CN217624318U - A packing plant for MSL3 level chip area - Google Patents

A packing plant for MSL3 level chip area Download PDF

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Publication number
CN217624318U
CN217624318U CN202221871517.4U CN202221871517U CN217624318U CN 217624318 U CN217624318 U CN 217624318U CN 202221871517 U CN202221871517 U CN 202221871517U CN 217624318 U CN217624318 U CN 217624318U
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China
Prior art keywords
support
reel
supporting
supporting surface
msl3
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CN202221871517.4U
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Chinese (zh)
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宋文
邹廷君
唐生桃
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Chengdu Advanced Power Semiconductor Co Ltd
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Chengdu Advanced Power Semiconductor Co Ltd
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Abstract

The utility model relates to a chip package field, concretely relates to a packing plant that is used for MSL3 level chip area, include: a reel, a support member, and an outer package; the reel includes: the support device comprises a mandrel and two first support surfaces arranged at two ends of the mandrel; the support comprises a second support surface and a third support surface which are connected in an intersecting way; the supporting piece is arranged on the outer side of the reel, so that the second supporting surface is used for abutting against the end face of one first supporting surface; the third supporting surface is used for supporting the side surface of the reel; the outer package can be outside the reel and the support by vacuum packaging; the utility model discloses need not use the support bar winding just can do in the periphery in chip area MSL3 level chip area provides the lateral part and supports, outer package can through evacuation package reel and support piece's outside formation vacuum package, when saving packaging material, the process of packing operation is simplified and convenient, has improved the efficiency of work.

Description

A packing plant for MSL3 level chip area
Technical Field
The utility model relates to a chip package field, especially a packing plant for MSL3 level chip.
Background
Semiconductor chip technology is becoming more mature, and chips made of such materials are used in many electronic products, and are often manufactured as chip tapes for packaging purposes for shipping or sale. The requirement for packaging the MSL 3-level chip strap is higher, and the MSL3 refers to a product with a humidity sensitivity level of 3 level, which is called a motion sensitivity level in English, so that the packaging of the MSL 3-level chip not only needs to meet the requirement of a Moisture-proof level, but also needs to use an object to support the chip strap in order to protect the MSL 3-level chip strap from being damaged by extrusion in transportation.
It is a common practice in the industry to wind a support bar at the periphery of a chip tape product, the chip tape is supported by a winding wire disc in a matching manner, as shown in fig. 1, the winding support bar 100 is wound at the side of the winding wire disc 200 (also the side of the chip tape 300) to provide a side support for the chip tape 300, the winding support bar can bear the pressure from the side of the chip tape 300 and resist pressure, the winding support bar 100 has fewer winding turns and has low pressure bearing capacity, a plurality of winding support bars are often required to be wound, the support at the outer side of the MSL 3-level chip can be met to form support protection, excessive winding support bars are wasted, the ending part is fixed by using materials such as adhesive tapes, and the operation process is complex and low in efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an: the problem that materials are wasted due to the fact that the winding quantity of the winding support strip is large due to the fact that the winding support strip is wound on the periphery of the MSL3 chip strip to provide support in the prior art is solved. The packaging device for the MSL 3-level chip is provided, and the MSL 3-level chip can be supported and packaged without winding a supporting strip.
In order to realize the purpose, the utility model discloses a technical scheme be:
a packaging apparatus for MSL3 chip straps, comprising: a reel, a support member, and an outer package; the reel includes: the support device comprises a mandrel and two first support surfaces arranged at two ends of the mandrel; the supporting piece comprises a second supporting surface and a third supporting surface which are connected in an intersecting way; the supporting piece is arranged on the outer side of the reel; the second supporting surface is used for abutting against the end surface of one of the first supporting surfaces; the third supporting surface is used for supporting the side of the reel; the outer package can be outside the reel and support by vacuum packing.
According to the packaging device, by arranging the reel, the supporting piece and the outer packaging piece, the upper supporting surface and the lower supporting surface of the reel can be supported on the upper surface and the lower surface of the MSL 3-level chip belt of the reel, the supporting piece is abutted to the first supporting surface through the second supporting surface to enable the third supporting surface to be located on the side surface of the MSL 3-level chip belt and further to be supported on the side surface of the MSL 3-level chip belt, when the MSL 3-level chip belt is subjected to upper extrusion force, lower extrusion force or lateral extrusion force, the supporting piece can form upper support, lower support and lateral support on the outer side of the MSL 3-level chip belt in a matching mode with the reel, so that the upper support, the lower support and the lateral surfaces of the MSL 3-level chip belt are protected from being extruded easily, extrusion-resistant packaging is realized without using a supporting strip, and the problem that the winding quantity of the supporting strip is large and materials are wasted is avoided; and, in the packaging process, MSL3 level chip area has been packed the back on the dabber of reel, through will support piece places and the cooperation lid is in the outside of reel makes the third holding surface is located the side of reel makes the second holding surface with the first holding surface butt of reel just can realize supporting the packing in this stage, can be in again outer packing through evacuation packing reel and support piece's outside can realize preventing damp and resistant extrusion packing to MSL3 level chip area, and simple placing or lid operation just can realize, makes operating procedure simplify and convenient, can improve work efficiency.
As a preferable embodiment of the present invention, the reel is disc-shaped; the second supporting surface and the third supporting surface are both in a circular ring shape matched with the reel. In this preferred embodiment, the height of the third supporting surface is set to be greater than or equal to the height of the reel, so that the third supporting surface can fully cover the side surface of the reel after the second supporting surface abuts against the first supporting surface of the reel, and the height of the reel is greater than or equal to the height of the MSL 3-level chip strap, so that the third supporting surface can fully cover the side surface of the MSL 3-level chip strap, and the overwrap is attached to the third supporting surface and the reel after being vacuumized, so that the overwrap does not contact the MSL 3-level chip strap to reduce external wear, thereby improving the package protection performance.
As a preferable scheme of the scheme, the second supporting surface and the third supporting surface are intersected to form an included angle of 90 degrees to be connected and fixedly connected. This preferred scheme passes through the second holding surface with the third holding surface becomes the second holding surface that 90 contained angles connect each other, makes the third holding surface through the butt of cooperation second holding surface and the perpendicular to first holding surface supports the positive side at MSL3 level chip area, can make things convenient for on the one hand the second holding surface carries out the butt, and on the other hand makes the third holding surface can provide the support by the face of perpendicular to side direction extrusion force, has strengthened supporting performance, has further strengthened this packing plant's pressure resistance.
As a preferred aspect of the present invention, the first supporting surface includes: the supporting inner ring, the supporting outer ring and the plurality of supporting bars are arranged at intervals; the support inner rings are arranged at two ends of the mandrel; and the two ends of the supporting bar are respectively connected with the supporting inner ring and the supporting outer ring. According to the preferred scheme, one or two of the first supporting surfaces are arranged to comprise a supporting inner ring, a supporting outer ring and a plurality of supporting strips which are arranged at intervals, the supporting can be provided at the upper surface and the lower surface of the MSL3 chip through the matching of the supporting strips and the supporting rings, materials are saved relative to the packaging material which is supported by the whole surface, and gaps among the supporting strips are used for exhausting gas in the first supporting members in the vacuum packaging operation.
As a preferable scheme of the present invention, the second supporting surface is a closed surface; the second supporting surface is made of semitransparent or transparent materials. This preferred scheme is through setting up the confined face is personally submitted to the second support, in the packing before vacuum packaging, through the second support face butt is in the first support face of reel can reduce dust or particulate matter and get into in the reel, further strengthened the protection of treating the packing product, make through translucent or transparent material the second support face, the second support face butt is in also can observe behind the first support face of reel be used for MSL3 level chip area in the reel, be favorable to the packing condition that the inspection is MSL3 level chip area in the packaging process, for example whether scatter or lack, can reduce the fault rate of operation, improve packing quality.
As a preferred embodiment of the present invention, the inner side of the third supporting surface is provided with an inwardly protruding anti-slip strip. According to the preferable scheme, the third supporting surface is covered on the side part of the first supporting piece through the inward protruding anti-slip strip, interference fit is formed, the third supporting surface can be prevented from naturally sliding off the first supporting piece, or the third supporting surface is placed to be loose relative to the first supporting piece, and the firmness of packaging is enhanced.
As the preferable scheme of the utility model, the outer packaging piece is a vacuum packaging bag. This preferred scheme is through setting up outer packing member into vacuum packaging bag, and at the evacuation in-process, vacuum packaging bag can be along with the exhaust of air and negative pressure shrink, works as vacuum packaging bag shrink and attach the reel with support piece's outside not only can realize being used for the dampproofing packing of MSL3 level chip area vacuum to vacuum packaging bag's shape can be along with the shape of first support piece and second support piece and change, thereby has improved this packing plant's general adaptability, has still made things convenient for the evacuation operation.
As a preferable aspect of the present invention, the first support member, the second support member, and the vacuum package are all antistatic. Because the MSL 3-grade chip belt of the product to be packaged is a chip and is sensitive to static electricity or a magnetic field, the first supporting piece, the second supporting piece and the outer packaging piece which are made of anti-static materials can protect the MSL 3-grade chip belt from being damaged by static electricity in the packaging or transportation operation.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. through setting up reel, support piece and outer packing, two upper and lower faces and the support piece of reel do MSL3 level chip area provides the support of two upper and lower faces and side, can bear packing or the outside extrusion force in the outside of the aforesaid MSL3 level chip area in the transportation, thereby the protection the outside of MSL3 level chip area is not damaged by the extrusion, realizes resistant extrusion packing, need not use winding support bar to avoid the problem that the support bar winding volume is big and extravagant material, thereby improved the economic benefits of packing.
2. In the use through will support piece place in support piece works as the second holding surface can the butt be in can accomplish the support to MSL3 level chip area on the first holding surface of reel promptly, can pass through evacuation packing with outer packing piece again reel and support piece's outside can realize preventing damp and resistant extrusion packing to MSL3 level chip area, need not the winding support bar, through placing or the simple operation completion of lid closure, saved the winding operation, also need not the rubberizing fixed, make operating procedure simplify and convenient, improved work efficiency.
Drawings
FIG. 1 is a three-dimensional top view of a conventional wound support strip wound to support a chip product;
fig. 2 is a schematic view of a packaging device provided by the present invention in a use state before packaging;
fig. 3 is a top view of the first support surface against which the second support surface of the present invention abuts;
fig. 4 is a bottom view of the first support surface with the second support surface abutting thereon;
fig. 5 is a bottom view of the first support surface of the present invention with the second support surface abutting below;
fig. 6 is a three-dimensional structure view a of the supporting member of the present invention;
fig. 7 is a three-dimensional structure view b of the supporting member of the present invention;
icon: 0-MSL3 level chip strap; 1-reeling; 11-a mandrel; 12-a first support surface; 120-a support inner ring; 121-support outer ring; 122-support strip; 123-vent hole; 2-a support; 21-a second support surface; 22-a third support surface; 221-antislip strips; 3-an outer package; 100-winding a supporting strip; 200-a winding disc; 300-chip strap.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Example 1
Referring to fig. 1, the utility model provides a pair of a packing plant for MSL3 level chip area, include: reel 1, support 2 and outer package 3; the reel 1 comprises: the support structure comprises a mandrel 11 and two first support surfaces 12 arranged at two ends of the mandrel 11; the supporting piece 2 comprises a second supporting surface 21 and a third supporting surface 22 which are connected in an intersecting way; the supporting piece 2 is arranged on the outer side of the reel 1, so that the second supporting surface 21 is used for abutting against the end surface of one of the first supporting surfaces 12; the third supporting surface 22 is used for supporting the side of the reel 1; the outer package 3 can be outside the reel 1 and the support 2 by vacuum packing.
It should be noted that the "first", "second" and "third" are distinguished only for descriptive purposes and are not in order, and as shown in fig. 2, the first supporting surface 12 includes two supporting members provided on both the upper and lower surfaces of the reel 1, the second supporting surface 21 is a supporting member provided on the supporting member 2 and capable of abutting against the first supporting surface 12, and the third supporting surface 22 is a member provided on the supporting member 2 and capable of being placed on the side of the reel 1 (on the side of the MSL 3-level chip strap 0); since the MSL 3-grade chip tape 0 is wound in a roll along the side of the reel 1 on the side of the core shaft 11, the side of the MSL 3-grade chip tape 0 is the side of the reel 1, and the upper and lower surfaces of the MSL 3-grade chip tape 0 are the upper and lower surfaces of the reel 1.
The term "abutting" is understood to mean that the third supporting surface 22 is located on the side of the reel 1 after passing through the first supporting surface 12 by moving the supporting member 2 along the upper or lower surface of the reel 1 by the packaging operation in which the third supporting surface 22 is first brought close to the reel 1 and the second supporting surface 21 is then brought close to the reel 1, and when the third supporting surface 22 completely covers and shields the MSL 3-level chip strap 0, the second supporting surface 21 can abut on the first supporting surface 12, and the position of the third supporting surface 22 can be limited to be located right to the side of the reel 1, so that the third supporting surface 22 can be located and cover the side of the MSL 3-level chip strap 0, and the side support can be provided for the MSL 3-level chip strap 0.
It should be noted that, referring to fig. 1, the fact that the second supporting surface 21 and the third supporting surface 22 intersect to make one side of the surfaces fixedly connected means that one side of the second supporting surface 21 is fixedly connected with one side of the third supporting surface 22, while the other side of the second supporting surface 21 freely extends, and the other side of the third supporting surface 22 also freely extends. It is preferable here to connect the second support surface 21 and the third support surface 22 at an angle of 90 ° to each other, so that, as shown in fig. 3 and 4, when the second support surface 21 abuts on the first support surface 12, the third support surface 22 is positioned on the side of the reel 1 perpendicular to the first support surface 12.
As shown in fig. 1, the MSL 3-grade chip strap 0 is wound in a reel 1, a support member 2 can be packed outside the reel 1, and an outer packing bag is further packed outside the MSL 3-grade chip strap 0, the reel 1 and the support member 2.
The specific packaging steps are as follows: the MSL 3-level chip tape 0 is wound on a reel 1 and fixed by glue, a support piece 2 is placed or covered on the outer side of the reel 1, the third supporting surface 22 is located on the side of the reel 1, the second supporting surface 21 abuts against the first supporting surface 12, then the MSL 3-level chip tape 0, the reel 1 and the support piece 2 are integrally placed in an outer package piece 3, the outer package piece 3 is vacuumized and packaged, and then the opening is sealed, so that the packaging of the MSL 3-level chip tape 0 is completed.
It should be noted that the outer packaging member 3 may be a packaging bag capable of being vacuumized and sealed, or may be a packaging box capable of being vacuumized and then sealed, where a vacuum packaging bag is preferably used, and preferably, as shown in fig. 2, the vacuum packaging bag may be placed in operation, and after the reel 1 and the supporting member 2 are fitted, the vacuum packaging bag is placed into the outer packaging member 3 and then placed into a vacuum packaging machine for vacuumization, and then the vacuum packaging bag is sealed, so as to achieve vacuum packaging.
It should be noted here that the height of the reel 1 is greater than or equal to the height of the MSL3 chip tape 0; the height of the third supporting surface 22 is greater than or equal to the height of the reel 1. It should be noted here that the height of the reel 1 refers to the distance between the outer surfaces of the two first supporting surfaces 12 of the reel 1, and the height of the third supporting surface 22 is greater than or equal to the height of the reel 1, so that the third supporting surface 22 can completely cover the side of the reel 1, and the exposed outside of the edge of the reel 1 can be prevented from being damaged.
It should be noted here that the core 11 of the reel 1 is cylindrical, i.e. capable of winding a chip tape, and the outer shape of the reel 1 may be a disk shape, a polygonal disk shape or other disk shapes, specifically, for example, if two first supporting surfaces 12 are provided as disk shapes, the reel 1 is a disk shape, two first supporting surfaces 12 are provided as polygonal shapes, the reel 1 is a polygonal shape, and the outer edge of the support 2 is also provided as a matching shape capable of being provided on the outer side of the reel 1, such as a hexagonal first supporting surface 12, a hexagonal second supporting surface 21 and a hexagonal third supporting surface 22; in this embodiment, as shown in fig. 1, the reel 1 is preferably configured to be a disk; the second supporting surface 21 and the third supporting surface 22 are both in the shape of a circular ring matched with the reel 1; the inner diameter of the annular second supporting surface 21 is smaller than the outer diameter of the reel 1; the inner diameter of the annular third support surface 22 is greater than or equal to the outer diameter of the reel 1. With particular reference to fig. 3 and 4, one first support surface 12 of the reel 1 in fig. 3 is fully illustrated, while the other first support surface 12 of the reel 1 in fig. 4 is brought into abutment by the smaller inner diameter of the second support surface 21.
Preferably, with reference to fig. 4, said first support surface 12 comprises: a support inner ring 120, a support outer ring 121 and a plurality of support bars 122 arranged at intervals; the supporting inner rings 120 are arranged at two ends of the mandrel 11; two ends of the supporting strip 122 are respectively connected to the supporting inner ring 120 and the supporting outer ring 121. It should be noted that, two of the first supporting surfaces 12 may be a first supporting surface 12 including the above structure, and the other first supporting surface 12 is in a plate shape, or both of the first supporting surfaces 12 may be the above structure including the supporting inner ring 120, the supporting outer ring 121 and the supporting bars 122. 2-4 show that the first supporting surface 12 includes a supporting inner ring 120, a supporting outer ring 121 and a plurality of supporting strips 122 arranged at intervals; it should be noted here that the first support surface 12 indicated as "upper" in fig. 3 indicates only one support surface shown as upper in fig. 3, while the other support surface shown as the state in fig. 3 is shown as the same state in fig. 4; in contrast, the "lower" first support surface 12 in the diagram of fig. 5 is the upper first support surface 12 shown in fig. 3, that is, fig. 5 is a state where the second support surface 21 is in contact with the other first support surface 12 than the state shown in fig. 3, that is, the second support surface 21 may be in contact with any one of the two first support surfaces 12.
Here, preferably, when both the first supporting surfaces 12 are supporting surfaces and the second supporting surface 21 is a closed surface, referring to fig. 5, an air vent 123 is provided on one of the first supporting surfaces 12 that is not abutted against the second supporting surface 21, so that after the supporting member 2 and the reel 1 are packed and placed on the outer package 3, air can be removed to achieve vacuum pumping.
Preferably, as shown in fig. 6, the inner side of the third supporting surface 22 is provided with an inwardly protruding anti-slip strip 221. The anti-slip strips 221 may be preferably arranged on the third supporting surface 22, when the third supporting surface 22 slides up and down relative to the first supporting surface 12, the anti-slip strips 221 contact the first supporting surface 12 to block the sliding by friction force, so as to realize the anti-slip function.
Preferably, as shown in fig. 7, the second supporting surface 21 is a closed surface; the second support surface 21 is made of a transparent or translucent material.
The reel 1, the support 2 and the outer package 3 are all antistatic. The reel 1, the support member 2 and the outer package member 3 are made of an antistatic material, so that the reel 1, the support member 2 and the outer package member 3 can be made antistatic, and the antistatic material may be: antistatic PVC board, antistatic PC board, antistatic PET board, antistatic nylon board can prevent the material of static.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of the present invention.

Claims (8)

1. A packaging apparatus for MSL3 chip strap, comprising: a reel (1), a support (2) and an outer package (3); the reel (1) comprises: the support comprises a mandrel (11) and two first support surfaces (12) arranged at two ends of the mandrel (11); the support (2) comprises a second support surface (21) and a third support surface (22) which are connected in an intersecting manner; the supporting piece (2) is arranged on the outer side of the reel (1); the second supporting surface (21) is used for abutting against the end surface of one of the first supporting surfaces (12); the third supporting surface (22) is used for supporting the side of the reel (1); the outer packaging (3) can be outside the reel (1) and the support (2) by vacuum packaging.
2. The packaging device for MSL 3-grade chip straps according to claim 1, characterized in that said reel (1) is disc-shaped; the second supporting surface (21) and the third supporting surface (22) are both in the shape of a circular ring matched with the reel (1).
3. The packaging device for MSL3 chip straps according to claim 2, characterized in that the second support surface (21) and the third support surface (22) are fixedly connected at an angle of 90 ° in intersection.
4. The packaging device for MSL 3-level chip straps according to claim 2, characterized in that said first support face (12) comprises: the support device comprises a support inner ring (120), a support outer ring (121) and a plurality of support bars (122) which are arranged at intervals; the support inner rings (120) are arranged at two ends of the mandrel (11); and two ends of the support bar (122) are respectively connected with the support inner ring (120) and the support outer ring (121).
5. The packaging device for MSL 3-grade chip straps according to claim 1, characterized in that said second support face (21) is a closed face; the second support surface (21) is a transparent or translucent member.
6. The packaging device for MSL 3-grade chip straps as claimed in any of claims 1-5, characterized in that the inner side of the third support surface (22) is provided with inwardly protruding cleats (221).
7. The packaging device for MSL 3-grade chip straps according to any of claims 1-5, characterized in that the outer package (3) is a packaging bag.
8. The packaging device for MSL3 chip straps according to any of the claims 1-5, characterized in that the reel (1), the support (2) and the outer package (3) are all antistatic members.
CN202221871517.4U 2022-07-13 2022-07-13 A packing plant for MSL3 level chip area Active CN217624318U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221871517.4U CN217624318U (en) 2022-07-13 2022-07-13 A packing plant for MSL3 level chip area

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221871517.4U CN217624318U (en) 2022-07-13 2022-07-13 A packing plant for MSL3 level chip area

Publications (1)

Publication Number Publication Date
CN217624318U true CN217624318U (en) 2022-10-21

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Application Number Title Priority Date Filing Date
CN202221871517.4U Active CN217624318U (en) 2022-07-13 2022-07-13 A packing plant for MSL3 level chip area

Country Status (1)

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CN (1) CN217624318U (en)

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