disclosure of Invention
The utility model solves the technical problem of providing the integrated circuit board soldering tin cleaning equipment which is convenient for limiting and fixing the circuit board, and ensures that the electronic elements on the circuit board are not contacted with a tabletop, thereby being convenient for a worker to clean soldering tin.
In order to solve the technical problems, the utility model provides an integrated circuit board soldering tin cleaning device, which comprises: an adjustable workbench; the two supporting plates are fixedly arranged at the top of the adjustable workbench; the placing frame is rotatably arranged on the two supporting plates; the handle is fixedly arranged on the output rod of the placement frame; the first pressing plates are arranged on the placing frame; the first screwing rods are respectively and threadedly mounted on the first pressing plates, and are in threaded connection with the placing frame; the cleaning mechanism is arranged on the adjustable workbench.
Preferably, the cleaning mechanism comprises a fan, a venturi tube, a suction tube and a connecting tube, wherein the fan and the venturi tube are fixedly installed at the top of the adjustable workbench, an exhaust end of the fan is fixedly connected with the venturi tube, the suction tube is fixedly installed at one side of the venturi tube, the connecting tube is fixedly installed at one side of the venturi tube, and the connecting tube extends to penetrate through the bottom of the adjustable workbench.
Preferably, the bottom fixed mounting of adjustable workstation has two limiting plates, two slidable mounting has the water tank in the limiting plate, fixed mounting has the water pipe in the water tank, water tank one side fixed mounting has the connecting piece, the connecting piece with the water pipe is linked together, the connecting piece with connecting pipe threaded connection, the both sides of water tank all articulate there is the otter board.
Preferably, the water tank and the two net plates are fixedly provided with limiting blocks, and the two limiting blocks are slidably provided with bolts.
Preferably, two mounting blocks are fixedly mounted on the supporting plate, a second screwing rod is mounted on any mounting block in a threaded mode, a second pressing plate is fixedly mounted on the second screwing rod, and soft cushions are fixedly mounted on the second pressing plate and the first pressing plate.
Preferably, a drain pipe is fixedly arranged on one side of the water tank, a valve is sleeved on the drain pipe, and the bottom of the inner wall of the water tank is obliquely arranged.
Compared with the related art, the integrated circuit board soldering tin cleaning equipment provided by the utility model has the following beneficial effects:
the utility model provides an integrated circuit board soldering tin cleaning device, which comprises:
1. the placing frame is rotated by rotating the handle, so that the two sides of the circuit board are convenient to clean, the circuit board is convenient to clean, and meanwhile, the height of the adjustable workbench can be conveniently adjusted by the operator according to the height of the operator, so that the operator with higher height does not need to bend over for a long time to clean the circuit board;
2. the negative pressure area is formed in the venturi tube by the air blown by the fan through the internal structure of the venturi tube, so that the suction tube sucks external air into the venturi tube, soldering tin can be sucked into the water tank by the suction tube to be collected, the soldering tin is collected intensively by the water tank so as to be reused, air can be discharged through the screen plate, the air can be discharged faster, the influence on cleaning of the soldering tin by the suction tube caused by the fact that the air cannot be discharged in the water tank is avoided, the screen plate is fixed through the bolt, the separation of the screen plate can be avoided when the venturi tube is used, and the soldering tin in the water tank is discharged out of the water tank;
3. fix the straw through the second clamp plate, can accomodate fixedly to the straw when need not to use the straw, fixed mode is comparatively simple convenient, is the slope form setting through the water tank bottom, can discharge water in the water tank when soldering tin, it is comparatively clean to discharge.
Drawings
FIG. 1 is a schematic diagram of a front view of a preferred embodiment of an integrated circuit board solder cleaning apparatus according to the present utility model;
FIG. 2 is a schematic rear sectional view of a preferred embodiment of an integrated circuit board solder cleaning apparatus according to the present utility model;
FIG. 3 is a schematic side cross-sectional view of a placement frame provided in accordance with the present utility model;
FIG. 4 is an enlarged schematic view of the portion A shown in FIG. 1;
fig. 5 is an enlarged schematic view of the portion B shown in fig. 1.
Reference numerals in the drawings: 1. an adjustable workbench; 2. a support plate; 3. placing a frame; 4. a handle; 5. a first platen; 6. a first screw; 7. a blower; 8. a venturi tube; 9. a suction pipe; 10. a connecting pipe; 11. a limiting plate; 12. a water tank; 13. a connecting piece; 14. a screen plate; 15. a limiting block; 16. a plug pin; 17. a mounting block; 18. a second screw; 19. and a second pressing plate.
Detailed Description
The utility model will be further described with reference to the drawings and embodiments.
Referring to fig. 1-5 in combination, fig. 1 is a schematic front view of a preferred embodiment of an integrated circuit board solder cleaning apparatus according to the present utility model; FIG. 2 is a schematic rear sectional view of a preferred embodiment of an integrated circuit board solder cleaning apparatus according to the present utility model; FIG. 3 is a schematic side cross-sectional view of a placement frame provided in accordance with the present utility model; FIG. 4 is an enlarged schematic view of the portion A shown in FIG. 1; fig. 5 is an enlarged schematic view of the portion B shown in fig. 1. The integrated circuit board soldering tin cleaning device includes: an adjustable workbench 1; the two support plates 2 are fixedly arranged on the top of the adjustable workbench 1; a placement frame 3, wherein the placement frame 3 is rotatably installed on the two support plates 2; a handle 4, the handle 4 being fixedly mounted on the output rod of the placement frame 3; a plurality of first pressing plates 5, wherein the plurality of first pressing plates 5 are arranged on the placing frame 3; the first screwing rods 6 are respectively and threadedly mounted on the first pressing plates 5, and the first screwing rods 6 are in threaded connection with the placing frame 3; the cleaning mechanism is used for cleaning soldering tin, and is arranged on the adjustable workbench 1, the placing frame 3 is rotated through the rotating handle 4, the two sides of the circuit board are cleaned conveniently, the cleaning mechanism is convenient to clean, meanwhile, the height of the adjustable workbench 1 can be adjusted conveniently by the aid of the height-adjustable workbench 1, and accordingly workers with higher heights do not need to bend over for a long time to clean the circuit board.
The cleaning mechanism comprises a fan 7, a venturi tube 8, a suction tube 9 and a connecting tube 10, wherein the fan 7 and the venturi tube 8 are fixedly installed at the top of the adjustable workbench 1, an exhaust end of the fan 7 is fixedly connected with the venturi tube 8, the suction tube 9 is fixedly installed at one side of the venturi tube 8, the connecting tube 10 extends to penetrate through the bottom of the adjustable workbench 1, wind blown by the fan 7 forms a negative pressure area in the venturi tube 8 through the inner structure of the venturi tube 8, so that the suction tube 9 sucks outside air into the venturi tube 8, and soldering tin is sucked into a water tank 12 by using the suction tube 9 to be collected.
The bottom fixed mounting of workstation 1 with adjustable has two limiting plates 11, two limiting plates 11 slidable mounting has water tank 12, fixed mounting has the water pipe in the water tank 12, water tank 12 one side fixed mounting has connecting piece 13, connecting piece 13 with the water pipe is linked together, connecting piece 13 with connecting pipe 10 threaded connection, the both sides of water tank 12 all articulate has otter board 14, concentrate through water tank 12 to collect to it is convenient for reuse, discharges the air through otter board 14, can make the faster discharge of air, avoids the unable discharge of air in water tank 12 to lead to influencing the clearance of straw 9 butt welding tin.
The water tank 12 and the two screen plates 14 are fixedly provided with limiting blocks 15, the two limiting blocks 15 are respectively provided with a bolt 16 in a sliding manner, the screen plates 14 are fixed through the bolts 16, and when the water tank is used, the screen plates 14 are prevented from being separated, so that soldering tin in the water tank 12 is discharged out of the water tank 12.
Two installation blocks 17 are fixedly installed on the supporting plate 2, a second screwing rod 18 is installed on any one of the installation blocks 17 in a threaded mode, a second pressing plate 19 is fixedly installed on the second screwing rod 18, soft cushions are fixedly installed on the second pressing plate 19 and the first pressing plate 5, the suction pipe 9 is fixed through the second pressing plate 19, and the suction pipe 9 can be stored and fixed when the suction pipe 9 is not needed.
One side fixed mounting of water tank 12 has the drain pipe, the cover is equipped with the valve on the drain pipe, the inner wall bottom of water tank 12 is the slope form setting, is the slope form setting through water tank 12 bottom, can be when the water in the discharge water tank 12 has soldered tin, and the emission is comparatively clean.
It should be noted that, in the present utility model, the circuits, electronic components and modules are all related to the prior art, and those skilled in the art may implement the present utility model completely, and it is needless to say that the protection of the present utility model does not relate to improvement of software and methods.
The working principle of the integrated circuit board soldering tin cleaning equipment provided by the utility model is as follows:
the scheme is also provided with an electric control cabinet, the electric control cabinet is arranged on the equipment, when the electric control cabinet is used, each electric equipment can be started to operate respectively, the power connection mode of each electric equipment is the prior mature technology, is a well-known technology of the person in the field, and is not redundant;
when the circuit board is used, the first twisting rod 6 is separated from the placing frame 3, then the circuit board is placed on the supporting frame, the first twisting rod 6 is installed on the placing frame 3, the first pressing plate 5 presses and fixes the circuit board, the soft cushion can protect the circuit board, the excessive pressing force is avoided, the circuit board is damaged, then a worker can conduct angle adjustment on the placing frame 3 according to the angle of convenient operation of the worker, when the placing frame 3 needs to be adjusted, the handle 4 is rotated firstly, the placing frame 3 is rotated, the placing frame 3 is inclined to an angle which is convenient for the worker to operate, and then the worker can clean soldering tin on the circuit board;
when the soldering tin is cleaned, firstly, an external air heater is used for blowing the soldering tin, the soldering tin is melted, when the soldering tin is melted, the air heater 7 is started, the air heater 7 pumps external air into the venturi tube 8, the venturi tube 8 is internally composed of an air inlet tube, a shrinkage tube, a venturi tube and a diffusion tube, the air flows into the venturi tube through the air inlet tube, then the air forms a negative pressure area at the joint of the venturi tube and the diffusion tube, so that the air at the suction tube 9 is sucked into the venturi tube 8, the melted soldering tin is adsorbed into the water tank 12 by the suction tube 9 for centralized collection, and then the air is discharged through the screen 14;
after cleaning, the suction pipe 9 is placed between the two mounting blocks 17, the second screw rod 18 is rotated to enable the second pressing plate 19 to fix the suction pipe 9, then the first screw rod 6 is rotated to enable the first screw rod 6 and the first pressing plate 5 to be separated from the placement frame 3, and the circuit board is taken down;
when the material in the water tank 12 needs to be discharged, the valve is opened first, the material in the water tank 12 is discharged through the drain pipe, the fixing bolt is arranged on the limiting plate 11 in a threaded mode, when the water tank 12 needs to be cleaned, the fixing bolt is separated from the limiting plate 11 first, then the water tank 12 slides out of the limiting plate 11, and the water tank 12 is taken down for cleaning.
Compared with the related art, the integrated circuit board soldering tin cleaning equipment provided by the utility model has the following beneficial effects:
the utility model provides integrated circuit board soldering tin cleaning equipment, which is characterized in that a placement frame 3 is rotated by rotating a handle 4, so that two sides of a circuit board are cleaned conveniently, the cleaning is more convenient, meanwhile, by setting an adjustable-height workbench 1, the height of the adjustable workbench 1 can be adjusted conveniently by workers according to the height of the workbench, so that the workers with higher height do not need to bend down for a long time to clean the circuit board, the negative pressure area is formed in a venturi tube 8 by wind blown by a fan 7 through the internal structure of the venturi tube 8, thereby sucking outside air into the venturi tube 8 by a suction tube 9, and sucking soldering tin into a water tank 12 by using the suction tube 9 well for collection;
collect the solder tin through water tank 12 to be convenient for reuse, discharge the air through otter board 14, can make the faster discharge of air, avoid the unable discharge of air in water tank 12 to lead to influencing the clearance of straw 9 solder tin, fix otter board 14 through bolt 16, can avoid otter board 14 to break away from when using, outside making the soldering tin in the water tank 12 discharge water tank 12, fix straw 9 through second clamp plate 19, can accomodate fixedly straw 9 when need not to use straw 9, the fixed mode is comparatively simple convenient, be the slope form setting through water tank 12 bottom, can discharge comparatively clean when the water in discharge water tank 12 has soldered tin.
The device structure and the drawings of the present utility model mainly describe the principle of the present utility model, and in terms of the technology of the design principle, the arrangement of the power mechanism, the power supply system, the control system, etc. of the device is not completely described, but the specific details of the power mechanism, the power supply system, and the control system thereof can be clearly known on the premise that those skilled in the art understand the principle of the present utility model.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (6)
1. An integrated circuit board soldering tin cleaning device for integrated circuit board soldering tin clearance, which is characterized by comprising:
an adjustable workbench;
the two supporting plates are fixedly arranged at the top of the adjustable workbench;
the placing frame is rotatably arranged on the two supporting plates;
the handle is fixedly arranged on the output rod of the placement frame;
the first pressing plates are arranged on the placing frame;
the first screwing rods are respectively and threadedly mounted on the first pressing plates, and are in threaded connection with the placing frame;
the cleaning mechanism is arranged on the adjustable workbench.
2. The integrated circuit board soldering tin cleaning device of claim 1, wherein the cleaning mechanism comprises a fan, a venturi tube, a suction tube and a connecting tube, the fan and the venturi tube are fixedly installed at the top of the adjustable workbench, an exhaust end of the fan is fixedly connected with the venturi tube, the suction tube is fixedly installed at one side of the venturi tube, the connecting tube is fixedly installed at one side of the venturi tube, and the connecting tube extends to penetrate through the bottom of the adjustable workbench.
3. The integrated circuit board soldering tin cleaning device of claim 1, wherein two limiting plates are fixedly arranged at the bottom of the adjustable workbench, a water tank is slidably arranged in the two limiting plates, a water pipe is fixedly arranged in the water tank, a connecting piece is fixedly arranged on one side of the water tank and communicated with the water pipe, the connecting piece is in threaded connection with the connecting pipe, and two sides of the water tank are hinged with net plates.
4. The integrated circuit board soldering tin cleaning device of claim 3, wherein the water tank and the two mesh plates are fixedly provided with limiting blocks, and the two limiting blocks are respectively provided with a bolt in a sliding manner.
5. The integrated circuit board soldering tin cleaning device of claim 1, wherein two mounting blocks are fixedly mounted on any one of the support plates, a second screwing rod is mounted on any one of the mounting blocks in a threaded manner, a second pressing plate is fixedly mounted on the second screwing rod, and soft cushions are fixedly mounted on both the second pressing plate and the first pressing plate.
6. The integrated circuit board soldering tin cleaning device according to claim 3, wherein a drain pipe is fixedly installed on one side of the water tank, a valve is sleeved on the drain pipe, and the bottom of the inner wall of the water tank is obliquely arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320399511.XU CN219648266U (en) | 2023-03-07 | 2023-03-07 | Integrated circuit board soldering tin cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320399511.XU CN219648266U (en) | 2023-03-07 | 2023-03-07 | Integrated circuit board soldering tin cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219648266U true CN219648266U (en) | 2023-09-08 |
Family
ID=87856021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320399511.XU Active CN219648266U (en) | 2023-03-07 | 2023-03-07 | Integrated circuit board soldering tin cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219648266U (en) |
-
2023
- 2023-03-07 CN CN202320399511.XU patent/CN219648266U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |