CN219633965U

CN219633965U - Spindle deviation adjusting device and circuit board processing equipment

Info

Publication number: CN219633965U
Application number: CN202320644063.5U
Authority: CN
Inventors: 袁侠伟; 黄齐齐
Original assignee: Suzhou Vega Technology Co Ltd
Current assignee: Suzhou Vega Technology Co Ltd
Priority date: 2023-03-28
Filing date: 2023-03-28
Publication date: 2023-09-05
Anticipated expiration: 2033-03-28

Abstract

The present disclosure relates to a spindle deviation adjusting device and a circuit board processing apparatus, wherein the spindle deviation adjusting device includes a base, a spindle mechanism, a Y-axis adjusting mechanism, a calibration mechanism. The spindle mechanism is used for machining a workpiece. The Y-axis adjusting mechanism comprises a Y-axis moving assembly and a locking assembly, when the locking assembly is in an open position, the main shaft mechanism moves in the Y-axis direction through the Y-axis moving assembly under the action of external force so as to calibrate the deviation of the main shaft mechanism in the Y-axis direction. The Y-axis motion assembly is locked when the locking assembly is in the locked position. And after the main shaft mechanism moves to a position matched with the calibration mechanism, the calibration mechanism applies external force for calibration to the main shaft mechanism, so that the main shaft mechanism moves in the Y-axis direction through the Y-axis adjusting mechanism. The circuit board processing equipment can calibrate the main shaft mechanism in the Y-axis direction through the calibration mechanism, and is beneficial to improving the processing precision of the circuit board processing equipment.

Description

Spindle deviation adjusting device and circuit board processing equipment

Technical Field

The present disclosure relates to the field of circuit board processing equipment, and more specifically, to a spindle deviation adjustment device; the present disclosure also relates to a circuit board processing apparatus.

Background

The traditional circuit board processing equipment still adopts the mode of unipolar processing to carry out processing to the mesa region that its corresponds at present, and its machining efficiency is extremely low, and longer process time can't satisfy user, manufacturer to the increasingly growing user demand of circuit board. In order to improve the production rate, when circuit boards are produced in a large scale in a current board factory, a copying typesetting mode is mostly adopted, namely, the offset copying in the whole X and Y directions is carried out according to the first small typesetting, so that a matrix typesetting structure is obtained, and the typesetting mode is very suitable for mass production. But it has a high requirement limit on the accuracy of the circuit board processing equipment.

The main shaft of the existing circuit board processing equipment is generally tightly held and fixed through a semicircular main shaft clamp and a main shaft pressing sleeve, and is driven by a motor to do up-and-down feeding motion on a Z-axis bottom plate, so that drilling and gong processing of the circuit board are realized. After the main shafts are clamped, the Y-axis direction is not adjustable, so that the absolute coordinates of the machining centers among the main shafts are different. The existing spindle installation mode cannot meet the production requirement that a plurality of spindles are adopted to machine and drill a plate at the same time so as to improve the machining efficiency of the plate. Therefore, a device capable of keeping the absolute coordinates of the machining centers between the plurality of spindles close or identical is needed to meet the purpose of improving the machining efficiency of the circuit board.

Disclosure of Invention

The disclosure provides a spindle deviation adjusting device and circuit board processing equipment for solving the problems existing in the prior art.

According to a first aspect of the present disclosure, there is provided a spindle deviation adjusting apparatus for a circuit board processing device, comprising:

a spindle mechanism configured to process a workpiece;

the Y-axis adjusting mechanism comprises a Y-axis motion assembly and a locking assembly; the spindle mechanism is configured to move in the Y-axis direction by the Y-axis movement assembly under the force of an external force when the locking assembly is moved to the open position; the locking assembly is configured to lock the Y-axis motion assembly in a locked position.

In one embodiment of the present disclosure, the Y-axis motion assembly includes:

a fixed bracket;

an adjustment bracket guide-fitted on the fixed bracket and configured to move in the Y-axis direction along the fixed bracket under the influence of external force; the main shaft mechanism is fixed on the adjusting bracket.

In one embodiment of the present disclosure, the adjustment brackets are provided with at least two, at least two adjustment brackets respectively located at opposite sides of the fixed bracket and configured to be respectively guide-fitted on the fixed bracket through bearing groups.

In one embodiment of the present disclosure, the locking assembly includes:

a locking bracket configured to be guide-fitted on the fixing bracket along a Y-axis and fixed with the spindle mechanism;

a locking member configured to move to a locking position that locks the locking bracket with the fixed bracket and to an open position that unlocks the locking bracket with the fixed bracket.

In one embodiment of the present disclosure, the circuit board processing apparatus includes:

the X-axis movement mechanism comprises an X-axis guide rail which is arranged on the base and extends along the X-axis direction, and an X-axis sliding block which is in guiding fit with the X-axis guide rail; the fixed bracket is configured to be fixed on the X-axis sliding block; the fixed support is C-shaped, and a mounting groove extending along the X-axis direction is formed on one side of the fixed support, which is adjacent to the X-axis guide rail; the X-axis sliding block is positioned in the mounting groove and is fixed with the fixing support.

In one embodiment of the disclosure, the circuit board processing apparatus includes a calibration mechanism including an ejector assembly and a positioning portion disposed at an output end of the ejector assembly, the positioning portion being configured to be controlled by a movement of the ejector assembly in a direction of the spindle mechanism, so that the spindle mechanism moves in a Y-axis direction by a Y-axis movement assembly under an external force to calibrate a deviation of the spindle mechanism in the Y-axis direction.

In one embodiment of the disclosure, the spindle mechanism is provided with a matching part matched with the positioning part, a positioning surface is arranged between the matching part and the positioning part, and the positioning part is configured to move in the Y-axis direction through the Y-axis movement assembly under the action of external force in the upward movement process of the positioning part.

In one embodiment of the present disclosure, the positioning surface is an inclined plane or curved surface disposed between the fitting portion and the positioning portion.

In one embodiment of the disclosure, the positioning surface is located on a side wall of the positioning part and the matching part distributed in the Y-axis direction; the positioning part and the matching part do not interfere with each other between the side walls in the X-axis direction.

In one embodiment of the disclosure, the positioning portion is a positioning pin disposed at an output end of the ejection assembly, and the mating portion is a positioning groove disposed on the spindle mechanism; or, the positioning part is a positioning groove arranged at the output end of the ejection assembly, and the matching part is a positioning pin arranged on the spindle mechanism.

In one embodiment of the present disclosure, the spindle mechanism includes:

the Z-axis bottom plate is fixed on the Y-axis motion assembly, and the matching part is arranged at the bottom of the Z-axis bottom plate;

A main shaft;

and the Z-axis movement mechanism is arranged on the Z-axis bottom plate and is configured to drive the main shaft to move in the Z-axis direction.

a table configured thereon for securing a workpiece; the workbench is provided with a calibration mechanism;

and the Y-axis movement mechanism is configured to drive the workbench and the calibration mechanism to move in the Y-axis direction.

In one embodiment of the disclosure, at least one machining area is provided on the table, each machining area is correspondingly provided with at least two spindle mechanisms, and at least one spindle mechanism is configured to cooperate with a Y-axis adjustment mechanism.

According to a second aspect of the present disclosure, there is also provided a circuit board processing apparatus including:

a base;

a spindle mechanism configured to process a workpiece;

The circuit board processing equipment has the beneficial effects that the main shaft mechanism can move in the Y axis direction through the Y axis movement assembly under the action of external force through the calibration mechanism, so that the aim of calibrating the main shaft mechanism in the Y axis direction is fulfilled, the defect that the traditional circuit board processing equipment cannot calibrate in the Y axis direction is overcome, and in addition, an additional driving mechanism is not required to be arranged on the main shaft mechanism to drive the main shaft to move in the Y axis direction, so that the processing precision and the processing efficiency of the circuit board processing equipment are improved, the structure of the circuit board processing equipment is simplified, and the manufacturing cost of the circuit board processing equipment is reduced.

Other features of the present disclosure and its advantages will become apparent from the following detailed description of exemplary embodiments of the disclosure, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic view of a part of a circuit board processing apparatus according to an embodiment of the present disclosure;

FIG. 2 is a side view of a portion of the structure of a circuit board processing apparatus provided in an embodiment of the present disclosure;

FIG. 3 is an enlarged schematic view of portion A of FIG. 2;

FIG. 4 is a schematic view of a portion of a Y-axis adjustment mechanism according to one embodiment of the present disclosure;

fig. 5 is a schematic view showing a part of the structure of a main shaft of a circuit board processing apparatus according to an embodiment of the present disclosure;

FIG. 6 is an exploded view of a portion of the Y-axis adjustment mechanism provided in one embodiment of the present disclosure;

fig. 7 is a flowchart of a control method of a circuit board processing apparatus provided in an embodiment of the present disclosure;

fig. 8 is a flowchart of a control method of a circuit board processing apparatus provided in another embodiment of the present disclosure;

fig. 9 is a flowchart of a control method of a circuit board processing apparatus provided in another embodiment of the present disclosure.

The one-to-one correspondence between the component names and the reference numerals in fig. 1 to 9 is as follows:

1. a base; 2. a work table; 3. a Y-axis movement mechanism; 31. a Y-axis grating ruler; 32. a Y-axis guide rail; 4. a positioning surface; 5. a spindle mechanism; 51. a positioning groove; 52. a Z-axis bottom plate; 53. a main shaft; 531. a clamping part; 532. a mounting plate; 54. a Z-axis motion mechanism; 541. a Z-axis grating ruler; 55. a first spindle mechanism; 56. a second spindle mechanism; 6. a Y-axis adjusting mechanism; 61. a Y-axis motion assembly; 611. a fixed bracket; 612. a mounting groove; 613. adjusting the bracket; 614. a bearing set; 615. a partition; 62. a locking bracket; 621. a guide bar; 7. a calibration mechanism; 71. an ejection assembly; 72. a positioning pin; 8. an X-axis movement mechanism; 81. an X-axis guide rail; 82. an X-axis sliding block.

Detailed Description

Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

Specific embodiments of the present disclosure are described below with reference to the accompanying drawings.

In this document, "upper", "lower", "front", "rear", "left", "right", and the like are used merely to indicate relative positional relationships between the relevant portions, and do not limit the absolute positions of the relevant portions.

Herein, "first", "second", etc. are used only for distinguishing one another, and do not denote any order or importance, but rather denote a prerequisite of presence.

Herein, "equal," "same," etc. are not strictly mathematical and/or geometric limitations, but also include deviations that may be appreciated by those skilled in the art and allowed by fabrication or use, etc.

The present disclosure provides a spindle deviation adjusting device, where the circuit board processing device may be a drilling machine, a forming machine, a gong drilling machine, or other devices that need to process a circuit board, and specifically, the circuit board processing device includes a base, a spindle mechanism, a Y-axis adjusting mechanism, and a calibration mechanism. Wherein the spindle mechanism is configured for machining a workpiece. The Y-axis adjusting mechanism comprises a Y-axis moving assembly and a locking assembly, and the calibrating mechanism is configured to apply an external force for calibration to the Y-axis adjusting mechanism after the main shaft mechanism moves to a calibrating position with the calibrating mechanism.

Specifically, when the locking assembly is located at the opening position, the spindle mechanism is configured to move in the Y-axis direction by the corresponding displacement through the Y-axis movement assembly under the action force of the calibration mechanism, so as to calibrate the deviation of the spindle mechanism in the Y-axis direction, that is, eliminate the deviation of the spindle mechanism in the Y-axis direction, thereby avoiding the deviation of the spindle mechanism in the Y-axis direction caused by installation clearance, positional deviation caused by long-time use or other factors, and improving the machining precision of the spindle mechanism on the workpiece. After the alignment of the spindle mechanism in the Y-axis direction is completed, the locking assembly is in a locking position to lock the Y-axis movement assembly so that the spindle mechanism does not move in the Y-axis direction.

For ease of understanding, the specific structure of the spindle deviation adjusting device of the present disclosure and its operation principle will be described in detail with reference to fig. 1 to 9 in conjunction with an embodiment.

For convenience of explanation of the spindle deviation adjusting device of the present disclosure, referring to the directions illustrated in fig. 1, in a three-axis rectangular coordinate system, an axial direction of a circuit board processing apparatus is referred to as an X-axis direction, a direction perpendicular to the X-axis direction and in the same horizontal plane as the X-axis is referred to as a Y-axis direction, and directions perpendicular to the X-axis direction and the Y-axis direction are referred to as Z-axis directions. Hereinafter, the description of the X, Y, Z axis direction including the spindle deviation adjusting device, the moving mechanism, the spindle mechanism, etc., which will appear later, is also consistent with the X, Y, Z axis direction of the circuit board processing apparatus, and this naming is merely for convenience of those skilled in the art to fully understand the present disclosure, which is not to be unduly limited by the present disclosure.

Referring to fig. 1 to 2, in one embodiment of the present disclosure, a spindle deviation adjusting apparatus is provided, and the circuit board processing device may be, for example, a PCB milling machine capable of drilling holes in a board such as a PCB board requiring higher accuracy. Of course, it is obvious to those skilled in the art that the circuit board processing apparatus of the present disclosure may be an intelligent machine tool or the like for processing other workpieces, and the structure and related functions of the circuit board processing apparatus of the present disclosure are described in detail herein by taking a PCB milling machine as an example. It should be noted, however, that the circuit board processing apparatus of the present disclosure may be not only a PCB milling machine, but also other types of circuit board processing apparatuses, and the present disclosure is not limited thereto.

Referring to fig. 1, taking a PCB milling machine as an example, the circuit board processing apparatus of the present disclosure includes a base 1, a spindle mechanism 5, a Y-axis adjusting mechanism 6, and a calibration mechanism 7. The spindle mechanism 5 of the present disclosure can be controlled by a corresponding driving mechanism to move in the X-axis direction relative to the base 1, and meanwhile, the tool bit in the spindle mechanism 5 can move in the Z-axis direction under the driving of the corresponding driving mechanism, and in the process of moving the tool bit in the Z-axis direction, a workpiece such as a circuit board located on a workbench can be processed; and the position of the tool bit relative to the work piece in the X-axis direction is adjusted by the movement of the spindle mechanism 5 in the X-axis direction. Generally, for the sake of simplicity of construction, a driving mechanism movable in the Y-axis direction is not provided on the base 1 to drive the spindle mechanism 5 to move in the Y-axis direction to change the position of the tool bit relative to the workpiece in the Y-axis direction. The displacement in the Y-axis direction is achieved by the table, i.e. the corresponding drive mechanism can drive the table to move in the Y-axis direction, thereby achieving adjustment of the position of the tool tip relative to the workpiece in the Y-axis direction. The PCB of above-mentioned structure bores gong machine, realizes the displacement in Y axle direction by the workstation, has avoided concentrating the triaxial motion and has set up in the position of spindle unit 5, can reduce the regional structure complexity of spindle unit 5 from this, is favorable to guaranteeing its precision in X axle direction, Z axle direction simultaneously.

In one embodiment of the present disclosure, the base 1 may be a reinforcement beam support or steel frame structure provided on the working surface, which may have an L-shaped structure extending in a horizontal direction of the working surface and extending in a vertical direction perpendicular to the working surface, respectively. Specifically, the base 1 includes a machine having a table top, and the table 2 is provided on the machine; a cross beam extending in the X-axis direction is provided on one side of the machine, for example, on the rear side of the machine, and the Y-axis adjusting mechanism 6 and the spindle mechanism 5 are provided on the cross beam. When the spindle mechanism 5 performs processing work, a workpiece is fixedly arranged on the workbench 2 and is arranged perpendicular to the spindle mechanism 5. The spindle mechanism 5 moves relative to the workpiece to realize the workpiece tapping treatment. The workpiece can also be a PCB board or other boards needing to be provided with holes, and the disclosure is not limited in any way.

In the present embodiment, referring to fig. 4 and 5, the Y-axis adjusting mechanism 6 includes a Y-axis moving assembly 61 and a locking assembly. When the lock assembly is moved to the open position, the spindle mechanism 5 is configured to be moved in the Y-axis direction by the Y-axis movement assembly 61 under the force of an external force to calibrate the deviation of the spindle mechanism 5 in the Y-axis direction. Correspondingly, when the locking assembly is moved to the locking position, the locking assembly locks the Y-axis moving assembly 61 to prevent the spindle mechanism 5 from moving in the Y-axis direction. The purpose of calibrating the spindle mechanism 5 in the Y-axis direction is achieved through the Y-axis adjusting mechanism, after calibration is completed, the position of the spindle mechanism 5 in the Y-axis direction can be locked through the locking assembly, so that the spindle mechanism 5 is always positioned at the calibrated position in the machining process to perform machining work, the machining precision of the spindle mechanism 5 is improved, the hole opening position can be more accurate, and the execution of subsequent tasks after the hole opening work is facilitated.

With continued reference to fig. 2 and 4, the calibration mechanism 7 is configured to apply an external force for calibration to the Y-axis adjustment mechanism 6 after the spindle mechanism 5 moves to a position that is compatible with the calibration mechanism 7. By the mutual cooperation of the calibration mechanism 7 and the spindle mechanism 5, the spindle mechanism 5 can move in the Y-axis direction under the action of the calibration mechanism 7, so that the position of the spindle mechanism 5 in the Y-axis direction can be adjusted. Therefore, the deviation of the position of the spindle mechanism 5 in the Y-axis direction caused by long-term use or factors such as the mounting piece and the connection mode of the spindle mechanism 5 can be avoided, and the machining precision is improved.

In the calibration, the spindle unit 5 is moved into a position which is adapted to the calibration unit 7, which is referred to as a calibration position in the following, i.e. the calibration unit 7 is in a calibration position which is used mainly for calibrating deviations of the spindle unit 5 in the Y-axis direction, so long as it is ensured that the calibration unit 7 is moved into or remains in a calibration position which is capable of performing displacements in the Y-axis direction. The locking assembly is moved to the open position so that the spindle mechanism 5 is free to move in the Y-axis direction. At this time, the alignment mechanism 7 cooperates with the spindle mechanism 5 to apply a force to move the spindle mechanism 5 in the direction of the alignment position, thereby driving the spindle mechanism 5 to move in the Y-axis direction, and performing alignment of the spindle mechanism 5 in the Y-axis direction. When the spindle mechanism 5 and the calibration mechanism 7 complete the calibration task, the locking assembly moves to the locking position to limit the movement of the spindle mechanism 5 in the Y-axis direction, so that the position of the spindle mechanism 5 in the Y-axis direction is kept stable. In this way, after the misalignment of the spindle mechanism 5 is eliminated, the spindle mechanism can be always positioned after calibration to perform the punching operation. The precision of the spindle mechanism 5 can be improved, and the hole position formed by the spindle mechanism is ensured to be as close as possible to the preset position, so that the machining precision is improved, and the machining error is within the control range.

In one embodiment of the present disclosure, referring to fig. 4 and 6, the y-axis motion assembly 61 includes a fixed bracket 611 and an adjustment bracket 613. The adjustment bracket 613 is guide-fitted on the fixing bracket 611, and is configured to move in the Y-axis direction along the fixing bracket 611 under the influence of external force. The spindle mechanism 5 is fixed to the adjustment bracket 613, so that when the adjustment bracket 613 or the spindle mechanism 5 is subjected to an external force and moves in the Y-axis direction, the spindle mechanism 5 can be driven to move synchronously.

In one embodiment of the present disclosure, to improve the accuracy of the movement of the Y-axis adjustment mechanism 6, with continued reference to fig. 6, the adjustment brackets 613 are provided with at least two, at least two adjustment brackets 613 are respectively located at opposite sides of the fixed bracket 611 and are configured to be respectively guide-fitted on the adjustment brackets 613 through the bearing groups 614. In this embodiment, a partition 615 extending along the Y-axis direction is further provided at the connection between the fixing bracket 611 and the adjusting bracket 613. In particular, the bearing set 614 may include two short slider linear bearings located on opposite sides of the divider 615, located on opposite sides of the divider 615 to be separated by the divider 615. The adjusting bracket 613 is provided with extension parts extending downwards at two sides in the X-axis direction respectively, so that a mounting groove is formed at the lower end face of the adjusting bracket 613, the partition 615 and the short sliding block linear bearings positioned at two opposite sides of the partition 615 are both positioned in the mounting groove, the fixed ends of the short sliding block linear bearings can be fixed on the fixed bracket 611 through screws, and the movable ends can be fixed on the adjusting bracket 613 through screws, thereby realizing guide fit between the adjusting bracket 613 and the fixed bracket 611. In the embodiment of the present disclosure, since the displacement amount of the adjustment bracket 613 moving in the Y-axis direction with respect to the fixed bracket 611 is relatively small, a short slider linear bearing can be employed, and the complexity of the structure therebetween is reduced while ensuring the moving accuracy. When the Y-axis adjusting mechanism 6 receives an external force along the Y-axis direction, the adjusting bracket 613 moves along the Y-axis direction relative to the fixing bracket 611 under the cooperation of the bearing set 614, so as to drive the spindle mechanism 5 to move synchronously with the same.

In one embodiment of the present disclosure, in order to further improve the accuracy of movement in the Y-axis direction after the Y-axis adjustment mechanism 6 is stressed, with continued reference to fig. 6, in this embodiment, spacers 615, bearing groups 614, and adjustment brackets 613 along the Y-axis direction are provided on both sides of the fixed bracket 611 that are opposite in the horizontal direction and both ends of the fixed bracket 611 that are opposite in the vertical direction. Specifically, an adjusting bracket 613 is disposed on each of opposite sides of the upper end surface of the fixed bracket 611, and an adjusting bracket 613 is disposed on each of opposite sides of the lower end surface of the fixed bracket 611. The arrangement of the adjustment bracket 613 and the fixing bracket 611 may be the same as the above-described embodiment. The spindle mechanism 5 is fixedly connected with the four adjusting brackets 613, so that the spindle mechanism can stably move in the Y-axis direction after being stressed through the four adjusting brackets 613 which are uniformly distributed, and the situation that dislocation occurs in the movement of the spindle mechanism 5 due to uneven stress of the adjusting brackets 613 is avoided. It should be noted that the number of the adjustment brackets 613 may be any integer number of five, six, or the like, as long as the spindle mechanism 5 can be stably moved in the Y-axis direction after being stressed, and the disclosure is not limited thereto.

In one embodiment of the present disclosure, the locking assembly includes a locking bracket 62 and a locking member (not shown). Referring to fig. 4 and 6, the lock bracket 62 is configured to be fitted on the fixing bracket 611 along the Y-axis guide, and is fixed with the spindle mechanism 5. The locking member is configured to move to a locking position that locks the locking bracket 62 with the fixing bracket 611, and to an opening position that unlocks the locking bracket 62 with the fixing bracket 611. With continued reference to fig. 6, the locking bracket 62 is disposed on the fixing bracket 611 at an intermediate position of the fixing bracket 611. Specifically, the locking brackets 62 are disposed in the middle area of the two oppositely disposed adjusting brackets 613, which is advantageous in that the adjusting brackets 613 located at both sides thereof can be uniformly and accurately blocked from moving in the Y-axis direction when the locking member is in the locking position, thereby further improving the moving accuracy of the Y-axis adjusting mechanism 6.

Specifically, with continued reference to fig. 6, a guide bar 621 is further provided at a position of the fixing bracket 611 corresponding to the locking bracket 62, the guide bar 621 extending in the Y-axis direction and configured to be integrally provided with the fixing bracket 611. The guide bar 621 may also be detachably connected to the fixing frame 611, which is not excessively limited in this disclosure. The locking bracket 62 is provided with a guide groove structure matched with the shape of the guide strip 621, and the locking bracket 62 and the fixed bracket 611 are in guide fit together by the guide strip 621 and the guide groove, so that the locking bracket 62 can move relative to the guide strip 621. After the lock bracket 62 is fixed with the spindle mechanism 5, when the spindle mechanism 5 moves in the Y-axis direction in synchronization with the adjustment bracket 613, the lock bracket 62 can be moved in synchronization with respect to the fixed bracket 611.

When the locking member is moved to the locking position, it is locked with the guide bar 621 to achieve blocking of the Y-axis adjustment mechanism 6 from moving in the Y-axis direction. Correspondingly, when the locking piece moves to the open position, the locking bracket 62 and the guide strip 621 are in a state of no interference, and the adjusting bracket 613 can move in the Y-axis direction, so that the spindle mechanism 5 can move in the Y-axis direction, and the purpose of performing Y-axis calibration on the spindle mechanism 5 is achieved.

In this embodiment, the locking member is configured to move between the locked position and the open position pneumatically or electrically in order to reduce the effect of vibrations generated during movement of the locking member to drive the locking bracket 62 on the position of the spindle mechanism 5. Of course, other ways of effecting movement of the locking member may be employed by those skilled in the art, and this disclosure is not so limited. In one embodiment of the present disclosure, the locking member may be in the form of a rail clamp structure known to those skilled in the art, and the rail clamp may be pneumatically driven. The rail clamp may be driven to a locked position, for example by a control air supply, in which the locking bracket 62 is locked with the guide bar 621 to prevent movement of the locking bracket 62 relative to the guide bar 621. By shutting off the air source, the rail clamp can lose pressure, and therefore the rail clamp can not lock the locking bracket 62 and the guide strip 621 any more, and at this time, the locking bracket 62 can move in the Y-axis direction relative to the guide strip 621 when an external force is applied, so that free movement and locking of the spindle mechanism 5 in the Y-axis direction are realized.

In one embodiment of the present disclosure, in order to achieve the movement of the spindle mechanism 5 in the X-axis direction to adjust the position of the spindle mechanism 5 in the X-axis direction with respect to the workpiece, referring to fig. 4, the circuit board processing apparatus further includes an X-axis movement mechanism 8. The X-axis moving mechanism 8 includes an X-axis guide rail 81 provided on the base 1 and extending in the X-axis direction, and an X-axis slider 82 guiding the fitting on the X-axis guide rail 81. The fixing bracket 611 is configured to be fixed to the X-axis slider 82. In this embodiment, the X-axis guide rail 81 protrudes from the base 1, and as shown in fig. 4, the X-axis guide rail 81 extends along the X-axis direction and has a strip-like structure. Referring also to fig. 6, the X-axis slider 82 is configured to have a groove structure adapted to the X-axis guide rail 81 so that the two can be slidably connected after being assembled together, thereby enabling the spindle mechanism 5 in the circuit board processing apparatus to move along the X-axis guide rail 81 in the X-axis direction. Of course, in order to realize the movement of the spindle mechanism 5 in the X-axis direction, an X-axis driving mechanism is further included, by which the displacement of the spindle mechanism 5 in the X-axis direction can be adjusted, and when the displacement of the spindle mechanism 5 in the X-axis direction occurs, the displacement of the spindle mechanism 5 in the X-axis direction can be calibrated by closed-loop control of the X-axis driving mechanism.

In a specific embodiment of the present disclosure, bolt holes are formed at corresponding positions on the X-axis sliding block 82 and the fixing support 611, and the two are fixed together through bolting, so that when the X-axis sliding block 82 moves relative to the X-axis guide rail 81, the fixing support 611 can be driven to move synchronously, so as to drive the spindle mechanism 5 to move in the X-axis direction. In this embodiment, the X-axis sliding block 82 and the fixing support 611 are arranged in an array, and four rows, four columns and sixteen bolt holes are arranged in total, so that the two bolt holes can be tightly connected and fixed together. Of course, it should be noted that other connection manners known to those skilled in the art may be adopted, and the number of the bolt holes formed thereon may be any integer number, so long as the X-axis sliding block 82 and the fixing support 611 can be fixedly connected, which is not limited herein.

In the present embodiment, referring to fig. 4, in order to improve the accuracy of movement of the circuit board processing apparatus in the X-axis direction, the X-axis guide rail 81 is configured such that two are oppositely disposed up and down in the Z-axis direction. Specifically, each X-axis guide rail 81 has an X-axis slider 82 that moves in cooperation therewith, and the fixing brackets 611 are respectively fixed with the two X-axis sliders 82. The X-axis movement mechanisms which are arranged in a vertically opposite mode can enable the spindle mechanism 5 to move in the X-axis direction stably, and the movement accuracy of the spindle mechanism 5 is not affected due to unbalanced stress. Of course, the number of the X-axis guide rails 81 may be any integer as long as it is possible to restrict the movement path of the spindle mechanism 5 in the X-axis direction and to allow the spindle mechanism 5 to smoothly move in the X-axis direction, and the present disclosure is not limited thereto.

In one embodiment of the present disclosure, referring to fig. 6, the fixing bracket 611 has a C-shape, and a mounting groove 612 extending in the X-axis direction is formed at a side of the fixing bracket 611 adjacent to the X-axis guide rail 81. The X-axis slider 82 is positioned in the mounting slot 612 and is secured to the fixed bracket 611. In this embodiment, since the fixing support 611 has a C-shaped structure, the mounting groove 612 formed by the fixing support can wrap the X-axis sliding block 82, specifically, three side surfaces of the mounting groove 612 are in contact fit with the X-axis sliding block, and the stability of connection between the two can be improved to a certain extent by increasing the connection surface between the two.

In another embodiment of the present disclosure, the fixing support 611 has a rectangular structure with a certain thickness, and may be directly and fixedly connected with the end surface of the X-axis sliding block 82 through a bolt, which is not described herein in detail. Of course, the fixing support 611 may have other structures, and the disclosure is not limited thereto, as long as the fixing support is capable of being fixed to the X-axis slider and has a certain thickness in the Y-axis direction, so that the adjusting support 613 can move in the Y-axis direction.

In one embodiment of the present disclosure, referring to fig. 2, the calibration mechanism 7 includes an ejector assembly 71 and a positioning portion disposed at an output end of the ejector assembly 71, the positioning portion being configured to be controlled by movement of the ejector assembly 71 in a direction of the spindle mechanism 5 to move the spindle mechanism 5 in a Y-axis direction by the Y-axis movement assembly 61 to calibrate a deviation of the spindle mechanism 5 in the Y-axis direction.

Referring to fig. 3, the ejection assembly 71 may be an ejection motor or an ejection cylinder, and the ejection assembly 71 may be disposed on the table 2 or at other positions, and driven by the ejection assembly 71, may move the positioning portion up and down along the Z-axis direction, so that the positioning portion is matched with the spindle mechanism 5. During the calibration, the spindle mechanism 5 is in a locked state in both the Z-axis and the X-axis directions, and its lock bracket 62 in the Y-axis direction is in an open position, i.e., the spindle mechanism 5 is only able to move in the Y-axis direction. When the ejector assembly 71 drives the matching portion to move upwards to contact with the spindle mechanism 5, the positions of the positioning portion and the spindle mechanism 5 are not completely corresponding to each other due to the deviation, and at this time, under the action of the positioning portion, the spindle mechanism 5 and the adjusting bracket 613 are synchronously displaced relative to the fixing bracket 611 in the Y-axis direction, that is, micro-movement of the spindle mechanism 5 in the Y-axis direction is realized. Along with the continuous movement of the positioning part along the direction of the spindle mechanism 5 along the Z-axis direction, the positioning part is gradually attached to the spindle mechanism 5, and in the process of gradually attaching the positioning part and the spindle mechanism 5, as long as the spindle mechanism 5 has deviation in the Y-axis direction, the positioning part always applies a force to the spindle mechanism 5 for moving in the Y-axis direction, so that the adjusting bracket 613 fixedly connected with the spindle mechanism 5 can move relative to the fixed bracket 611 under the action of the force through the bearing group 614 matched with the positioning part until the positioning part and the spindle mechanism 5 are at the same position in the Y-axis direction, namely, the deviation of the spindle mechanism 5 in the Y-axis direction is eliminated, thereby realizing the calibration of the spindle mechanism 5 in the Y-axis direction. At this time, the locking bracket 62 and the guide bar 621 are locked together by the movement of the locking member to fix the position of the spindle mechanism 5 in the Y-axis direction, thereby facilitating the execution of the subsequent processing task. The error of the spindle mechanism 5 in the Y-axis direction is eliminated by the calibration mechanism 7, which is advantageous in improving the accuracy of the spindle mechanism 5 at the time of processing.

In order to enable the spindle mechanism 5 to move in the Y-axis direction under the action of the positioning portion in the case where there is a deviation in the Y-axis direction of the spindle mechanism 5, in one embodiment of the present disclosure, referring to fig. 3, a fitting portion that fits with the positioning portion is provided on the spindle mechanism 5, a positioning surface 4 is formed between the fitting portion and the positioning portion, and the positioning portion is configured to enable the spindle mechanism 5 to move in the Y-axis direction under the pressing action of the positioning surface 4 in the process of moving upward. The fitting portion may be provided on the bottom end face of the spindle mechanism 5, as shown in fig. 3, and the fitting portion is a trapezoidal groove provided at the bottom of the spindle mechanism 5 and extending in the X-axis direction. The positioning portion is a convex structure adapted to the shape of the fitting portion, specifically, the positioning portion is configured as a convex structure extending in the X-axis direction. In the process of calibrating the matching part and the positioning part of the spindle mechanism 5, the matching part gradually moves towards the direction of the positioning part under the limiting action of the positioning part and is attached to the positioning part. With continued reference to fig. 3, in the process of gradually attaching the two parts, the groove surface of the mating part is gradually attached to the convex surface of the positioning part, and the positioning surface 4 formed by attaching the two parts applies an acting force to the mating part, so that the mating part moves towards the position where the positioning part is located, until the positioning surfaces 4 of the positioning part and the mating part are completely mated together, the movement is stopped, and thus the calibration work of the spindle mechanism 5 in the Y-axis direction is completed. After the positioning part finishes the calibration task, the position of the spindle mechanism in the Y-axis direction can be locked by the locking piece, so that the spindle mechanism 5 is fixed in the calibration position, and the subsequent processing task is facilitated.

In one embodiment of the present disclosure, the locating portion may also be a protrusion of a "V-shaped" configuration, and the mating portion is a "Λ -shaped" groove configuration that mates with the "V-shaped" protrusion. Of course, the structures of the mating portion and the positioning portion may be interchanged, that is, the mating portion has a protruding structure, and the positioning portion has a groove structure corresponding to the protruding structure, which is not limited herein.

In a specific embodiment of the present disclosure, referring to fig. 3, the positioning surface 4 is an inclined plane or curved surface disposed between the mating portion and the positioning portion according to the shape of the positioning portion, the mating portion. The positioning surface 4 can apply a moving force to the matching portion in the direction of the positioning portion, so that the spindle mechanism 5 can be calibrated.

In one embodiment of the present disclosure, the positioning surface 4 is located on the side walls of the positioning portion and the mating portion distributed in the Y-axis direction, and the positioning portion and the mating portion do not interfere between the side walls in the X-axis direction. The axial side wall of the positioning portion may include four side walls including two side walls sequentially distributed in the X-axis direction and two side walls sequentially distributed in the Y-axis direction, wherein the positioning surface 4 is provided on the two side walls located in the Y-axis direction. The positioning surface 4 is configured as an inclined surface extending gradually outwards from top to bottom, and the inner wall of the corresponding position on the matching part is configured to be matched with the positioning surface 4 on the positioning part. When the positioning portion is located at the calibration position, if there is no deviation in the Y-axis direction of the spindle mechanism 5 at this time, it can be directly fitted with the fitting portion on the spindle mechanism 5 during the upward movement of the positioning portion. If the spindle mechanism 5 has a deviation in the Y-axis direction, and there is a deviation in the Y-axis direction between the positioning surface of the positioning portion and the positioning surface of the mating portion during the upward movement of the positioning portion, the two are pressed against each other, so that the displacement of the spindle mechanism 5 in the Y-axis direction occurs, thereby eliminating the deviation of the spindle mechanism 5 in the Y-axis direction.

In the present embodiment, the positioning portion and the engaging portion are configured to be interference-engaged with each other only in the Y-axis direction, so that the spindle mechanism 5 moves only above the Y-axis direction during the calibration. Specifically, in order to prevent the positioning portion and the matching portion from interfering with each other in the X-axis direction, the dimensions of the positioning portion and the matching portion in the X-axis direction can be changed, so that the side walls, which are distributed in the X-axis direction, between the positioning portion and the matching portion are not bonded together when the positioning portion and the matching portion are matched with each other, and therefore, the positioning portion and the matching portion are only contacted with each other in the Y-axis direction and form a positioning surface 4, and the positioning surface 4 is not formed in the X-axis direction.

In a specific embodiment of the present disclosure, the positioning portion is a positioning pin 72 disposed at the output end of the ejector assembly 71, and the mating portion is a positioning groove 51 disposed on the spindle mechanism 5. The positioning pin 72 and the positioning groove 51 are mutually matched to form a positioning surface 4 in the Y-axis direction so as to drive the spindle mechanism 5 to move in the Y-axis direction towards the center of the positioning pin 72, thereby achieving the aim of calibrating the spindle mechanism 5 in the Y-axis direction. In another embodiment of the present disclosure, the positioning portion is a positioning groove provided at the output end of the ejection assembly 71, and the mating portion is a positioning pin provided on the spindle mechanism 5. The matching relationship and driving principle of the positioning groove and the positioning pin are described in detail above, and the disclosure is not repeated here.

In one embodiment of the present disclosure, referring to fig. 2 and 5, spindle mechanism 5 includes a Z-axis base plate 52, a spindle 53, and a Z-axis movement mechanism 54. Wherein, the Z-axis bottom plate 52 is fixed on the adjusting bracket 613, and the matching part is arranged at the bottom of the Z-axis bottom plate 52. The Z-axis moving mechanism 54 is provided on the Z-axis base plate 52, and is configured to move the spindle 53 in the Z-axis direction. In order to improve the machining precision, referring to fig. 1, the spindle 53 may be guided and matched on the Z-axis bottom plate 52 through the mounting plate 532, so that the Z-axis movement mechanism 54 may drive the spindle 53 to move in the Z-axis direction relative to the workpiece, so that in the process of machining the workpiece, the spindle 53 may perform a hole-forming operation perpendicular to the workpiece, so as to avoid the inclination of the position of the spindle hole, and influence the machining precision. In a specific embodiment of the present disclosure, the Z-axis base plate 52 further has a Z-axis grating scale 541 thereon for detecting the moving distance of the mounting plate 532 in the Z-axis direction, so that the moving distance of the spindle 53 in the Z-axis direction can be further precisely controlled. Referring to fig. 5, the spindle 53 may be fixedly connected to the mounting plate 532 through a clamping portion 531, and a bottom portion of the spindle 53 may be provided with a tool bit or the like for machining a workpiece, which will not be described in detail in the present disclosure.

In one embodiment of the present disclosure, with continued reference to fig. 1, the circuit board processing apparatus further includes a table 2, a Y-axis motion mechanism 3. Wherein the table 2 is configured for holding a workpiece, and the alignment mechanism 7 is provided on the table 2. The Y-axis movement mechanism 3 is configured to move the table 2, the alignment mechanism, in the Y-axis direction. The Y-axis movement mechanism 3 includes a Y-axis driving mechanism for driving the table 2 to move in the Y-axis direction, and a Y-axis guide rail 32 and a Y-axis grating ruler 31 provided between the bottom of the table 2 and the base 1 and extending in the Y-axis direction, and the table 2 can move in the direction of the Y-axis guide rail 32 by the driving of the Y-axis driving mechanism. The Y-axis grating scale 31 is configured to record the moving distance thereof in the Y-axis direction.

In the present embodiment, the Y-axis movement mechanism 3 provided on the table 2 is a closed-loop driving system having characteristics of high adjustment accuracy, high resolution, and the like. The circuit board processing equipment disclosed by the disclosure has the advantages that the Y-axis movement mechanism 3 drives the calibration mechanism 7 and the workbench 2 to move, so that the accurate movement capability of the circuit board processing equipment can be ensured, and meanwhile, the driving mechanisms for driving the main shaft mechanism 5 and the Y-axis adjustment mechanism 6 to move in the Y-axis direction are additionally arranged, thereby being beneficial to simplifying the structures of the main shaft mechanism 5 and the Y-axis adjustment mechanism 6.

In the circuit board processing equipment disclosed by the disclosure, the calibration mechanism 7 can be driven to move to the calibration position by the Y-axis movement mechanism 3, then the main shaft mechanism 5 can be moved to the calibration position by the X-axis movement mechanism, the calibration mechanism 7 moves upwards to be matched with the main shaft mechanism 5, and the locking piece is opened, so that the main shaft mechanism 5 can move freely in the Y-axis direction. When the spindle mechanism 5 has the deviation in the Y-axis direction, the calibration mechanism 7 can drive the spindle mechanism 5 and the Y-axis adjusting mechanism 6 to move in the Y-axis direction until the deviation of the spindle mechanism 5 in the Y-axis direction is eliminated, and then the locking piece can be moved to a locking state, so that the calibration of the spindle mechanism 5 in the Y-axis direction is realized.

In one embodiment of the present disclosure, with continued reference to fig. 1, at least one machining area is provided on the table 2, each machining area is correspondingly provided with at least two spindle mechanisms 5, and at least one spindle mechanism 5 is configured to cooperate with a Y-axis adjustment mechanism 6. Because most of the workpieces are often designed into an array-type distributed layout structure, in order to improve the processing efficiency of the circuit board processing equipment, the two sides of the same workpiece matrix are respectively processed by the multiple spindle mechanisms 5, so that the processing time of the circuit board processing equipment on the same workpiece can be greatly shortened, and the processing efficiency of the circuit board processing equipment is improved. In a specific embodiment of the present disclosure, referring to fig. 1, two spindle mechanisms 5 are provided in each processing area as an example, and specifically, the two spindle mechanisms 5 are respectively denoted as a first spindle mechanism 55 and a second spindle mechanism 56. The specific structure and movement modes of the first spindle mechanism 55 and the second spindle mechanism 56 are similar to those of the spindle mechanism 5 in the foregoing, and will not be described in detail herein.

In actual machining, in order to improve the machining accuracy of the circuit board machining apparatus, the first spindle mechanism 55 and the second spindle mechanism 56 need to be synchronized in the Y-axis direction, so that one workpiece can be machined at the same time. In this embodiment, the first spindle unit 55 and the second spindle unit 56 are engaged with the Y-axis adjusting mechanisms 6, that is, the first spindle unit 55 and the second spindle unit 56 can be aligned in the Y-axis direction. The first spindle mechanism 55 and the second spindle mechanism 56 are provided with the calibration mechanism 7 at the positions corresponding to the first spindle mechanism 55 and the second spindle mechanism 56 on the workbench 2, so that the first spindle mechanism 55 and the second spindle mechanism 56 can be calibrated by the same calibration mechanism 7, and the first spindle mechanism 55 and the second spindle mechanism 56 can be positioned at the same position in the Y-axis direction, thereby achieving the purpose of processing one workpiece by using the two spindle mechanisms 5.

In one embodiment of the present disclosure, with continued reference to fig. 1, this embodiment is similar to the above-described embodiment, except that either one of the first spindle mechanism 55 and the second spindle mechanism 56 is configured to cooperate with the Y-axis adjustment mechanism 6, i.e., only one of the first spindle mechanism 55 and the second spindle mechanism 56 can be calibrated in the Y-axis direction. In the following description, the second spindle unit 56 and the Y-axis adjusting unit 6 are combined, and in this embodiment, only the second spindle unit 56 is aligned so that the position in the Y-axis direction is the same as that of the first spindle unit 55, so that the absolute coordinates of the machining centers of the first spindle unit 55 and the second spindle unit 56 in the Y-axis direction are identical or within the allowable range of machining errors. First, the second spindle mechanism 56 needs to be moved to the calibration position corresponding to the calibration mechanism 7, and the first calibration of the second spindle mechanism 56 is achieved through the positioning part and the matching part, and at this time, the current Y-axis value can be recorded through the Y-axis grating ruler 31 on the workbench 2. Next, the first machining center coordinates and the second machining center coordinates of the first spindle mechanism 55 and the second spindle mechanism 56 are acquired by a detection mechanism (not shown in the drawing) on the circuit board machining apparatus, and the deviation Δy in the Y-axis direction between the two is calculated. Then, the second spindle mechanism 56 is moved again to the position recorded by the Y-axis grating scale 31; when the second spindle unit 56 and the calibration unit 7 are engaged with each other, the deviation Δy is moved by the Y-axis movement unit 3 so as to be aligned with the first spindle unit 55 in the Y-axis direction or to be within an allowable error range. Finally, the second spindle mechanism 56 is locked in a calibrated position for execution of subsequent processing tasks.

Specifically, the second spindle mechanism 56 is first moved to the calibration position corresponding to the calibration mechanism 7, and preliminary calibration of the second spindle mechanism 56 is achieved through the positioning portion and the matching portion. Next, after the preliminary calibration work is completed, the machining center coordinates of the first spindle unit 55 and the second spindle unit 56 are detected by a detection mechanism (not shown) on the circuit board machining apparatus, respectively, to obtain the first machining center coordinates and the second machining center coordinates of the first spindle unit 55 and the second spindle unit 56. Specifically, the first machining center positions are denoted as (X1, Y1), and the second machining center positions are denoted as (X2, Y2). The deviation Δy between Y1 and Y2 is known due to factors such as the use time limit of the circuit board processing equipment, the mounting manner of the spindle 53, the connection state between the parts, and the like. Then, the second spindle mechanism 56 is moved to the calibration position again and is matched with the calibration mechanism 7, and the workbench 2, the calibration mechanism 7 positioned on the workbench 2 and the second spindle mechanism 56 matched with the calibration mechanism 7 are moved by the offset delta Y distance along the Y axis direction under the drive of the Y axis movement mechanism 3, so that the first spindle mechanism 55 and the second spindle mechanism 56 are positioned at the same position along the Y axis direction. Finally, after the calibration work is completed, the locking piece of the second spindle mechanism 56 is moved to the locking position, so that the locking piece is fixed at the calibrated position, and therefore the circuit board processing equipment processes the same workpiece through the first spindle mechanism 55 and the second spindle mechanism 56, and the purpose of improving the processing efficiency while ensuring the processing precision is achieved.

Of course, it is also possible for a person skilled in the art to fit the first spindle unit 55 and the Y-axis adjustment mechanism 6 together, and to calibrate the deviation of the first spindle unit 55 in the Y-axis direction so that the absolute coordinates of the machining centers of the first spindle unit 55 and the second spindle unit 56 in the Y-axis direction are identical or at least within the allowable range of machining errors. In the circuit board processing equipment disclosed by the disclosure, the calibration mechanism 7 is matched with the bottom of the Z-axis bottom plate 52 in position, so that the purpose of calibrating the spindle mechanism is realized. However, since there is still an installation error between the installation plate 532, the spindle, the Z-axis movement mechanism, and the Z-axis bottom plate 52 in the spindle mechanism, the deviation between the components due to the installation error still cannot be solved by the above-described steps of calibrating the two spindle mechanisms respectively. In the other embodiment, by calibrating one spindle mechanism and driving one spindle mechanism to move in the Y-axis direction to a corresponding position based on the Y-axis deviation between the machining coordinates of the two spindle mechanisms, the absolute coordinates of the machining centers of the two spindle mechanisms in the Y-axis direction are kept consistent or within the error range, thereby eliminating or partially eliminating the deviation caused by the installation error of each component. This is because the machining center coordinates of the two main shafts refer to the center coordinates of the tool bit, or refer to the center coordinates of the main shafts, and the deviation due to the mounting error can be reduced as much as possible based on the deviation between the two center coordinates and compensating by moving the corresponding distance.

In one embodiment of the present disclosure, in order to further improve the processing efficiency of the circuit board processing apparatus, referring to fig. 1, the table 2 is configured to be disposed to extend along the X-axis direction of the base 1, and a plurality of processing regions are disposed in parallel on the table 2, each of which is provided with at least two spindle mechanisms 5 correspondingly. With continued reference to fig. 1, six sets of working areas are horizontally disposed on the table 2, and two spindle mechanisms 5 are correspondingly disposed in each working area. The two spindle mechanisms 5 in each working area are configured to simultaneously process one workpiece, whereby six workpieces can be simultaneously processed, i.e., the twelve spindle mechanisms respectively process the respective corresponding workpieces. Specifically, the structure and working principle of each group of circuit board processing devices are described in detail above, and the disclosure is not repeated here. By adopting the arrangement, a plurality of workpieces can be processed in batches, compared with the processing of a single workpiece, the processing time of the circuit board processing equipment is greatly shortened by arranging the plurality of groups of processing devices, and the processing efficiency of the circuit board processing equipment is improved, so that the circuit board processing equipment can meet the increasingly-increased processing demands. Accordingly, a calibration mechanism is provided on the table 2 at a position corresponding to each machining region, respectively, which allows the two spindle mechanisms corresponding to each machining region to be calibrated by the calibration mechanism at the corresponding position, which is not described in detail herein.

It is noted that the processing area includes, but is not limited to, six, which may be any integer number. Similarly, the number of spindle mechanisms 5 corresponding to each processing area is not limited to two, so long as a plurality of spindle mechanisms can work simultaneously, and the positions of the spindle mechanisms in the Y-axis direction are within an acceptable error range, so that the processing of the plates with the array structure can be realized, the processing rate of the circuit board processing equipment is improved, and the present disclosure does not limit too much.

The present disclosure also provides a control method of a circuit board processing apparatus, the control method including a calibration step, in particular, referring to fig. 7, the calibration step including:

and S71, controlling the spindle mechanism 5 to move to a position corresponding to the calibration mechanism 7.

The calibration mechanism 7 is arranged on the workbench 2, and the workbench 2 moves to a calibration position under the action of the Y-axis movement mechanism; thereafter, the spindle mechanism 5 can be moved to a position corresponding to the calibration position under the drive of the X-axis movement mechanism, that is, the positioning groove 51 on the Z-axis bottom plate 52 in the spindle mechanism 5 is located at a position above the positioning pin 72 on the calibration mechanism 7.

S72, when the locking assembly moves to the open position, the calibration mechanism 7 is controlled to move in the direction of the spindle mechanism 5 to apply an external force for calibration to the spindle mechanism 5, and the spindle mechanism 5 is configured to move in the Y-axis direction by the Y-axis movement assembly 61 after receiving the external force to calibrate the deviation of the spindle mechanism 5 in the Y-axis direction.

The locking piece in the locking assembly is opened, so that the adjusting bracket 613 can drive the spindle mechanism 5 to move freely in the Y-axis direction after being stressed. The ejector assembly 71 may thereafter be controlled to eject upwardly and bring the alignment pins 72 into contact engagement with the alignment slots 51 of the Z-axis baseplate 52. Under the condition that the main shaft mechanism 5 has Y-axis direction deviation, as the positioning pin 72 and the positioning groove 51 are not completely aligned, the positioning pin 72 continuously moves upwards along the Z-axis, and the positioning pin 72 and the positioning groove are enabled to displace in the Y-axis direction under the extrusion action of the positioning surface until the positioning groove 51 and the positioning pin 72 are completely matched, so that the main shaft mechanism 5 is aligned in the Y-axis direction.

And S73, controlling the locking assembly to move to the locking position so as to lock the Y-axis moving assembly 61.

Since the spindle mechanism 5 has been calibrated by the calibration mechanism 7, the locking member in the locking assembly is thereafter closed, thereby locking the spindle mechanism 5 in the Y-axis direction, avoiding displacement of the spindle mechanism 5 in the Y-axis direction.

In one embodiment of the present disclosure, referring to fig. 8, the spindle mechanism 5 includes at least a first spindle mechanism 55, a second spindle mechanism 56 corresponding to the same processing area, and at least the second spindle mechanism 56 is configured to cooperate with the Y-axis moving assembly 61, i.e., the second spindle mechanism 56 can be displaced in the Y-axis direction under cooperation of the Y-axis moving assembly 61 to calibrate displacement deviation of the second spindle mechanism 56 in the Y-axis direction. After the preliminary calibration in the Y-axis direction is performed on the second spindle mechanism 56 by the calibration step, it further includes:

S81, a deviation Δy of the machining center coordinates of the first spindle unit 55 and the second spindle unit 56 in the Y-axis direction is obtained.

After the second spindle mechanism 56 is calibrated in the Y-axis direction by the above-described calibration step, the ejector assembly 71 is controlled to be downward and the positioning pins 72 are disengaged from the positioning grooves 51 of the Z-axis base plate 52. At this time, the second spindle unit 56 may be moved to the machining center coordinate detecting position, and the machining center coordinates of the first spindle unit 55 and the second spindle unit 56 may be detected by the detecting unit, where the machining center coordinates of the second spindle unit 56 are the machining center coordinates of the second spindle unit 56 after one calibration. And the deviation deltay of the first spindle mechanism 55 and the second spindle mechanism 56 in the Y-axis direction is obtained based on the machining center coordinates of the first spindle mechanism 55 and the second spindle mechanism 56.

Specifically, in one embodiment of the present disclosure, the step of obtaining the deviation Δy of the machining center coordinates of the first spindle mechanism 5, the second spindle mechanism 5 in the Y-axis direction includes: referring to fig. 9, S91, detecting first machining center coordinates of the first spindle mechanism 55; s92, detecting second machining center coordinates of the second spindle mechanism 56 after calibration; s93, the deviation Δy of the machining center coordinates of the first spindle unit 55 and the second spindle unit 56 in the Y-axis direction is obtained based on the first machining center coordinates and the second machining center coordinates.

S82, the locking assembly on the second spindle mechanism 56 is opened, the second spindle mechanism 56 and the calibration mechanism 7 are controlled to be matched together again, and the second spindle mechanism 56 can move delta Y in the Y-axis direction through the Y-axis movement assembly 61 by applying external force to the second spindle mechanism 56 so as to compensate the position deviation between the first spindle mechanism 55 and the second spindle mechanism 56.

After the second spindle mechanism 56 is moved to the calibration position of the calibration mechanism 7 again, the locking member in the locking assembly is opened, so that the ejection assembly 71 drives the second spindle mechanism 56 to move freely in the Y-axis direction. Specifically, the upward-jacking ejection assembly 71 is matched with the positioning groove 51 of the Z-axis bottom plate 52 through the positioning pin 72 to position the second spindle mechanism 56, and then the displacement of the Y-axis movement mechanism 3 driving the workbench 2 to move Δy in the Y-axis direction can be controlled, so that the ejection assembly 71 and the second spindle mechanism 56 are driven to move by a distance Δy in the Y-axis direction in the movement process of the workbench 2, and the deviation of the second spindle mechanism 56 and the first spindle mechanism 55 in the Y-axis direction can be calibrated.

In one embodiment of the present disclosure, the spindle mechanism 5 includes at least a first spindle mechanism 55, a second spindle mechanism 56 corresponding to the same processing region. Referring to fig. 9, the first spindle unit 55 and the second spindle unit 56 are calibrated by the calibration step, respectively. Specifically, the first spindle unit 55 is calibrated by the calibration unit 7 by the above-mentioned calibration step, and the second spindle unit 56 is calibrated by the calibration unit 7 by the above-mentioned calibration step, thereby realizing that the absolute coordinates of the machining centers of the first spindle unit 55 and the second spindle unit 56 in the Y-axis direction are kept consistent or within an allowable error range.

In one embodiment of the present disclosure, the processing method further comprises a control unit. The control unit is configured to perform the calibration step after the spindle mechanism 5 is operated for a predetermined time or after the spindle mechanism 5 processes a predetermined number of workpieces. When the circuit board processing equipment disclosed by the disclosure works, the main shaft can be in processing fit with the workpiece on the workbench through the fit of all the components. After the spindle mechanism 5 has been operated for a predetermined time, the control unit may control the spindle mechanism 5 to perform the above-described calibration step. Alternatively, the control unit may control the spindle mechanism 5 to perform the above-described calibration step after the circuit board processing apparatus processes a predetermined number of workpieces. In one embodiment of the present disclosure, the control unit is configured to detect a positional deviation of the spindle mechanism 5 after the spindle mechanism 5 is operated for a predetermined time, and the control unit performs the calibration step based on the positional deviation being greater than a threshold value. In the present embodiment, the machining center of the spindle mechanism 5 can automatically calibrate the deviation of the spindle mechanism 5 in the Y-axis direction through the above calibration step, so that the circuit board machining apparatus can always have good accuracy to perform the machining task. Specifically, the control unit is configured to automatically detect a positional deviation of the spindle mechanism 5 in the Y-axis direction after a predetermined time interval during machining, and to perform the calibration step after the positional deviation is greater than a threshold value. The circuit board processing equipment disclosed by the invention can automatically detect and calibrate the spindle mechanism 5 in the working process, and automatically adjust and compensate to realize the improvement of the processing precision and the further improvement of the accuracy of drilling holes on the produced PCB.

In one embodiment of the present disclosure, the control unit is configured to detect a positional deviation of the spindle mechanism 5 after the spindle mechanism processes a predetermined number of workpieces, and the control unit performs the calibration step based on the positional deviation being greater than a threshold value. In the present embodiment, after the circuit board processing apparatus processes a certain number of circuit boards, the positional deviation of the spindle mechanism 5 in the Y-axis direction is automatically detected, and the control unit performs the calibration step based on the positional deviation being greater than the threshold value. The control unit can control the spindle mechanism 5 to automatically execute the calibration procedure in the working process, so that the machining precision is improved, and the accuracy of drilling holes in the produced circuit board is further improved. The compensation deviation delta Y is automatically adjusted, so that the processing efficiency of the circuit board processing equipment can be improved, and the quality of circuit boards processed and produced in batches is kept stable and reliable, and the consistency is good.

The disclosure also provides a spindle deviation adjusting device or circuit board processing equipment. The spindle deviation adjusting device or the circuit board processing equipment comprises a spindle mechanism 5 and a Y-axis adjusting mechanism 6. The spindle mechanism 5 is configured for processing a workpiece. The Y-axis adjusting mechanism 6 includes a Y-axis moving assembly 61 and a locking assembly, and when the locking assembly moves to the open position, the spindle mechanism 5 is configured to move in the Y-axis direction by the Y-axis moving assembly 61 under the action of external force to calibrate the deviation of the spindle mechanism 5 in the Y-axis direction; the locking assembly is configured to lock the Y-axis motion assembly 61 in the locked position. The functions of the various structures in the spindle offset adjustment device are referred to above and are not illustrated here.

The foregoing description of the embodiments of the present disclosure has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the technical improvements in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims

1. A spindle bias adjustment device for a circuit board processing apparatus, comprising:

-a spindle mechanism (5), the spindle mechanism (5) being configured for processing a workpiece;

a Y-axis adjustment mechanism (6), the Y-axis adjustment mechanism (6) comprising a Y-axis movement assembly (61) and a locking assembly; the spindle mechanism (5) is configured to move in the Y-axis direction by an external force through a Y-axis movement assembly (61) when the locking assembly is moved to an open position; the locking assembly is configured to lock the Y-axis motion assembly (61) in a locked position.

2. The spindle deviation adjusting apparatus according to claim 1, wherein the Y-axis moving assembly (61) includes:

a fixed bracket (611);

an adjustment bracket (613), the adjustment bracket (613) being guide-fitted on the fixing bracket (611) and configured to move in the Y-axis direction along the fixing bracket (611) under the influence of external force; the spindle mechanism (5) is fixed on the adjusting bracket (613).

3. Spindle deviation adjusting device according to claim 2, characterized in that the adjusting brackets (613) are provided with at least two, at least two adjusting brackets (613) being located on opposite sides of the fixed bracket (611) respectively and being configured to be guided fitted on the fixed bracket (611) respectively by means of bearing sets (614).

4. The spindle bias adjustment device of claim 2, wherein the locking assembly comprises:

a locking bracket (62), wherein the locking bracket (62) is configured to be matched on the fixed bracket (611) along the Y-axis direction and fixed with the spindle mechanism (5);

a locking member configured to move to a locking position that locks the locking bracket (62) with the fixed bracket (611) and to an opening position that unlocks the locking bracket (62) with the fixed bracket (611).

5. The spindle deviation adjusting apparatus according to claim 2, wherein the circuit board processing device includes:

an X-axis movement mechanism (8), wherein the X-axis movement mechanism (8) comprises an X-axis guide rail (81) which is arranged on the base (1) and extends along the X-axis direction, and an X-axis sliding block (82) which is in guiding fit on the X-axis guide rail (81); the fixed bracket (611) is configured to be fixed on the X-axis sliding block (82); the fixed support (611) is C-shaped, and a mounting groove (612) extending along the X-axis direction is formed on one side of the fixed support (611) adjacent to the X-axis guide rail (81); the X-axis sliding block (82) is positioned in the mounting groove (612) and is fixed with the fixing support (611).

6. Spindle deviation adjusting device according to claim 1, characterized in that the circuit board processing equipment comprises a calibration mechanism (7), the calibration mechanism (7) comprises an ejection assembly (71) and a positioning part arranged at the output end of the ejection assembly (71), the positioning part is configured to be controlled by the movement of the ejection assembly (71) towards the spindle mechanism (5), so that the spindle mechanism (5) moves in the Y-axis direction by the Y-axis movement assembly (61) under the action of external force, and the deviation of the spindle mechanism (5) in the Y-axis direction is calibrated.

7. The spindle deviation adjusting device according to claim 6, wherein the spindle mechanism (5) is provided with a fitting portion fitted with the positioning portion, a positioning surface (4) is provided between the fitting portion and the positioning portion, and the positioning portion is configured to move the spindle mechanism (5) in the Y-axis direction by an external force through the Y-axis moving assembly (61) under the action of the positioning surface (4) during upward movement.

8. The spindle deviation adjusting device according to claim 7, wherein the positioning surface (4) is an inclined plane or curved surface provided between the fitting portion and the positioning portion.

9. The spindle deviation adjusting apparatus according to claim 7, wherein the positioning surface (4) is located on a side wall of the positioning portion, the fitting portion, which is distributed in the Y-axis direction; the positioning part and the matching part do not interfere with each other between the side walls in the X-axis direction.

10. The spindle deviation adjusting apparatus according to claim 7, wherein the positioning portion is a positioning pin (72) provided at an output end of the ejector assembly (71), and the mating portion is a positioning groove (51) provided on the spindle mechanism (5); or, the positioning part is a positioning groove (51) arranged at the output end of the ejection assembly (71), and the matching part is a positioning pin (72) arranged on the spindle mechanism (5).

11. Spindle deviation adjustment device according to claim 7, characterized in that the spindle mechanism (5) comprises:

the Z-axis bottom plate (52), the Z-axis bottom plate (52) is fixed on the Y-axis motion assembly (61), and the matching part is arranged at the bottom of the Z-axis bottom plate (52);

a main shaft (53);

and the Z-axis movement mechanism (54) is arranged on the Z-axis bottom plate (52) and is configured to drive the main shaft (53) to move in the Z-axis direction.

12. The spindle deviation adjusting apparatus according to claim 1, wherein the circuit board processing device includes:

a table (2), on which table (2) a workpiece is mounted; the workbench (2) is provided with a calibration mechanism (7);

and the Y-axis movement mechanism (3) is configured to drive the workbench (2) and the calibration mechanism (7) to move in the Y-axis direction.

13. Spindle deviation adjustment device according to claim 12, characterized in that at least one machining area is provided on the table (2), each machining area being provided with at least two spindle mechanisms (5) in correspondence, and that at least one spindle mechanism (5) is configured to cooperate with a Y-axis adjustment mechanism (6).

14. A circuit board processing apparatus, comprising:

a base (1);