CN219625635U - Water channel plate for heat dissipation of power semiconductor module - Google Patents
Water channel plate for heat dissipation of power semiconductor module Download PDFInfo
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- CN219625635U CN219625635U CN202321087039.2U CN202321087039U CN219625635U CN 219625635 U CN219625635 U CN 219625635U CN 202321087039 U CN202321087039 U CN 202321087039U CN 219625635 U CN219625635 U CN 219625635U
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Abstract
The water channel plate for heat dissipation of the power semiconductor module comprises a water channel plate main body and a separated type flow disturbing column plate, wherein the top surface of the water channel plate main body is a placement plane which is tightly attached to and fixes the power module, a concave water cooling groove is formed in the middle of the placement plane, and the separated type flow disturbing column plate is detachably embedded in the water cooling groove; the water channel plate main body is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively communicated to the water cooling groove. The water channel plate for heat radiation of the power semiconductor module can enable the water channel plate main body and the separated type flow disturbing column plate to be combined with the power module with the bottom without the integrated flow disturbing column plate, and the power module with the bottom with the integrated flow disturbing column plate can be installed when the water channel plate main body is used singly, so that the water channel plate main body is not required to be disassembled and assembled when different types of power modules are replaced, the assembly is convenient, the cost is saved, and the working efficiency is improved.
Description
Technical Field
The utility model relates to the field of power semiconductor aging test equipment, in particular to a water channel plate for heat dissipation of a power semiconductor module, which is applied to the power semiconductor aging test equipment as a cooling device and a test fixture so as to cool the power semiconductor module placed on the cooling device.
Background
In the power semiconductor burn-in test, the power semiconductor module to be tested is designed with various specifications according to requirements, for example, a spoiler is integrated in some power semiconductor modules, and the spoiler is not integrated in some power semiconductor modules. When the power semiconductor module is installed, the power semiconductor module can only be matched with one type of water channel plate, so that the water channel plate cannot be compatible with more power semiconductor modules, the corresponding water channel plate is designed according to the type of the power semiconductor module to be tested, the design cost is increased, the water channel plate is replaced according to the power semiconductor module to be tested, the disassembly and assembly are troublesome, and the work efficiency is affected.
Disclosure of Invention
Based on the above, the utility model provides a water channel plate for heat dissipation of a power semiconductor module, which solves the technical problem that the water channel plate in the prior art cannot be compatible with more types of power semiconductor modules.
In order to achieve the above purpose, the utility model provides a water channel plate for heat dissipation of a power semiconductor module, which comprises a water channel plate main body and a separated type spoiler column plate, wherein the top surface of the water channel plate main body is a placing plane which is provided with a power module which is tightly attached and fixed, a concave water cooling groove is arranged in the middle of the placing plane, and the separated type spoiler column plate is detachably embedded in the water cooling groove; the water channel plate main body is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively communicated to the water cooling groove.
As a further preferable technical scheme of the utility model, the water inlet and the water outlet are respectively arranged at the left side and the right side of the water cooling tank, and the left side and the right side of the water cooling tank are respectively communicated with the water inlet and the water outlet.
As a further preferable technical scheme of the utility model, a sealing ring groove is arranged at the peripheral edge of the water cooling groove, a sealing rubber ring is arranged in the sealing ring groove, and the power module seals the water cooling groove by pressing the sealing rubber ring.
As a further preferable embodiment of the present utility model, the water channel plate body is integrally formed.
As a further preferable technical scheme of the utility model, the placement plane of the water channel plate main body is provided with screw holes, and the power module is fixedly connected with the water channel plate main body through the screw holes by adopting screws.
As a further preferable technical scheme of the utility model, the separated spoiler column comprises a base plate, wherein a plurality of spoiler columns are distributed on the top surface of the base plate in an array, and the top of each spoiler column is used for contacting with the bottom surface of the power module which is clung to and fixed on the placing plane.
The water channel plate for heat radiation of the power semiconductor module comprises a water channel plate main body and a separated type turbulent flow column plate, wherein the top surface of the water channel plate main body is a placement plane which is provided with a power module which is tightly attached and fixed, a concave water cooling groove is formed in the middle of the placement plane, and the separated type turbulent flow column plate is detachably embedded in the water cooling groove; be equipped with water inlet and delivery port in the water course board main part, the water inlet with the delivery port communicates respectively to the water-cooling groove for water course board main part and disconnect-type vortex column board combine the mountable bottom and do not take the power module of integrated vortex column board, but the mountable bottom has the power module of integrated vortex column board when water course board main part monomer used, when changing different grade type power module, need not to dismantle the water course board main part, and the equipment is convenient, has not only saved the cost, has improved work efficiency moreover.
Drawings
The utility model will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a schematic view of a power semiconductor module heat dissipation waterway board according to an embodiment of the present utility model;
FIG. 2 is a schematic view of an embodiment of a split spoiler according to the present utility model;
FIG. 3 is a schematic diagram of an assembly of a power module with an integrated spoiler pillar on the bottom surface and a power semiconductor module heat dissipating waterway board;
fig. 4 is an assembly schematic diagram of a power module without an integrated spoiler on the bottom surface and a water channel plate for heat dissipation of a power semiconductor module.
In the figure: 1. the water channel plate comprises a water channel plate main body, 2, a separated turbulent flow column plate, 21, a base plate, 22, a turbulent flow column body, 3, a water inlet, 4, a water outlet, 5, a water cooling tank, 6 and a power module.
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The utility model will be further described with reference to the drawings and detailed description. The terms such as "upper", "lower", "left", "right", "middle" and "a" in the preferred embodiments are merely descriptive, but are not intended to limit the scope of the utility model, as the relative relationship changes or modifications may be otherwise deemed to be within the scope of the utility model without substantial modification to the technical context.
As shown in fig. 1-4, the utility model provides a water channel plate for heat dissipation of a power semiconductor module, which comprises a water channel plate main body 1 and a separated spoiler column plate 2, wherein the top surface of the water channel plate main body 1 is a placement plane which is provided with a power module 6 which is tightly attached and fixed, a concave water cooling groove 5 is arranged in the middle of the placement plane, and the separated spoiler column plate 2 is detachably embedded in the water cooling groove 5; the water channel plate main body 1 is provided with a water inlet 3 and a water outlet 4, and the water inlet 3 and the water outlet 4 are respectively communicated with the water cooling tank 5. The water inlet 3 is externally connected with cooling water, so that the cooling water is discharged from the water outlet 4 after passing through the water cooling tank 5, and the bottom surface of the power module 6 can be cooled when the cooling water passes through the water cooling tank 5.
The power semiconductor module heat dissipation water channel plate can be matched with two different power modules 6, wherein one power module is provided with an integrated spoiler column plate, and the other power module is not provided with the integrated spoiler column plate. As shown in fig. 3, when the power module 6 with the integrated spoiler column is adopted, the water channel plate main body 1 does not need to use the separated spoiler column 2, the separated spoiler column 2 needs to be disassembled and taken out, then the power module 6 is placed on a plane to be placed, the spoiler column on the bottom surface of the power module 6 is inserted into the water cooling tank 5, and meanwhile, the power module 6 is attached to the placing plane to realize sealing of the water cooling tank 5; as shown in fig. 4, when the power module 6 without the integrated spoiler is adopted as the bottom surface of the power module 6 in fig. 4, the separated spoiler 2 needs to be inserted into the water-cooling tank 5, then the power module 6 is placed on a plane to be placed, the bottom surface of the power module 6 is contacted with the top of the separated spoiler 2, and meanwhile, the power module 6 is attached to the placing plane to seal the water-cooling tank 5.
The peripheral edge of water cooling tank 5 is equipped with the sealing washer groove, be equipped with the sealing washer in the sealing washer groove, thereby power module 6 through the crimping the sealing washer will water cooling tank 5 seals to can avoid the test in-process, the cooling water flows from the gap between water course board main part 1 and the power module 6.
Preferably, the water channel plate body 1 is integrally formed, and is made of metal copper or aluminum with good heat dissipation and heat conduction properties, or an alloy of copper or aluminum.
The plane of placing of water course board main part 1 is equipped with the screw hole, power module 6 passes through the screw hole adopts the screw with water course board main part 1 fixed connection.
In a specific implementation, the water inlet 3 and the water outlet 4 are respectively arranged at the left side and the right side of the water cooling tank 5, and the left side and the right side of the water cooling tank 5 are respectively communicated with the water inlet 3 and the water outlet 4. Preferably, both the water inlet 3 and the water outlet 4 are lower than the bottom surface of the water cooling tank 5, the water inlet 3 is communicated with one side of the water cooling tank 5 through an inclined upward water flow channel, and the water outlet 4 is communicated with the other side of the water cooling tank 5 through an inclined downward water flow channel.
In another implementation, the split type spoiler 2 is a split structure of the power module 6 and is detachably connected to the waterway board main body 1, the split type spoiler 2 includes a base plate 21, a plurality of spoiler cylinders 22 with cylindrical structures are distributed on the top surface of the base plate 21 in a whole row, and the top of each spoiler cylinder 22 is used for contacting with the bottom surface of the power module 6 which is tightly attached to and fixed on a placing plane. During the use, the separated spoiler column plates 2 are placed in the water cooling tank 5, and water flows through the whole row of the spoiler column plates 22, so that the cooling water can conduct heat more uniformly to the power module 6 when flowing through the water cooling tank 5.
While particular embodiments of the present utility model have been described above, it will be appreciated by those skilled in the art that these are merely illustrative, and that many variations or modifications may be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined only by the appended claims.
Claims (6)
1. The water channel plate for heat dissipation of the power semiconductor module is characterized by comprising a water channel plate main body and a separated type turbulent flow column plate, wherein the top surface of the water channel plate main body is a placement plane which is tightly attached to and fixes the power module, a concave water cooling groove is formed in the middle of the placement plane, and the separated type turbulent flow column plate is detachably embedded in the water cooling groove; the water channel plate main body is provided with a water inlet and a water outlet, and the water inlet and the water outlet are respectively communicated to the water cooling groove.
2. The waterway board for heat dissipation of power semiconductor module according to claim 1, wherein the water inlet and the water outlet are provided at left and right sides of the water cooling tank, respectively, and the left and right sides of the water cooling tank are communicated with the water inlet and the water outlet, respectively.
3. The water channel plate for heat dissipation of power semiconductor module according to claim 1, wherein a seal ring groove is provided at an outer peripheral edge of the water cooling groove, a seal ring is provided in the seal ring groove, and the power module seals the water cooling groove by crimping the seal ring.
4. The waterway board for heat dissipation of power semiconductor module according to claim 1, wherein the waterway board body is integrally formed.
5. The waterway board for heat dissipation of power semiconductor module according to claim 1, wherein a placement plane of the waterway board body is provided with screw holes, and the power module is fixedly connected with the waterway board body by the screw holes using screws.
6. The water channel plate for heat dissipation of power semiconductor modules according to claim 1, wherein the separated type flow disturbing column plate comprises a base plate, a plurality of flow disturbing columns are distributed on the top surface of the base plate in an array, and the top of each flow disturbing column is used for being in contact with the bottom surface of the power module which is clung to and fixed on a placement plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321087039.2U CN219625635U (en) | 2023-05-08 | 2023-05-08 | Water channel plate for heat dissipation of power semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321087039.2U CN219625635U (en) | 2023-05-08 | 2023-05-08 | Water channel plate for heat dissipation of power semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219625635U true CN219625635U (en) | 2023-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321087039.2U Active CN219625635U (en) | 2023-05-08 | 2023-05-08 | Water channel plate for heat dissipation of power semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219625635U (en) |
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2023
- 2023-05-08 CN CN202321087039.2U patent/CN219625635U/en active Active
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