CN211556412U - Laser seed source system and laser radar - Google Patents

Laser seed source system and laser radar Download PDF

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Publication number
CN211556412U
CN211556412U CN202020276636.XU CN202020276636U CN211556412U CN 211556412 U CN211556412 U CN 211556412U CN 202020276636 U CN202020276636 U CN 202020276636U CN 211556412 U CN211556412 U CN 211556412U
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CN
China
Prior art keywords
laser
circuit board
source system
seed source
shield
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Active
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CN202020276636.XU
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Chinese (zh)
Inventor
郭丰收
史鹏飞
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LeiShen Intelligent System Co Ltd
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LeiShen Intelligent System Co Ltd
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Priority to CN202020276636.XU priority Critical patent/CN211556412U/en
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Publication of CN211556412U publication Critical patent/CN211556412U/en
Priority to PCT/CN2021/078482 priority patent/WO2021179932A1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/484—Transmitters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • H01S3/067—Fibre lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The utility model discloses a laser seed source system and laser radar. The laser seed source system comprises a circuit board, a laser and a control module, wherein a laser emitting unit and a driving unit are integrated in the laser, the driving unit is used for driving the laser emitting unit, the laser and the control module are both arranged on the first surface of the circuit board, the laser is electrically connected with the control module, and the control module is used for controlling the driving unit. The utility model provides a laser seed source system and laser radar has simplified packaging technology, the cost is reduced.

Description

Laser seed source system and laser radar
Technical Field
The embodiment of the utility model provides a relate to optical device technical field, especially relate to a laser seed source system and laser radar.
Background
The optical fiber laser is a laser using a rare earth element doped glass optical fiber as a gain medium, has the advantages of good beam quality, high efficiency, good heat dissipation property, high reliability and the like, and becomes one of the important light source choices of the laser radar.
At present, the fiber laser is designed by a driving module and a laser separately, a ceramic substrate and a metal shell are adopted, the volume is large due to low integration level, special equipment is needed for resistance welding, and the problems of high cost, relatively complex packaging process and the like exist.
SUMMERY OF THE UTILITY MODEL
The utility model provides a laser seed source system and laser radar to simplify packaging technology, reduce cost.
In a first aspect, an embodiment of the present invention provides a laser seed source system, including: the circuit board, the laser and the control module; a laser emitting unit and a driving unit are integrated in the laser; the driving unit is used for driving the laser emitting unit; the laser and the control module are both arranged on the first surface of the circuit board; the laser is electrically connected with the control module, and the control module is used for controlling the driving unit.
Optionally, the laser seed source system further includes a first shielding cover and a second shielding cover; the first shielding cover and the second shielding cover are respectively arranged on two sides of the circuit board to form a shell of the laser seed source module.
Optionally, the laser seed source system further includes a heat dissipation unit;
the heat dissipation unit is arranged on a second surface of the circuit board, the second surface and the first surface are oppositely arranged, and the vertical projection of the heat dissipation unit on the plane of the circuit board is at least partially overlapped with the vertical projection of the laser on the plane of the circuit board.
Optionally, the first shielding cover and the second shielding cover are connected to the circuit board by dispensing or soldering.
Optionally, the first shielding cover and the second shielding cover are copper shielding covers or copper alloy shielding covers.
Optionally, the circuit board is further provided with a positioning through hole and a mounting through hole;
the positioning through hole is positioned at the edge of the circuit board and used for positioning the mounting positions of the first shielding cover and the second shielding cover;
the mounting through hole is located outside the first shield cover setting area and the second shield cover setting area.
Optionally, the laser further includes a transmission fiber;
the transmission optical fiber is connected with the laser emission unit and is used for transmitting laser pulse signals;
the circuit board further comprises a hollow part;
the vertical projection of the transmission optical fiber on the plane of the circuit board is at least partially overlapped with the hollow part.
Optionally, the circuit board further comprises a signal transmission terminal;
the signal transmission terminal is arranged at the edge of the circuit board and used for realizing signal transmission between the laser seed source system and other equipment.
Optionally, the signal transmission terminal is a gold finger or a pad.
In a second aspect, the embodiment of the present invention further provides a laser radar, including any one of the laser seed source systems of the first aspect.
The embodiment of the utility model provides a technical scheme, through with laser instrument and control module integration in same one side of a circuit board, the integrated level is high, reduced the product volume, the packaging process does not need special equipment to carry out resistance weld for the packaging process is simpler, also the cost is reduced.
Drawings
Fig. 1 is a schematic external structural diagram of a laser seed source system according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an internal structure of a laser seed source system according to an embodiment of the present invention;
fig. 3 is a schematic top view of a laser seed source system according to an embodiment of the present invention;
fig. 4 is a schematic bottom view of a laser seed source system according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another laser seed source system according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is the embodiment of the utility model provides an external structure schematic diagram of a laser seed source system, fig. 2 is the utility model provides an internal structure schematic diagram of a laser seed source system, fig. 3 is the utility model provides a overlook structure schematic diagram of a laser seed source system, fig. 4 is the utility model provides a structure schematic diagram is looked from to an upward of laser seed source system, fig. 5 is the utility model provides a structure schematic diagram of another kind of laser seed source system, as shown in fig. 1-5, the utility model provides a laser seed source system includes circuit board 10, laser 11 and control module 12. The laser 11 is internally integrated with a laser emitting unit 111 and a driving unit 112, the driving unit 113 is used for driving the laser emitting unit 111, the laser 11 and the control module 12 are both arranged on the first surface 21 of the circuit board 10, the laser 11 is electrically connected with the control module 12, and the control module 12 is used for controlling the driving unit 113.
Specifically, as shown in fig. 1-4, the embodiment of the present invention provides a laser seed source system, which sets a laser 11 and a control module 12 on a first surface 21 of a circuit board 10, wherein, a laser emitting unit 111 and a driving unit 112 are integrated in the laser 11, the laser emitting unit 111 is used for emitting laser, the driving unit 112 is connected with the control module 12 and the laser emitting unit 111 respectively, the driving unit 112 is used for driving the laser emitting unit 111 to emit laser pulse signals, and the control module 12 is used for controlling the driving unit 112 in the laser 11. The control module 12 may be a pulse circuit control module, the pulse circuit control module is configured to control the laser 11 to emit a laser pulse signal, the control module 12 may also be another controller, and a person skilled in the art may set the control module 12 according to actual requirements to implement corresponding functions. In addition, the Circuit Board 10 may be a Printed Circuit Board (PCB), which simplifies the assembly and welding of electronic products, reduces the wiring workload in the conventional manner, greatly reduces the labor intensity of workers, and is beneficial to reducing the product volume, reducing the product cost, and improving the quality and reliability of electronic devices.
The embodiment of the utility model provides a laser seed source system, through with laser instrument 11 and control module 12 integrated in the same one side of a circuit board 10, the integrated level is high, reduced the product volume, the encapsulation process does not need special equipment to carry out resistance weld for the encapsulation process is simpler, also the cost is reduced.
With continued reference to fig. 1, optionally, the laser seed source system provided by the embodiment of the present invention further includes a first shielding cover 13 and a second shielding cover 15, where the first shielding cover 13 and the second shielding cover 15 are respectively disposed on two sides of the circuit board 10, and form a housing of the laser seed source system.
Exemplarily, as shown in fig. 1, a first shielding cover 13 is disposed on a first surface 21 of a circuit board 10, a laser 11 and a control module 12 are both disposed in an accommodating space of the first shielding cover 13, a second shielding cover 15 is disposed on a second surface 22 of the circuit board 10, and the second surface 22 and the first surface 21 are disposed opposite to each other, so that the first shielding cover 13 and the second shielding cover 15 form a housing of a laser seed source system, thereby playing a role in shielding, dust-proof and water-proof, and avoiding mutual interference between the laser seed source system and other electronic circuits, so as to protect the circuit board 10.
With continuing reference to fig. 2 and fig. 4, optionally, the laser seed source system provided in the embodiment of the present invention further includes a heat dissipation unit 14, the heat dissipation unit 14 is disposed on the second surface 22 of the circuit board 10, the second surface 22 and the first surface 21 are disposed opposite to each other, and a vertical projection of the heat dissipation unit 14 on the plane where the circuit board 10 is located at least partially overlaps a vertical projection of the laser 11 on the plane where the circuit board 10 is located.
Specifically, the heat dissipation unit 14 is used for avoiding the damage of the device caused by the overhigh temperature of the laser 11 during operation, and the heat dissipation unit 14 and the laser 11 are respectively arranged on two sides of the circuit board 10, and the heat dissipation unit 14 is arranged at the position corresponding to the laser 11, so that the heat dissipation of the laser 11 is facilitated.
Illustratively, the heat dissipation unit 14 is disposed on the second surface 22 of the circuit board 10, and the heat dissipation unit 14 is located in the accommodating space of the second shielding case 15, so that the heat dissipation unit 14 can also conduct the heat generated by the laser 11 to the second shielding case 15 to achieve a heat dissipation function while avoiding mutual interference between the laser seed source system and other electronic circuits.
Wherein, the heat dissipation unit 14 can adopt semiconductor Cooler (Thermo Electric Cooler, TEC), semiconductor Cooler utilizes the peltier effect of semiconductor material to pass to the opposite side with heat one side of semiconductor Cooler, thereby realize the refrigeration function, semiconductor Cooler is current transduction type device, through the control of input current, can realize the temperature control of high accuracy, in addition temperature detection and control means, realize remote control very easily, programme-controlled, computer control, be convenient for constitute automatic control system, and it has the refrigeration fast, advantage such as power is little, it can be understood, heat dissipation unit 14 can also adopt other radiators in other embodiments, the utility model discloses do not limit this.
Alternatively, the first shield shell 13 and the second shield shell 15 are connected to the circuit board 10 by dispensing or soldering.
The first shielding cover 13 and the second shielding cover 15 can be connected with the circuit board 10 through glue or spot welding, and special equipment is not needed for resistance welding in the connection process, so that the packaging process is simpler, and the cost is reduced.
Optionally, the first shield can 13 and the second shield can 15 are copper shield cans or copper alloy shield cans.
The first shielding cover 13 and the second shielding cover 15 are copper shielding covers or copper alloy shielding covers, which can make the weight of the laser seed source system lighter and reduce the cost, and for example, the first shielding cover 13 and the second shielding cover 15 are made of copper.
With continued reference to fig. 1 to 4, optionally, the circuit board 10 is further provided with a positioning through hole 101 and a mounting through hole 102, the positioning through hole 101 is located at an edge of the circuit board 10 for positioning the mounting positions of the first shielding cover 13 and the second shielding cover 15, and the mounting through hole 102 is located outside the area where the first shielding cover 13 and the second shielding cover 15 are located.
Specifically, the positioning through holes 101 are formed in the circuit board 10 to position the mounting positions of the first shielding cover 13 and the second shielding cover 15, so as to facilitate uniformity of products and facilitate fixing the first shielding cover 13 and the second shielding cover 15 on the circuit board 10, and the first shielding cover 13 and the second shielding cover 15 can be designed to have the same size to reduce the number of the positioning through holes 101, for example, as shown in fig. 1 to 4, in the laser seed source system provided by the embodiment of the present invention, 4 positioning through holes 101 are formed in the circuit board 10, and 4 positioning through holes 101 are respectively located at 4 corners of the first shielding cover 13 and the second shielding cover 15, so as to implement a positioning function. The circuit board 10 is further provided with a mounting through hole 102, the mounting through hole 102 is located outside the setting region of the first shielding case 13 and the setting region of the second shielding case 15, and the mounting through hole 102 is used for mounting the laser seed source system on other debugging platforms for debugging.
Optionally, the laser 11 includes a laser emitting unit 111, a driving unit 112, and a transmission fiber 113, where the transmission fiber 113 is connected to the laser emitting unit and is used for transmitting the laser pulse signal.
With continued reference to fig. 2-5, optionally, the laser 11 further includes a transmission fiber 113, and the transmission fiber 113 is connected to the laser emitting unit 111 for transmitting the laser pulse signal. The circuit board 10 further includes a hollow-out portion 103, and a vertical projection of the transmission fiber 113 on a plane where the circuit board 10 is located at least partially overlaps the hollow-out portion 103.
Specifically, the laser 11 is further provided with a transmission fiber 113, the transmission fiber 113 is used for transmitting a laser pulse signal emitted by the laser emitting unit 111, the transmission fiber 113 is used as a laser gain medium, and the waveguide structure of the transmission fiber enables the laser seed source system to easily obtain single transverse mode output, is slightly influenced by external factors, can realize high-brightness laser output, and is also beneficial to compressing the volume and saving the cost. The hollow-out portion 103 is disposed on the circuit board 10 at a position corresponding to the transmission fiber 113, so that a fiber clamp can be conveniently placed during the fiber coupling step, and the coupling difficulty is reduced. Wherein, the shape and the size of fretwork portion 103 can set up according to the actual demand, as long as can be convenient for place the fiber clamp can, the utility model discloses do not limit to this.
With continued reference to fig. 1-4, optionally, the circuit board 10 further includes a signal transmission terminal 104, the signal transmission terminal 104 is disposed at an edge of the circuit board 10, and the signal transmission terminal 104 is used for implementing signal transmission between the laser seed source system and other devices.
Specifically, the signal transmission terminal 104 is electrically connected to the control module 12 and the laser 11, and may be used for signal transmission or power transmission, for example, as shown in fig. 1 to 4, the signal transmission terminal 104 may be composed of a plurality of golden conductive contact pieces, and electrically connects the power supply to the signal transmission terminal 104, so as to supply power to the control module 12 and the laser 11. The signal transmission terminal 104 can be disposed on the second surface 22 of the circuit board 10, so as to make reasonable use of the space on the circuit board 10, which helps to reduce the volume of the laser seed source system.
Optionally, the signal transmission terminal 104 is a gold finger or a bonding pad.
Wherein, the golden finger is not easy to be oxidized, and the contact resistance is stable. When the golden finger is adopted, the first shielding cover and the second shielding cover under the new adaptive size are directly adopted as the shell.
In an embodiment, when the signal transmission terminal 104 is a pad, the volume of the pad is smaller, and the cost is lower, so that the size of the whole circuit board is reduced, and the shell specification of the traditional seed source laser is adopted, so that the circuit board can be directly arranged in a standard shell under the traditional specification, and only the type of the shell needs to be changed into a shell with a shielding function, so that the production cost can be reduced.
The embodiment of the utility model provides a laser source seed system is through the same one side with laser instrument 11 and control module 12 integration at a circuit board 10 to through some glue or welding mode with first shield cover 13 and second shield cover 15 be connected with circuit board 10, form shielding case, improve laser source seed system's integrated level, reduce the product volume, and need not special equipment among the packaging process and carry out resistance weld, make the packaging process simpler, reduced manufacturing cost.
Based on the same inventive concept, the embodiment of the present invention further provides a laser radar, which includes the laser seed source system provided by any of the above embodiments, and the explanation of the structure and the terminology which are the same as or corresponding to the above embodiments is not repeated herein. The laser radar is a radar system for detecting the position, speed and other characteristic quantities of a target by emitting laser beams, and the working principle of the radar system is to emit detection signals (laser beams) to the target, then compare the received signals (target echoes) reflected from the target with the emitted signals, and after proper processing, obtain the relevant information of the target, such as the parameters of the target distance, direction, height, speed, attitude, even shape and the like, so as to detect, track and identify the targets of airplanes, missiles and the like.
The embodiment of the utility model provides a laser radar through with laser instrument 11 and control module 12 integration in laser seed source system in the same one side of a circuit board 10, improves laser radar's integrated level, reduces the product volume to need not special equipment among the packaging process and carry out resistance weld, make packaging process simpler, reduced manufacturing cost.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (10)

1. A laser seed source system, comprising: the circuit board, the laser and the control module; a laser emitting unit and a driving unit are integrated in the laser; the driving unit is used for driving the laser emitting unit; the laser and the control module are both arranged on the first surface of the circuit board; the laser is electrically connected with the control module, and the control module is used for controlling the driving unit.
2. The laser seed source system of claim 1, further comprising a first shield and a second shield; the first shielding cover and the second shielding cover are respectively arranged on two sides of the circuit board to form a shell of the laser seed source system.
3. The laser seed source system of claim 2, further comprising a heat dissipation unit;
the heat dissipation unit is arranged on a second surface of the circuit board, the second surface and the first surface are oppositely arranged, and the vertical projection of the heat dissipation unit on the plane of the circuit board is at least partially overlapped with the vertical projection of the laser on the plane of the circuit board.
4. The laser seed source system of claim 2, wherein the first shield and the second shield are attached to the circuit board by dispensing or soldering.
5. The laser seed source system of claim 2, wherein the first shield and the second shield are copper shields or copper alloy shields.
6. The laser seed source system of claim 3, wherein the circuit board is further provided with a positioning through hole and a mounting through hole;
the positioning through hole is positioned at the edge of the circuit board and used for positioning the mounting positions of the first shielding cover and the second shielding cover;
the mounting through hole is located outside the first shield cover setting area and the second shield cover setting area.
7. The laser seed source system of claim 1, wherein the laser further comprises a transmission fiber;
the transmission optical fiber is connected with the laser emission unit and is used for transmitting laser pulse signals;
the circuit board further comprises a hollow part;
the vertical projection of the transmission optical fiber on the plane of the circuit board is at least partially overlapped with the hollow part.
8. The laser seed source system of claim 2, wherein the circuit board further comprises signal transmission terminals;
the signal transmission terminal is arranged at the edge of the circuit board and used for realizing signal transmission between the laser seed source system and other equipment.
9. The laser seed source system of claim 8, wherein the signal transmission terminal is a gold finger or a solder pad.
10. A lidar including the laser seed source system of any one of claims 1-9.
CN202020276636.XU 2020-03-09 2020-03-09 Laser seed source system and laser radar Active CN211556412U (en)

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CN202020276636.XU CN211556412U (en) 2020-03-09 2020-03-09 Laser seed source system and laser radar
PCT/CN2021/078482 WO2021179932A1 (en) 2020-03-09 2021-03-01 Laser seed source system and laser radar

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Application Number Priority Date Filing Date Title
CN202020276636.XU CN211556412U (en) 2020-03-09 2020-03-09 Laser seed source system and laser radar

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021179932A1 (en) * 2020-03-09 2021-09-16 深圳市镭神智能系统有限公司 Laser seed source system and laser radar

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CN114530747A (en) * 2022-01-28 2022-05-24 北京春秋煜盛科技有限公司 Frequency doubling crystal laser with electromagnetic shielding layer of pulse power supply high-voltage line

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JP6036463B2 (en) * 2013-03-26 2016-11-30 日立金属株式会社 Optical module, optical communication device, and optical transmission device
DE102015114292A1 (en) * 2015-08-27 2017-03-02 Osram Opto Semiconductors Gmbh Laser component and method for its production
CN108429120B (en) * 2018-05-08 2024-08-16 深圳市杰普特光电股份有限公司 Fiber laser output device
CN108988113A (en) * 2018-09-21 2018-12-11 深圳市创鑫激光股份有限公司 Optical fiber laser
CN209088258U (en) * 2018-12-10 2019-07-09 武汉雷英激光科技有限公司 A kind of portable power laser controller
CN109917353B (en) * 2019-04-23 2020-05-19 上海禾赛光电科技有限公司 Laser emitting device of laser radar and laser radar
CN211556412U (en) * 2020-03-09 2020-09-22 深圳市镭神智能系统有限公司 Laser seed source system and laser radar

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021179932A1 (en) * 2020-03-09 2021-09-16 深圳市镭神智能系统有限公司 Laser seed source system and laser radar

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