CN219635974U - Wafer packing carton after cutting - Google Patents
Wafer packing carton after cutting Download PDFInfo
- Publication number
- CN219635974U CN219635974U CN202320685181.0U CN202320685181U CN219635974U CN 219635974 U CN219635974 U CN 219635974U CN 202320685181 U CN202320685181 U CN 202320685181U CN 219635974 U CN219635974 U CN 219635974U
- Authority
- CN
- China
- Prior art keywords
- wafer
- upper cover
- periphery
- groove
- iron frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012856 packing Methods 0.000 title claims description 13
- 238000005520 cutting process Methods 0.000 title claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052742 iron Inorganic materials 0.000 claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 claims abstract description 26
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims description 10
- 229940095676 wafer product Drugs 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 50
- 239000000463 material Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000002699 waste material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 210000000056 organ Anatomy 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/80—Packaging reuse or recycling, e.g. of multilayer packaging
Abstract
The utility model discloses a cut wafer packaging box in the field of wafer packaging, which comprises a bearing disc, wherein an accommodating groove for accommodating an iron frame is formed in the bearing disc, a circular supporting boss is arranged in the middle of the bearing disc, a wafer is placed on the supporting boss, the annular accommodating groove surrounds the periphery of the supporting boss, the thickness of the supporting boss is smaller than the groove depth of the accommodating groove, an upper cover is rotationally connected to the side of the bearing disc, an annular inner pressing ring corresponding to the supporting boss is arranged on the lower portion of the upper cover in a protruding mode, when the upper cover is pressed on the bearing disc, the inner pressing ring surrounds the periphery of the wafer, the upper cover above the inner pressing ring is arranged corresponding to the wafer, an outer groove is formed in the periphery of the inner pressing ring in a surrounding mode, the groove depth of the outer groove is larger than the thickness of the inner pressing ring, and the annular outer groove is arranged corresponding to the iron frame in the accommodating groove. According to the utility model, the new packaging jig is used for packaging a single wafer product, so that the cost is reduced; the use of lighter packaging jigs reduces the transportation cost of the package when shipment.
Description
Technical Field
The utility model belongs to the field of wafer packaging, and particularly relates to a wafer packaging box after cutting.
Background
In the prior art, a wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the original material is silicon. The silicon ingot is ground, polished and sliced to form a silicon wafer, i.e., a wafer. Domestic wafer lines are mainly 8 inches and 12 inches.
After dicing, the wafers are packaged and shipped or transported by using a wafer cassette, which is generally used for packaging and accommodating a plurality of wafers, but sometimes a factory needs to ship a single wafer product according to customer requirements, which is disadvantageous in that: 1. for shipment of single wafer products, a wafer cassette still needs to be used for packaging, so that resource waste is caused; 2. the wafer cassette has larger volume and weight, and the express expense is higher in the transportation process; 3. the wafer cassette has a high price and an increased packaging cost.
Disclosure of Invention
The utility model aims to provide a cut wafer packaging box, which is used for packaging a single wafer product by using a new packaging jig, so that the cost is reduced; the use of lighter packaging jigs reduces the transportation cost of the package when shipment.
The purpose of the utility model is realized in the following way: the utility model provides a wafer packing carton after cutting, includes the loading tray, set up the holding tank of placing the chase on the loading tray, the loading tray middle part is equipped with circular support boss, has placed the wafer on the support boss, the holding tank is the annular, and annular holding tank centers on at the support boss periphery, the thickness of supporting the boss is less than the groove depth of holding tank, the loading tray avris rotates and is connected with the upper cover, the upper cover sets up corresponding with the loading tray, and the upper cover lower part arch is equipped with the annular internal pressure ring corresponding with the holding boss, and when the upper cover was pressed on the loading tray, the internal pressure ring encircleed in the wafer periphery, and the upper cover of internal pressure ring top corresponds the wafer setting, the upper cover lower part is located the internal pressure ring periphery is encircleed and is seted up the external groove, and the groove depth of external groove is greater than the internal pressure ring thickness, and annular external groove corresponds the chase setting in the holding tank.
When the wafer product containing the iron frame after the cutting process is packaged and delivered, firstly, a clean black packaging box is prepared, the material of a bearing disc and an upper cover is plastic, then the wafer containing the iron frame is correspondingly placed in the bearing disc, so that the wafer is positioned on a supporting boss, the diameter of the supporting boss is slightly larger than that of the wafer, the iron frame is positioned in a containing groove, the supporting boss slightly arches the wafer upwards, an adhesive film on the lower side of the iron frame slightly deforms, and then tavid paper is covered on the wafer and fixed with the iron frame to protect an IC; then, the upper cover is covered, the upper cover is attached to the bearing disc, the inner part of the upper cover is arranged corresponding to the iron frame and the wafer, and the surface of the covered upper cover is attached with wafer information, so that the identification is facilitated; finally, the bearing disc and the three-side gap of the upper cover are fixed by red glue materials, the packing box is vacuumized by an organ bag, and the packing box is packed by a paper box, so that the packing box can be delivered. Compared with the prior art, the utility model has the beneficial effects that: the packaging can be carried out on a single product, so that unnecessary resource waste is avoided; the logistics transportation cost is reduced; and the purchase cost of the packaging raw materials is reduced.
As a further improvement of the utility model, the bearing plate and the upper cover are square, and the peripheries of the bearing plate and the upper cover are respectively provided with a lower side plate and an upper side plate which are enclosed into a rectangle, and the lower side plate and the upper side plate are attached. The lower side plate and the upper side plate are both in a shape like Chinese character 'kou', so that the bearing plate and the upper cover are conveniently bonded and fixed by using the adhesive.
In order to prevent the iron frame from directly contacting the bearing disc and the inner side wall of the upper cover, the outer periphery of the iron frame, the inner side wall of the bearing disc and the inner side wall of the upper cover are respectively provided with a space, and the inner pressure ring is positioned between the outer periphery of the wafer and the inner periphery of the iron frame.
As a further improvement of the utility model, the thickness of the inner pressure ring is 0.95-1.05cm, the groove depth of the outer groove is 1.95-2.05cm, and the thickness of the supporting boss is 0.95-1.05cm.
In order to provide the support to the chase, the holding tank is inside to be provided with a plurality of arc supporting pads along circumference equipartition, and the chase supports on the supporting pad, and two chase grooves of taking of 180 at circumferential interval have been seted up to the holding tank periphery on the loading tray.
As a further improvement of the utility model, the lower part of the iron frame is provided with a glue film, and the wafer is arranged on the glue film. The packaging box is used for packaging the wafer product with the iron frame after the cutting process.
In order to protect the wafer IC and to close and fix the bearing plate and the upper cover, the wafer is covered with tavid paper, and when the upper cover is pressed on the bearing plate, gaps on three sides of the upper cover and the bearing plate are fixed through glue materials.
Drawings
Fig. 1 is a plan view of the upper cover of the present utility model after being opened.
Fig. 2 is a schematic diagram of pressing a wafer with a frame after the upper cover and the carrier plate are separated.
Fig. 3 is an enlarged view at a in fig. 2.
The device comprises a bearing plate 1, a supporting boss 1a, a containing groove 2, an iron frame 3, a wafer 4, a glue film 5, an upper cover 6, an inner pressing ring 6a, an outer groove 7, an upper side plate 8, a lower side plate 9, a supporting pad 10 and an iron frame taking groove 11.
Detailed Description
As shown in fig. 1-3, the cut wafer packaging box comprises a carrying tray 1, wherein a containing groove 2 for placing a frame 3 is formed in the carrying tray 1, a circular supporting boss 1a is arranged in the middle of the carrying tray 1, a wafer 4 is placed on the supporting boss 1a, a glue film 5 is arranged at the lower part of the frame 3, and the wafer 4 is arranged on the glue film 5; the packaging box is used for packaging the wafer 4 product containing the iron frame 3 after the cutting process; the holding tank 2 is annular, annular holding tank 2 centers on the periphery at supporting boss 1a, supporting boss 1 a's thickness is less than holding tank 2's groove depth, it is connected with upper cover 6 to bear 1 avris rotation, upper cover 6 and the corresponding setting of bearing plate 1, upper cover 6 lower part arch is equipped with annular internal pressure ring 6a corresponding with supporting boss 1a, when upper cover 6 is pressed on bearing plate 1, internal pressure ring 6a encircles at wafer 4 periphery, upper cover 6 of internal pressure ring 6a top corresponds wafer 4 setting, upper cover 6 lower part is located internal pressure ring 6a periphery and has around having outer recess 7, the groove depth of outer recess 7 is greater than the thickness of interior pressure ring 6a, annular external recess 7 corresponds the chase 3 setting in the holding tank 2. The thickness of the inner compression ring 6a is 0.95-1.05cm, the groove depth of the outer groove 7 is 1.95-2.05cm, and the thickness of the supporting boss 1a is 0.95-1.05cm. In order to provide support to the iron frame 3, a plurality of arc supporting pads 10 are uniformly distributed in the accommodating groove 2 along the circumferential direction, the iron frame 3 is supported on the supporting pads 10, and two iron frame taking grooves 11 which are circumferentially spaced by 180 degrees are formed in the periphery of the accommodating groove 2 on the bearing disc 1.
The bearing disc 1 and the upper cover 6 are square, the peripheries of the bearing disc 1 and the upper cover 6 are respectively provided with a lower side plate 9 and an upper side plate 8 which are enclosed into a rectangle, and the lower side plate 9 and the upper side plate 8 are attached. The lower side plate 9 and the upper side plate 8 are both in a shape of Chinese character kou, so that the bearing plate 1 and the upper cover 6 are conveniently bonded and fixed by using the adhesive. In order to prevent the iron frame 3 from directly contacting the inner side walls of the bearing plate 1 and the upper cover 6, spaces are reserved between the periphery of the iron frame 3 and the inner side walls of the bearing plate 1 and the inner side walls of the upper cover 6, and an internal pressure ring 6a is positioned between the periphery of the wafer 4 and the inner periphery of the iron frame 3.
In order to protect the wafer IC and to close and fix the carrying tray 1 and the upper cover 6, the tavern paper is covered above the wafer 4, and when the upper cover 6 is pressed on the carrying tray 1, the gaps between the upper cover 6 and the three sides of the carrying tray 1 are fixed by the glue.
When the wafer 4 product containing the iron frame 3 after the cutting process is packaged and delivered, firstly, a clean black packaging box is prepared, the material of the bearing disc 1 and the upper cover 6 is plastic, then the wafer 4 containing the iron frame 3 is correspondingly placed into the bearing disc 1, the wafer 4 is positioned on the supporting boss 1a, the diameter of the supporting boss 1a is slightly larger than that of the wafer 4, the iron frame 3 is positioned in the accommodating groove 2, the supporting boss 1a slightly upwards arches the wafer 4, the adhesive film 5 at the lower side of the iron frame 3 slightly deforms, and then tavid paper is covered above the wafer 4 and fixed with the iron frame 3 to protect an IC; then, the upper cover 6 is covered, the upper cover 6 is attached to the bearing disc 1, the inner part of the upper cover 6 is arranged corresponding to the iron frame 3 and the wafer 4, and the information of the wafer 4 is attached to the surface of the covered upper cover 6, so that the identification is convenient; finally, the bearing disc 1 and the upper cover 6 are fixed by using red glue materials, the packing box is vacuumized by using an organ bag, and the packing box is packaged by using a paper box, so that the goods can be delivered. The utility model can pack single-chip products, avoiding unnecessary resource waste; the logistics transportation cost is reduced; and the purchase cost of the packaging raw materials is reduced.
The utility model is not limited to the above embodiments, and based on the technical solution disclosed in the utility model, a person skilled in the art may make some substitutions and modifications to some technical features thereof without creative effort according to the technical content disclosed, and all the substitutions and modifications are within the protection scope of the utility model.
Claims (7)
1. The utility model provides a wafer packing carton after cutting, its characterized in that, including bearing dish, offer the holding tank of placing the chase on the bearing dish, the bearing dish middle part is equipped with circular support boss, has placed the wafer on the support boss, the holding tank is annular, and annular holding tank centers on at the support boss periphery, the thickness of support boss is less than the groove depth of holding tank, bearing dish avris rotation is connected with the upper cover, the upper cover sets up corresponding with the bearing dish, and the upper cover lower part arch is equipped with the annular internal pressure ring corresponding with the holding boss, and when the upper cover was pressed on the bearing dish, interior pressure ring encircleed in the wafer periphery, and the upper cover of interior pressure ring top corresponds the wafer setting, the upper cover lower part is located interior pressure ring periphery is encircleed and is offered the external groove, and the groove depth of external groove is greater than interior pressure ring, and annular external groove corresponds the chase setting in the holding tank.
2. The cut wafer packaging box according to claim 1, wherein the carrying tray and the upper cover are square, and the peripheries of the carrying tray and the upper cover are respectively provided with a lower side plate and an upper side plate which are enclosed into a rectangle, and the lower side plate and the upper side plate are attached.
3. The cut wafer packing box according to claim 1 or 2, wherein the outer periphery of the iron frame, the inner side wall of the bearing disc and the inner side wall of the upper cover are respectively provided with a space, and the inner pressure ring is positioned between the outer periphery of the wafer and the inner periphery of the iron frame.
4. A cut wafer packing box according to claim 1 or 2, wherein the thickness of the inner pressing ring is 0.95-1.05cm, the depth of the outer groove is 1.95-2.05cm, and the thickness of the supporting boss is 0.95-1.05cm.
5. The wafer packaging box after cutting according to claim 1 or 2, wherein a plurality of arc-shaped supporting pads are uniformly distributed in the accommodating groove along the circumferential direction, the iron frame is supported on the supporting pads, and two iron frame taking grooves which are circumferentially spaced by 180 degrees are formed in the periphery of the accommodating groove on the bearing plate.
6. The post-dicing wafer packing box according to claim 1 or 2, wherein the lower portion of the iron frame is provided with a film, and the wafer is disposed on the film.
7. The cut wafer packing box according to claim 1 or 2, wherein tavern paper is covered on the wafer, and when the upper cover is pressed on the carrying tray, gaps between the upper cover and three sides of the carrying tray are fixed by glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320685181.0U CN219635974U (en) | 2023-03-31 | 2023-03-31 | Wafer packing carton after cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320685181.0U CN219635974U (en) | 2023-03-31 | 2023-03-31 | Wafer packing carton after cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219635974U true CN219635974U (en) | 2023-09-05 |
Family
ID=87819726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320685181.0U Active CN219635974U (en) | 2023-03-31 | 2023-03-31 | Wafer packing carton after cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219635974U (en) |
-
2023
- 2023-03-31 CN CN202320685181.0U patent/CN219635974U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |