CN208256620U - chip ball-planting device - Google Patents
chip ball-planting device Download PDFInfo
- Publication number
- CN208256620U CN208256620U CN201820842588.9U CN201820842588U CN208256620U CN 208256620 U CN208256620 U CN 208256620U CN 201820842588 U CN201820842588 U CN 201820842588U CN 208256620 U CN208256620 U CN 208256620U
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- Prior art keywords
- chip
- ball
- template
- steel mesh
- planting
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- 229910000831 Steel Inorganic materials 0.000 claims abstract description 38
- 239000010959 steel Substances 0.000 claims abstract description 38
- 238000001179 sorption measurement Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 4
- 238000007906 compression Methods 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 2
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000029058 respiratory gaseous exchange Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Cultivation Receptacles Or Flower-Pots, Or Pots For Seedlings (AREA)
Abstract
The utility model relates to chip encapsulation technology fields, specifically disclose a kind of chip ball-planting device, which includes: pedestal, including base body and several support columns being vertically set on the base body；Ball template is planted, chip placement and steel mesh are used for, including stencil body and several first through hole being provided on the stencil body；Extensible member is arranged between the pedestal and ball placement template, and telescopic direction is vertical with the base body and/or the stencil body；The stencil body can be vertically threaded through on the support column by the first through hole.In compression process, support column can pass through first through hole, and the steel mesh for having planted ball is jacked up, and realize the separation of steel mesh and chip, complete steel mesh knockout course.In the steel mesh knockout course, steel mesh can be vertically detached from from chip, and tin ball position is not susceptible to deviate.
Description
Technical Field
The utility model relates to a chip package technical field, concretely relates to chip plants ball device.
Background
Along with the progress of technology, the miniaturization trend of electronic equipment is more and more obvious, and in order to meet the miniaturization development trend and improve the chip integration level, most IC products adopt BGA package. BGA is called Ball Grid Array (Ball Grid Array package) and has the advantages of small package area, large number of pins, good electrical performance and the like, so that the BGA is widely applied to the field of chip package.
At present, in production and experiment, often need plant the ball to the chip surface, place the steel mesh on the chip surface promptly, aim at the net gape of steel mesh at the electrode department of chip, print soldering tin in net gape department, heat soldering tin through the heating method and melt completely, take off the steel mesh from the chip surface after the cooling (drawing of patterns process promptly). However, the existing demolding process is manually performed, and the perpendicularity of manual control is poor, so that the position of the solder ball is easy to deviate, and a large amount of time and labor cost are consumed for manual demolding.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model discloses the technical problem that solve is: in the prior art, the position of the solder ball is easy to deviate in the demoulding process.
In order to solve the technical problem, the utility model discloses a technical scheme as follows:
the utility model provides a chip plants football shirt and puts, include:
the base comprises a base body and a plurality of support columns vertically arranged on the base body;
the ball planting template is used for placing a chip and a steel mesh and comprises a template body and a plurality of first through holes formed in the template body;
the telescopic piece is arranged between the base and the ball planting template, and the telescopic direction is vertical to the base body and/or the template body;
the template body can vertically penetrate through the supporting column through the first through hole.
Optionally, the telescopic member is sleeved on the supporting column.
Optionally, the telescoping member is disposed between the base body and the template body independently of the support post; the extensible member and the ball planting template are detachably connected.
Optionally, the side of the template body is provided with at least one pressing handle.
Optionally, the method further comprises:
and the vacuum adsorption device is connected with the ball planting template and is used for fixing the chip in the ball planting template.
Optionally, the vacuum adsorption device comprises a sucker, an air suction pipeline and an air pump which are connected in sequence, wherein the sucker is connected with the template body and used for adsorbing the chip.
Optionally, a second through hole is formed in the middle of the base body, and the air suction pipeline extends to the bottom of the base through the second through hole.
Optionally, at least one groove for placing the chip is formed in the template body.
Optionally, at least two limiting parts are arranged on the template body, and the steel mesh is positioned and fixed through the limiting parts.
Optionally, the first through hole is a circular hole, and the support column is a cylinder.
The above technical scheme of the utility model has following advantage for prior art:
the embodiment of the utility model provides a chip plants ball device plants the ball template and is used for planting the ball through the steel mesh to the chip. After the ball planting is finished, as the telescopic piece is arranged between the base and the ball planting template and the telescopic direction is vertical to the base body and/or the template body, the template body can be compressed towards the direction close to the base body; because the template body is provided with a plurality of first through holes, the base body is provided with a plurality of support columns perpendicular to the base body, and the first through holes of the template body can vertically penetrate through the support columns, so that in the compression process, the support columns can penetrate through the first through holes, the steel mesh jack-up of the planted balls is realized, the separation of the steel mesh and the chip is realized, and the steel mesh demoulding process is completed. In the steel mesh demoulding process, the steel mesh can be separated from the chip along the vertical direction, and the position of the solder ball is not easy to deviate.
The embodiment of the utility model provides a chip ball planting device, extensible member can overlap and locate on the support column, also can be independent of the support column and set up between base body and template body, promptly, the setting of extensible member position is comparatively nimble, and alternative height. In addition, the extensible member is detachably connected with the ball planting template, so that the chip ball planting device can be mounted and dismounted, and the later maintenance and management of the chip ball planting device can be facilitated.
The embodiment of the utility model provides a chip ball planting device, the side of template body is provided with a handle that pushes down at least. The handle is pushed down and the compression process of setting up to the template body provides the strong point, has improved this chip and has planted the convenience of use and the drawing of patterns efficiency of ball device.
The embodiment of the utility model provides a chip ball planting device still includes the vacuum adsorption device, and the vacuum adsorption device is connected with the ball planting template for be fixed in the ball planting template with the chip. Therefore, in the demolding process, the chip can be stably fixed in the ball planting template and cannot be stuck to the steel net, and the reliability of the chip ball planting device is improved.
The embodiment of the utility model provides a chip ball planting device, vacuum adsorption device are including the sucking disc, the pipeline of breathing in and the air pump that connect gradually, sucking disc and this body coupling of template for adsorb the chip. The vacuum adsorption device with the structure has the advantages of simple structure, easy realization and low cost.
The embodiment of the utility model provides a chip ball planting device, the second through-hole that link up is seted up at base body middle part, and the breathing pipe passes through the second through-hole and extends to the base bottom. The second through-hole offer help laying vacuum adsorption device's suction line, humanized design has improved structural rationality.
The embodiment of the utility model provides a chip plants ball device is provided with two at least locating parts on the template body, and the steel mesh is fixed a position and is fixed through the locating part. The locating part is provided with and helps fixed steel mesh to improve the counterpoint precision between steel mesh and the chip, improve and plant the ball precision, improve the yield.
The embodiment of the utility model provides a chip ball planting device, first through-hole are the round hole, and the support column is the cylinder. From this, in the drawing of patterns process, the support column of cylinder wears to locate circular shape first through-hole, has reduced frictional force between them, has improved drawing of patterns efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a chip ball mounting device according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a vacuum adsorption device in the chip ball mounting device according to an embodiment of the present invention;
description of reference numerals:
1-a base; 11-a base body; 12-a support column; 13-a second via;
2-planting a ball template; 21-template body; 22-a first via; 23-a groove; 24-a limit piece;
3-a telescopic member;
4-pressing the handle;
5-vacuum adsorption device; 51-a suction cup; 52-an air intake duct; 53-air pump.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Examples
The embodiment of the utility model provides a chip plants ball device, as shown in figure 1, including base 1, plant ball template 2 and extensible member 3. Wherein,
the base 1 includes a base body 11 and a plurality of support columns 12 vertically disposed on the base body 11. The support column 12 and the base body 11 may be detachably connected or fixedly connected. The support posts 12 are generally disposed at the edge of the base body 11, and the number is not limited, and may be two or three or four or five, etc.
The ball planting template 2 is used for placing a chip and a steel mesh and comprises a template body 21 and a plurality of first through holes 22 arranged on the template body 21. The number of the first through holes 22 is the same as the number of the support pillars 12, and the positions of the first through holes 22 correspond to the positions of the support pillars 12 one by one.
Preferably, the template body 21 is provided with at least one groove 23 for placing the chip, the number of the grooves 23 can be one or two or three, and the like, the setting can be performed according to actual conditions, the number of the grooves 23 is increased, the number of the chips which can be used for planting the balls at one time through the chip ball planting device is increased, and the ball planting efficiency is improved.
During actual use, the steel mesh is placed on the chip, and the opening position on the steel mesh corresponds to the electrode surface position of the chip. Preferably, at least two limiting members 24 are disposed on the formwork body 21, the steel mesh is positioned and fixed by the limiting members 24, and the limiting members 24 are generally positioning pins. The locating part 24 is provided with and helps fixed steel mesh to improve the counterpoint precision between steel mesh and the chip, improve and plant the ball precision, improve the yield.
The extensible member 3 is arranged between the base 1 and the ball planting template 2, the extensible direction is perpendicular to the base body 11 and/or the template body 21, and the template body 21 can vertically penetrate through the support column 12 through the first through hole 22. That is, after planting the ball for the chip through planting the ball template 2, the compression effect of usable extensible member 3 for template body 21 compresses towards base body 11 direction, and then makes support column 12 penetrate first through-hole 22 and jack up the steel mesh on template body 21, realizes the drawing of patterns.
It should be noted that, in the initial state (i.e., in the non-demolding state), the top end of the supporting column 12 does not penetrate the first through hole 22, but is located inside or outside the first through hole 22, in order not to affect the arrangement of the steel net.
Meanwhile, it should be noted that the extensible member 3 may be connected to the base 1 and the ball-planting form 2 at the same time, may be connected to the base 1 separately, or may be connected to the ball-planting form 2 separately, as long as the extensible direction is perpendicular to the base body 11 or the form body 21. The connection mode is preferably detachable connection, which is beneficial to the assembly and disassembly of the chip ball-planting device and the later maintenance and management of the chip ball-planting device.
In this embodiment, the telescopic member 3 is generally a spring, and the structure is simple; and parts such as an air cylinder and the like capable of realizing the telescopic function can be selected.
The embodiment of the utility model provides a chip plants ball device plants ball template 2 and is used for planting the ball through the steel mesh to the chip. After the ball planting is finished, as the telescopic piece 3 is arranged between the base 1 and the ball planting template 2, and the telescopic direction is vertical to the base body 11 and/or the template body 21, the template body 21 can be compressed towards the direction close to the base body 11; because the template body 21 is provided with the first through holes 22, the base body 11 is provided with the support columns 12 perpendicular to the base body 11, and the template body 21 can vertically penetrate through the support columns 12 through the first through holes 22, the support columns 12 can penetrate through the first through holes 22 in the compression process, the steel mesh with planted balls is jacked up, the separation of the steel mesh and the chips is realized, and the steel mesh demoulding process is completed. In the steel mesh demoulding process, the steel mesh can be separated from the chip along the vertical direction, and the position of the solder ball is not easy to deviate.
As an alternative, the telescopic member 3 is sleeved on the supporting column 12. As an alternative embodiment, the extensible member 3 is provided between the base body 11 and the template body 21 independently of the support column 12. The utility model provides a setting of 3 positions of extensible member is comparatively nimble, and alternative height.
As an alternative, the side of the template body 21 is provided with at least one push-down handle 4. Can set up a handle 4 that pushes down respectively at a set of relative side of template body 21, after planting the ball, the handle 4 that pushes down of control both sides is compressed template body 21 towards the base direction. The pressing handle 4 provides a supporting point for the compression process of the template body 21, and the use convenience and the demoulding efficiency of the chip ball planting device are improved.
As an alternative embodiment, as shown in fig. 1 and 2, the chip ball-planting device further includes a vacuum adsorption device 5, and the vacuum adsorption device 5 is connected to the ball-planting template 2 and is used for fixing the chip in the ball-planting template 2. Therefore, in the demolding process, the chip can be stably fixed in the ball-planting template 2 and cannot be stuck on a steel net, and the reliability of the chip ball-planting device is improved.
As an alternative embodiment, as shown in fig. 2, the vacuum suction device 5 includes a suction cup 51, a suction pipe 52 and an air pump 53 connected in sequence, and the suction cup 51 is connected to the template body 21 for sucking the chip. By controlling the air pump 53, air in the suction cup 51 is purged to realize vacuum suction. The vacuum adsorption device 5 with the structure has the advantages of simple structure, easy realization and low cost.
As an optional embodiment, the middle part of the base body 11 is provided with a through second through hole 13, and the air suction pipeline 52 extends to the bottom of the base through the second through hole 13. The second through hole 13 is provided to facilitate the installation of the air suction pipeline 52 of the vacuum adsorption device 5, and the humanized design improves the structural reasonableness.
In an alternative embodiment, the first through hole 22 is a circular hole, and the support post 12 is a cylinder. From this, in the drawing of patterns process, during the support column 12 of cylinder wears to locate circular shape first through-hole 22, reduced frictional force between them, improved drawing of patterns efficiency.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (10)
1. A chip ball mounting device, comprising:
the base (1) comprises a base body (11) and a plurality of support columns (12) vertically arranged on the base body (11);
the ball planting template (2) is used for placing a chip and a steel mesh and comprises a template body (21) and a plurality of first through holes (22) formed in the template body (21);
the telescopic piece (3) is arranged between the base (1) and the ball planting template (2), and the telescopic direction is vertical to the base body (11) and/or the template body (21);
the template body (21) can vertically penetrate through the supporting column (12) through the first through hole (22).
2. The chip ball mounting device according to claim 1, wherein the telescopic member (3) is sleeved on the supporting column (12).
3. The chip ball mounting device according to claim 1, wherein the expansion member (3) is provided between the base body (11) and the template body (21) independently of the support column (12); the telescopic piece (3) is detachably connected with the ball planting template (2).
4. The chip ball mounting device according to any one of claims 1-3, wherein the side of the template body (21) is provided with at least one pressing handle (4).
5. The chip ball mounting device according to claim 1, further comprising:
and the vacuum adsorption device (5) is connected with the ball planting template (2) and is used for fixing the chip in the ball planting template (2).
6. The chip ball-planting device according to claim 5, wherein the vacuum suction device (5) comprises a suction cup (51), a suction pipe (52) and an air pump (53) which are connected in sequence, and the suction cup (51) is connected with the template body (21) and is used for sucking the chip.
7. The chip ball mounting device according to claim 6, wherein a second through hole (13) is formed in the middle of the base body (11), and the suction pipe (52) extends to the bottom of the base (1) through the second through hole (13).
8. The chip ball mounting device according to claim 1, wherein the template body (21) is provided with at least one groove (23) for placing the chip therein.
9. The chip ball mounting device according to claim 1, wherein the template body (21) is provided with at least two stoppers (24), and the steel mesh is positioned and fixed by the stoppers (24).
10. The chip ball mounting device according to claim 1, wherein the first through hole (22) is a circular hole, and the supporting column (12) is a cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820842588.9U CN208256620U (en) | 2018-05-31 | 2018-05-31 | chip ball-planting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820842588.9U CN208256620U (en) | 2018-05-31 | 2018-05-31 | chip ball-planting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208256620U true CN208256620U (en) | 2018-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820842588.9U Active CN208256620U (en) | 2018-05-31 | 2018-05-31 | chip ball-planting device |
Country Status (1)
| Country | Link |
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| CN (1) | CN208256620U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993298A (en) * | 2021-12-27 | 2022-01-28 | 深圳中科四合科技有限公司 | BGA component self-alignment structure and alignment method |
-
2018
- 2018-05-31 CN CN201820842588.9U patent/CN208256620U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993298A (en) * | 2021-12-27 | 2022-01-28 | 深圳中科四合科技有限公司 | BGA component self-alignment structure and alignment method |
| CN113993298B (en) * | 2021-12-27 | 2022-03-22 | 深圳中科四合科技有限公司 | BGA component self-alignment structure and alignment method |
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