CN219641926U - Laser radar and vehicle - Google Patents

Abstract

The utility model relates to a laser radar and a vehicle, wherein the laser radar comprises: the laser comprises a metal substrate, a PCB (printed circuit board), a laser emitting chip and a laser receiving chip; the PCB board is fixed in the surface of metal base plate, and the PCB board includes first hole and second hole, and laser emission chip is fixed in on the metal base plate through first hole, and laser receiving chip is fixed in on the metal base plate through the second hole, and laser emission chip and laser receiving chip are respectively with PCB board electric connection. According to the laser radar, the laser transmitting chip and the laser receiving chip are fixed on the same metal substrate, so that the adhesion failure of the laser transmitting chip and the laser receiving chip and the substrate at the vehicle-mounted limiting temperature is avoided, and the reliability of the laser radar is further improved.

Description

Laser radar and vehicle

Technical Field

The utility model relates to the technical field of laser detection, in particular to a laser radar and a vehicle.

Background

Lidar, which is an important component of an autonomous vehicle, can be classified into a mechanical type, a solid type, and a hybrid solid type in a scanning manner. Where solid-state lidar has no rotating and movable scanning components, its proper operation relies on an exact match of the positions of the laser emitting chip and the laser receiving chip. The solid-state laser radar has the advantages of small size, high precision, high speed and the like, and becomes a future development trend of the automatic driving vehicle.

The existing solid-state laser radar generally attaches a laser transmitting chip and a laser receiving chip to a PCB substrate to complete assembly, and under the vehicle-mounted limiting temperature, a large amount of residual stress is easily generated between the laser transmitting chip and the laser receiving chip and the PCB substrate, so that the laser transmitting chip and the laser receiving chip deform, warp and the like, and then the laser transmitting chip and the laser receiving chip are attached to the substrate to fail, thereby affecting the reliability of the laser radar.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, an object of the present utility model is to provide a lidar and a vehicle to improve the reliability of the lidar at the vehicle-mounted limit temperature.

In a first aspect, the present utility model provides a lidar comprising: the laser comprises a metal substrate, a PCB (printed circuit board), a laser emitting chip and a laser receiving chip; the PCB board is fixed in the surface of metal base plate, and the PCB board includes first hole and second hole, and laser emission chip is fixed in on the metal base plate through first hole, and laser receiving chip is fixed in on the metal base plate through the second hole, and laser emission chip and laser receiving chip are respectively with PCB board electric connection.

The laser radar of the utility model forms the first hole and the second hole by manufacturing the via hole on the PCB. The PCB is attached to the metal substrate, and the laser emitting chip and the laser receiving chip are respectively arranged in the first hole and the second hole and are respectively fixed with the metal substrate, so that the positions of the laser emitting chip and the laser receiving chip are limited. Through setting up laser emission chip and laser receiving chip respectively with PCB board electric connection to make laser emission chip can emit the detection light under the control of the drive circuit on the PCB board, in order to scan the obstacle.

It can be understood that the metal substrate has good thermal conductivity, and the thermal expansion coefficients of the metal substrate, the laser emitting chip and the laser receiving chip are well matched, and the laser emitting chip and the laser receiving chip are fixed on the metal substrate, so that the laser emitting chip, the laser receiving chip and the substrate are prevented from being attached to fail at the vehicle-mounted limiting temperature, and the reliability of the laser radar is further improved. Meanwhile, the metal substrate has higher surface flatness, and the attaching position precision of the laser transmitting chip and the laser receiving chip can be improved.

In one embodiment, the package profile of the laser emitting chip is stepped, and the laser emitting chip includes two electrodes of opposite polarity, one electrode being located at the upper step and the other electrode being located at the lower step.

In this embodiment, the package shape of the laser emitting chip is set to be step-shaped, so that two electrodes opposite to each other of the laser emitting chip are disposed on the same side of the laser emitting chip, and the laser emitting chip can be directly attached to the metal substrate. That is, the electrical connection between the laser emitting chip and the PCB is ensured, and the defects of short circuit and the like caused by the contact between the electrode of the laser emitting chip and the metal substrate can be avoided.

In one embodiment, the periphery of the upper step surface is provided with a positive electrode of the laser emitting chip, and the positive electrode is electrically connected with the PCB through a gold wire; the periphery of the lower step surface is provided with a negative electrode of the laser emitting chip, and the negative electrode is electrically connected with the PCB through a gold wire.

In the present embodiment, the positive and negative electrodes of the laser emitting chip are disposed at the outer periphery of the upper step and the outer periphery of the lower step, respectively, to expose the center of the step, so that the detection light can be emitted from the center of the step. The two electrodes are respectively connected with the PCB through gold wires so as to realize the electric connection between the laser emitting chip and the PCB.

In one embodiment, pins are arranged on the upper surface of the package of the laser receiving chip and are electrically connected with the PCB through gold wires.

In one embodiment, the device further comprises a bracket fixed on the metal substrate; the bracket is used for fixing the projection lens group and the fixed receiving lens group; the projection lens group is arranged right above the laser transmitting chip, and the receiving lens group is arranged right above the laser receiving chip.

In this embodiment, a projection lens group is disposed right above the laser emission chip to reduce the divergence angle of the detection light to ensure the quality of the light beam. And a receiving lens group is arranged right above the laser receiving chip to receive the light beam reflected by the obstacle in a large range as possible. And meanwhile, the bracket is arranged on the metal substrate and is used for fixing the projection lens group and the receiving lens group.

In one embodiment, the support is made of a material having a similar thermal expansion coefficient to the metal substrate.

In this embodiment, the bracket is made of a material with a thermal expansion coefficient similar to that of the metal substrate, so as to reduce residual stress generated between the bracket and the metal substrate at the vehicle-mounted limiting temperature, and further improve the attachment reliability of the bracket and the metal substrate, thereby further improving the reliability of the laser radar.

In one embodiment, the bracket, the laser emitting chip and the laser receiving chip are fixed on the metal substrate by glue.

In one embodiment, the lidar is a solid-state lidar and the lasing chip comprises: a VSCEL array; the laser receiving chip includes: SPAD arrays.

In this embodiment, the laser emitting chip includes the VSCEL array, so that the detection light can be emitted along the direction perpendicular to the metal substrate, thereby simplifying the structure of the laser radar. Meanwhile, the VSCEL array has the advantages of high output power and high quality light beams, so that the power consumption of the laser radar can be reduced, and the reliability of the laser radar can be improved. The laser receiving chip comprises the SPAD array, so that detection light reflected to the laser receiving chip can be directly converted into digital signals, the number of components required by the laser radar is reduced, and the structure of the laser radar is further simplified. Meanwhile, the SPAD array has single photon detection capability, so that the efficiency can be improved.

In one embodiment, the material of the package substrate of the laser emitting chip is aluminum nitride.

In the embodiment, the packaging substrate is manufactured by adopting the aluminum nitride material based on the advantages of high heat conduction, high insulation, high circuit accuracy, high surface flatness, low thermal expansion coefficient and the like, so that the reliability of the laser radar can be improved.

In one embodiment, the laser emitting chip has M light emitting units, and the light emitting units are divided into N groups, and M > N; each light-emitting unit in each group is connected in series and is electrically connected to the PCB through a metal wire.

In this embodiment, the plurality of light emitting units are grouped, and each group of light emitting units is electrically connected to the PCB board through the metal wire, so as to further simplify the circuit and realize the grouping control of the detection light.

In one embodiment, the projections of the individual gold wires onto the surface of the metal substrate are spaced apart from each other.

In the embodiment, the projection of each gold wire on the surface of the metal substrate is arranged at intervals, so that the risk of accidental overlapping between the gold wires is reduced, and the reliability of the laser radar is improved.

In one embodiment, the laser receiving lens set includes an optical filter for filtering the ambient light to avoid interference of the ambient light with the detection light reflected to the laser receiving chip.

In this embodiment, the optical filter is disposed at the laser receiving lens group, so as to filter the light rays of other wavebands except the detection light rays, so as to avoid the interference of the ambient light on the detection light rays, and further improve the detection precision.

In one embodiment, the metal substrate is an aluminum substrate.

In this embodiment, the metal substrate is provided as the aluminum substrate based on the advantages of higher thermal conductivity, higher insulation and relatively lower price of the aluminum substrate, so as to further improve the reliability of the laser radar and reduce the manufacturing cost thereof.

In a second aspect, the utility model provides a vehicle comprising a lidar as in any of the embodiments described above.

It will be appreciated that the vehicle of the second aspect of the present utility model has a higher reliability due to the use of the lidar provided by the first aspect of the present utility model.

Drawings

FIG. 1 is a view of a laser radar action area of a terminal provided by the utility model and illustrated by taking a vehicle as an example;

FIG. 2 is a schematic cross-sectional view of a lidar according to an embodiment of the present utility model;

FIG. 3 is a schematic cross-sectional view of a lidar according to another embodiment of the present utility model;

FIG. 4 is a schematic perspective view of a laser emitting chip;

fig. 5 is a schematic plan view of a VSCEL array.

Reference numerals:

100-laser radar; 10-a metal substrate; 11-a first surface; 20-a PCB board; 21-a first hole; 22-a second hole; 30-a laser emitting chip; 31-positive electrode; 32-negative electrode; 33-a first step; 34-a second step; 35-step center; 36-a light emitting unit; 40-a laser receiving chip; 41-upper surface; 42-pins; 50-gold wire; 60-supporting; 61-through holes; 70-a projection lens group; 80-receiving a lens group; 81-a lens; 82-an optical filter; 90-electronic component.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the utility model may be practiced. The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present utility model are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present utility model, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. It should be noted that the terms "first," "second," and the like in the description and claims of the present utility model and in the drawings are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprises," "comprising," "includes," "including," or "having," when used in this specification, are intended to specify the presence of stated features, operations, elements, etc., but do not limit the presence of one or more other features, operations, elements, etc., but are not limited to other features, operations, elements, etc. Furthermore, the terms "comprises" or "comprising" mean that there is a corresponding feature, number, step, operation, element, component, or combination thereof disclosed in the specification, and that there is no intention to exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

The radar is arranged on the terminal product and is used for detecting obstacles or target objects. For example, when the terminal product is intelligent transportation equipment such as a vehicle, the function of detecting the obstacle can be realized through a radar arranged on the vehicle body; or through the radar that sets up in the cabin, when detecting that the user gets into or leaves the vehicle, corresponding switching on or switching off partial function. For obstacle detection, the terminal product of the utility model can also be intelligent household equipment or intelligent manufacturing equipment, such as unmanned aerial vehicle, robot and the like. In the detection process of the terminal product, the obstacle or the target object in the surrounding environment needs to be identified so as to achieve the functions of detecting the obstacle and avoiding collision or accurately identifying the target object. For convenience of description, in the embodiment of the present utility model, an application of the radar in the end product is described by taking a vehicle to detect an obstacle as an example.

Please refer to a schematic diagram of the vehicle-to-radar application according to the embodiment of the present utility model shown in fig. 1.

In this embodiment, the vehicle may be a gasoline or diesel powered vehicle, an electric vehicle, a hybrid vehicle, or the like, and the radar may be used in one or more of the manners shown in fig. 1.

In the vehicle shown in fig. 1, a plurality of detection areas of the radar are provided based on a plan view structure of the vehicle. Wherein in zone i, in the position directly in front of and directly behind the vehicle, a parking assistance system (Parking Assist System, PAS) and/or an automatic parking assistance system (Auto Parking Assist, APA) may be provided; in the II zone, two-side coming car warnings (Cross Traffic Assist, CTA) can be set at two-side oblique front positions of the car; in the third area, an automatic parking assist system (Auto Parking Assist, APA), a parking space measurement system (Parking Lot Vulture, PLV), side View (Side View), and the like may be provided at both Side positions of the vehicle; in the iv region, door opening warning systems (DOA), reversing warning systems (Rear Cross Traffic Alert, RCTA), blind area monitoring systems (Blind spot vehicle Discern System, BSD), lane changing auxiliary systems (Lane Change Assist, LCA) and the like can be arranged at rear positions of two oblique sides of the vehicle; in the v region, a rear automatic emergency brake (Rear Automatic Emergency Braking, R-AEB) or the like may be provided at a position slightly farther from the rear of the vehicle.

In a scene where a road is relatively congested or an obstacle such as a parking lot is relatively dense, a vehicle is generally slow in speed, and it is necessary to detect the obstacle in a 360-degree range of the whole vehicle. The detection range is wide and the detection precision is high based on the laser radar, so that the utility model realizes the area monitoring by arranging the laser radar for the I-V area so as to accurately detect the short-distance obstacle. It can be understood that, for the end products such as unmanned aerial vehicle, robot, etc., in the respective use scenes, there are situations that the surrounding obstacles are relatively dense, and the laser radar related to the utility model can also be adopted to detect the obstacles.

Please refer to fig. 2, which is a schematic diagram illustrating a cross-sectional structure of a lidar 100 according to an embodiment of the present utility model. The lidar 100 may be provided in a vehicle to which the present utility model relates for enabling an operation of obstacle detection.

As shown in fig. 2, the inventive lidar 100 comprises a metal substrate 10, a PCB board 20, a laser emitting chip 30 and a laser receiving chip 40. The metal substrate 10 has a first surface 11, and the pcb board 20, the laser emitting chip 30, and the laser receiving chip 40 are all located on the first surface 11. The PCB 20 is provided with two vias, a first hole 21 and a second hole 22, respectively. The laser emitting chip 30 is fixed on the first surface 11 of the metal substrate 10 through the first hole 21, and the laser receiving chip 40 is fixed on the first surface 11 of the metal substrate 10 through the second hole 22.

In one embodiment, the laser radar 100 of the present utility model is further provided with a plurality of gold wires 50, wherein some gold wires 50 are connected between the PCB 20 and the laser emitting chip 30, and other gold wires 50 are connected between the PCB 20 and the laser receiving chip 40, so that the laser emitting chip 30 and the laser receiving chip 40 are electrically connected with the PCB 20 respectively. The surface of the PCB 20 facing away from the metal substrate 10 is provided with a driving circuit (not shown in the figure), and the laser emitting chip 30 and the laser receiving chip 40 are respectively electrically connected with the PCB 20, that is, respectively connected with the corresponding driving circuits on the PCB 20.

The laser emitting chip 30 emits detection light to detect an obstacle outside the vehicle under the driving of the corresponding driving circuit, the detection light is received by the laser receiving chip 40 after being reflected by the obstacle, and the laser receiving chip 40 feeds back detection information to the system control unit. The system control unit controls driving behavior of the vehicle body based on the detection information.

It will be appreciated that whether or not the laser receiving chip 40 can accurately receive the detection information depends on whether or not the positional matching of the laser emitting chip 30 and the laser receiving chip 40 is accurate. In the prior art, a laser transmitting chip and a laser receiving chip are attached to a PCB (printed circuit board) in general, when the laser radar works under a severe vehicle-mounted condition, a large amount of residual stress is easily generated between the laser transmitting chip and the laser receiving chip and the PCB substrate, so that the laser transmitting chip and the laser receiving chip deform and warp, and the like, so that the relative positions of the laser transmitting chip and the laser receiving chip deviate, and the reliability of the laser radar is further influenced.

According to the laser radar 100 disclosed by the utility model, the laser emitting chip 30 and the laser receiving chip 40 are attached to the same metal substrate 10, the metal substrate 10 has good thermal conductivity, and the thermal expansion coefficients of the metal substrate 10 and the laser emitting chip 30 and the laser receiving chip 40 are well matched, so that the attachment failure of the laser emitting chip 30 and the laser receiving chip 40 and the substrate at the vehicle-mounted limiting temperature can be avoided, the relative positions of the laser emitting chip 30 and the laser receiving chip 40 are prevented from being influenced, and the reliability of the laser radar 100 can be further improved. Meanwhile, the attachment position accuracy of the laser emitting chip 30 and the laser receiving chip 40 can be improved based on the fact that the metal substrate 10 has high surface flatness.

As shown in fig. 3 and 4, in one embodiment, the laser emitting chip 30 includes a positive electrode 31 and a negative electrode 32, and the package shape of the laser emitting chip 30 is stepped, the positive electrode 31 being located at the upper stepped surface periphery, that is, the positive electrode 31 being located at the first stepped surface periphery 33, and the negative electrode 32 being located at the lower stepped periphery, that is, the negative electrode 32 being located at the second stepped surface periphery 34. While the positive electrode 31 and the negative electrode 32 are connected to the PCB board 20 through gold wires 50, respectively.

It can be appreciated that, in the present embodiment, the package shape based on the laser emitting chip 30 is in a step shape, so that two electrodes of the laser emitting chip 30 can be disposed on the same side of the laser emitting chip 30, thereby directly attaching the laser emitting chip 30 to the first surface 11, and avoiding the adverse conditions such as short circuit caused by contact between the electrodes of the laser emitting chip 30 and the metal substrate 10. Meanwhile, the positive electrode 31 and the negative electrode 32 are respectively disposed at the periphery of the first step 33 and the periphery of the second step 34, so that the step center 35 can be exposed, so that the detection light emitted from the laser emitting chip 30 can be emitted from the step center 35.

As shown in fig. 3, in one embodiment, the package upper surface 41 of the laser receiving chip 40 is provided with pins 42, and gold wires 50 connect the pins 42 and the PCB 20 to achieve electrical connection of the laser emitting chip 30 and the PCB 20.

In the embodiment illustrated in fig. 3, the inventive lidar 100 further comprises a holder 60, a projection lens group 70 and a receiving lens group 80. The bracket 60 is fixed on the first surface 11 of the metal substrate 10. The holder 60 is provided with through holes 61, the number of which is two, and the two through holes 61 are located directly above the laser emitting chip 30 and the laser receiving chip 40, respectively. The projection lens group 70 and the receiving lens group 80 are fixed to the holder 60 through the through holes 61, respectively.

It can be understood that in the present embodiment, the holder 60 is fixed on the metal substrate 10, and the projection lens group 70 and the receiving lens group 80 are respectively fixed on the holder 60 to define the relative positions of the projection lens group 70 and the receiving lens group 80 and the laser emitting chip 30 and the laser receiving chip 40, respectively. The projection lens group 70 is disposed right above the laser emitting chip 30, so that the divergence angle of the detection light can be reduced to ensure the quality of the light beam. The receiving lens group 80 is disposed right above the laser receiving chip 40 to receive the light beam reflected by the obstacle in a large range, thereby improving the signal intensity of the detection light.

In the embodiment shown in fig. 3, the receiving lens group 80 includes lenses 81 and filters 82, and the number of lenses 81 may be plural, and the plural lenses 81 may be arranged at intervals. The filter 82 is located on the side of the lens 81 close to the laser receiving chip 40. It will be appreciated that the optical filter 82 can filter ambient light, i.e. filter light in other bands than the detection light, and prevent light in other bands from being reflected to the laser receiving chip 40, so as to avoid interference of the ambient light on the detection light reflected to the laser receiving chip 40, and influence the detection result.

In one embodiment, the support 60 is made of a material having a similar thermal expansion coefficient to that of the metal substrate 10.

It can be appreciated that in the present embodiment, the bracket 60 is made of a material having a thermal expansion coefficient similar to that of the metal substrate 10, for example, a liquid crystal polymer (Liquid Crystal Polyester, LCP) may be used to make the bracket 60, so that residual stress generated between the bracket 60 and the metal substrate 10 at the vehicle-mounted limiting temperature may be reduced, and further, the reliability of attachment between the bracket 60 and the metal substrate 10 may be improved, thereby further improving the reliability of the lidar 100.

In one embodiment, the stand 60, the laser emitting chip 30 and the laser receiving chip 40 may be fixed on the metal substrate 10 by glue to ensure the reliability of the laser radar 100, and also simplify the assembly process.

As shown in fig. 3, the laser radar 100 of the present utility model further includes an electronic component 90, and the electronic component 90 is mounted on the PCB 20. The number of the electronic components 90 may be plural, and the plural electronic components 90 may be configured as chips, or may be electronic devices such as capacitors and resistors. The electronic components are electrically connected to the PCB 20 to achieve a predetermined function.

In the above embodiment, the number of the PCB boards 20 is one, and the attachment of the laser emitting chip 30 and the laser receiving chip 40 to the metal substrate 10 is achieved by punching holes in the PCB boards 20. In other embodiments, the number of the PCBs 20 may be multiple, and each PCB 20 may be respectively mounted with the electronic components 90, and the electrical connection between the PCBs 20 is achieved through a transmission line (not shown).

In one embodiment, the laser radar 100 is a pure solid-state laser radar, no moving parts are in the pure solid-state laser radar, and scanning can be realized only by matching the semiconductor chip with the optical lens, so that the problem that the moving parts are not high in reliability under severe vehicle-mounted conditions is solved.

In one embodiment, the laser emitting chip 30 of the present utility model includes: a VSCEL array; the laser receiving chip 40 includes: SPAD arrays. As shown in fig. 5, the VSCEL array is to array a plurality of light emitting units 36 on the substrate surface of the laser emitting chip 30.

It should be noted that VSCEL is an area-emitting laser, and the laser beam of VSCEL is emitted from a direction perpendicular to the top surface thereof, which has high output power, conversion efficiency, and beam quality. The light emitting unit 36 emits a probe beam to detect an obstacle, and an echo beam of the probe beam reflected by the obstacle is received by the laser receiving chip 40, and converts an optical signal into an electrical signal, and then undergoes time conversion and histogram processing to finally obtain information of the obstacle.

In the present embodiment, based on the advantages of the VSCEL, the provision of the laser emitting chip 30 including the VSCEL array can simplify the structure of the laser radar 100, and at the same time can reduce the power consumption of the laser radar 100 and can improve the reliability of the laser radar 100. The SPAD array is based on single photon detection capability, and the laser receiving chip 40 comprises the SPAD array, so that detection light reflected to the laser receiving chip 40 can be directly converted into digital signals, the number of components required by the laser radar 100 is reduced, the structure of the laser radar 100 is further simplified, and meanwhile, the detection efficiency can be improved.

In one embodiment, the plurality of light emitting units 36 are divided into a plurality of groups, each group sequentially emitting light according to a preset timing. As shown in fig. 5, the plurality of light emitting units 36 of each column are grouped to be activated and emit light simultaneously by the driving of the driving circuit.

It can be appreciated that each group of light emitting units 36 after grouping can be electrically connected with the PCB board in series through the gold wires 50, so that the circuit can be further simplified, and meanwhile, the grouping control can enable each light emitting unit 36 to activate light emission sequentially according to the time sequence, so as to reduce crosstalk caused by simultaneous light emission detection of all the light emitting units 36. The above manner of grouping the light emitting units 36 by columns is merely described as an example, and in other embodiments, the light emitting units may be grouped by rows, sub-array groups, or the like, which is not particularly limited in the present utility model.

In one embodiment, the package substrate is fabricated from an aluminum nitride material, i.e., the second step 34 is fabricated from an aluminum nitride material. Based on the aluminum nitride material, the laser radar has the advantages of high heat conduction, high insulation, high circuit accuracy, high surface flatness, low thermal expansion coefficient and the like, so that heat dissipation can be increased, the risk of the laser emission chip 30 at the vehicle-mounted limiting temperature is reduced, meanwhile, a good insulation effect can be achieved between the laser emission chip 30 and the metal substrate 10, and the reliability of the laser radar is improved.

In one embodiment, the metal substrate 10 is an aluminum substrate. It can be appreciated that, based on the advantages of the aluminum substrate, such as high thermal conductivity, high insulation, and relatively low price, the reliability of the lidar 100 can be further improved and the manufacturing cost thereof can be reduced by selecting the aluminum substrate as the metal substrate 10.

It should be appreciated that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present utility model, the meaning of "plurality" is two or more, unless explicitly defined otherwise.

In the description of the present specification, reference to the term "some embodiments" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or examples is included in at least one embodiment of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

It is to be understood that the utility model is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims. Those skilled in the art will recognize that the full or partial flow of the embodiments described above can be practiced and equivalent variations of the embodiments of the present utility model are within the scope of the appended claims.

Claims (10)

1. A lidar, comprising: the laser comprises a metal substrate, a PCB (printed circuit board), a laser emitting chip and a laser receiving chip;

the PCB is fixed on the surface of the metal substrate, the PCB comprises a first hole and a second hole, the laser emitting chip is fixed on the metal substrate through the first hole, the laser receiving chip is fixed on the metal substrate through the second hole, and the laser emitting chip and the laser receiving chip are respectively and electrically connected with the PCB.

2. The lidar of claim 1, wherein the package profile of the lasing chip is stepped, the lasing chip comprising two electrodes of opposite polarity, the two electrodes being located on an upper step and a lower step, respectively.

3. The lidar according to claim 2, wherein the upper step surface is provided with a positive electrode of the laser emitting chip, and the positive electrode is electrically connected with the PCB board through a gold wire; the periphery of the lower step surface is provided with a negative electrode of the laser emission chip, and the negative electrode is electrically connected with the PCB through a gold wire.

4. The lidar of claim 1, wherein the package upper surface of the laser receiving chip is provided with pins, and the pins are electrically connected with the PCB board through gold wires.

5. The lidar of claim 1, further comprising a bracket fixed to the metal substrate; the bracket is used for fixing the projection lens group and the fixed receiving lens group; the projection lens group is arranged right above the laser transmitting chip, and the receiving lens group is arranged right above the laser receiving chip.

6. The lidar of claim 5, wherein the bracket is made of a material having a similar thermal expansion coefficient to the metal substrate.

7. The lidar of claim 5, wherein the bracket, the laser emitting chip, and the laser receiving chip are fixed to the metal substrate by glue.

8. The lidar of claim 1, wherein the lidar is a solid-state lidar, and the lasing chip comprises: a VSCEL array; the laser receiving chip includes: SPAD arrays.

9. The lidar of claim 2, wherein the material of the package substrate of the lasing chip is aluminum nitride.

10. A vehicle comprising a lidar according to any of claims 1 to 9.