CN219626622U

CN219626622U - Full-automatic adhesive tape sticking device suitable for fixing chip

Info

Publication number: CN219626622U
Application number: CN202320136447.6U
Authority: CN
Inventors: 雷衍岳; 韩堂
Original assignee: Ningxia Xinka Intelligent Technology Co ltd
Current assignee: Ningxia Xinka Intelligent Technology Co ltd
Priority date: 2023-02-07
Filing date: 2023-02-07
Publication date: 2023-09-01
Anticipated expiration: 2033-02-07

Abstract

The utility model discloses a full-automatic tape sticking device suitable for fixing a chip, and relates to the technical field of chip tape sticking. The utility model comprises the following steps: the negative pressure mechanism comprises an air extractor, the other end of the first air suction pipe is connected with a negative pressure chamber, and two sides of the negative pressure chamber are connected with second air suction pipes; the top of the limiting plate is fixedly connected with a telescopic rod, the top of the telescopic rod penetrates through the movable groove to extend to the outside and is fixedly connected with a pressing block, and the bottom of the pressing block is provided with an anti-skid block; secondly, the briquetting of setting can firmly compress spacing to the chip both ends, has further strengthened the firm effect of chip.

Description

Full-automatic adhesive tape sticking device suitable for fixing chip

Technical Field

The utility model relates to the technical field of chip taping, in particular to a full-automatic taping device suitable for fixing chips.

Background

The chip is a miniature electronic device or component, and the components such as transistors, diodes, resistors, capacitors, inductors and the like required in a circuit and wiring are interconnected together by adopting a certain process and are manufactured on a small or several small semiconductor wafers or dielectric substrates, in the process, the chip is exposed, the external parts are easy to scratch and damage, and the functional defect of the product is caused, so that the surface of the chip is required to be shielded by using an adhesive tape to prevent the defect in advance.

The existing chip uses the full-automatic tape sticking device to replace manual film sticking, so that the labor is reduced, the UPH is high, the efficiency of chip tape sticking is improved, the chip is still required to be placed and positioned on the base manually, dislocation or offset of the chip is easy to occur in the tape sticking process, and the accuracy of tape sticking is reduced; therefore, when designing the full-automatic taping device for chips, attention is required to automatically fix the chips.

Accordingly, the inventor has the problem of providing a fully automatic tape sticking device suitable for fixing chips, which is expected to achieve the purpose of more practical value, by keeping the experience of design development and actual manufacturing in the related industry for many years and researching and improving the existing structure and the defects.

Disclosure of Invention

Based on the above, the utility model aims to provide a full-automatic tape sticking device suitable for fixing chips, so as to solve the technical problems that the chips are required to be placed and positioned on a base manually, misplacement or offset easily occurs in the tape sticking process, and the accuracy of tape sticking is reduced.

In order to achieve the above purpose, the present utility model provides the following technical solutions: be suitable for full-automatic rubberizing tape unit of fixed chip, include:

the negative pressure mechanism comprises an air extractor, the air extractor is electrically connected with the controller, the input end of the air extractor is connected with a first air suction pipe, the other end of the first air suction pipe is connected with a negative pressure chamber, two sides of the negative pressure chamber are connected with a second air suction pipe, and the top of the negative pressure chamber is connected with an air hole;

the compressing mechanism comprises a movable groove, a reset spring is connected to the bottom in the movable groove, a limiting plate is fixedly connected to the top of the reset spring, a telescopic rod is fixedly connected to the top of the limiting plate, the top of the telescopic rod penetrates out of the movable groove to extend to the outside and is fixedly connected with a pressing block, and an anti-skid block is arranged at the bottom of the pressing block.

By adopting the technical scheme, the negative pressure is formed in the placing groove by using the air extractor, so that the chip is automatically positioned in the placing groove, the automatic program of the device is improved, the fixing effect of the chip is ensured, and the accuracy of chip taping is improved; secondly, the briquetting of setting can firmly compress spacing to the chip both ends, has further strengthened the firm effect of chip.

Further, the negative pressure chamber is installed in the bottom of base, the rear side of base upper surface is provided with the mount, the top of mount one side is provided with straining device, the front surface mounting of mount has mounting panel, goes up mould and lower mould, and mounting panel, last mould and lower mould are installed from top to bottom in proper order, the last fixed surface of mounting panel installs flexible cylinder, the flexible end fixed mounting of flexible cylinder has the punching press sword.

Through adopting above-mentioned technical scheme, can adjust the tensioning of sticky tape, can also drive the punching press sword and descend perpendicularly after starting flexible cylinder to die-cut the sticky tape, realize the effect of full-automatic rubberizing tape to the chip.

Further, the standing groove is formed in the front side of the upper surface of the base, the standing groove is located at a crack between the two pressing mechanisms, a chip is mounted in the standing groove, and the standing groove is communicated with the negative pressure chamber through a plurality of air holes.

Through adopting above-mentioned technical scheme, help when the air exhauster circular telegram starts, through a plurality of gas pockets, make the inside negative pressure that forms of standing groove to make the chip of placing in the standing groove inside firmly adsorbed, thereby ensured the stability of chip follow-up rubberizing tape in-process.

Further, one end of the second air suction pipe far away from the negative pressure chamber extends to the inside of the movable groove, and a sealing ring is arranged at the joint between the second air suction pipe and the movable groove.

Through adopting above-mentioned technical scheme, can make the movable groove inside form the negative pressure equally when the air exhauster starts to drive telescopic link and briquetting synchronous decline, so that realize compressing tightly fixed process to chip upper surface both ends, and the sealing washer of setting, can further strengthen the gas tightness between second breathing pipe and the movable groove, avoid gas to take place to reveal.

Further, the telescopic rod is in sliding connection with the movable groove, the telescopic rod is fixedly connected with the limiting plate, and the limiting plate is clamped and slides with the movable groove.

Through adopting above-mentioned technical scheme, help promoting the stability of telescopic link reciprocates in-process, simultaneously, the limiting plate of setting can prevent that the telescopic link position from taking place the skew.

Further, the anti-skid block is positioned right above two ends of the chip, and the anti-skid block adopts a wear-resistant rubber hemisphere.

Through adopting above-mentioned technical scheme, make the antiskid ribbed tile can laminate in the up end of chip accurately, improve the steadiness of chip, simultaneously, adopt wear-resisting rubber hemispheroid's antiskid ribbed tile, not only can reduce the damage to the chip upper surface, can also strengthen its fixed effect to the chip.

In summary, the utility model has the following advantages:

1. according to the utility model, the chip to be adhered with the adhesive tape is placed in the placing groove, the air extractor is started, and the air extractor is connected with the negative pressure chamber through the second air suction pipe, and the negative pressure chamber is communicated with the placing groove through the plurality of air holes, so that the air in the negative pressure chamber is discharged to form negative pressure, and the external air is extracted from the plurality of air holes, so that the chip can be firmly adsorbed and fixed in the placing groove; the vacuum type chip sticking device is beneficial to utilizing the air extractor to enable negative pressure to be formed inside the placing groove so as to automatically position the chip inside the placing groove, thereby improving the automatic program of the device, guaranteeing the fixing effect of the chip and improving the accuracy of chip sticking tape.

2. According to the utility model, in the starting process of the air extractor, the negative pressure chamber can also extract air in the movable groove from the second air suction pipe, so that the movable groove can also form negative pressure in the same way, the limiting plate is driven to move downwards, the reset spring is extruded to shrink the limiting plate, the telescopic rod is lowered into the movable groove, so that the pressing block can approach to the chip, the anti-slip block can be attached to the upper surface of the chip, the chip is pressed and positioned, and the two ends of the chip can be firmly pressed and limited by the arranged pressing block, so that the stabilizing effect of the chip is further enhanced.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic perspective view of a base of the present utility model;

FIG. 3 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;

fig. 4 is an enlarged schematic view of the structure of fig. 1B according to the present utility model.

In the figure: 1. a base; 2. a fixing frame; 21. a tensioning mechanism; 22. a mounting plate; 23. a telescopic cylinder; 24. punching a cutter; 3. an upper die; 4. a lower die; 5. a placement groove; 6. a chip; 7. a negative pressure mechanism; 71. an air extractor; 72. a first air suction pipe; 73. a negative pressure chamber; 74. air holes; 75. a second air suction pipe; 8. a compressing mechanism; 81. a movable groove; 82. a return spring; 83. a limiting plate; 84. a telescopic rod; 85. briquetting; 86. an anti-skid block.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

Hereinafter, an embodiment of the present utility model will be described in accordance with its entire structure.

Full-automatic taping device suitable for chip fixing, as shown in fig. 1-4, comprises:

the negative pressure mechanism 7, the negative pressure mechanism 7 comprises an air extractor 71, the air extractor 71 is electrically connected with the controller, the input end of the air extractor 71 is connected with a first air suction pipe 72, the other end of the first air suction pipe 72 is connected with a negative pressure chamber 73, two sides of the negative pressure chamber 73 are connected with a second air suction pipe 75, the top of the negative pressure chamber 73 is connected with an air hole 74, and the air extractor 71 is used for forming negative pressure in the placing groove 5 so as to automatically position the chip in the placing groove 5, thereby improving the automation program of the device, guaranteeing the fixing effect of the chip and improving the accuracy of the chip adhesive tape; the compressing mechanism 8, compressing mechanism 8 includes movable groove 81, and the bottom is connected with reset spring 82 in the movable groove 81, and reset spring 82's top fixedly connected with limiting plate 83, limiting plate 83's top fixedly connected with telescopic link 84, the top of telescopic link 84 wears out the movable groove 81 and extends to outside and fixedly connected with briquetting 85, and briquetting 85's bottom is provided with non slipping spur 86, and briquetting 85 who sets up can firmly compress tightly spacingly to the chip both ends, has further strengthened the firm effect of chip.

Referring to fig. 1 and 3, the negative pressure chamber 73 is installed in the bottom of the base 1, the rear side of the upper surface of the base 1 is provided with a fixing frame 2, a tensioning mechanism 21 is arranged above one side of the fixing frame 2, a mounting plate 22, an upper die 3 and a lower die 4 are installed on the front surface of the fixing frame 2, the mounting plate 22, the upper die 3 and the lower die 4 are sequentially installed from top to bottom, a telescopic cylinder 23 is fixedly installed on the upper surface of the mounting plate 22, a punching cutter 24 is fixedly installed at the telescopic end of the telescopic cylinder 23, tensioning of a tape can be adjusted, and the punching cutter 24 can be driven to vertically descend after the telescopic cylinder 23 is started, so that the tape is punched, and the effect of full-automatic tape pasting is realized on a chip.

Referring to fig. 1 and 2, a placement groove 5 is formed in the front side of the upper surface of the base 1, the placement groove 5 is located at a gap between two pressing mechanisms 8, a chip 6 is mounted in the placement groove 5, the placement groove 5 is communicated with a negative pressure chamber 73 through a plurality of air holes 74, negative pressure is formed in the placement groove 5 through the plurality of air holes 74 when the air extractor 71 is electrified and started, so that the chip placed in the placement groove 5 is firmly adsorbed, and stability of the chip in the subsequent taping process is guaranteed.

Referring to fig. 1 and 4, the end of the second air suction pipe 75 far away from the negative pressure chamber 73 extends to the inside of the movable groove 81, and a sealing ring is arranged at the joint between the second air suction pipe 75 and the movable groove 81, so that negative pressure is formed in the movable groove 81 when the air suction machine 71 is started, and the telescopic rod 84 and the pressing block 85 are driven to synchronously descend, so that the process of compressing and fixing two ends of the upper surface of a chip is realized, and the sealing ring can further enhance the air tightness between the second air suction pipe 75 and the movable groove 81, and gas leakage is avoided.

Referring to fig. 1, 2 and 4, the telescopic rod 84 is slidably connected with the movable slot 81, and the telescopic rod 84 is fixedly connected with the limiting plate 83, and the limiting plate 83 and the movable slot 81 are clamped and slide, so that stability in the up-and-down movement process of the telescopic rod 84 is improved, and meanwhile, the limiting plate 83 can prevent the position of the telescopic rod 84 from shifting.

Referring to fig. 1, 2 and 4, the anti-slip block 86 is located at a position right above two ends of the chip 6, and the anti-slip block 86 is made of a wear-resistant rubber hemisphere, so that the anti-slip block 86 can be accurately attached to the upper end face of the chip 6, stability of the chip is improved, and meanwhile, damage to the upper surface of the chip can be reduced, and fixing effect of the chip can be enhanced by the anti-slip block 86 made of the wear-resistant rubber hemisphere.

In some other embodiments, the tensioning mechanism 21 includes an adjusting plate, a tensioning roller, an internal threaded hole, a threaded rod and a knob, which can facilitate the tensioning of the adhesive tape by a worker and prevent the adhesive tape from being loosened to affect the rubberizing.

The implementation principle of the embodiment is as follows: firstly, placing the chip 6 to be adhered with the adhesive tape in the placing groove 5, starting the air extractor 71, and since the air extractor 71 is connected with the negative pressure chamber 73 through the second air suction pipe 75 and the negative pressure chamber 73 is communicated with the placing groove 5 through the plurality of air holes 74, air in the negative pressure chamber 73 is discharged to form negative pressure, so that external air is extracted from the plurality of air holes 74, and finally, the chip 6 can be firmly adsorbed and fixed in the placing groove 5;

in the starting process of the air extractor 71, the negative pressure chamber 73 also draws air in the movable groove 81 from the second air suction pipe 75, so that the movable groove 81 also forms negative pressure, and further drives the limiting plate 83 to move downwards, and extrudes the reset spring 82 to shrink, so that the telescopic rod 84 is lowered and shrunk into the movable groove 81, so that the pressing block 85 can approach the chip 6, the anti-skid block 86 can be attached to the upper surface of the chip 6, and the chip 6 is pressed and positioned;

finally, the telescopic cylinder 23 is started to drive the punching cutter 24 to punch downwards, the adhesive tape between the upper die and the lower die is directly punched into the shape of the adhesive tape, and the adhesive tape is attached to the chip 6.

The parts not involved in the present utility model are the same as or can be implemented by the prior art, and are not described in detail herein.

Although embodiments of the utility model have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the utility model as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the utility model, provided that such modifications are within the scope of the appended claims.

Claims

1. Be suitable for full-automatic rubberizing tape unit of fixed chip, its characterized in that includes:

the negative pressure mechanism (7), the negative pressure mechanism (7) comprises an air extractor (71), the air extractor (71) is electrically connected with a controller, the input end of the air extractor (71) is connected with a first air suction pipe (72), the other end of the first air suction pipe (72) is connected with a negative pressure chamber (73), two sides of the negative pressure chamber (73) are connected with a second air suction pipe (75), and the top of the negative pressure chamber (73) is connected with an air hole (74);

the compressing mechanism (8), compressing mechanism (8) includes movable groove (81), be connected with reset spring (82) in movable groove (81), the top fixedly connected with limiting plate (83) of reset spring (82), the top fixedly connected with telescopic link (84) of limiting plate (83), movable groove (81) are worn out on the top of telescopic link (84) and extend to outside and fixedly connected with briquetting (85), the bottom of briquetting (85) is provided with non slipping spur (86).

2. The fully automatic taping device adapted to secure chips as defined in claim 1, wherein: the negative pressure chamber (73) is installed in the bottom of base (1), the rear side of base (1) upper surface is provided with mount (2), the top of mount (2) one side is provided with straining device (21), the front surface mounting of mount (2) has mounting panel (22), goes up mould (3) and lower mould (4), and mounting panel (22), go up mould (3) and lower mould (4) and install from top to bottom in proper order, the last fixed surface of mounting panel (22) installs flexible cylinder (23), the flexible fixed mounting of flexible cylinder (23) has punching press sword (24).

3. The fully automatic taping device adapted to secure chips as defined in claim 2, wherein: the front side of base (1) upper surface has seted up standing groove (5), and standing groove (5) are located the crack department between two hold-down mechanism (8), internally mounted of standing groove (5) has chip (6), standing groove (5) are linked together with negative pressure chamber (73) through a plurality of gas pockets (74).

4. The fully automatic taping device adapted to secure chips as defined in claim 1, wherein: one end of the second air suction pipe (75) far away from the negative pressure chamber (73) extends into the movable groove (81), and a sealing ring is arranged at the joint between the second air suction pipe (75) and the movable groove (81).

5. The fully automatic taping device adapted to secure chips as defined in claim 1, wherein: the telescopic rod (84) is in sliding connection with the movable groove (81), the telescopic rod (84) is fixedly connected with the limiting plate (83), and the limiting plate (83) is clamped and slides with the movable groove (81).

6. The fully automatic taping device adapted to secure chips as defined in claim 1, wherein: the anti-skid blocks (86) are positioned right above the two ends of the chip (6), and the anti-skid blocks (86) are wear-resistant rubber hemispheres.