CN219642838U - LED support structure with built-in IC - Google Patents

Abstract

The utility model relates to an LED support structure with an internal IC (integrated circuit), which comprises a support main body, conductive pins, a bonding pad, an IC chip, an LED chip and a lead, wherein the conductive pins and the bonding pad are fixed at the bottom of the support main body, the bonding pad is arranged in the middle of the support main body, a plurality of conductive pins are uniformly distributed at two side ends of the bonding pad, the IC chip is fixed on the conductive pins, a plurality of LED chips are fixed on the bonding pad, and the IC chip, the LED chip and the conductive pins are correspondingly connected through the lead. The utility model discloses an LED bracket structure with an built-in IC, which not only optimizes the wire bonding process, but also improves the sexual resistance of an LED lamp bead and is beneficial to the expansion of the subsequent functions of the LED lamp bead by arranging an independent placement area of an IC chip and an LED chip.

Description

LED support structure with built-in IC

Technical Field

The utility model relates to the technical field of LED lamps, in particular to an LED bracket structure with an internal IC.

Background

Along with the continuous development of the LED market, more and more requirements are also put forward on the integration degree of the LED lamp beads, so that not only are the diversity of the lamp beads required, but also the luminous efficiency is required, and the wiring and the PCB layout between the external circuit and the LED lamp beads are also required to be continuously simplified. The IC magical color lamp bead is a lamp bead which integrates and packages an LED chip and an IC. Usually, R, G, B is mainly three colors, but can be any single color, and the LED ports realize constant current driving. Along with the application penetration of the multicolor lamp beads in multiple fields, the specification is continuously extended, and meanwhile, the integrated matching of the control circuit and the light-emitting circuit is also required to meet the application requirements of different personalized products.

Referring to fig. 1, an example of an LED holder 5050 is shown, where three-channel ICs and R, G, B three-color LED chips may be placed inside the lamp beads, and four-channel ICs and R, G, B, Y four-color LED chips may also be placed inside the lamp beads. The IC and the LED lamp beads are placed in the center of the support functional area, the IC and the LED lamp beads are not placed in specific positions, the die bonding and wire bonding process is needed to be considered simultaneously in position placement, the PAD area is small in the IC, the space between the PAD and the PAD is small, in addition, when the gold wires are used for electrically communicating the IC, the LED and the substrate, the electric connection can be realized only by needing to punch a plurality of gold wires, the wire-to-wire crossing process is generally encountered in the wire bonding process, the chip is blocked, the longer gold wires are needed to be punched, and the use performance of the lamp beads is easily affected, and the subsequent function expansion is not facilitated due to the limited placement and installation positions.

Accordingly, there is a need to provide an LED mounting structure with an IC built therein to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to overcome the defects and the defects of the prior art, and provides an LED bracket structure with an internal IC, and by arranging an independent placement area of an IC chip and an LED chip, the utility model not only optimizes the wire bonding process, but also improves the sexual resistance of the LED lamp bead, and is also beneficial to the development of the subsequent functions of the LED lamp bead.

The aim of the utility model is realized by the following technical scheme:

the utility model provides a built-in IC's LED support structure, includes support main part, electrically conductive foot, pad, IC chip, LED chip and lead wire, electrically conductive foot and pad are fixed support main part's bottom, just the pad set up in support main part's middle part, a plurality of electrically conductive foot evenly distributed is in the both sides end of pad, the IC chip is fixed on the electrically conductive foot, a plurality of the LED chip is fixed on the pad, just pass through between IC chip, LED chip and the electrically conductive foot the lead wire corresponds each other and connects.

As a preferred technical solution of the present utility model, the conductive pins are provided with a first conductive pin, a second conductive pin, a third conductive pin, a fourth conductive pin, a fifth conductive pin and a sixth conductive pin, and the first conductive pin, the second conductive pin and the third conductive pin are disposed at one end of the bracket main body, and the fourth conductive pin, the fifth conductive pin and the sixth conductive pin are disposed at the other end of the bracket main body.

As a preferable technical scheme of the utility model, the inner end of the second conductive pin is provided with an extension part, and the IC chip is fixed on the extension part.

As a preferable technical scheme of the utility model, the fourth conductive pin and the sixth conductive pin are provided with bending parts, and the bending parts of the fourth conductive pin and the sixth conductive pin are symmetrically arranged at two ends of the bonding pad.

As a preferable technical scheme of the utility model, the bending part is provided with an L-shaped structure, one end of the bending part is connected with the fourth conductive pin or the sixth conductive pin, and the other end of the bending part is provided at one end of the extension part.

As an optimized technical scheme of the utility model, the bracket main body is provided with the bottom interval white channel and the light reflecting frame, the light reflecting frame is connected to the edge of the upper end of the bottom interval white channel, and the bottom interval white channel and the light reflecting frame are arranged into an integrated structure.

As a preferable technical scheme of the utility model, the upper end of the bottom interval white channel is provided with a step fixing groove.

As a preferable technical scheme of the utility model, the bottom ends of the conductive pins and the bonding pads are provided with step blocks, and the step blocks are inlaid in the step fixing grooves.

As a preferable technical scheme of the utility model, the middle part of the reflective frame is set as a functional area, and the inner ends of the bonding pad, the IC chip, the LED chip, the lead wire and the conductive pin are all arranged in the functional area.

As a preferable technical scheme of the utility model, the side wall of the light reflecting frame is provided with a light reflecting surface, and one corner outside the light reflecting frame is set as a marking corner

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, one conductive pin is extended inwards to place the IC chip, so that the IC chip and the LED chip are provided with respective die bonding areas, the situation that the distance between the IC chip and the LED chip is too close, die bonding abnormality is reduced, the LED chip is limited between two PADs on the IC chip is avoided, the influences of the PAD position and the lead frame position on the IC chip are reduced, and the die bonding process is optimized.

2. According to the utility model, as the IC chip and the LED chip can be independently welded in a specific area, the difficulty in welding wires such as chip blocking and crossing among leads is reduced; meanwhile, the bending part is arranged to extend the far conducting pins to the vicinity of the IC chip, so that the situation that a long lead wire needs to be bonded when the PAD and the conducting pins on the IC chip are far away is avoided, and the wire bonding process is optimized.

3. The utility model optimizes the solid welding process of the LED lamp beads, effectively improves the yield of products, and avoids the lamp beads from being abnormally dead, invalid and the like; the distance between the IC chip and the LED chip is adjusted, shielding of light of the LED is avoided, luminous efficiency of the lamp bead is improved, and in addition, the placement position of the LED chip is also located at the central part of the bracket, and light distribution of the lamp bead is improved.

4. According to the LED lamp bead, the extending part and the bending part are arranged on the corresponding conductive pins, so that on one hand, the placing positions of the IC chip and the LED chip are increased by the extending part, more LED chips are more conveniently placed, or more PADs and functional ICs are adopted, and the subsequent function expansion of the LED lamp bead is more facilitated; on the other hand, the bending part is positioned at the middle position of the white channel at the bottom and spans across the bracket main body to play a role of reinforcing structure, so that the compactness and bending resistance of the bracket are further improved, and the risk of fracture of the bracket by the white channel is improved.

Drawings

Fig. 1 is a drawing of the background of the utility model.

Fig. 2 is a schematic structural view of an LED support according to the present utility model.

Fig. 3 is a schematic top view of the LED support of the present utility model.

Fig. 4 is a schematic diagram of a distribution structure of conductive pins and pads according to the present utility model.

Fig. 5 is a schematic diagram of a connection structure among a conductive pin, an IC chip and an LED chip according to the present utility model.

Fig. 6 is a schematic structural view of the bracket body of the present utility model.

Wherein the above figures include the following reference numerals:

1. the support comprises a support body, 11, a bottom interval white channel, 111, a step fixing groove, 12, a light reflecting frame, 121, a functional area, 122, a light reflecting surface, 123, a marking angle, 2, a conductive pin, 21, a first conductive pin, 22, a second conductive pin, 23, a third conductive pin, 24, a fourth conductive pin, 25, a fifth conductive pin, 26, a sixth conductive pin, 27, an extension part, 28, a bending part, 3, a bonding pad, 4, an IC chip, 5, an LED chip, 6, a lead wire, 7 and a step block.

Detailed Description

The present utility model will be described in further detail with reference to examples and drawings, but embodiments of the present utility model are not limited thereto.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

As shown in fig. 2 to 6, the present utility model is embodied as follows: the utility model provides a built-in IC's LED support structure, including support main part 1, electrically conductive foot 2, bonding pad 3, IC chip 4, LED chip 5 and lead wire 6, fix electrically conductive foot 2 and bonding pad 3 through the mode of moulding plastics in the bottom of support main part 1, set up bonding pad 3 in the middle part of support main part 1, fix a plurality of LED chips 5 on bonding pad 3, install red R in this embodiment, green G, blue B, four kinds of chips of yellow Y, satisfy the diversified requirement of lamp pearl, a plurality of electrically conductive foot 2 evenly distributed are at the both ends of support main part 1, and the outer end of electrically conductive foot 2 exposes in the outside, be used for connecting power or other electrical components and carry out the circular telegram, then fix IC chip 4 on electrically conductive foot 2, rethread lead wire 6 is according to circuit requirement with electrically conductive foot 2, the mutual correspondence between IC chip and the LED chip, form a LED lamp pearl passageway. Through adopting this structure, separate the independent fixed with IC chip 4 and LED chip 5, avoid too near and cause solid brilliant abnormal phenomenon to take place between the two, also effectively optimized the bonding wire technology of LED lamp pearl simultaneously, promoted the sexual tolerance of lamp pearl, still be favorable to the expansion of the follow-up function of lamp pearl.

In the embodiment of the utility model, six conductive pins 2 are provided according to the connection requirement of the lamp bead circuit, namely, a first conductive pin 21, a second conductive pin 22, a third conductive pin 23, a fourth conductive pin 24, a fifth conductive pin 25 and a sixth conductive pin 26, the conductive pins 2 are uniformly arranged on two sides, the first conductive pin 21, the second conductive pin 22 and the third conductive pin 23 are arranged on one end of the bracket main body 1 and are also arranged on one side end of the bonding pad 3, and the fourth conductive pin 24, the fifth conductive pin 25 and the sixth conductive pin 26 are arranged on the other end of the bracket main body 1 and are also arranged on the other side end of the bonding pad 3, so that wire bonding connection is convenient.

In order to separate and fix the IC chip 4 from the LED chip 5, an extension portion 27 is provided at the inner end of the second conductive pin 21, and fix the IC chip 4 on the extension portion 27, since the extension portion 27 is protruding toward the middle and the same side end of the bonding PAD 3 is recessed inward, in the subsequent functional expansion of the LED lamp bead, the area of the extension portion 27 can be increased appropriately, so that more LED chips 5 can be placed, and more PAD and functional IC chips can be adopted, thereby having strong applicability; the area of the IC chip 4 can be properly increased, a plurality of PADs used for connection are arranged on the IC chip 4, the distance between the PADs can be increased, the bonding wire connection is facilitated, and the bonding wire process is optimized.

In addition, because the position of the IC chip 4 is changed, the distance between the IC chip and the conductive pin 2 at the other end of the bracket main body 1 is increased, in order to reduce the use of the lead wire 6 and avoid disorder of wire bonding connection, the fourth conductive pin 24 and the sixth conductive pin 26 are provided with bending parts 28, the bending parts 28 are in an L-shaped structure, one end of each bending part 28 is connected with the fourth conductive pin 24 or the sixth conductive pin 26, the other end of each bending part is bent and extended near the extending part 27, the wire bonding connection is more convenient, and the bending parts 28 of the fourth conductive pin 24 and the sixth conductive pin 26 are symmetrically arranged at the two ends of the bonding pad 3 at the same time, and traverse the middle part of the bracket main body 1, which is equivalent to arranging two reinforcing ribs in the bracket, thereby further improving the compactness and the bending resistance of the bracket.

In the embodiment of the utility model, the bracket main body 1 is provided with the bottom interval white channel 11 and the reflective frame 12, the reflective frame 12 is connected to the upper end edge of the bottom interval white channel 11, and the bracket main body 1 is manufactured by injection molding, so that the bottom interval white channel 11 and the reflective frame 12 are of an integrated structure, and the bottom ends of the conductive pins 2 and the bonding pads 3 are provided with the step blocks 7, and the step fixing grooves 111 are formed in the corresponding positions of the molded bottom interval white channel 11, so that the step blocks 7 are embedded in the step fixing grooves 111, the LED lamp bead structure is reinforced, and the conductive pins 2 and the bonding pads 3 are prevented from falling off.

In the embodiment of the utility model, the middle part of the reflective frame 12 is set as the functional area 121, and the bonding pad 3, the IC chip 4, the LED chip 5, the lead 6 and the inner ends of the conductive pins 2 are all arranged in the functional area 121, the IC chip 4 and the LED chip 5 are independently placed for die bonding, thereby avoiding the shielding of the chip, effectively improving the luminous efficiency of the lamp bead, and simultaneously, the placement of the LED lamp bead 5 can be properly adjusted towards the center of the bracket, and improving the light distribution of the lamp bead; and a reflecting surface 122 is arranged on the side wall of the reflecting frame 12, so that the lamp light can be diffused out to the periphery; and one corner outside the reflecting frame 12 is set as a marking corner 123, so that a user can clearly know the anode and the cathode of the bracket, and the burning out caused by the wrong connection of the lamp beads is avoided.

The foregoing examples merely illustrate embodiments of the utility model and are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (9)

1. The utility model provides a built-in IC's LED support structure, its characterized in that includes support main part, electrically conductive foot, pad, IC chip, LED chip and lead wire, electrically conductive foot and pad are fixed support main part's bottom, just the pad set up in support main part's middle part, a plurality of electrically conductive foot evenly distributed is in the both sides end of pad, the IC chip is fixed on the electrically conductive foot, a plurality of the LED chip is fixed on the pad, just pass through between IC chip, LED chip and the electrically conductive foot the lead wire corresponds each other and connects, and fourth electrically conductive foot and sixth electrically conductive foot are provided with the bending portion, and the bending portion symmetry of fourth electrically conductive foot and sixth electrically conductive foot sets up the both ends of pad.

2. The LED mounting structure of claim 1, wherein the conductive pins are provided with a first conductive pin, a second conductive pin, a third conductive pin, a fourth conductive pin, a fifth conductive pin, and a sixth conductive pin, and the first, second, and third conductive pins are disposed at one end of the mounting body, and the fourth, fifth, and sixth conductive pins are disposed at the other end of the mounting body.

3. The LED mounting structure of claim 2, wherein the inner ends of the second conductive pins are provided with extensions, and the IC chip is fixed to the extensions.

4. The LED mounting structure of claim 3, wherein the bending portion is configured as an L-shaped structure, one end of the bending portion is connected to the fourth conductive leg or the sixth conductive leg, and the other end of the bending portion is disposed at one end of the extending portion.

5. The LED mounting structure of claim 1, wherein the mounting body is provided with a bottom spacer white channel and a reflective frame, the reflective frame is connected to an upper edge of the bottom spacer white channel, and the bottom spacer white channel and the reflective frame are integrally formed.

6. The IC-embedded LED package assembly of claim 5, wherein the upper end of the bottom spacer white channel is provided with a stepped fixing groove.

7. The LED mounting structure of claim 6, wherein the conductive pins and the bottom ends of the bonding pads are provided with step blocks, and the step blocks are embedded in the step fixing grooves.

8. The LED package structure of claim 6, wherein the reflective border has a functional area at a middle portion thereof, and the pad, the IC chip, the LED chip, the lead wire, and the inner ends of the conductive pins are all disposed in the functional area.

9. The IC-embedded LED package assembly of claim 6, wherein the side walls of the light reflecting bezel are provided with light reflecting surfaces, and wherein one corner of the exterior of the light reflecting bezel is provided as a logo corner.